Note: Descriptions are shown in the official language in which they were submitted.
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BACKGROU_D OF THE INVENTION
The present invention generally relates to a new
and improved connection and circuit arrangement for
integrated semiconductor and hybrid units.
The technological development of such type of
circuit arrangements containing several integration planes
has led to an ever increasing number of electronic functions
to be arranged in a limited space~ The relatively complex
circuit arrangements of this kind give raise to relatively
high manufacturing costs, since the possibly necessary
functional tests are time-consuming due to the complexity of
the electrical circuitry. Also subsequent modifications of
such circuit arrangements may be effected only at high
expenditure, so that new designs are frequently required. On
the other hand, the high packiny and power density required
for such types of circuit arrangemants has lead to
undesirably high heat formation which, in the presence of
alternating st~ress or loads, may cause the formation of
cracks or fissures in the soldered connections.
SUMMAP~Y OF THE INVE:NTION
Therefore, with the foregoing in mind, it is a
primary object of the present invention to provide an
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improved connection and circuit arrangement with high packing
density of the components and superior operational
reliability so that there do not arise the aforementioned
drawbacks and shortcomings of the prior art constructions.
A further significant object of the present
invention aims at providiny a new and improved desi~n of a
circuit arrange,ment which may be developed and manufactured
at low cost and requirès only moderate testing activities.
Now in order to implement these and still further
objects of the invention, which will become more readily
apparent as the description proceeds, the connection and
circuit arrangement of the present invention is manifested by
the features that a number of passive and/or active
electrical components are disposed on a preferably
multi-layer printed circuit board and are electrically
interconnected therewith. ~he printed circuit board bearing
or provided with these electrical components is laminated to
a base panel~ ~he electrical components, the printed circuit
carrying the electrical components and the base panel form
essentially one modular unit. A plurality of such modular
units are arran~ed in a matrix arrangement on a support
structure or element provided, in turn, with at least one
printed circuit board on one side or surface of the support
structure or element and serving ~or electrical contact with
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the modular units, and the modular units are secured to this
support structure or element in a detachable manner.
B~IEF DESCRIPTION OF THE DRAWINGS
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The invention will be better understood and objects
other than those set forth above, will become apparent when
consideration is given to the following detailed description
thereof. Such description makes reference to the annexed
drawings wherein throughout the various figures of the
drawings there ha~e been generally used the same reference
characters to denote the same or analogous components and
wherein:
Figure 1 is a schematic and perspective view of a
connection and circuit arrangement containing a printed
circuit board with a matrix or matrix-like arrangement of the
modular units;
Figu~e 2 is ~ schematic sectional view of a modular
unit;
Figura 3 is a fragmentary sectional view of the
connection and circuit arrangement containing the printed
circuit board according to the showing of Figure 1 and with
modular units disposed on both surfaces;
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Figure 4 is a perspective view of a modified
construction of modular unit; and
Figure 5 is a sectional view of a modular printed
circuit board system or assembly with a plurality of modular
units and arranged in a tower or stack configuration.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Describing now the drawings, it is to be understood
that to simplify the showing thereof, only enough of the
structure of the various exemplary embodiments of the
inventive connection and circuit arrangement has been
illustrated therein as is needed to enable one skilled in the
art to readily understand the underlying principles and
concepts of ~his invention. Turning now specifically to
Figure 1 of the drawings, the connection and circuit
arrangement illustrated therein by way of example and not
limitation will be seen to comprise a connection and circuit
arrangement 45~ provided at an end or lateral face thereof
with an interconnect or connection bar or ledge stxucture 35
and with a matrix arrangement composed of a plurality of
modular unlts or modules 10 possessing essentially the same
dimensions. ~hese modular units or modules 10 possess a, for
instance, quadrangular configuration, preferably a
substantially square-shaped configuration and are fastened to
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one side or surface of a support structure or element 30 in a
detachable manner by means of threaded bolts or scxews 36 or
other conventional attachment means or expedients. On the
opposite side or surface of the support structure or element
30 there may be disposed other modular units which have not
been particularly depicted in Figure 1, but may comprise an
arrangement like the modular units 10' of the structure shown
in Figure 3 whi~ch will be considered more fully hereinafter.
Figure 2 shows a sectional view of a modular unit
or module on an enlarged scale and conveniently designated by
reference numeral 10 or 10', as the case may be, and forming
essentially one structural unit. Each such modular unit or
module 10 or 10' basically comprises a metallic base panel or
plate 16 containing a stepped or offset portion 16', a
flexible preferably multi-layer printed circuit board 17
(multi-layer) as well as a plurality of passive and/or active
electrical components 11, 12, 13, 14 and 15 disposed in a
matrix arrangement on this printed circuit board 17. The
flexible multi~layer printed circuit board 17 is laminated,
such as thermocompression bonded to the base panel 16. The
stepped or offset portion 1~' of the base panel or plate 16
bears a substantially frame-shaped elastic intermediate layer
19 which is preferably manufactured from an elastomeric
material and functions as a compression or pressure element
ser~ing to absorb mechanical stress in the arrangement.
