Note: Descriptions are shown in the official language in which they were submitted.
~3~
-1- 8CU-3503
POLYETHERIMIDE-POLYPHENYLENE ETHER BLENDS
This invention relates to a class of
polyetherimide-polyphenylene ether blends. The
components of the blend are generally compatible and
the bIends have good impact strength as well as good
mechanical properties.
The blends of the invention include a
polyetherimide o the formula:
_ _
~ 11
N \ \ ~ - 0 Z - 0 - A / ~ - R
a
; 10 where a represents a whole number in excess of 1, e.g.,
10 to 10,000 or more, the group -O-A~ is selected from:
I~`r~ _0~
.
R' being hydrogen, lower alkyl or lower alkoxy, preerably
~ ,r~7
~3q~ 8CU-3503
--2--
the polyetherimide includes the latter -O-A~ group where
R' is hydrogen such that the polyetherimide is of the
formula:
_
O O
_ ~N --X~J-- -- Z -- ~ N -- R --_
11 ll
O O a
and the divalent bonds of the -O-Z-O radical are ln the
3r31; 3,4'; 4,3' or the 4,4' position;
Z is a member of the class consisting of
( 1 ) ~ 4;~H3 ~H3
H3C ~H3 H3C~ _~Br Br CH3
~0~
3 3 H3C r sr CH3
~ ~ C(CH3)
sr r
and (2) divalent organic radicals of the general formula:
-~ (X)q 4~
~2~ gcU-3503
where X is a member selected from the class consisting of
divalent radicals of the formulas
O O
y 2y ~ C , -O-, -O- and -S-
where q i5 0 or l, y is a whole number from l to 5, and R
is a divalent organic radical selected from the classconsisting of (I) aromatic hydrocarbon radicals having
from 6-20 carbon atoms and halogenated derivatives thereof,
(2~ alkylene radicals and cycloalkylene radicals having
from 2-20 carbon atoms, C(2 8) alkylene terminated
lQ polydiorganosiloxane, and (3) divalent radicals included
by the formula
~ Q ~ ~
where Q is a member selected from the class consisting of
1~0 O
-O-, -C-, -S- and -C H
o
where X is a whole number from 1 to 5 inclusive.
Particularly preferred polye-therimides for the purposes
of the present invention includes those where -O-A~
and Z respectively are:
CH3
~ ~ and ~ ~ ) ~ C ~ O }
I CH3
8CU-3503
and R is selected from:
~ CH2 ~ ~
The polyetherimides where R is metaphenylene are most
preferred.
The blends o~ the invention also include a
polyphenylene ether which has the repeating structural
units of the formula:
0--~
where the oxygen ether atom of one structural unit is
connected to the benzene nucleus of the next adjoining
unit, b is a positive integer and is at least 50,
generally at least 100~ and Yl, Y2, Y3 and Y4, which
may be the same or dif~erent, are monovalent
~ubstitutents seIected from the group consisting o
hydrogenl halogen, hydrocarbon radicals, halohydrocarbon
radicals having at least two carbon atoms between the
halogen atom and the benzene nucleus, hydrocarboxy
radicals and halohydrocarboxy radicals having at least
two carbon atoms between the halogen atom and the
benzene nucleusA Suitable hydrocarbon radicals include
alkyl of one to ten carbon atoms and aryl of six to
twenty carbon atoms. Preferred polyphenylene ethers
for the purposes of the present invention include those
where Yl and Y2 are selected from alkyl of one to four
carbon atoms and phenyl and Y3 and Y4 are hydrogen.
Particularly preferred polyphenylene ethers for the
purposes of the present invention are poly
~3~ 8CU-3503
--5--
(2,6-dimethyl 1,4-phenylene)ether, i.e./ Yl and Y2 are
methyl, poly(2,6-diphenyl~1,4 phenylene) ether, i.e~
Yl and Y2 are phenyl, and poly(2-methyl-6-phenyl~1~4-
phenylene)ether, i.e., Yl is methyl and Y2 is phenyl.
Other suitable polyphenylene ethers include poly(2-
benzyl~6-methyl~4 phenylene)ether and poly(2,6~
dibenzyl~l,4 phenylene)ether.
The polyetherimides can be obtained by any
of the methods well known to those skilled in the art
including the reaction of any aromatic bis(ether
anhydrides) of the formula:
O ' O
il . Il
0/ ~ O--Z--O ~,~;~0
Il 11
O O
where Z is as defined hereinbefore with an organic diamine
of the formula
H2N~R-NH2
where R is as defined hereinbefore.
