Note: Descriptions are shown in the official language in which they were submitted.
~-`'LE,~tP~ T~ 7-~E~: 2 18 9 0 4 3
DP 1499 ~5 ~ T~ TRA~SI ATI~
Ho/ma
Diehl GmbH & Co, 90478 Nuremberg
Multi-part sealing casing
The invention relates to a multi-part sealing casing for
accommodating electrical comFonents, wherein the casing comprises a
frame, a bottom, a top and a multipoint connector fitted at one side
of the frame, wherein by being pushed in, by means of the multipoint
connector, the casing can be electrically and mechanically connected
to a counterpart plug in an electrical apparatus.
-Such casings which are made from plastic material have been on
the market for some years under the standardisation of the Personal
-Computer Memory Card International Association (PCMCIA), under the
technical designation of PCMC~A-cards. Those cards have between 35- to
88-pole sockets or plugs respectively, wherein in terms of quantity
68-pole plug connectors have acquired particular significance. In
their interior such casings accommodate electronic circuits, in
particular memory circuits which serve for PC-memories and fax or
modem control arrangements. However hard disc drives have also already
been fitted into such casings. The particular advantages thereof are
that the structural groups disposed therein are protected from
external influences on the one hand while on the other hand they can
be easily replaced by being fitted into plug-in mc~ of electrical
apparatuses. For PCs or fax devices for example but also for machine
control systems, that affords major options in regard to expansion of
their technical capabilities, and in particul æ also easier
adaptability to differing customer requirements.
~ ~futurc`thc n~,~cr o~ cl~ al ~L ~c~ul~l y~-~u~ L~ 1.~
be disposed in such a casing will increase, with t~ . L~It that on
the one hand the packing de~ y ~l~ on the other hand the heat
generated by th~ components will increase more and more. Packing
iiL~-c~ bc i..~.c~os~d ~ hc ao c~ll~d clli~ ~ b~rd tcchno~lo~g~
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1 av -
In future the number of electrical structural groups which are to
be disposed in such a casing will increase, with the result that on
the one hand the packing denslty and on the other hand the heat
genera~ed by those ccnFonents will increase more and more. Packing
density can be increased by the so-called chip-on-board technology
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which however presupposes that such casings are hermetically sealed as
the components are no longer themselves encapsulated in the casing. On
the other hand the increased packing density means that the heat output
per unit of volume rises.
Plastic casings are not hermetlcally sealing and are no longer
satisfactory for such future uses. In addition their heat emission to the
exterior is slight. Metal casings are therefore a choice means for
meeting the above-mentioned future requirements. Casings of high-quality
steel which initially present themselves for purposes of that kind
however can no longer be adequately equal to higher levels of
requirements in regard to thermal conductivity.
- It is already known from Patent Abstracts of Japan, Volume 15, No
2 (M-1065), corresponding to JP-A-2 255 394 of 07.01.91, in an IC-card,
~ to provide a frame of aluminium alloy, and to mount thereon a respective
metal plate comprising a bottom and a top. The housing is closed off by a
multipoint connector in the frame.
The aim of the present invention is therefore that of proposing a
casing for such uses, which affords the possibility of hermetic sealing
integrity, with at the same time a high level of thermal conductivity and
good casing strength.
To attain that object the invention proposes the features
characterised in claim 1.
The invention is based on the notion that optimum properties in
respect of such a casing are afforded if its two main technical
requirements are met by use of materials which are optimised for the
respectively intended purpose. In other words, those parts of the casing
in regard to which the important consideration is radiation of heat are
made from a material with a high thermal conductivity capability, namely
a copper alloy,
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21 89343
h h ~'~ r~ ~9~^ th~ ~~ cn~jr~C ~ h^~tic~ll~
the components are no longer themselves encapsulated in the casing ~On
the other hand the increased packing density means that th ~ heat
output per unit of volume rises.
Plastic casings are not hermetically sealing and ~ no longer
satisfactory for such future uses. In addition their ~ t emission to
the exterior is slight. Metal casings are therefore~ choice means for
meeting the above-mentioned future requiremen ~ Casings of high-
quality steel which initially present themse ~ s for purposes of that
kind however can no longer be adequately/equal to higher levels of
requirements in regard to thermal condu ~ vity.
