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Patent 2492538 Summary

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(12) Patent Application: (11) CA 2492538
(54) English Title: VALVE ASSEMBLY FOR MICROFLUIDIC DEVICES, AND METHOD FOR OPENING AND CLOSING SAME
(54) French Title: ENSEMBLE DE SOUPAPE POUR DISPOSITIFS MICROFLUIDIQUES ET PROCEDE POUR OUVRIR ET FERMER CET ENSEMBLE
Status: Deemed Abandoned and Beyond the Period of Reinstatement - Pending Response to Notice of Disregarded Communication
Bibliographic Data
(51) International Patent Classification (IPC):
  • B01L 03/02 (2006.01)
  • B01L 03/00 (2006.01)
  • F16K 01/00 (2006.01)
  • F16K 01/10 (2006.01)
  • G01N 01/10 (2006.01)
(72) Inventors :
  • MEAD, DENNIS E. (United States of America)
  • BRYNING, ZBIGNIEW T. (United States of America)
(73) Owners :
  • APPLERA CORPORATION
(71) Applicants :
  • APPLERA CORPORATION (United States of America)
(74) Agent: MARKS & CLERK
(74) Associate agent:
(45) Issued:
(86) PCT Filing Date: 2003-07-23
(87) Open to Public Inspection: 2004-02-05
Examination requested: 2005-01-14
Availability of licence: N/A
Dedicated to the Public: N/A
(25) Language of filing: English

Patent Cooperation Treaty (PCT): Yes
(86) PCT Filing Number: PCT/US2003/022897
(87) International Publication Number: US2003022897
(85) National Entry: 2005-01-14

(30) Application Priority Data:
Application No. Country/Territory Date
10/336,274 (United States of America) 2003-01-03
10/336,706 (United States of America) 2003-01-03
10/403,640 (United States of America) 2003-03-31
10/403,652 (United States of America) 2003-03-31
10/426,587 (United States of America) 2003-04-30
60/398,851 (United States of America) 2002-07-26
60/398,946 (United States of America) 2002-07-26

Abstracts

English Abstract


A normally open fluid manipulation valve assembly (20) and system, and a
method for closing, re-opening and re-closing same. The normally open valve
assembly can include a substrate (22) including a first surface, with first
and second recesses (28, 30) formed in the first surface. A recessed channel
(34) can be formed in the first surface. The recessed channel can extend from
the first recess to the second recess and can be at least partially defined by
a first deformable material (42) having a first modulus of elasticity. The
valve assembly can also include an elastically deformable material (32) having
a modulus of elasticity that is greater than the modulus of elasticity of the
first deformable material, and an adhesive layer (44) that contacts the first
surface.


French Abstract

La présente invention concerne un ensemble de soupape de manipulation fluidique (20) normalement ouverte, un système correspondant et un procédé pour fermer, rouvrir et refermer ledit ensemble. Ledit ensemble de soupape de manipulation fluidique normalement ouverte peut comprendre un substrat (22) présentant une première surface, avec des premiers et seconds évidements (28, 30) formés dans cette première surface. Un canal en retrait (34) peut être ménagé dans la première surface. Ce canal en retrait peut s'étendre du premier évidement au second évidement et peut être au moins partiellement défini par un premier matériau déformable (42) qui présente un premier module d'élasticité. L'ensemble de soupape selon cette invention peut également comprendre un matériau à déformation élastique (32), qui présente un module d'élasticité supérieur au module d'élasticité du premier matériau déformable, ainsi qu'une couche adhésive (44), qui est en contact avec la première surface.

Claims

Note: Claims are shown in the official language in which they were submitted.


-14-
WHAT IS CLAIMED IS:
1. A valve assembly comprising:
a substrate including;
a first surface;
a first recess formed in the first surface;
a second recess formed in the first surface; and
a recessed channel that is recessed relative to the first surface of the
substrate
and extending from the first recess to the second recess, the recessed channel
being at least
partially defined by a first deformable material having a first modulus of
elasticity;
an elastically deformable cover including;
a layer of an elastically deformable material having a modulus of elasticity
that
is greater than the modulus of elasticity of the first deformable material;
and
an adhesive layer in contact with the first surface of the substrate;
wherein the elastically deformable cover covers the recessed channel and forms
a
fluid communication between the first and second recesses when the elastically
deformable
cover layer is in a non-deformed state.
2. The valve assembly of claim 1, wherein in a deformed state of the
elastically
deformable cover, the adhesive layer is capable of contacting the recessed
channel.
3. The valve assembly of claim 1, wherein the substrate comprises a
polycarbonate material.
4. The valve assembly of claim 1, wherein the substrate comprises a cyclic
olefin
copolymer material.
5. The valve assembly of claim 1, wherein the adhesive layer comprises a
pressure sensitive adhesive.
6. The valve assembly of claim 1, wherein the adhesive layer comprises a hot
melt adhesive.
7. A system comprising:
a valve assembly including;
a substrate including;
a first surface;
a first recess formed in the first surface;
a second recess formed in the first surface; and

-15-
a recessed channel that is recessed relative to the first surface of
the substrate and extending from the first recess to the second recess, the
recessed
channel being at least partially defined by a first deformable material having
a first
modules of elasticity;
an elastically deformable cover including;
a layer of an elastically deformable material having a modules of
elasticity that is greater than the modules of elasticity of the first
deformable material;
and
an adhesive layer in contact with the first surface of the
substrate;
wherein the elastically deformable cover covers the recessed channel
and forms a fluid communication between the first and second recesses when the
elastically deformable cover layer is in a non-deformed state;
a platform including at least one holder for supporting the valve assembly;
and
a first deformer including a drive unit capable of driving the first deformer
toward the
valve assembly and applying a deforming force to at least one of the
elastically deformable
cover and the deformable material of the recessed channel.
8. The system of claim 7, wherein the first deformer is capable of forcing the
adhesive layer against the recessed channel to prevent fluid communication
between the first
and second recesses.
9. The system of claim 8, wherein the first deformer includes a distal tip and
an
electrically resistive heater at or adjacent the distal tip.
10. The system of claim 7, wherein the first deformer includes a channel blade
that is capable of being driven by the drive unit to deform the elastically
deformable cover
and the material defining the recessed channel.
11. The system of claim 10, wherein the drive unit is further capable of
bringing
the first deformer out of contact with the elastically deformable cover such
that the cover
elastically rebounds faster than the deformed material of the recessed channel
and a fluid
communication results between the first and second recesses by way of a fluid
communication opening.