Aromatic bis(ether anhydride)s of the above
formula include, for example, 2,2~bis~4~(2,3~
dicarboxyphenoxy)phenyl]~propane dianhydride; 4,4'~bis(2,
2~ 3~dicarboxyphenoxy)diphenyl ether dianhydride; 1,3~bis(2,
3~dicarboxyphenoxy)benzene dianhydride; 4,4'-bis(2,3-
dicarboxyphenoxy)diphenyl sulfide dianhydride; 1,4-bis(2,
3-dicarboxyphenoxy)benzene dianhydride; 4,4'~bis(2,3~
dicarboxyphenoxy) benzophenone dianhydride; 4,4'-bis(2,3~
dicarboxyphenoxy)diphenyl sulfone dianhydride;
2,2-bis~4-(3f4-dicarboxyphenoxy)phenyl~propane dianhydride;
4,4'-bis(3,4-dicarboxyphenoxy)diphenyl ether dianhydride;
~L~3~
8CU-3503
--6--
4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride;
1,3-bis(3~4-dicarboxyphenoxy)benezene dianhydride; 1 t 4-bis
(3,4-dicarboxyphenoxy)benzene dianhydride; 4,4'-bis(3,4-
dicarboxyphenoxy)benzophenone dianhydricle 4-(2,3-
dicarboxyphenoxy)-4~(3,4-dicarboxyphenoxy)diphenyl -2,2-
propane dianhydride; etc. and mixtures of such
dianhydrides.
In addition, aromatic bis(ether anhydride)s also
included by the above formula are shown by Koton, M.M.:
Florinski, F.S.; sessonov~ M.I.; Rudakovr A.P. (Institute
of Heteroorganic compoundsf Academy of Sciences, U.S.S.R.),
U.S.S.R. 257,010, Nov. 11, 1969, Appl. May 3, 1967. In
addition, dianhydrides are shown by M.M. Koton, F.S~
Florinski~ Zh Org. Khin, 4(5), 774 (1968).
Organic diamines of the above formula include,
for example, m-phenylenediamine, p-phenylenediamine, 4,4'-
diaminodiphenylpropane, 4,4'-diaminodiphenylmethane
benzidine, 4,4'-diaminodiphenyl sulfide, 4,4'-
diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ether, 1,5-
diaminoaphthalene~ 3,3'-dimethylbenzidine, 3,31_
dimethoxybenzidine, 2,4-bis(~ -amino-t-butyl)toluene/
bis(p-~ -amino-t-butylphenyl~ether, bis(p-~ -methyl-o-
aminopentyl)benzene, l,3-diamino-4-isopropylbenzene, 1,2-
bis(3-aminopropoxy)ethane, m-xylylenediamine, p-
xylylenediamine, 2f4-diaminotoluene, 2,6-diaminotoluene,
bis(4-aminocyclohexyl)methane, 3-
methylheptamethylenediamine, 4~4-
dimethylheptamethylenediamine/ 2,11-dodecanediamine r 2,2-
dimethylopropylenediamine, octamethylenediamine, 3-
methoxyhexamethylenediamine, 2~5-
dimethylhexamethylenediamine, 2,5-
dimethylheptamethylenediamine, 3-
methylheptamethylenediamine, 5-
methylnonamethylendediamine, 1~4-cyclohexanediamine r 1,12-
octadecanediamine~ bis(3-aminopropyl)sulfide, N-methyl-bis
(3-aminopropyl)amine, hexamethylenediame,
heptamethylenediamine~ nonamethylenediamine,
8CU-3503
--7--
decamethylenediamine, bis(3-aminopropyl)
tetramethyldisiloxane, bis(4-aminobutyl)
tetramethyldisiloxane, etc.
In general~ the reactions can be advantageously
carried out employing well-known solvents, e.g.,
o-dichlorobenzene, m-cresol/toluene, etc. in which to
effect interaction between the dianhydrides and the
diamines/ at temperatures of from about 100 to about 240 C.
Alternatively, the polyetherimides can be prepared by melt
polymerization of any of the above dianhydrides with any
of the above diamino compounds while heating the mixture of
the ingredients at elevated temperatures with concurrent
intermixing. Generally~ melt polymerization temperatures
between about 200 to 400C~ and preferably 230 to 300 C.
can be employed. The conditions of the reaction and the
proportions of ingredients can be varied widely depending
on the desired molecular weight~ intrinsic viscosity, and
solvent resistance. In general r equimolar amounts of
diamine and dianhydride are employed for high molecular
weight polyetherimides, however, in certain instances, a
slight molar excess (abbut 1 to 5 mol percent) of diamine
can be employed resulting in the production of
polyetherimides having terminal amine groups. Generally,
useful polyetherimides have an intrinsic viscosity [~ ]
greater than 0.2 deciliters per gram~ preferably ~.35 to
0.60, or 0.7 deciliters per gram or even higher when
measured in m-cresol at 25C.