The aim of the present invention~ s therefore that of proposing a
casing for such uses, which af~ rds the possibility of hermetic
~ sealing integrity, with at ~ same time a high level of thermal
conductivity and good casin ~strength.
To attain that o ~ ct the invention proposes the features
characterised in clai~ l;
The inventio ~ s based on the notion that optimum properties in
respect of s ~ a casing are afforded if its two main technical
requirement~are met by use of materials which are optimised for the
respecti ~ y intended purpose. In other words, those parts of the
casin ~in regard to which the important consideration is radiation of
hea~ ~ are made from a material with a high thermal conductivity
~ y, name~ m~ al~ whereas those parts of the casing
which electrically connect the structural groups in its interior to
the outside world, namely the multipoint connector, are formed from
another material which permits a good sealing action and in particular
a hermetic sealing effect.
In accordance with a development of the invention it is provided
that the second material, that is to say the material for the
multipoint connector, comprises a second copper material which is
pressure-englazable. That makes it possible to achieve hermetic
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sealing integrity for the metal lead-through means in the multipoint
connector. The other parts of the casing, namely the frame, the
bottom and the top are hermetically sealingly closed to each other
and to the multipoint connector by soldering or by laser welding
together.
In accordance with another development the invention provides
that the multipoint connector comprises a ceramic, such as for
example A12~3 in a high state of purity. In this case there is no
need for the mutual insulation of the metal lead-through means by the
multipoint connector as the ceramic is a very good insulator.
In accordance with the invention it is immaterial whether at its
outward side of the casing the multipoint connector has sockets or
plug portions. For mechanical reasons however the arrangement of
sockets is preferred as the mechanical loading is lower when the
connector is fitted together with the counterpart plug member.
A further embodiment of the invention provides that the casing is
hermetically sealing and has tw~ multipoint connectors which are
arranged one behind the other and of which the multipoint connector
which is inward of the casing comprises the second copper material or
the ceramic, has hermetically sealing metal lead-through means and is
electrically connected to a multipoint connector which is outward of
the casing, the latter ccmprising ~lQotio ~-tori~ ~vllly ~ c~ g
properties and carrying the external plugs - or sockets - ~ are
operatively connected to the counterpart plug. The c ~ 11 be of
such a design configuration when the casi ~ very frequently
plugged in and unplugged, that is to s ~ rticularly high and/or
frequent mechanical loading occu ~ the region of the multipoint
connector. Here the se ~ on of the function of affording
hermetic sealing int ~ y and the aspect of carrying mechanical
forces, to all ~ e them to two multipoint connectors, is
advantageous ~
In ~ rdance with a further development of the invention the
fjv~ p~r m~Gri~l ca.~ oomr~;C^ ~ry pure co~er or a copper alloy
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3~,
plastic material, having no sealing properties and carrying the external
plugs - or sockets - which are operatively connected to the counterpart
plug. The casing will be of such a design conflguration when the casing
is very frequently plugged in and unplugged, that is to say a
particularly high and/or frequent mechanical loading occurs in the
region of the multipoint connector. Here the separation of the function
of affording hermetic sealing integrity and the aspect of carrying
mechanical forces, to allocate them to two multipoint connectors, is
advantageous.
In accordance with a further development of the invention the
first copper material can comprise very pure copper or a copper alloy
which affords good thermal conductivity such as for example CuFe2P or a
commercially available copper-nickel-silicon alloy (CuNiSi).
As a further preferred embodiment of the invention it is provided
that the second copper material comprises a pressure-englazable alloy,
such as for example CuNi9Sn8, CuCrZr or a CuNiSi-alloy produced in
accordance with a new method, with properties which differ from the
commercially available CuNiSi-alloys.