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A contact element or pad 18 corresponding in shape
essentially to the shape of the intermediate layer or spacer
structure 19 is connected to the printed circuit board 17 by
means of the contact or connecting conductors or structure
20. In a preferred embodiment the contact or connecting
conductors 20 are formed by the flexible ends or peripheral
portions of the printed circuit board 17 (see Figure 4),
which at least on two sides are bent to extend downwardly
past the base panel or plate 16 and are positioned between
the intermediate layer 19 and the contact element or pad 18,
as shown in Figure ~. Each individual modular unit or module
10 or 10', as the case may be, can be cover~d by means of an
appropriately formed cover member or hood or lid 40 covering
the electrical components 11 to 15 t as schematically
indicated in Figure 2 by a chain-dotted line.
Figure 3 shows in sectional view a portion of the
support structure or element 30 with ~odular units or modules
10 and 10' disposed on both sides or surfaces thereof~
The support structure or element 30 comprises a
first metallic plate 26 and a second metallic plat~ 27.
These first and second plates 26 and 27 are spaced from one
another by appropriately arrang~d spacer elements, such as
lamellae or plates 28 which are dlsposed in inclined
relationship to one another and positioned, for instance,
such that there is formed a honeycombed structure. These
spaced and parallely positioned first and second plates 26
and 27 are attached to each other by the spacer lamellae or
plates 28 to form a hollow space 25 between these two plates
26 and 27 and which hollow space 25 assures for good heat
transfer or dissipation between the two spaced plates 26 and
27.
These two spaced plates 26 and 27 of the support
structure or element 30 are bondingly laminated to associated
printed circuit boards 21 and 23 which are pre~erably
multi-layer printed circuit boards provided with
appropriately configured recesses 22 and 24 for receiving and
thermally connecting or attaching the related stepped or
offset portion 16' of the base panel or plate 16 of each
modular unit 10 to these two plates 26 and 27. In the
assembled state the modular units 10 and 10' are disposed in
the recesses 22 and 24 through their stepped or offset
portions 16' and fastened by means of the screws 36 or the
like on the s~pport structuxe or element 30 a~ainst the
restoring force of the elastic intermediate layer or spacer
19, as shown in Figure 1. This results, on the one hand, in
a good thermal connection of the stepped or offset portion
16' with the respective plates 26 and 27 and, on the other
hand, assures for a likewise good electrical contact between
the contact pads or elements 18 and their opposite
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counter-contacts on the multi-layer printed circuit boards 21
and 23. These multi-layer printed circuit boards 21 and 23
are electrically connected with the printed circuit boards 17
through the connection conductors or lines 20.
Figure 4 shows in perspective view a modular unit
110 or 110', as the case may be, provided with a cover member
or hood or lid~140. In contrast to the modular units 10 and
10' of the embodiment of Figure 2, here the connecting
structures or connecting conductors 120 and 120' are
configured to possess a greater surface and their peripheral
portions protrude laterally from the depicted arrangement.
Additionally, there is partially visible the stepped or
offset portion 16' of the base panel 16.
Figure 5 shows a multiple printed circuit board
system 50 comprising two support structures or elements 30
equipped with the modular units 110 and 110' on both surfaces
or sides as well as a further support structure or element
30' provided with modular units 110' on one surface or side.
The support structures or elements 30 and 30l, here shown in
a simplified Eorm, are spaced from one another by means of
the frame structures or parts 52 and 53 and bear by means of
their not particularly referenced edges upon these frame
structures or parts 52 and 53 provided with enclosing support
or beaxing surfaces.
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The resultant housing-like encased printed circuit
board system 50 is covered by means of an upper cover or hood
51 and a lower cover or hood 54. The components or parts 51,
52, 53 and 54 are mutually sealed by means of conventional
seals 55, 55' and 55'' and are fastened together into a
tower-like structural unit or stack structure by not
particularly show screws or other conventional attachment
means~ The spaced support structures or elements 30 and 30'
are interconnected by means of contact pins or elements 56
and 57 which are preferably of resilient construction and
which extend to, and are in contact with, the contact
surfaces of the printed circuit boards 21 and 23. The hollow
spaces 130 between the modular units llO and 110' are foamed
with a conventional material, such as a dielectric material,
to form a so-called pressure pad 60, 61 an~ 62. In this
case, the screw connection 36 shown in Figura 1 may be
omitted.
Plug-in connections 65, 66 and 67 are arranged on
the upper cover or hood 51 of the printed circuit board
system 50 and are appropriately spaced from each other.
These pl~g~in connections 65, 66 and 67 are connacted by
means of conductoxs or lines 65', 66' and 67' with
appropriate plug-in sockats 68 and 69 located on the
uppermost support structure or element 30'.
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It should be emphasized that the modular units 10,
10' and 110, 110', by virtue of their standardized size, may
be manu~actured at comparatively low cost and may be designed
in an optimal way with regard to development, manufacture,
testing and reliability of the circuit structures. The
dimensions required for the modular units 10, 10' and 110,
110' a~e moderate with regard to circuit technology and allow
a simple, separate and functional testing of each individual
modular unit.
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The printed cixcuit board~45 equipped with the
modular units 10, 10' as well as the printed circuit board
system or assembly 50 equipped with the modular units 110 and
110' assure optimal heat elimination or dissipation. The
thermal energy is transferred from the electronic components
(semiconductor components) 11, 12, 13, 14 and 15 via the base
panel 16 to the support structures or elements 30 and 30'
provided with the hollow space 25, and this thus prevents
damage due to local overheating.
