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Patent 2052034 Summary

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Claims and Abstract availability

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(12) Patent Application: (11) CA 2052034
(54) English Title: US TRANSDUCER FOR AIR AND GAS FLOW MEASUREMENT AND A METHOD FOR THE MANUFACTURE THEREOF
(54) French Title: TRANSDUCTEUR DE MESURE DU DEBIT D'AIR ET DE GAZ, ET METHODE DE FABRICATION
Status: Deemed Abandoned and Beyond the Period of Reinstatement - Pending Response to Notice of Disregarded Communication
Bibliographic Data
(51) International Patent Classification (IPC):
  • H4R 17/00 (2006.01)
  • B6B 1/06 (2006.01)
  • G10K 11/02 (2006.01)
  • H4R 31/00 (2006.01)
(72) Inventors :
  • MAGORI, VALENTIN (Germany)
  • HABRICH, REINER (Germany)
(73) Owners :
  • SIEMENS AKTIENGESELLSCHAFT
(71) Applicants :
  • SIEMENS AKTIENGESELLSCHAFT (Germany)
(74) Agent: SMART & BIGGAR LP
(74) Associate agent:
(45) Issued:
(22) Filed Date: 1991-09-23
(41) Open to Public Inspection: 1992-03-26
Availability of licence: N/A
Dedicated to the Public: N/A
(25) Language of filing: English

Patent Cooperation Treaty (PCT): No

(30) Application Priority Data:
Application No. Country/Territory Date
P 40 30 302.0 (Germany) 1990-09-25

Abstracts

English Abstract


ABSTRACT OF THE DISCLOSURE
A US transducer for air and gas flow measurement has a cast
transducer core formed of a castable damping material which is
placed into a core mold. The transducer core is formed of a
piezoceramic wafer whose thickness is partially exposed at one side
of a damping member, and is composed of the damping member in which
the piezoceramic wafer is partially enclosed with leads that can
be guided toward the outside. The transducer core is enveloped
with a castable adapter material in a bipartite mold for the
formation of an adapter and assembly member.


Claims

Note: Claims are shown in the official language in which they were submitted.


WE CLAIM AS OUR INVENTION:
1. A method for manufacturing a US
transducer, comprising the steps of:
providing a piezoceramic wafer and placing the piezoceramic
wafer in a core mold together with respective leads, the
piezoceramic wafer having a portion which is partially exposed at
one side within the core mold;
introducing a castable damping material into the core mold
to at least partially cover the exposed portion of the piezoceramic
wafer at the one side;
removing the piezoceramic wafer with the casted damping
material which together form a transducer core and introducing the
transducer core into a bipartite mold for formation of an adapter
and assembly member; and
introducing a castable adapter material into the bipartite
mold so that the adapter and assembly member is formed which
envelopes the transducer core.
2. A method according to claim 1 wherein the
castable adapter material covers an exposed side of the transducer
core opposite said one side covered by the castable damping
material.
3. A method according to claim 1 including
the steps of:
said core mold having a recess which receives the
piezoceramic wafer and its associated leads;
providing a collar in a damping member formed by the casted
damping material at its side facing away from the piezoceramic
wafer;

removing the finished transducer core from the core mold and
introducing the collar into a recess of a first shaped part of said
bipartite mold used for the formation of the adapter and assembly
member;
providing the bipartite mold with a second shaped part which
is introducible into the first shaped part with the collar of the
transducer core being enclosed at least partly by the first shaped
part and by the second shaped part; and
injecting the adapter material into the bipartite mold for
the formation of the adapter and assembly member by use of the
first and second shaped parts so as to form the adapter and
assembly member which completely envelopes the transducer core
except for an exposed portion of the collar.
4. A method according to claim 1 including
the steps of:
providing said core mold with a recess for acceptance of the
piezoceramic wafer when the wafer is placed in the core mold;
the core mold being shaped to provide a resulting damping
member when the damping material is cast into the core mold with
a collar at its side facing away from the piezoceramic wafer;
when the finished transducer core is removed from the core
mold, introducing the collar into a recess of a first shaped part
of the bipartite mold for the formation of the adapter and assembly
member;
providing a second shaped part of the bipartite mold with
an upwardly directed opening which accepts the transducer core and
which is partially filled with said adapter material; and
placing the transducer core in the first shaped part such
that it is directed downward towards the opening of the second
shaped part, and pressing the first shaped part into the opening