The invention will be described in greater detail hereinafter with
reference to the drawing in which:
Figure 1 is a view of a casing according to the invention,
Figure 2 is a view of a multipoint connector from above,
Figure 3 is a view of the multipoint connector looking in the
direction indicated by the arrow A in Figure 2,
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~. ,.
h ~ffor~ n~ tivity such ~ f~r ~"~ ~ 6r
a co~mercially av~ hle copper-nickel-silicon alloy (CuNi ~
As a further preferred embodiment of the invention ~ is provided
that the second copper material camprises a f sure-engl a7.~l e
alloy, such as for ex~l~le CuNi9Sn8, Cu ~ or a CuNiSi-alloy
produced in accordance with a new me ~ d, with properties which
differ fram the c~,l"eLcially av~ ~ C~NiSi-alloys, as is described
for example in our patent app ~ ion No P .... .
The invention wil ~ described in greater detail hereinafter
with reference to ~ drawing in which:
Figure 1 ~ view of a casing according to the invention,
Figu ~ is a view of a multipoint connector fram above,
e 3 is a view of the multipoint connector looking in the
~t~ dlcated ~y ~he~~ .. R in Figuro 2,1
Figure 4 is a view of a hermetically sealing multipoint connector
when two multipoint connectors are provided in the casing,
Figure 5 is a view of the multipoint connector of Figure 4
viewing in the direction indicated by the arrow B,
Figure 6 shows a frame portion for receiving a single multipoint
connector,
Figure 7 shows a frame portion for receiving two multipoint
connectors,
Figure 8 shows the frame portion with an inserted multipoint
connector,
Figure 9 shows the frame portion with two inserted multipoint
connectors,
Figure 9a is a view on an enlarged scale of the connection of the
two multipoint connectors of Figure 9, and
Figure 10 is a view in section taken along line X-X in Figure 3
when using a ceramic multipoint connector.
Figure 1 is a perspective view of such a casing 1 camprising a
frame 2, a top 3, a multipoint connector 4 and a bottom portion 5
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(not visible). Although not visible in the drawing, arranged in the
casing on a circuit board are electronic structural groups which are
electrically connected to the multipoint connector 4, in particular
the sockets 6 arranged thereon.
The frame 2, the top 3 and the bottom 5 are optimised in regard
to a high level of thermal conductivity, by the selection of
-~ ~e ~' ~ cc ~;Lee ~UII~OnellL~ L \~ely ~ULë ~
~ ant consideration is the best level of th~rm~l conductivity and
not a ~ h level of strength. However copper alloys with good thermal
conductiv ~y and high strength are preferably used. In this case, it
is possible ~ use commercially avAilAhle alloys such as CuFe2P or
CuNiSi but als ~ other copper alloys which are suitable as conductor
material for elec ~onic components.
The purpose of ~ multipoint connector, as a part of the casing,
is on the one hand~to carry the mechanical loading with the
counterpart plug portion ~not shown) of an electrical apparatus, and
on the other hand to provl~e for a sealing electrical lead-through
effect, preferably however a ~ ermetically sealing electrical lead-
through effect. Therefore, a mat ~ ial which is optimised in terms of
that function is to be selected for~ uch a multipoint connector. That
can be either copper alloys with spec ~ 1 properties or ceramics with
a high insulation effect. Suitable co~ er alloys which have the
desired properties are those which are ~ ressure-englazable. The
pressure-englazing operation makes it possib ~ for metal conductors
to be passed through a wall of the casing in ~ rmetically sealing
relationship. Alloys having properties of that kl` ~ are for example
CuNi9Sn8, CuCrZr and CuNiSiCr, as are cull~leLcially ~ vAilAhle, or
however special CuNiSi-alloys which are produced in acco ~ance with a
particular method as are described in patent ~rp1icAtion No~P .... .
Figure 2 is a view from above of a multipoint connector 4 ~ igure
3 is a view of the multipoint connector looking in the dire~ ion
indicated by the arrow A in Figure 2. It will be seen that sockets\
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5 ~
material. Those three components could be of very pure copper if the
important consideration is the best level of thermal conductivity and
not a high level of strength. According to the invention however copper
alloys with gocd thermal conductivity and high strength are used. In
this case, it is possible to use commercially available alloys such as
CuFe2P or CuNiSi but also other copper alloys which are suitable as
conductor material for electronic components.
The purpose of the multipoint connector, as a part of the casing,
is on the one hand to carry the mechanical loading with the counterpart
plug portion (not shown) of an electrical apparatus, and on the other
hand to provide for a sealing electrical lead-through effect, preferably
- however a hermetically sealing electrical lead-through effect.