-16-
12. The system of claim 7, wherein the substrate comprises a polycarbonate
material.
13. The system of claim 7, wherein the substrate comprises a cyclic olefin
copolymer material.
14. The system of claim 7, wherein the adhesive layer comprises a pressure
sensitive adhesive.
15. The system of claim 7, wherein the adhesive layer comprises a hot melt
adhesive.
16. A valve assembly comprising:
a substrate including;
a first surface;
a first recess formed in the first surface;
a second recess formed in the first surface;
a recessed channel that is recessed relative to the first surface of the
substrate
and extends from the first recess to the second recess; and
a deformation channel that is recessed relative to the recessed channel and
extends from the first recess to the second recess;
wherein the recessed channel and the deformation channel are at least
partially
defined by a first deformable material having a first modulus of elasticity;
an elastically deformable cover including;
a layer of an elastically deformable material having a modulus of elasticity
that
is greater than the modulus of elasticity of the first deformable material;
and
an adhesive layer in contact with the first surface of the substrate;
wherein, in a deformed state of the elastically deformable cover, a portion of
the
elastically deformable cover is spaced from the deformation channel and forms
a fluid
communication opening between the first and second recesses.
17. The valve assembly of claim 16, wherein the substrate comprises a
polycarbonate material.
18. The valve assembly of claim 16, wherein the substrate comprises a cyclic
olefin copolymer material.
19. The valve assembly of claim 16, wherein the adhesive layer comprises a
pressure sensitive adhesive.

-17-
20. The valve assembly of claim 16, wherein the adhesive layer comprises a hot
melt adhesive.
21. A system comprising:
a valve assembly including;
a substrate including;
a first surface;
a first recess formed in the first surface;
a second recess formed in the first surface;
a recessed channel that is recessed relative to the first surface of the
substrate and extends from the first recess to the second recess; and
a deformation channel that is recessed relative to the recessed channel
and extends from the first recess to the second recess;
wherein the recessed channel and the deformation channel are at least
partially defined by a first deformable material including a first modulus of
elasticity;
an elastically deformable cover including;
a layer of an elastically deformable material having a modulus of
elasticity that is greater than the modulus of elasticity of the first
deformable material;
and
an adhesive layer in contact with the first surface of the
substrate;
wherein, in a deformed state of the elastically deformable cover, a
portion of the elastically deformable cover is spaced from the deformation
channel and forms a fluid communication opening between the first and
second recesses.
a platform including at least one holder for supporting the valve assembly;
and
a first deformer including a drive unit capable of driving the first deformer
toward the
valve assembly and applying a deforming force to the elastically deformable
cover.
22. The system of claim 21, wherein the first deformer includes a contact pad
disposed at one end thereof, the first deformer being capable of being driven
by the drive unit
such that the pad can contact the elastically deformable cover layer and force
adhesive of the
adhesive layer into the deformation channel to close the fluid communication
between the
first and second recesses.

-18-
23. The system of claim 22, wherein the contact pad of the first deformer
includes
an electrically resistive heater disposed at or adjacent the one end of the
first deformer.
24. The system of claim 22, wherein the drive unit is further capable of
bringing
the first deformer out of contact with the elastically deformable cover after
closing the fluid
communication opening between the first and second recesses.
25. The system of claim 21, wherein the substrate comprises a polycarbonate
material.
26. The system of claim 21, wherein the substrate comprises a cyclic olefin
copolymer material.
27. The system of claim 21, wherein the adhesive layer comprises a pressure
sensitive adhesive.
28. The system of claim 21, wherein the adhesive layer comprises a hot melt
adhesive.
29. A method comprising:
providing a valve assembly including:
a substrate including;
a first surface;
a first recess formed in the first surface;
a second recess formed in the first surface; and
a recessed channel that is recessed relative to the first surface of
the substrate and extending from the first recess to the second recess, the
recessed
channel being at least partially defined by a first deformable material having
a first
modulus of elasticity;
an elastically deformable cover including;
a layer of an elastically deformable material having a modulus of
elasticity that is greater than the modulus of elasticity of the first
deformable material;
and
an adhesive layer in contact with the first surface of the substrate;
wherein the elastically deformable cover covers the recessed channel
and forms a fluid communication between the first and second recesses when the
elastically
deformable cover layer is in a non-deformed state;

