Note: Descriptions are shown in the official language in which they were submitted.
(57) Summary:
Between an insulating layer (2) and a load distribution ]ayer (12), a heat conducting
layer (10) is arranged. The insulating layer (2) contains a recess (6) for receiving a
pipe (8) which carries a heat carrying medium. To avoid temperature peaks above
the pipe (8) in the load distribution layer (12), between it and pipe (8), an insulation
(20, 20a) is provided.
WO9 1/10~66 PCI /CH9 1/00007
Prefabricated Tile Flemen~ for an Area ~ir Conditioning Syslem
The invention concerns a prefabricated tile element for an area air conditioning system in
accordance with the essence of Claim 1.
A prefabricated tile element of the type mentioned above, is, for instance, manufactured,
distributed and fabricated by the firm John & Co. in Achen/Baden under the name of
"JOCO-Fussbodenheizung Top 2000" (JOCO Floor Heating Top 2000). In these known
prefabricated tile elements, after installing them, a separating layer must be put down
over which a normal DIN (Gerrnan Industrial Standard) floor finish must then be
applied. Only then can the floor covering be put down. Aside from the fact that this
construction method is relatively complicated, it requires a structural height which is not
suitable for the rehabilitation of old buildings. Additionally, there is the fact that the top
flooring heats more above the pipes, thus causing uneven heat distribution.
The object of the invention is designing a prefabricated tile element of the type
mentioned above in such a way that the mentioned disadvantages are avoided.
In accordance with the invention, the task is solved by the characterizing features of
Claim 1.
As a resu]t of the fact that the load distribution layer has a thickness which is smaller
than that of the insulating layer, a particularly low structural height results so that an
area air conditioning system of such tile elements is particularly suitable even for the
rehabilitation of old bui]dings. As a result of the fact that the load distribution layer is
connected to the heat conducting layer and/or the insulating layer, the installation work
is simplified because the additional application of a Qoor finish layer is no longer
required. On the load distribution layer, the floor superstructure such as, for instance,
ceramic tiles, carpeting or parquet flooring can be attached directly or, if necessary, after
prior application of a compensating layer. In spite of the low total height of the tile
element, uniform heat distribution results nevertheless, because, as a result of the
insulation, above the pipes, the area of the load distribution layer is essentially heated as
much as the neighboring areas in which the load distribution layer is directly connected
to the heat conducting layer.
Advantageous refinements of the tile element are described in Claims 2 through 20.
The insulation above the pipes can, in the simplest case, be formed, in accordance with
Claim 2, by an air gap. Also expedient is an embodiment in accordance with Claim 3,
where the insulation strip can be simply inserted into the recess or can be arranged on
the underside of a covering strip covering the recess.
The heat peaks in the areas of the pipes can be further reduced by a refnement in
accordance with Claim 4.
The heat conducting layer can, for instance, be formed by metallic vapor-sputtering of
the insulating layer. More advantageous, however, is a refinement in accordance with
Claim S because, as a result of it, particularly a thicker heat conducting layer becomes
possible and the risk of damage and thereby an interruption of the heat transfer is
reduced. Advantageous is a refinement in accordance with Claim 6. The air gap formed
as a result of the distance of the piece of heat conducting sheet metal in the recess
reduces the heat transfer in an undesired direction, i.e. toward the subflooring. For this
pur~,ose, the tile element is preferable improved in accordance with Claim 7.