of the second shaped part until the first and second shaped parts
of the bipartite mold enter into engagement with one another such
that the adapter material contained in the second shaped part is
displaced and ascends around the entering transducer core so as to
form the adapter and assembly member.
5. A method according to claim 1 including
the step of connecting the leads of the piezoceramic wafer to
terminal pins which are enclosed in a damping member formed by the
casted damping material such that they radially project from a
collar of the damping member toward an outside.
6. A method according to claim 5 wherein the
leads are connected to the terminal pins by soft soldering and the
pins projecting from the collar toward the outside do so in an
anti-twist manner.
7. A method according to claim 1 including
the steps of providing terminal plug pins that are held by a
connector plug socket enclosed within a damping member formed by
the casted damping material such that the terminal plug pins are
integrated in the damping member parallel to a rotational axis of
the transducer core and project from the side facing away from the
piezoceramic wafer, and connecting the leads of the piezoceramic
wafer to the terminal plug pins.
8. A method according to claim 7 wherein the
damping member is provided with a collar and the collar having a
channel for anti-twist protection.
9. A method according to claim 1 including
the step of providing the adapter and assembly member with an

annular channel for acceptance of a rubber ring for holding the
adapter and assembly member.
10. A method according to claim 1 including
the step of providing the adapter and assembly member as a hollow
cylinder closed at one of its ends.
11. A method according to claim 1 including
the step of providing the adapter and assembly member as a hollow
cylinder closed at its one end and wherein the end that closes the
hollow cylinder is designed in a shape of a truncated cone.
12. A method according to claim 1 including
the step of providing the damping member formed by the casted
damping material with a collar having a peripheral ridge for
decoupling structure-borne noise and an edge enlargement
peripherally of the ridge for holding the damping member.
13. A method for manufacturing a US
transducer, comprising the steps of:
providing a piezoceramic wafer and placing the piezoceramic
wafer in a seating recess in a core mold, the piezoceramic wafer
having a portion which is partially exposed above the seating
recess at one side within the core mold;
introducing a castable damping material into the core mold
to at least partially cover the exposed portion of the piezoceramic
wafer at the one side;
removing the piezoceramic wafer with the casted damping
material which together form a transducer core and introducing the
transducer core into a bipartite mold for formation of an adapter
and assembly member; and
introducing a castable adapter material into the bipartite
mold so that the adapter and assembly member is formed which at

least partially surrounds the transducer core.
14. A US transducer, comprising:
a transducer core formed of a piezoceramic wafer with leads
and wherein said wafer is covered at one side by a damping member;
and
the transducer core being at least partially surrounded with
a castable adapter material means for formation of an adapter and
assembly member.
15. A US transducer, comprising:
a piezoceramic wafer having leads extending therefrom;
a damping material covering one side of the wafer and having
the terminal leads embedded therein; and
an adapter and assembly member covering an opposite side of
said wafer covered by the damping member, said adapter and assembly
member also at least partially surrounding portions of said damping
material.
11

Description

Note: Descriptions are shown in the official language in which they were submitted.


20~2~3~
BACKGROUND OF THE INVENTION
The present invention is directed to a US transducer,
particularly for air and gas flow measurement, and is also directed
to a method for the manufacture thereof.
Methods for the manufacture of such US transducers that have
been hitherto disclosed are cost-intensive and time-consuming in
view of the number of manufacturing steps and/or the expense of
manufacturing equipment.
In view of the constantly increasing need for cost-
beneficial US transducers, there is the desire to create a method
for the manufacture of such US transducers which makes fewer
demands both of the time expenditure as well as of the apparatus
expense for the manufacturing process, and thus offers the
possibility of manufacturing cost-beneficial US transducers.
~UMMARY OF T~E INVENTION
An object of the invention is to specify a method for
manufacturing a US transducer for sound emission and for sound
reception, for example for air and gas flow measurement, with which
US transducers of the type initially cited can be reliably
manufactured with low time expenditure and/or apparatus expense.
For achieving this object, a method for manufacturing a US
transducer for air and gas flow measurement is proposed which is
inventively characterized in that steps are provided for casting
a transducer core composed of a castable damping material in a core
mold or shape. The transducer core is composed of a piezoceramic
wafer which has its thickness partially exposed at one side of a
damping member and is composed of the dampingl member. The
piezoceramic wafer is partially connected with leads which can be
conducted toward the outside. The transducer core is enveloped