-19-
driving a first deformer against the elastically deformable cover to deform
the cover
and force the adhesive layer against the recessed channel to prevent fluid
communication
between the first and the second recesses.
30. The method of claim 29, further comprising transferring heat energy from
the
first deformer to the adhesive layer when the first deformer is driven against
the deformable
cover.
31. The method of claim 29, further comprising bringing the first deformer out
of
contact with the elastically deformable cover, whereby the adhesive layer
adheres the
deformable material of the cover against the recessed channel to prevent fluid
communication
between the first and the second recesses.
32. The method of claim 29, further comprising driving the first deformer
against
the elastically deformable cover to deform the deformable material of the
recessed channel.
33. The method of claim 32, further comprising bringing the first deformer out
of
contact with the elastically deformable cover such that the cover elastically
rebounds faster
than the deformed material of the recessed channel and a fluid communication
results
between the first and second recesses.
34. A method of closing a fluid communication between a first recess and a
second recess of a valve assembly, comprising:
providing a valve assembly including;
a substrate including;
a first surface;
a first recess formed in the first surface;
a second recess formed in the first surface;
a recessed channel that is recessed relative to the first surface of the
substrate and extends from the first recess to the second recess; and
a deformation channel that is recessed relative to the recessed channel
and extends from the first recess to the second recess;
an elastically deformable cover including;
a layer of an elastically deformable; and
an adhesive layer in contact with the first surface of the
substrate;

-20-
driving a first deformer including a contact pad disposed at one end thereof
against
the elastically deformable cover such that the contact pad forces adhesive of
the adhesive
layer into the deformation channel to close the fluid communication opening
between the
first and second recesses.
35. The method of claim 34, further comprising transferring heat energy from
the
contact pad of the first deformer to the adhesive.
36. The method of claim 34, further comprising bringing the first deformer out
of
contact with the elastically deformable cover.
37. The method of claim 34, wherein the second recess retains a purification
material.

Description

Note: Descriptions are shown in the official language in which they were submitted.


CA 02492538 2005-O1-14
WO 2004/011149 PCT/US2003/022897
-1-
VALVE ASSEMBLY FOR MICROFLUIDIC DEVICES, AND
METHOD FOR OPENING AND CLOSING SAME
CROSS REFERENCE TO RELATED APPLICATION
[0001] The present application claims priority benefit from U.S. Patent
Applications
Nos. 10/336,274, filed January 3, 2003, 10/336,706, filed January 3, 2003,
10/403,652, filed
March 31, 2003, 10/403,640, filed March 31, 2003, 10/426,587, filed April 30,
2003, U.S.
Provisional Patent Applications Nos. 60/398,851, filed July 26, 2002, and
60/398,946, filed
July 26, 2002. All U. S. Patent Applications and U.S. Provisional Patent
Applications
mentioned herein are incorporated herein in their entireties by reference.
FIELD
[0002] The assemblies, systems, and methods described herein relate to
microfluidic
devices. More particularly, the present teachings relate to valve assemblies
for use in
microfluidic devices that can be opened and closed to manipulate, process, or
otherwise alter
micro-sized amounts of fluids and fluid samples.
BACKGROUND
[0003] Microfluidic devices are useful for manipulating fluid samples through
the use
of openable and closeable valves. There continues to exist a demand for valves
for use in
microfluidic devices, and methods for such valves, that allow for the
processing of a large
number of fluid samples simultaneously, quickly, .and reliably.
SUMMARY
[0004] According to various embodiments, a valve assembly is provided. The
valve assembly
can include a substrate including a first surface, with first and second
recesses formed in the
first surface. A recessed channel can be formed in the.first surface and the
recessed channel
can be recessed relative to the first' surface. The recessed channel can
extend from the first
recess to the second recess, and can be at least partially defined by a first
deformable material
having a first modules of elasticity.
[0005] The valve assembly can also include an elastically deformable cover.
The
elastically deformable cover can include a layer of an elastically deformable
material having a
modules of elasticity that is greater than the modules of elasticity of the
first deformable
material. An adhesive layer can contact the first surface of the substrate.
The elastically
deformable cover can be arranged to cover the recessed channel and form a
fluid

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-2-
communication between the first and second recesses when the elastically
deformable cover
layer is in a non-deformed state.
[0006] According to various embodiments, a system can be provided including
the valve
assembly described above. The system can further include a platform including
at least one
holder for holding the assembly, as well as a first deformer. A drive unit can
be capable of
driving the first deformer toward the assembly and can be capable of applying
a deforming
force to at least one of the elastically deformable cover and the deformable
material of the
recessed channel. The first deformer can be capable of forcing the adhesive
layer against the
recessed channel to prevent fluid communication between the first and second
recesses.
[0007] According to various embodiments, a closed valve assembly can be re-
opened. The
drive unit of the system can be capable of driving the first deformer
including a channel blade
to deform the elastically deformable cover and the material of the recessed
channel. The
drive unit can also be capable of bringing the first deformer out of contact
with the elastically
deformable cover such that the cover elastically rebounds faster than the
deformed 'material
of the recessed channel. A fluid communication can thereby be formed between
the first and
second recesses by way of a fluid communication opening.
[0008] According to various embodiments, the re-opened valve assembly can be
re-closed.
To re-close the valve assembly, the drive unit can include a deformer
including a contact pad
disposed at one end thereof. The deformer can be driven by the drive unit such
that the pad
can contact the elastically deformable cover layer and force adhesive of the
adhesive layer
into the deformation channel to close the fluid communication between the
first and second
recesses.
[0009] According to various embodiments, methods are provided for closing an
initially open
fluid communication situated between two recesses of a microfiuidic assembly,
and then re-
opening, and then re-closing the fluid communication.
[00010] According to various embodiments, the valve assembly and system, and
the method
of opening and closing the valve assembly, allow for the processing of a large
number of
samples, such as micro-sized amounts of fluids and fluid samples,
simultaneously, quickly,
and reliably.
[00011] Additional features and advantages of various embodiments will be set
forth in part in
the description that follows, and in part will be apparent from the
description, or may be learned
by practice of various embodiments. The objectives and other advantages of
various embodiments