Included among the many methods of making the
polyetherimides are those disclosed in U.S. Patent Nos.
3,847,867, issued November 12, 1974 to Heath et al
3,847,869, issued November 12, 1974 to Williams~
3,850,885, issued November 26, 1974 to l~hlte and
3,855,178, issued December 17, 1974 to White~ etc.
Suitable methods for preparing polyphenylene
ethers are disclosed in U.S. Patent Nos. 3,306,874,
issued March 7~ 1967 to Hay, 8,306,875, issued
March 7~ 1967 to Hay, 3,257,357, issued June 21, 1966
to Stamatoff and 3,257,358, issued ~une 21, 1966 to
~3~
8CU-3503
--8--
Stamatoff. One method for preparing polyphenylene
ethers comprises oxidizing a substituted phenol of
the formula:
Y~Yl
~OH
Y3 Y2
where Yl through Y4 have the meanings set forth
previously. Oxidation of the phenol can be accomplished
by passing an oxygen containing gas through the phenol
while in the presence of a catalyst such as a cuprous
salt and a tertiary amine.
In accordance with the present invention,
blends of a polyetherimide and a polyphenylene ether
are generally obtainable in all proportions of the two
polymers relative to each other. Consequently, blends
comprising from about 1 to about 99%, by weight,
polyetherimide and from about 99 to about 1%, by weight
polyphenylene eth~r are included within the scope of
the present invention. Preferably, the blends of the
present invention contain from about 5% to about 95%
by weight, polyetherimide and from about 95% to about
5%, by weight, polyphenylene ether. sy controlling the
proportions of the polyetherimide and polyphenylene
ether relative to each other, blends having certain
predetermined properties which are improved over
those of either a polyetherimide or a polyphenylene
component alone are readily obtained.
It is contemplated that the polyetherimide-
polyphenylene ether blends of the present invention
may also include additive materials such as fillers,
stabilizers, plasticizers, flexibilizers, surfactant
agents, pigmentsl dyes, reinforcements, flame retardants
and diluents in conventional amounts. It is also
contemplated that the blends of the invention may include
two or more polyetherimides with one or more polyphenylene
~CU-3503
_9~
ethers or two or more polyphenylene ethers in combination
with one or more polyekherimides.
Methods for forming polyetherimicle-
polyphenylene ether blends may vary considerably. Prior
art blending techniques are generally satisfactory. A
preferred method comprises blending the polymers and
additives such as reinforcements in powder, granular or
filamentous form, extruding the blend, and chopping the
extrudate into pellets suitable for mo]ding by means
conventionally used to mold normally solid thermoplastic
compositions.
The polyetherimide-polyphenylene ether blends of
the present invention have application in a wide variety of
physical shapes and forms, including the use as films,
molding compounds, coatings, etc. When used as films or
when made into molded products, these blends, including
laminated products prepared therefrom~ not only possess
good physical properties at room temperature but they
retain their strength and excellent response to work-
loading at elevated temperatures for long periods oftime. Films formed from the blends of this invention
may be used in application where films have been used
previously. Thus, the blends of the recent invention
can be used in automobile and aviation applications for
decorative and protective purposes, and as high
temperature electrical insulation for motor slot liners,
transformers, dielectric capacitors, coil and cable
wrappings (form wound coil insulation for motors), and
for containers and container linings~ The blends can
also be used in laminated structures where films or
solutions of the blend are applied to various heat-
resistant or other type of materials such as asbestos,
mica, glass fiber and the like, the sheets superimposed
one upon the other, and thereafter subjecting the
sheets to elevated temperatures and pressures to effect
flow and cure of the resinous binder to yield cohesive
3~ ~3~
8CU-3503
--10--
laminated structures. Films made from the subject
polyetherimide-polyphenylene ether blends can also
serve in printed circuit applications.
Alternatively, solutions of the blends
herein described can be coated on electrical
conductors such as copper, aluminum, and the like
and thereafter the coated conductor can be heated
at elevated temperatures to remove the solvent and
provide a continuous resinous composition thereon~
If desired, an additional covercoat may be applied
to such insulated conductors including the use of
polymeric coatings, such as polyamides, polyesters,
silicones, polyvinylformal resins, epoxy resins,
polyimides~ polytetrafluoroethylener etc. The use
of the blends of the present invention as overcoats
on other types of insulation is not precluded.