In principle, it is possible to design the load distribution layer in such a way that it is
applied at the building site, after laying the pipes, for instance by gluing in accordance
with Claim 19 or interlocking in accordance with Claim 20. But more advantageous is a
refinement in accordance with Claim 8, because then, with the exception of the covering
strips, the load distribution layer is, directly prefabricated, connected to the insulating
layer and the heat conducting layer. After laying the pipelines, the recesses need merely
be closed off by means of the covering strips so that the tile element and/or the area air
conditioning system is ready for the application of the top flooring. In principle, it is
possible to design the tile elements in such a way that, in the case of contiguous tile
elements, the individual layers are also buttjoined. Advantageous, however, is an
improvement in accordance with Claim 9, because the covering strips which overlap the
contact points allow better load distribution and prevent the contact points from bleeding
through the finished top flooring. A particularly advantageous refinement of thecovering strips is described in Claim 10. It is also advantageous to reinforce the covering
strips in accordance with Claim 11. The covering strips can be separately supplied and
installed. Advantageous, however, is a refinement in accordance with Claim 12 which
prevents covering strip losses and simplifies installation. The attachment of the covering
strips can be improved by a refinement in accordance with Claim 13.
Particularly advantageous is a refinement of the tile elements in accordance with Claim
14 which improves the interconnection of the individual adjacently placed tile elements.
This also prevents the risk of having contact points bleed through on the top flooring. It
J~
is also particularly advantageous, if the tile elements are improved in accordance with
Claim 15 so that any unintentional detachment of adjacent tile elements is prevented.
In principle, it is possible to build up the tile elements of the most varied materials. Thus
the insulating layer can consist of natural materials such as cork, fibers and similar. But
plastics, in particular foamed plastics, are also a possibiiity. Moreover, for this purpose,
the insulating layer and the load distribution layer can consist of different or like
materials but, no matter what, materials of different specific gravities. Particularly
advantageous is a refinement of the tile element in accordanoe with Claim 13 because
MegithanR and ReprolitR have proven to be environmentally safe, toxicologically
harmless materials which additionally present exoellent physical properties and display
good tolerance to foreign matter.
The load distribution layer will advantageously be refined in accordance with Claim 17
and thus offers not only high stability but, in particular, also good heat distribution.
On the underside of the tile element, the latter can additionally be reflned in accordance
with Claim 1~, in order to irnprove the insulating characteristics and the foot-step sound
characteristics.
Particularly advantageous is also a refinement in accordance with Claim 19 in which the
individual layers are glue-bonded to each other, (and) particularly, (if bonded) by means
of the same material of which the insulating layer and the load distribution layer in
accordance with Claim 16 consist. If neoessary, as mentioned above, the load
distribution layer can be attached in accordance with Claim 20.
Sample embodiments of the object of the invention are described in more detail below,
based on the drawings which show the following:
Figure I A tile element with an insulating layer, a heat conducting layer and a load
distribution layer in a lateral view and in a cutout;
Figure 2 A tile element in which, on an insulating layer, a load distribution layer
and, above it, a heat conducting layer is arranged, in a cross section and in
a cutout;
Figure 3 A tile element with an anchoring link on the heat conducting layer, in a
cross section and in a cutout;
$ ~
Figure 4 A tile element with integrally formed fastening cam of the load distribution
layer in the insulating lay~r, in a cross section and in a cutout;
Figure 5 A tile element with snap-type latching of the load distribution layer in the
heat conducting layer, in a cross section and in a cutout; and
Figure 6 A tile element with snap-type latching of the covering strip, in a cross
section and in a cutout;
Figure I shows, in a cross section and in a cutout, a tile element which has an insulating
layer 2 which is arranged on an attenuation layer 4, for instance a felt layer or a fleece
layer. Insulating layer 2 contains one or more recesses 6, each for one pipe 8 for
conducting a heat carrier medium. On the upper side of insulating layer 2 and recess 6, a
heat conducting layer 10 is arranged which consists, for instance, of a piece of sheet
aluminum. Above heat conducting layer 10 lies a load distribution layer 12, the
thickness D2 of which is [smaller (Gersnan word missing)] than thickness D, of the
insulating layer. The individual layers are glue-bonded to each other.
Recess 6 in insulating layer 2 is designed in such a way that heat-conducting layer 10
encloses the pipe firmly over at least 180 and forrns, at the same time, an air gap 14 with
inside wall 16 of recess 6. For spacing, sectionally arranged beads 18, oriented towards
the outside, are provided in heat conducting layer 10. This reduces the heat transfer
downward.