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-3-
will be realized and attained by means of the elements and combinations
particularly pointed out in
the description herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[00012] Fig. lA is a partial cut-away top view of a substrate layer of a
substrate layer of a fluid
manipulation valve assembly according to various embodiments, shown in an
initial non-actuated
stage;
[00013] Fig. 1B is a cross-sectional side view of the fluid manipulation valve
assembly shown
in Fig. lA, taken along line 1B-1B of Fig. lA, and in an initial non-actuated
stage;
[00014] Fig. 2A is a top view of the substrate layer of the fluid manipulation
valve assembly
according to various embodiments, shown without an elastically deformable
cover and in a first
stage of actuation ofthe valve assembly;
[00015] Fig. 2B is a cross-sectional side view of the fluid manipulation valve
assembly shown
in Fig. 2A, taken along line 2B-2B as shown in Fig. 2A, and shown with the
elastically deformable
cover in a deformed state corresponding to the first stage of actuation;
[00016] Fig. 3A is a top view of the substrate layer of the fluid manipulation
valve assembly
according to various embodiments, shown without the elastically deformable
cover and in a
second stage of actuation of the valve assembly;
[00017] Fig. 3B is a cross-sectional side view of the fluid manipulation valve
assembly shown
in Fig. 3A, taken along line 3B-3B of Fig. 3A, and shown with the elastically
deformable cover in
a further deformed state corresponding to the second stage of actuation;
[00018] Fig. 4A is a top view of the substrate layer of the fluid manipulation
valve assembly
according to various embodiments, shown without the elastically defornlable
cover and in a third
stage of actuation of the valve assembly;
[00019] Fig. 4B is a cross-sectional side view of the fluid manipulation valve
assembly shown
in Fig. 4A, taken along line 4B-4B of Fig. 4A, and shown with the elastically
deformable cover
partially rebounded from the substrate layer corresponding to the third stage
of actuation;
[00020] Fig. SA is a top ~riew of the substrate layer of the fluid
manipulation valve assembly
according to various embodiments, shown without the elastically deformable
cover and,prior to a
fourth stage of actuation of the valve assembly;
[00021] Fig. SB is a cross-sectional side view of the fluid manipulation valve
assembly shown
in Fig. SA, taken along line SB-SB of Fig. SA, and shown with the elastically
deformable cover
partially rebounded from the substrate layer.

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[00022] Fig. 6A is a top view of the substrate layer of the fluid manipulation
valve assembly
according to various embodiments, shown without the elastically deformable
cover and in a fourth
stage of actuation of the valve assembly;
[00023] Fig. 6B is a cross-sectional side view of the fluid manipulation valve
assembly shown
in Fig. 6A, taken along line 6B-6B of Fig. 6A, and shown with the elastically
deformable cover in
a further deformed state, whereby the valve assembly has been re-closed
corresponding to the
fourth stage of actuation;.
[00024] Fig. 7 is a perspective view of the substrate layer of the fluid
manipulation valve
assembly according to various embodiments.
[00025] It is to be understood that both the foregoing general description and
the following
detailed description are exemplary and explanatory only, and are intended to
provide an
explanation of various embodiments of the present teachings.
DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS
[00026] Fig. 1A shows a partial cut-away top view of a substrate layer portion
22 of a
fluid manipulation valve assembly 20 according to various embodiments. At
least two
recesses 28, 30 can be formed in the substrate layer 22, and can be separated
by an
intermediate wall 32. The intermediate wall 32 can define an area of a valve
26 that can be
manipulated to control fluid communication between the two recesses 28, 30.
The
intermediate wall 32 can be formed from a deformable material that can be
inelastically or
elastically deformable. According to various embodiments, the entire substrate
layer 22 can
include an inelastically or elastically deformable material.
[00027] According to various embodiments, the substrate layer 22 of the
assembly 20 can
include a single layer of material, a coated layer of material, a mufti-
layered material, and
combinations thereof. Various other characteristics ofthe substrate layer 22,
such as dimensions,
different levels and layers of recesses, as well as other properties, for
example, are described in
U.S. Patent Application No. 10/336,274, filed January 3, 2003, to Bryning et
al. (hereinafter
Bryning et al.), which has been incorporated herein in its entirety by
reference above. An
exemplary substrate can be made of a single-layer substrate of a non-brittle
plastic material, such
as polycarbonate or TOPAS, a plastic cyclic olefin copolymer material
available from Ticona
(Celanese AG), Summit, New Jersey, USA
[00028] According to various embodiments, plastics can be used to form the
components
of the valve assembly 20, such as the substrate layer 22. The plastics can
include

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polycarbonate, polycarbonate/ABS blends, ABS, polyvinyl chloride, polystyrene,
polypropylene oxide, acrylics, polybutylene terephthalate and polyethylene
terephthalate
blends, nylons, .blends of nylons, and combinations thereof. Additional
materials used to
form the valve assembly 20, for example, are disclosed in Bryning et al.
[00029] According to various embodiments, the substrate layer 22 can be rrlade
of a
material, for example, glass or plastic, that can withstand thermal cycling at
temperatures
between 60°C, and 95°C, as for example, experienced while
performing polymerase chain
reaction (PCR). Furthermore, the material should be sufficiently strong to
withstand a force
necessary to achieve manipulation of a fluid sample through the assembly 20,
for example,
centrifugal force necessary to spin and manipulate a sample within the
assembly 20.
[00030] Fig. 1B is a cross-sectional side view of the valve 26 shown in Fig.
lA, taken
along line 1B-1B of Fig. lA. The valve 26 can include an elastically
deformable cover
including a cover layer 42 and an adhesive layer 44. The adhesive layer 44 can
include, for
example, a pressure sensitive or hot melt adhesive, disposed between the
substrate layer 22
and the elastically deformable cover layer 42. The elastically deformable
cover can be
attached to a surface 24 of the substrate layer 22 by way of any conventional
attachment
procedure. For example, the cover layer 42 can be heat welded to the surface
24 of the
substrate layer 22. According to various embodiments, the elastically
deformable cover layer
42 and the adhesive layer 44 can be transparent. However, according to various
embodiments, either or both of these layers can be opaque.
[00031] According to various embodiments, the elastically deformable cover can
cover
portions of the recess-containing substrate layer 22 in areas where a portion
of the substrate
layer 22 is to be deformed. For example, the cover can cover any number of a
plurality of
recesses serially aligned, au of the recesses, or the area comprising the
intermediate wall 32.
The cover can partially cover one or more recesses, chambers, inlet ports,
ducts, and the like.
The cover layer 42 of the cover can have elastic properties that enable it to
be temporarily
deformed as a deformer contacts and deforms the intermediate wall 32, for
example,
underneath the cover layer 42, as disclosed, for example, in Bryning et al.
[00032] As shown in Fig. 1B, a height of the intermediate wall 32 between the
recesses
28, 30 can be formed with a depression relative to a surface 24 of the
substrate layer 22,
thereby forming a recessed channel 34. Moreover, the non-depressed portion of
the
intermediate wall 32 can be flush with a top surface 24 of the recess-
containing substrate