Other applications which are contemplated
for these blends include their use as binders for
asbestos fibers, carbon fibersr and other fibrous
2Q materials in making brake linings. In addition,
molding compositions and molded articles may be formed
from the polymeric blends of the invention preferably
by incorporating such fillers as asbestos, glass
fibers, talcr quartz, powder, finely divided carbon,
silica, and the like into the blends prior to molding.
Shaped articles may be formed under heat, or under
heat and pressure, in accordance with practices well-
known in the art.
The following examples illustrate specific
polyetherimide-polyphenylene ether blends in accordance
with the present invention. It should be understood
that the examples are given for the purpose o~
illustration and do not limit the invention. In the
examples, all parts and percentages are by weight unless
otherwise specified~
~ 8CU-3503
EXAMPLE 1
Cast and compressed films of polyetherimide-
polyphenylene ether blends according to -the invention
were prepared and the films then examined for compat-
ibility~
The polyetherimide of the blend was prepared
from the reaction product of essentially equimo:Lar
amounts of 2,2-bis[~-(3,4-dicarboxy phenoxy)phenyl]propane
dianhydride and m~phenylene diamine and the polyphenylene
ether was poly(2,6-diphenyl-1,4-phenylene) ether. A blend
of about 9 parts of polyetherimide to one part of
polyphenylene ether was assessed for compatibility by a)
combining 10~ chloroform solutions of each polymer to
detect cloudiness which can be indicative of incompatibility,
b) compression molding a dried coprecipitated polymer
mixture so as to determine hbmogeneity in the pressed
sample, and c) solution casting a polymer mixture into
a plate and drying to produce a film so as to determine
homogeneity.
Specifically, solutions of each component of the
blend were prepared by dissolving about 10% by weight of
the polymer in about 90~ by weight of chloroform. The
contained polymer blend was then precipitated by the
addition of methanol and the resultant precipitate dried
~5 under vacuum at about 80C. A portion of the dried blend
was redissolved in chloroform and the resultant solution
cast on a glass plate. The chloroform was allowed to
e~aporate slowly at 25C. leaving a film that was dried
under vacuum at about 80C. until a constant film weight
resulted to thereby produce a film of about one to five
mils in thickness. The remainder of the dried blend was
compression molded between aluminum plates for about five
minutes at about 5000 psi and at about 270 - 315 C. A
summary of the assessments of the blend is set forth in the
following Table I.
~ 8CU-3503
-12-
EXAMPLE II
~.
The procedure of Example I was repeated with
the exceptlon that about one part of the polyetherimide
to about one part of the polyphenylene ether were used
to produce the blend according to the invention.
Observations of the blend after combination in
chloroform, compression molding and solution casting
are set forth in the following Table I. A ~ifferential
scanning calorimetry (DSC) measurement on the
compression molded sample showed a vaLue for the
glass transition temperature (Tg) of 205 C. Only
one transition was detected~
EXAMPLE III
I'he procedure of Example I was repeated with
the exception that about one part polyetherimide to
about nine parts of polyphenylene were used to produce
the blend according to the invention. Observations
of the blend after combination in chloroform, compression
molding and solution casting are set forth in the
following Table I~
.... . . . . . ..
. . .. .... ... .. ...... ... . .... . .
~3~ 8CU-3503
--13--
N N
~ ~ ~ ~ .
O
~o ~of
O U~
. a~ ~ ~
~ ~ 'X'X ~
~ ,J ~ ~ ~
:q a) ~ ~
h ~ :
: '~ ll~
.IJ '~ : U
a) ~. : ~ u u
: ~
h
a~
' ~q
: -~u o a)
~ ~' a ,,
~: . n
~, ~1: Q ~1
U~ ~3 ~
~ ~ Q)
,, a) E~ o
O S~ l_
* pO~
O
O
rl P~
fd H .. ..
a
1~H H H O
X H H Q~
F':l H It
~3~ 8CU-3503
-14-
EXA~PLE IV
The procedure of Example II was repeated with
the exception that poly(2-methyl-6-phenyl-1,4 phenylene)
ether was used instead of poly(2,6-diphenyl-1~4-phenylene)
ether. Observations of the blend after combination in
chloroform, compression molding and solution casting are
set forth in the following Table II.