Recess 6 is designed in such a way that, above pipe 8, insulation is present through to the
load distribution ]ayer 12 which (insulation) attenuates the heat transfer from pipe 8 to
load distribution layer 12. This insulation will, in the simplest case, be formed by an air
gap 20. For widening the air gap, in insulating layer 2 recesses 22 are present on both
sides of the pipe. But it is also possible to insert into recess 6, including the lateral
recesses 22, an insulation strip 20a, as indicated by dots and dashes. This insulation strip
20a can be detached or attached to the underside of a covering strip 24 and can be
inserted together with it.
Above the insulation and/or air gap 20, above pipe 8, load distribution layer 12 is divided
and contains covering strip 24 which laterally overlaps the recesses 22. In the example
shown, on the left side, by means of a material bridge 26, covering strip 24 is flexibly
connected to the adjacent parts of load distribution layer 12. On the right side, covering
strip 24 has a latching lobe 28 by means of which it latches in an undercut 30 of the
adjacent load distribution layer. At its front faces 32,34, the tile element has a cross
section which causes it to positively latch with Ihe neighboring tile elements. For this
purpose, two abutting front faces 42 have a comb 36 which is preferably conically
desi~ned. The remaining front faces 34 are provided with corresponding grooves 28.
Furthermore, in the area of front faces 32,34, load distribution layer 12 is set back and
the remaining gap between neighboring tile elements is bridged by a covering strip 40
which can preferably be designed in analogy to covering strip 24 above a recess 6. As a
result, contact point 42 between two tile elements P"P2 is safely covered.
In the example shown, the tile element consists of insulating layer 2 which is preferably
formed of a foamed MegithanR (a caprolacton compound) or ReprolitR (a polyacrylic
polyurethane compound) and preferably has a specific gravity between 800 and 1000
N/m3. Thickness D, of the insulating layer is, for example, 18 to 23 mm. The heat
conducting layer is formed by a piece of sheet alurninum which may, for example, have a
thickness of 0.2 to 0.5 mrn. The load distribution layer 12 can, for exarnple, have a
thickness D2 of 2 to 10 mrn and can also be formed of the most varied materials,preferably, however, it consists of MegithanR or ReprolitR with a corresponding higher
density of 2 000 to 3 000 N/m3, for instance. In any case, the embodiment is such that
the common load values for tloors, for example 10 000 to 20 000 Ntcm2 are achieved.
Load distribution layer 12 will expediently be provided with a filler material, for example
graphite or aluminum powder, in order to increase the heat conductivity. If necessary,
the load distribution layer can also have a reinforcing insert, in the form of glass fibers,
for instance. Covering strip 24 which covers up the recess preferably consists of the same
material as load distribution layer 12 but without heat conducting filler materials. On
the other hand, covering strip 24 can also be provided with a reinforcing insert, in the
form of glass fibers, for instance. Covering strip 40 at contact point 42 will expediently
again be provided with a heat conducting filler material and can, moreover, receive a
reinforcing insert.
The entire build-up of the tile element is preferably made in such a way that the total
thickness will be approx. 25 mm. The size of the tile element will preferably be 450 x 900
or 600 x 900 mm. Every tile element contains a number of recesses 6 for pipes 8 the
distance of which is preferably 150 mm.
Figure 2 shows another sample embodiment of a tile element with an insulating layer 44
which has a recess 46 for pipe 8. In this sample embodiment, on insulating layer 44,
there is arranged first of all load distribution layer 48 and finally, above it, heat
conducting layer 50 in the form of a piece of sheet aluminum. Load distribution layer 48
and insulating layer 44 have a recess 52 in which a covering strip 54 is arranged which
covers up recess 46 and a lateral recess 56. Covering strip 54 is thicker than load
distribution layer 48. Moreover, the covering strip contains, on both longitudinal faces
58, lobes 60 by means of which it latches in grooves 62 in the two lateral walls 64 of
recess 52. In this sample embodiment, again, the individual layers, i. e. insulating layer
44, load distribution layer 48 and heat conducting layer 50 are preferably glue-bonded to
each other by means of MegithanR. Insulating layer 44 and load distribution layer 48
preferably also consist of MegithanR and/or ReprolitR of different specific gravities.