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layer 22 of the assembly 20. As illustrated in Fig. 1B, in the non-deformed
state of the cover
layer 42, the recessed channel 34 of the intermediate wall 32 can form a fluid
communication
36 between the first recess 28 and the second recess 30. Therefore, in the non-
deformed
state of the elastically deformable cover, the valve 26 is in a normally open
condition.
[00033] According to various embodiments, the following describes the ability
of the
valve 26 of the fluid manipulation valve assembly 20 to be closed using
mechanical pressure,
and temperature, for example, as well as the ability of the valve 26 to be re-
opened again,
and then re-closed again. In particular, the following describes how the
adhesive of the
adhesive layer 44 is manipulated to open and close the valve 26.
[00034] Figs. 2A and 2B show a top view and a cross-sectional side view,
respectively, of
the valve 26 of the fluid manipulation valve assembly 20 in the first valve
closing condition.
In Fig. 2B, the valve 26 is shown in deforming contact with a first deformer
48 positioned
after initiation of, and during, the first valve closing condition. The first
deformer 48 can
include a length that extends in a direction from the first recess 28 toward
the second recess
30. The length can be at least as long as the length of the intermediate wall
32, or
alternatively, the first deformer 48 can be shorter than the length of the
intermediate wall. As
can be seen in Fig. 2B, a drive mechanism 46 can be arranged to displace the
first deformer
48 in a direction towards the cover layer 42 such that a contact surface 54 of
the first
deformer 48 deforms the cover layer 42 and the adhesive layer 44 towards the
recessed
channel 34. In the first valve closing condition, the fluid communication 36
between the first
recess 28 and the second recess 30 can be sealed or closed. Fig. 2A
illustrates a top view of
the substrate layer portion 22 when the valve 26 is in the first valve closing
condition. In
Fig. 2A, as well as in Figs. 3A-6A, the fluid manipulation valve assembly 20
is illustrated
without the elastically deformable cover such that the features of the
substrate layer 22 can
be seen without looking through the elastically deformable cover. According to
various
embodiments, the substrate layer 22 in the area of the intermediate wall 32 is
not necessarily
deformed by the first deformer 48 in the first valve closing condition.
According to various
embodiments, the first deformer 48 can be removed from contacting the cover
layer 42, and
the cover layer 42 can stay adhered to the recessed channel 34 by way of the
adhesive layer
44.
[00035] According to various embodiments, the currently closed valve 26 of the
fluid
manipulation valve assembly 20 is capable of being re-opened, and then re-
closed. Figs. 2B,

CA 02492538 2005-O1-14
WO 2004/011149 PCT/US2003/022897
_7_
3B and 4B sequentially illustrate a procedure for re-opening the valve 26
starting from the
first valve closing condition, according to various embodiments.
[00036] As can be seen in Fig. 3B, in a first re-opening step, the drive
mechanism 46 can
further actuate the first deformer 48 such that the contact surface 54 of the
first deformer 48
deforms the cover layer 42 into the intermediate wall portion 32 of the
substrate layer 22,
thereby also displacing adhesive in a direction away from the first deformer
48. As a result,
the intermediate wall 32 can be deformed by the deforming force of the first
deformer 48 to
form a deformation channel 40 in the substrate layer 22. With respect to Fig.
3B, the first
deformer 48 can press the elastically deformable cover layer 42 through the
adhesive layer 44
such that substantially none of the adhesive can be present between the cover
layer 42 and
the deformation channel 40. As a result, as discussed below with reference to
Fig. 4B, when
the first deformer 48 is removed from being in contact with the valve 26, the
cover layer 42
can elastically rebound, forming a fluid communication opening 38.
[00037] The deformation channel 40 is also shown in Fig. 7, which illustrates
a
perspective view of the substrate layer 22 along with various depressions and
channels
formed therein. The cover layer 42 and the adhesive layer 44 have been omitted
in Fig. 7 to
more clearly illustrate the features of the substrate layer 22. According to
various
embodiments, only a portion of the recessed channel 34 of the intermediate
wall 32 can be
deformed to partially form a fluid communication between the two recesses 28,
30.
[00038] Fig. 3A illustrates a top view of the substrate layer portion 22 after
the first re-
opening step. According to various embodiments, and referring to Figs. 3A and
7, the first
deformer 48 (shown in Fig. 3B) forms the deformation channel 40 within the
recessed
channel 34 of the intermediate wall 32.
[00039] According to various embodiments, the deformable material of the
intermediate
wall 32 can be inelastically or elastically deformable. If the deformable
material of the
intermediate wall 32 is elastically deforrnable, it can be less elastically
deformable (have a
greater rnodulus of elasticity) than the material of the elastically
deformable cover layer 42,
whereby the cover layer 42 is able to recover or rebound from the deformation,
more quickly
than the intermediate wall material, as disclosed, for example, in Bryning et
al. For the sake
of example, but not to be limiting, the material of the intermediate wall 32
is described as
being inelastically deformable.