EXA~PLE V
The procedure of Example IV was repeated with
the exception that about three parts of polyetherimide
to about nine parts of polyphenylene ether were used to
produce the blend according to the invention.
Observations of the blend after combination in chloroform,
compression molding and solution casting are set forth in
the following Table II. A DSC measurement showed two
Tg values (168 and 210 C).
EXAMPLE VI
.
The procedure of Example IV was repeated with
the exception that about nine parts polyetherimide to
about one part of polyphenylene ether were used to
produce the blend according to the invention.
Observations of the blend after combination in chloroform,
compression molding and solution casting are set forth in
the following Table II.
... . .. .. ...... . . . . . . ..
-15- 8CU-3503
h ~: S~ h
,~ a
, O
~U~
5~
,J ~) ~
~ ~ ~ 'X
h ~ -
a) Q
H .C ~ ~ ~ ,4
~ R
t:~ ~:
n nL(l D
u~ ~ I I--
P~
O ' ~ O
: ~, H ~ ~
8c~-3503
-16-
EXAMPLE VII
The procedure of Example II was repeated with
the exception that polyt2,6-dimethyl-1,4 phenylene)
ether was used instead of poly(2,6-diphenyl-1,4 phenylene)
ether. Observations of the blend after combination in
chloroform~ compression molding and solution casting are
set forth in the following Table III.
EXAMPLE VIII
The procedure of Example VII was repeated with
the exception that about one part polyetherimide to about
three parts of polyphenylene ether were used to produce
the blend according to the invention. Observations of the
blend after combination in chloroform, compression
molding and solution casting are set forth in the
following Table III.
XAMPLE IX
The procedure of Example VII was repeated with
the exception that about one part polyetherimide to
about nine parts of polyphenylene ether were used to
produce the blend according to the invention. Observations
of the blend after combination in chloroform, compression
molding and solution casting are set forth in the following
Table.
.
~3~
8CU-3 50 3
--17--
S~ C
0: 0 .
~rl
O ~ t~
O ~ ~ ~ r-J
~: O
: ~
:
:
~ ,~
: ~ X
: rl
h ~1
~: :
. ~ :
~1 : ~ U~
Q ~a : ~ N
: a) : c~ (d
S~ :
a) Q
'
. ',
: rl
a) : : ~, t~
~ : :
H ~ : ~ O O a)
H ~ : O 0 ~5 ~1 ~1
: H O : ~q ~ ~I r-l R ~ r4
tq lQ ~ U~ rl U~ rl
~:1 Q, : : a) o ~ ~ x o x
: ~ : : 5~
m ~ p~ ~
: E~ ~1 . ~ R E
':
::
a
a
.,~ :
~: . ~3
~:
a) O ~ u~ ~
~: ~ ~ ~ ~:
~ S~:
O ~:
P~
#
O
0
b~ ~rl
a) fa H .. ..
:
S~
aJ ~a~
Ql 1-1 H ~C
H H H 1-~
d ~ H O
~3~
8CU-3503
-18-
From the above results r several observations
concerning the blends according to the invention can be
made. ~lthough poly(2,6-diphenyl-1,4-phenylene)ether
does not form a homogeneous blend with the polyetherimide
when compression molded since crystallization is very
rapid at the pressing temperatures and a non-uniform
product results, if solutions of a mixture of amorphous
and polyetherimide are used to cast films on glass
plates, the films are found to be transparent over a
wide range of compositions~ Consequently, the polymers
appear to be compatible in all proportions when amorphous.
With a blend containing poly(2-methyl-6-phenyl-
1,4 phenylene)ether, some haziness is noted unless the
ratio of polyetherimide to poly(2-methyl-6-phenyl-1/4-
phenylene)ether is low. Since poly(2-methyl-6-phenyl-
1,4-phenylene~ether does not crystallize, the haziness
indicates some incompatibility at the 1:1 ratio, but less
at other ratios 4 A blend containing poly(2,6-dimethyl-
1,4-phenylene oxide), shows somewhat limited compatibility
even at low polyetherimide ratios. In general, the
compatibility of the polyphenylene ethers to polyetherimide
seems to be lessened as the quantity of aliphatic groups
in the polymer increases.
Substitution of other polyetherimides and/or
other polyphenylene ethers for the polyetherimide and/or
polyphenylene ether blends o~ the above examples, also
may result in the formulation of polyetherimide polymer
blends having similar characteristics.
While the present invention has been described
with reference to particular embodiments thereof~ it will
be understood that numerous modifications may be made by
those skilled in the art without actually departing from
the spirit and scope of the invention as defined in the
appended claims.