2a~2~3~
with a castable adapter material in a bipartite f~rm for the
formation of an adapter and assembly member.
BRIEF DESCRIPTION OF TNE_DRAWING~
Figures lA, lB, and lC schematically show the steps required
for the manufacture of a transducer core;
Figure 2 shows a schematic sectional view from which a step
for enveloping the transducer core manufactured according to Figure
1 with a castable adapter material A in a bipartite mold proceeds;
Figure 3 shows a schematic illustration of a procedure for
enveloping the transducer core manufactured according to Figure 1
with an evaluatable adapter material according to a second
exemplary embodiment;
Figure 4 shows a schematic sectional view of a transducer
core having a pot of adapter material surrounding it, whereby anti-
twist terminal pins are provided which are conducted radially out
of the transducer core from a piezoceramic wafer;
Figure 5 shows a schematic sectional view of a transducer
core which is provided with a pot of adapter material, whereby
connector plugs for the piezoceramic wafer of the transducer which
are aligned parallel to the rotational axis of the structure are
provided in the transducer core;
Figure 6 shows a schematic sectional view with a
corresponding bottom view of an exemplary embodiment of a
transducer core having a channel for the anti-twist protection
thereof;
Figure 7 shows a further exemplary embodiment of the
transducer core manufactured in accordance with Ithe invention,
whereby a rubber ring for holding the transducer core is introduced
into a channel;

20~2~3~
Figure 8 shows another exemplary embodiment of an
inventively manufactured transducer core, whereby a bead 10 for
decoupling structure-borne noise having an edge enlargement 11 for
holding the damping member connected thereto is designed at a
collar of the damping member; and
Figure 9 schematically shows the various manufacturing steps
of the invention for manufacturing a US transducer and sho~s a
schematic, sectional view of the overall structure of a US
transducer manufactured with these steps which can be utilized as
a gas counter.
DE8CRIPTION OF THE PREFERRED EMBODIMEN~8
As already stated, Figure 1 schematically shows the steps
required for the inventive manufacture of a transducer core. For
casting a transducer core, the piezoceramic wafer 1 provided with
leads (not shown) that can be conducted toward the outside is
placed into a core mold Fl for the formation of the transducer core
1/2. This core mold Fl has a recess F11 intended for the
acceptance of the piezoceramic wafer 1. Damping material D is
subsequently cast into the core mold F1. The core mold F1 is
designed such that the damping member 2 is designed with a collar
2a at its side facing away from the piezoceramic wafer 1~ The
finished transducer core 1/2 removed from the core mold F1 has its
collar 2a introduced into a recess F2a of a first shaped part F2
of a mold F2/F3 for the formation of an adapter and assembly member
3, see Figure 2. A second shaped part F3 of the mold F2/F3 is
introduced into the first shaped part F2 for forming an adapter and
assembly member 3 such that the collar 2a of the ~ransducer core
1/2 is at least partially enclosed by, first, the first shaped part
F2 and, second, by the second shaped part F3. Subsequently, an
adapter material A is injected into the mold F2/F3 formed by the