CA 02492538 2005-O1-14
WO 2004/011149 PCT/US2003/022897
_g_
[00040] Fig. 4B illustrates the second re-opening step which re-establishes
the fluid
communication between the recesses 28, 30. In the second re-opening step, the
first
deformer 48 is withdrawn from contacting the valve 26, thereby allowing the
elastically
deformable cover layer 42 to recover or rebound in a direction away from the
deformation
channel 40 formed in the intermediate wall 32. The inelastically deformable
material of the
intermediate wall 32 remains deformed, or remains deformed for a particular
period of time,
after the first deformer 48 is withdrawn. Upon recovering or rebounding, a
portion of the
elastically deformable cover layer 42 adjacent the deformation channel 40
ofthe intermediate
wall 32, is spaced a set distance from the deformation channel 40 such that a
fluid
communication opening 38 can be formed. Thus, the fluid communication between
the first
and second recesses 28, 30 can be re-established.
[00041] According to various embodiments, the elastically deformable cover
layer 42 can
return back substantially to its original state after deformation to achieve
fluid
communication between the two or more recesses. Alternatively, the elastically
deformable
cover layer 42 can rebound to any extent sufficient to achieve fluid
communication.
According to various embodiments, the elastically deformable cover layer 42
does not
necessarily have to be completely elastic, but should be sufficiently elastic
to rebound a
distance that is greater than about 25% of its deformed distance, for example,
greater than
about 50% of its deformed distance.
[00042] The elastically deformable cover layer 42 can be chemically resistant
and inert, as
can be the substrate layer 22. The elastically deformable cover layer 42 can
be selected to be
able to withstand thermal cycling, for example, between about 60°G. and
about 95°C., as
may be experienced during PCR. Any suitable elastically deformable film
material can be
used, for example, elastomeric materials. The thickness of the cover layer 42
should be
sufficient for the cover layer 42 to be deformed by the deformer 48 as
required to re-shape
the intermediate wall 32 beneath the cover layer 42. Under such deforming, the
elastically
deformable cover layer 42 should not puncture or break and should
substantially return to its
original orientation after deforming an underlying intermediate wall. Various
other
characteristics of elastically deformable cover layers 42, such as material
properties and
bending characteristics, are disclosed, for example, in Bryning et al.
[00043] According to various embodiments, the deformers used can include any
of a
variety of shapes, for example a shape that leaves an impression in the
inelastically

CA 02492538 2005-O1-14
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-9-
deformable material of the substrate layer 22 that results in a fluid
communication being
formed between the two recesses or recessed portions of the assembly 20. A
straight edge,
chisel-edge, or pointed-blade design, for example, can be used to form a
trough or other
channel for achieving a fluid communication between the two deformers. Other
characteristics of deformers for use are disclosed, for example, in Bryning et
al.
[00044] The assembly 20, according to various embodiments, can include a
variety of
deformers, for example, one or more opening blade deformers 48 (as disclosed
above and
shown in Figs. 2B, 3B and 4B, for example) and one or more closing blade
deformers 50 (as
discussed below and shown in Fig. SB and 6B, for example). Such systems or
assemblies
can be used in connection with processing assemblies that include at least one
series of
recesses, one or more of which is in fluid communication with another, and one
or more of
which is separated from another by an intermediate wall. More details about.
the assembly
are set forth below.
[00045] Figs. 4B, SB and 6B sequentially illustrate a procedure for re-closing
the valve 26
starting from the condition that fluid communication between the first and
second recesses
28, 30 has been re-established by way of the formation of the fluid
communication opening
38. As can be seen in Fig. ~B, in a first re-closing step, the drive mechanism
46 can drive a
second deformer 50 in a direction towards and into contact with the
elastically deformable
cover layer 42 of the open valve 26. The second deformer 50 can include a
contact pad 52
or similar compliant device attached at an actuating end thereof.
[00046] Fig. 6B illustrates the second re-closing step which results in the
fluid
communication between the recesses 28, 30 being re-closed. In the second re-
closing step,
the drive mechanism 46 can force the contact pad 52 of the second deformer 50
into contact
with the elastically deformable cover layer 42. When forcibly brought into
contact with the
cover layer 42, the contact pad 52 can mold into the shape of the depression
formed by the
cover layer 42, the adhesive layer 44 and the intermediate wall 32. As a
result of the
compliant or malleable characteristics of the pad 52, the material of the pad
52 can operate
to manipulate the adhesive 45 of the adhesive layer 44 into the area of the
fluid
communication opening 38, thereby re-closing the valve 26.
[00047] According to various embodiments, the resilient characteristics of the
contact pad
52 allows its shape to change when forced into contact with a structure, such
as a valve
assembly. The contact pad 52 can be a material that is chemically resistant
and inert. Tlae

