Note: Descriptions are shown in the official language in which they were submitted.
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LED MODULE
BACKGROUND OF THE INVENTION
1. Field of the Invention:
The present invention relates to a LED (light emitting
diode) and more particularly, to a LED module that dissipates
heat quickly durinc, operation.
2. Description of the Related Art:
In recent decades, human beings consume eneray heavily,
resultina in an energy crisis. Nowadays, scientists in different
countries are trying hard to develop new eneray and
every-savina products. In consequence, various petroleum
substitutes have been developed, the utilization of solar power
has been enhanced, and various low power consumption type
fuel enaines and motors and power-savin~ li~htin~ fixtures have
been created. Nowadays, LEDs (light emittina diodes) have been
intensively used to substitute for conventional incandescent
bulbs and fluorescent bulbs in various fields for the advantaQe
of low power consumption.
The lower power consumption characteristic of LEDs is
well known. Followinj fast development of semiconductor
technology, high brightness LEDs are developed for use in many
fields for illumination. For exan:ple, T Ens have been
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intensively used in motor vehicles for vehicle lights.
However, a LED must be paekaQed with a light
transmittance resin before application. Because a high
brightness LED releases much heat durino, operation and is
enclosed in the package, heat cannot be quickly dissipated
durinc, the operation.
SUMMARY OF THE INVENTION
The present invention has been accomplished under the
circumstances in view. It is therefore the main object of the
present invention to provide a LED (light emitting diode)
module, which dissipates heat quickly durina the operation of
the LED (li-ht emittinc, diode). Accordina to one embodiment of
the present invention, the LED module comprises a heat sink,
which is partially covered with an insulative layer and has a
groove in a top recess thereof, and a plurality of mountin~
through holes cut through the top and bottom sides, a LED
mounted in the groove of the heat sink, metal conduction plates
fastened to the mountina through holes and extended to the
outside of the heat sink, lead wires respectively connected
between the metal condu-ction plates and positive and negative
terminals of the LED, a li~ht transmittance resin molded on the
sink
groove over the LED, and a lens holder fastened P~ *o *~ ~V r-~+.lA,*lJ111
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to hold an optical lens over the liQht transmittance resin.
AccordinQ to another embodiment of the present invention, the
LED module comprises a heat sink, the heat sink havincy a top
side, a top orroove in the top side, an insulative layer covered on
the top side outside the groove; a metal thin film covered on the
1:op Qroove; at least one light emitting diode respectively fixedly
on the metal thin film; a plurality of metal conduction plates
affixed to the heat sink; a plurality of lead wires respectively
connected between the metal conduction plates and positive and
negative terminals of the at last one light emitting diode; and a
]liaht transmittance resin molded on the aroove of the heat sink
and coverin- the li-ht emittincr diode.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded view of a LED module in
accordance with a first embodiment of the present invention.
FIG. 2 is a sectional assembly view of the LED module
;in accordance with the first embodiment of the present
invention.
FIG. 2A is similar to FIG. 2 but showing the LED
mounted on a metal thin film on the groove in the top recess of
ithe heat sink.
FIG. 3 is a perspective assembly view of the LED
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module in accordance with the first embodinient of the present
invention.
FIG. 4 is an exploded view of a LED module in
accordance with a second embodiment of the present invention.
FIG. 5 is a sectional assembly view of the LED module
in accordance with the second embodiment of the present
invention.
FIG. 6 is a perspective assembly view of the LED
module in accordance with the second embodiment of the
present invention.
FIG. 7 is an exploded view of a LED module in
accordance with a third embodiment of the present invention.
FIG. 8 is sectional assembly view of the LED module in
accordance with the third embodiment of the present invention.