20~2~3~
first shaped part F2 and by the second shaped part F3 for the
formation of the adapter and assembly member 3. This is undertaken
in order to design the adapter and assembly member 3 so that it
completely surrounds the transducer core 1/2, except for an exposed
part of the collar 2a.
A further, preferred method conforming to an exemplary
embodiment of the invention provides that the piezoceramic wafer
1 provided with leads (not shown) that can be conducted toward the
outside is placed into the core mold F1 for the formation of the
transducer core 1/2, this core mold Fl comprising a recess F11
intended for the acceptance of the piezoceramic wafer 1.
Subsequently, damping material D is cast into the core mold Fl.
The core mold F1 is designed such that the damping member 2 has a
collar 2a at its side facing away from the piezoceramic wafer 1.
The finished transducer core 1/2 removed from the core mold F1 has
its collar 2a introduced into a recess F2a of a first shaped part
F2 of a mold F2/F3 for the formation of the adapter and assembly
member 3. For the formation of the adapter and assembly member 3,
a second shaped part F3 of the mold F2/F3 having an upwardly
directed opening F3a which accepts the transducer core is partially
filled with adapter material. Subsequently, the first shaped part
F2 together with the transducer core 1/2 directed down toward the
opening F3a of the second shaped part F3 is pressed into the
opening F3a of the second shaped part F3 until the two shaped parts
F2/F3 enter into engagement with one another. Thus, the adapter
material contained in the second shaped part F3 is displaced and
ascends around the entering transducer core 1/2 to form the adapter
and assembly member 3 (see Figure 3).
The aforementioned leads la, lb are preferably connected by
soft soldering to terminal pins 5a, 5b. These terminal pins 5a,
5b are enclosed in the damping member 3 such that they preferably
.'

2 0 ~ 2 ~ 3 !~
radially project toward the outside from the collar 2a in an anti-
twist fashion (see Figure ~).
According to another embodiment of the invention, the leads
la, lb, which are preferably connected by soft soldering to
terminal plug pins 6a, 6b are held at a connector plug socket 6
where they can be connected to. The connector plug socket is
enclosed in the damping member 2 when the damping member 2 is cast
such that the terminal plug pins 6a, 6b are aligned parallel to the
rotational axis of the transducer core 1/2 and are integrated in
the damping member 2 projecting from the side thereof facing away
from the piezoceramic wafer 1. The collar 2 is preferably designed
with a channel 7 for anti-twist protection (see Figures 5 and 6).
According to another embodiment of the invention, a step can
be provided for designing the adapter and assembly member 3 with
an annular channel 8 for the acceptance of a rubber ring 9 for
holding the adapter and assembly member 3 ~Figure 7).
The adapter and assembly member 3 can be designed as a
hollow cylinder closed at its ends; however, it can also be
expedient for assembly reasons that the end closing the hollow
cylinder is designed in the shape of a truncated cone.
It can be advantageously provided according to another
embodiment of the invention that the collar 2a is designed with a
ridge 10 for decoupling structure-borne noise and i8 provided with
an edge enlargement 11 for holding the damping member 2.
Although various minor changes and modifications might be
proposed by those skilled in the art, it will be understood that
we wish to include within the claims of the patent warranted hereon
all such changes and modifications as reasonably come within our
contribution to the art.

Representative Drawing
A single figure which represents the drawing illustrating the invention.
Administrative Status

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Event History

Description Date
Inactive: IPC expired 2022-01-01
Inactive: IPC from MCD 2006-03-11
Inactive: IPC from MCD 2006-03-11
Inactive: IPC from MCD 2006-03-11
Application Not Reinstated by Deadline 1994-03-23
Time Limit for Reversal Expired 1994-03-23
Inactive: Adhoc Request Documented 1993-09-23
Deemed Abandoned - Failure to Respond to Maintenance Fee Notice 1993-09-23
Application Published (Open to Public Inspection) 1992-03-26

Abandonment History

Abandonment Date Reason Reinstatement Date
1993-09-23
Owners on Record

Note: Records showing the ownership history in alphabetical order.

Current Owners on Record
SIEMENS AKTIENGESELLSCHAFT
Past Owners on Record
REINER HABRICH
VALENTIN MAGORI
Past Owners that do not appear in the "Owners on Record" listing will appear in other documentation within the application.
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Document
Description 
Date
(yyyy-mm-dd) 
Number of pages   Size of Image (KB) 
Cover Page 1992-03-25 1 19
Claims 1992-03-25 5 159
Abstract 1992-03-25 1 14
Drawings 1992-03-25 4 42
Descriptions 1992-03-25 5 196
Representative drawing 1999-07-06 1 2