CA 02492538 2005-O1-14
WO 2004/011149 PCT/US2003/022897
-10-
material of the contact pad can be selected to be able to withstand thermal
cycling, as may be
required while performing PCR. Any suitable elastically deformable and
malleable material
can be used, for example, a soft rubber, such as silicone rubber. The
particular softness
characteristics of the contact pad can be chosen depending on the flow
characteristics of the
adhesive used in the adhesive layer 44. According to various embodiments, the
contact pad
52 can have a memory, such that it reverts back to its original orientation
after being forced
into contact with the valve 26. The thickness of the contact pad 52 should be
su~cient for
the pad to be deformed to an extent such that it can fill the depression
formed in the cover
layer 42 during previous processing steps.
[00048] Alternatively or additionally, the contact pad 52 can be capable of
heating the
components of the valve assembly. According to various embodiments, the
contact pad 52
can heat the adhesive layer 44, when the contact pad is forced into contact
with the valve
assembly. For example, the contact pad 52 can be formed partially or entirely
of a thermally
conductive material or of a material that can act as a resistance heater, or
the contact pad 52
can be arranged as a radiant heater, as described in U.S. Patent Application
No. 10/359,668,
filed February 6, 2003, to Shigeura, that is incorporated herein in its
entirety by reference.
When the contact pad 52 of the second deformer 50 is formed of a thermally
conductive
material, the contact pad 52 can be heated by convection or conduction, for
example. When
the contact pad 52 of the second deformer 50 is made of a material that
operates as a
resistance heater, it can be heated by running an electrical current through
the contact pad
52, for example. A contact pad 52 formed as a resistance heater can be
arranged to include
appropriate electrical contacts, that can provide the contact pad 52 in
electrical contact with
a power source.
[00049] According to various embodiments, when the contact pad 52 is in the
position of
contacting the cover layer 42, the temperature of the contact pad 52 can be in
a range such
that heat transferred to the adhesive layer 44 can reduce the viscosity of the
adhesive 45. By
heating and, in turn, reducing the viscosity of the adhesive 45, a heat
emitting contact pad 52
can assist in the closing, or re-closing of the valve 26, by promoting the
manipulability of the
adhesive 45. Various types of adhesives, such as pressure sensitive adhesives
and hot melt
adhesives, for example, can be heated to improve their manipulability.
[00050] According to various embodiments, the deformer 48, as disclosed in
relation to
Figs. 2B-4B, can be capable of heating a valve assembly, as described above
with reference

CA 02492538 2005-O1-14
WO 2004/011149 PCT/US2003/022897
-11-
to the second deformer 50. For example, the deformer 48 can be formed of a
thermally
conductive material, a material that can act as a resistance heater, or as a
radiant heater,. For
example, when the deformer 48 is in the position shown in Fig. 2B, and the
cover layer 42
and the adhesive layer 44 are forced into contact with the recessed channel
34, the deformer
48 can be used to heat the adhesive of the adhesive layer 44, to adhere or
assist in adhering
the cover layer 42 to the recessed channel 34 to close the valve assembly.
According to
various embodiments, the entire deformer 48, or a portion of the deformer 48,
for example,
the tip or a contact portion of the tip, can be formed of a material that can
transfer heat to
heat the components of the valve assembly.
[00051] According to various embodiments, after the contact pad 52 is forced
into
contact with the elastically deformable cover layer 42 and manipulates the
adhesive to re-
close the valve 26, the drive mechanism 46 can be then be operated to retract
the second
presser 50 from the valve 26.
[00052) According to various embodiments, the adhesive layer 44 can be any
suitable
manipulatable adhesive. For example, pressure sensitive adhesives or hot melt
adhesives can
be used. Examples of pressure sensitive adhesives include, silicone pressure
sensitive
adhesives, fluorosilicone pressure sensitive adhesives, and other polymeric
pressure sensitive
adhesives. Characteristics that are considered in choosing an adhesive
include, for example,
tackiness, viscosity, melting point, malleability. The application of heat to
the adhesive can
assist in opening and closing the valve 26.
[00053] According to various embodiments, the adhesive layer 44 can have any
suitable
thickness and preferably does not deliteriously affect any sample, desired
reaction, or
treatment of a sample processed through the assembly. The adhesive layer 44
can be more
adherent to the elastically deformable cover layer 42 than to the underlying
inelastically
deformable material, and can rebound with the elastically deformable cover
layer 42.
[00054] With the valve 26 in the re-closed condition, as shown in Fig. 6B, the
complete
cycle of closing, re-opening and re-closing a normally open valve 26 according
to various
embodiments has been completed.
[00055] The series of steps shown in Figs. lA-6A and Figs. 6A-6B can be
sequential or
in any other order. For example, the valve 26 can be opened starting from an
initially closed
position, or the valve 26 can be closed from the initially open position shown
in Fig. SB.

CA 02492538 2005-O1-14
WO 2004/011149 PCT/US2003/022897
-12-
[00056] According to various embodiments, the assembly can be provided as a
system
with a positioning unit including a platform and holder for registering the
area of the
assembly to be deformed, with a particular deformer. Precision positioning
drive systems
can be used to enable the particular deformer and the valve assembly to be
moved relative to
one another such that the feature of the valve assembly to be deformed is
aligned and
registered with the deformer.
[00057] According to various embodiments, the fluid manipulation valve
assembly 20 can
be disk-shaped, card-shaped, or include any other suitable or appropriate
shape, the specific
shape being suitably adaptable for specific applications. The assembly 20, or
the substrate
layer 22 of the assembly 20 can be shaped to provide a series of generally
linearly extending
recesses or chambers that can be fluidically connected to one another by
valves 26 according
to various embodiments. For example, series of recesses can be provided in
assemblies
according to various embodiments whereby centrifugal force can be applied to
the assembly
to move a fluid sample from one recess of a series to a subsequent recesses in
the series, by
centrifugal force. For example, disk-shaped assemblies including radially-
extending series of
recesses are provided according to various embodiments.
[00058] The assembly 20 can be sized to be conveniently processed by a
technician.
Depending upon the number of series of chambers or configuration desired, the
assembly 20
can include any appropriate size, i.e. diameter, thickness, length, as
disclosed, for example, in
Bryning et al.
[00059] Assemblies 20 according to various embodiments can include two or more
recesses separated by an intermediate wall, and inlet and/or outlet ports to
access the
recesses. Inlet and outlet ports can be provided through various surfaces of
the assembly can
be arranged to provide various fluid communications, such as a venting
arrangement, as
disclosed, for example, in Bryning et al.
[00060] According to various embodiments, methods are provided for opening and
closing a fluid communication between at least two recesses, the at least two
recesses being
separated by at least one intermediate wall.
[00061] According to various embodiments, a method provides closing and
opening an
initially open fluid communication between two recesses. The method includes
elastically
deforming the cover against the substrate layer 22 to close the initially open
fluid
communication 36 between the two recesses 28, 30. More specifically, the
method includes