Therefore, a material which is optimised in terms of that function is to
be selected for sucn a multipoint connector. That can be either copper
alloys with special properties or ceramics with a high insulation
effect. Suitable copper alloys which have the desired properties are
those which are pressure-englazable. The pressure-englazing operation
makes it possible for metal conductors to be passed through a wall of
the casing in hermetically sealing relationship. Alloys having
properties of that kind are for example CuNi9Sn8, CuCrZr and CuNiSiCr,
as are commercially available, or however special CuNiSi-alloys which
are produced in accordance with a particular method.
Figure 2 is a view from above of a multipoint connector 4. Figure
3 is a view of the multipoint connector looking in the direction
indicated by the arrow A in Figure 2. It will be seen that sockets 6
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are arranged on the side of the multipoint connector, which is
outward of the casing, whereas metal plugs 7 project on the side
which is inward of the casing, the plugs 7 being electrically
connected to the sockets 6 in the interior of the multipoint
connector.
The described multipoint connector, in this case comprising
ceramic A12O3, has 68 sockets and an equal number of plugs. The
arrangement of the sockets 6 and the plugs 7 in the multipoint
connector 4 is produced by soldering, thereby permitting hermetically
sealing integrity in respect of the locations where the metal
cc~ponents pass through the multipoint connector. The procedure for
producing that soldering effect is however not subject-matter of this
invention.
In those cases in which the loading on the multipoint connector 4
by virtue of being frequently plugged into and unplugged frc,m an
apparatus is particularly high, it may be expedient for the
multipoint connector to be specifically designed for a high
mechanical loading at the outward side of the casing, but to take
away from it the function of affording sealing integrity. In such a
case it may be desirable to provide in the casing a second multipoint
connector 8 which performs the function of affording hermetic sealing
integrity. For that purpose, the multipoint connector which comprises
one of the above-mentioned pressure-englazable materials has an equal
number of metal leao-through means 9 which are hermetically sealingly
disposed in the multipoint connector 8. Presure englazing of the
metal lead-through means 9 in the multipoint connector 8 is effected
in the usual manner and is also not subject-matter of this invention.
Figure 6 shows a frame portion 2 which is prepared to receive an
individual multipoint connector when the multipoint connector
simultaneously permits hermetic sealing integrity to be achieved, as
was described on the multipoint connector with reference to Figures 2
and 3. Figure 7 shows a frame portion 2 which is suitable for
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receiving two multipoint connectors, namely a multipoint connector 8
in the position inwardly of the casing and a multipoint connector 4
in the position outwardly of the casing, the multipoint connector 4
comprising plastic material and not having any sealing metal lead-
through means. Multipoint connectors of that kind are ccmmerciallyavailable and do not need to be described in greater detail.
Figure 8 shows a multipoint connector 4 fitted into the frame
portion 2. In Figure 9 multipoint connectors 4 and 8 are fitted into
the frame portion. Figure 9a shows on an enlarged scale that the
plugs of the multipoint connectors 4 and 8 are connected together by
wires.
As already described, the multipoint connector 4 can ccmprise
ceramic material. That material has the advantage that it is a goc~
insulator and therefore insulation problems as between the various
metal lead-through means do not occur. However in order that the
metal lead-through means can be hermetically sealingly fitted in the
bores in the multipoint connector, it is necessary for those bores to
be metallised so that it is possible to solder the socket and the
plug in the bore. Figure 10 is a view in section taken along line X-X
in Figure 3, showlng how such a lead-through means looks. The insides
of the bores 12 in the ceramic body 4 are metallised, the socket 10 on
which a metal wire 11 serving as a plug is arranged is pushed into
the bore 12 and it is hermetically sealingly secured there by
soldering. So that the multipoint connector 4 of ceramic can be
hermetically sealingly connected to the rest of the casing, that is
to say the frame 2, the bottom 5 and the top 3, the corresponding
contact surfaces of the multipoint connector 4 must also be
metallised. In that case a hermetically sealing connection is
possible between those cc~onents, by means of soldering or laser
welding. Met~ ation of the ceramic body can be effected for
example with tungsten or molybdenum.
-r.