Heat distribution layer 50 can be covered by a protective layer or protective plastic sheet
in a manner which is not specifically illustrated.
Figure 3 shows another sample embodiment of a tile element in which heat conducting
layer 66 is embedded between insulating layer 68 and load distribution layer 70. Heat
conducting layer 66 which again consists of a piece of sheet metal, has an integrally
formed anchoring ]ink 72 which is embedded in insulating layer 68.
In the tile element of Figure 4, a heat conducting layer 74 is again embedded between an
insulating layer 76 and a load distribution layer 78. Heat conducting layer 74 contains
an orifice 80 through which, during application of load distribution layer 48 and
compression of the same, a material plug 82 was pressed into the softer insulating layer
76, creating or improving the connection between the layers.
In the sample embodiment of Figure 5, a heat conducting layer 84 is again embedded
between an insulating layer 86 and a load distribution layer 88. For fastening the load
distribution layer 88, a snap-type latching device 90 is present, with heat conducting layer
84 which is positively connected to insulating layer 86, containing a latching recess 92,
into which a head-type latching element 94 of load distribution layer 88 latches. The
arrangement can be made in such a way that the connection between load distribution
layer 88 and heat conducting layer 84 and/or insulating layer 86 is achieved exclusively
across a multiplicity of latching devices which are distributed over the tile element.
Figure 6 shows another tile element in which a heat conducting layer 96 is sandwiched
between an insulating layer 98 and a load distribution layer 100. Insulating layer 98
contains again a recess 102 for receiving pipe 8 as well as a recess 104 for receiving a
covering strip 106. The latter overlaps recess 102 and an expanding recess 108. Covering
strip 106 is connected, by means of a snap-type latching device 110 in analogy to latching
device 90 of Figure 5, to the heat conducting layer 96 and thereby also to insulating layer
98. For this purpose, heat conducting layer 96 contains integrally formed latching
recesses 112 and covering strip 106 contains head-type latching elements 114 projecting
downward which latch into latching recess 112. Instead of the latching device 220,
covering strip 106 can also be provided with integrally formed suction cups which are not
illustrated and which attach by suction to the bottom of the recesses. Otherwise, the tile
element of Figure 6 corresponds essentially to the tile element of Figure 1.
REFERENCE LIST
P, Tile element
P2 Tile element
D2 Thickness of 12
Dl Thickness of 2
2 Insulating layer
4 Attenuating layer
6 Recess
8 Pipe
10 Heat conducting layer
12 Load distribution layer
14 Air gap
16 Inside wall
18 Beads
20 Air gap
22 Recess
24 Covering strip
26 Material bridge
28 Latching lobe
30 Undercut
32 Front face
34 Front face
36 Comb
38 Channel
40 Covering strip
42 Contact point
44 Insulating layer
46 Recess
48 Load distribution layer
50 Heat conducting layer
52 Recess
54 Covering strip
56 Recess
58 Longitudinal front face
60 Lobe
62 Groove
7~
64 Side wall
66 Heat conducting layer
68 Insulating layer
70 Load distribution layer
72 Anchoring link? element
74 Heat conducting layer
76 Tnsulating layer
78 Load distribution layer
Orifice
82 Material plug
84 Heat conducting layer
86 Insulating layer
88 Load distribution layer
90 Latching device
92 Latching recess
94 Latching element
96 Heat conducting layer
98 Insulating layer
100 Load distribution layer
1 02 Recess
104 Recess
106 Covering strip
108 Recess
110 Latching device
I l2 Latching recess
114 Latching element