CA 02492538 2005-O1-14
WO 2004/011149 PCT/US2003/022897
-13-
driving the elastically deformable cover of the assembly with a first deformer
48 to deform
the cover against the recessed channel 34 of the substrate layer 22 and close
the initially open
fluid communication 36. The first deformer 48 can then be brought out of
contact with the
elastically deformable cover.
[00062] To re-open the fluid communication, the method includes forcing the
first
deformer 48 against the elastically deformable cover to deform the deformable
material of
the recessed channel 34. The first deformer 48 is then brought out of contact
with the cover
such that the cover elastically rebounds faster than the deformed material of
the recessed
channel 34 and a fluid communication 36 results between the first and second
recesses 28,
30.
[00063] According to various embodiments, methods are provided for forming a
barner to
re-close the fluid communication 36 between the two recessed portions of the
assembly.
According to such methods, a deformer 50 including a contact pad 52 disposed
at one end is
forced against the elastically deformable cover. The contact pad 52 forces
adhesive 45 of the
adhesive layer 44 into a deformation channel 40 to close the fluid
communication opening 38
formed between the first and second recesses 28, 30. The deformer 50 is then
moved out of
contact with the elastically deformable cover.
[00064] According to various embodiments, after an assembly has been deformed
to form
a fluid communication, the deformed assembly can then be treated or processed
to achieve a
product, for example, a reaction product or a purification product. Methods of
manipulating
the flow of fluids and other components within various chambers of a series of
chambers can
be effected by, for example, centrifugal force, electrical forces such as are
used in
electrophoresis or in electroosmosis, pressure, vacuum, gravity, centripetal
force, capillary
action, or by any other suitable fluid manipulating technique, or combination
thereof. As a
result of a fluid manipulation step, the manipulated fluid can be reacted in a
newly-entered
chamber, for example, by PCR under thermal cycling conditions, by a sequencing
reaction
under specified thermal conditions, by purification, and/or by any combination
of treatments.
[00065] Those skilled in the art can appreciate from the foregoing description
that the
present teachings can be implemented in a variety of forms. Therefore, while
these teachings
have been described in connection with particular embodiments and examples
thereof, the
present teachings should not be so limited.

Representative Drawing
A single figure which represents the drawing illustrating the invention.
Administrative Status

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Event History

Description Date
Application Not Reinstated by Deadline 2008-07-23
Time Limit for Reversal Expired 2008-07-23
Inactive: Abandoned - No reply to s.30(2) Rules requisition 2007-09-20
Deemed Abandoned - Failure to Respond to Maintenance Fee Notice 2007-07-23
Inactive: S.30(2) Rules - Examiner requisition 2007-03-20
Inactive: IPC from MCD 2006-03-12
Inactive: IPC from MCD 2006-03-12
Amendment Received - Voluntary Amendment 2005-06-29
Inactive: Cover page published 2005-03-18
Letter Sent 2005-03-15
Letter Sent 2005-03-15
Inactive: Acknowledgment of national entry - RFE 2005-03-15
Application Received - PCT 2005-02-11
National Entry Requirements Determined Compliant 2005-01-14
Request for Examination Requirements Determined Compliant 2005-01-14
All Requirements for Examination Determined Compliant 2005-01-14
Application Published (Open to Public Inspection) 2004-02-05

Abandonment History

Abandonment Date Reason Reinstatement Date
2007-07-23

Maintenance Fee

The last payment was received on 2006-07-10

Note : If the full payment has not been received on or before the date indicated, a further fee may be required which may be one of the following

  • the reinstatement fee;
  • the late payment fee; or
  • additional fee to reverse deemed expiry.

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Please refer to the CIPO Patent Fees web page to see all current fee amounts.

Fee History

Fee Type Anniversary Year Due Date Paid Date
Registration of a document 2005-01-14
Basic national fee - standard 2005-01-14
MF (application, 2nd anniv.) - standard 02 2005-07-25 2005-01-14
Request for examination - standard 2005-01-14
MF (application, 3rd anniv.) - standard 03 2006-07-24 2006-07-10
Owners on Record

Note: Records showing the ownership history in alphabetical order.

Current Owners on Record
APPLERA CORPORATION
Past Owners on Record
DENNIS E. MEAD
ZBIGNIEW T. BRYNING
Past Owners that do not appear in the "Owners on Record" listing will appear in other documentation within the application.
Documents

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Document
Description 
Date
(yyyy-mm-dd) 
Number of pages   Size of Image (KB) 
Claims 2005-01-13 7 282
Drawings 2005-01-13 7 116
Description 2005-01-13 13 821
Abstract 2005-01-13 2 70
Representative drawing 2005-01-13 1 10
Acknowledgement of Request for Examination 2005-03-14 1 178
Notice of National Entry 2005-03-14 1 202
Courtesy - Certificate of registration (related document(s)) 2005-03-14 1 105
Courtesy - Abandonment Letter (Maintenance Fee) 2007-09-16 1 177
Courtesy - Abandonment Letter (R30(2)) 2007-11-28 1 167
PCT 2005-01-13 6 346