FIG. 9 is a perspective assembly view of the LED
module in accordance with the third embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
ReferrinQ to FIGS. 1-3, a LED module in accordance
with a first embodiment of the present invention is shown
comprisin~ a heat sink 1, a LED (Li~ht Emitting Diode) 2
mounted in the heat S:nk 1, n n:l u 1Pnc hnlder ? fa3te.~.ed t~ tl:e
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heat sink 1 and holding an optical lens 33 corresponding to the
LED 2. The heat sink 1 has a top recess 11, a groove 12 fornzed
in the top recess 11 for the mounting of the LED 2, and a
plurality of mountina through holes 13 cut throuah the top and
bottom sides. Further, the top surface of the heat sink 1 is
covered with an insulation layer A. Further, a plurality of metal
conducting plates 131 are respectively fastened to the heat sink
1. The metal conducting plates 131 each have an upright shank
132 respectively inserted from the bottom side of the heat sink 1
into the mountin- through holes 13. After insertion of the
upright shanks 132 into the mounting through holes 13, the top
ends 133 of the upright shanks 132 are hammered down to affix
the upright shanks 132 to the heat sink 1. Further, lead wires 21
are respectively connected between the positive and negative
electrodes of the LED 2 and the upright shanks 132 of the metal
conductina plates 131. A light transmittance resin 4 is molded
on the top recess 11 over the LED 2, keepina the LED 2
embedded in the light transmittance resin 4. The lend holder 3
has a plurality of bottom hooks 31 respectively hooked on the
bottom ed(ye of the heat sink 1, and a center opening 32. The
optical lens 33 is fastened to the center openin- 32 of the lens
holder 3. The heat sink 1 is made out of a metal material, for
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example, gold, silver, copper, iron, aluminum, or their alloy that
transfers heat energy efficiently. Further, a metal thin film 121
may be directly bonded to the aroove 12 that is not covered by
the insulative layer A so that the LED 2 can be directly fastened
to the metal thin film 121. Durinc, the operation, heat energy is
quickly transferred from the LED 2 to the heat sink 1 through
the metal thin film 121 (see FIG. 2A). The metal thin film 121
can be a film of nickel gold alloy, nickel silver alloy, or nickel
copper alloy.
FIGS. 4-6 show a LED module in accordance with a
second embodiment of the present invention. This embodiment
is substantially similar to the aforesaid first embodiment with
the exception that the heat sink 1 has a plurality of peripheral
notches 14 for securing the bottom hooks 31 of the lens holder 3.
Further, the heat sink 1 has only two mountina through holes 13
for the mounting of two metal conducting plates 131.
FIGS. 7-9 show a LED module in accordance with a
third embodiment of the present invention. Accordinc, to this
embodiment, the LED module comprises a heat sink 5, a LED
(Light Emitting Diode) 2 mounted in the heat sink 5, and a lens
liolder 3 fastened to the heat sink 5 and holdina an optical lens
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33 correspondinb t.o the LED 2. The A~+ c;~k e r., ., +~p n'l.r
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recess 52 for the mountinc, of the LED 2, a plurality of top
border recesses 51 spaced around the top center recess 52, an
upriQht rod 511 respectively disposed in each top border recess
51, and a plurality of peripheral bottom notches 53. Further, the
top surface of the heat sink 5 is covered with an insulation layer
A. Further, a plurality of metal conducting plates 512 are
respectively fastened to the top border recesses 51 of the heat
sink 5 and extended to the periphery of the heat sink 5. The
imetal conducting plates 512 each have a vertical through hole
513 respectively coupled to the upright rod 511. Further, lead
wires 21 are respectively connected between the positive and
negative electrodes of the LED 2 and the metal conducting
plates 512. A light transmittance resin 4 is molded on the top
side of the heat sink 5 over the LED 2, keeping the LED 2
embedded in the light transmittance resin 4. The lend holder 3
has a plurality of bottom hooks 31 respectively hooked on the
peripheral bottom notches 53 of the heat sink 5, and a center
opening 32. The optical lens 33 is fastened to the center opening
32 of the lens holder 3. Further, a locating frame 6 is
sandwiched between the heat sink 5 and the lens holder 3,
having a center opening 61 correspondin- to the center openina
i2 of the lens holder 3, and 1plurality a Tof inside notciiecu 62 iiiut
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accommodate the upright rods 511 respectively.
In the aforesaid embodiments, the lens holder 3 and the
optical lens 33 are two independent members. Alternatively, the
optical lens 33 can be formed integral with the lens holder 3. If
desired, the lens holder 3 and the optical lens 33 can be
eliminated from the LED module. Further, the LED module can
be made carrying two or more LEDs 2.
Although particular embodiments of the invention have
been described in detail for purposes of illustration, various
modifications and enhancements may be made without departing
from the spirit and scope of the invention.
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