CA 02866813 2014-09-09
[DESCRIPTION]
[Title of Invention]
PLATED PLASTIC CHASSIS
[Technical Field]
[00011
The present invention relates to a plated plastic chassis which is used as an
internal chassis, etc. of an electrical product.
Priority is claimed on Japanese Patent Application No. 2012-057957, filed
March 14, 2012, the content of which is incorporated herein by reference.
IBackground Art]
100021
High rigidity is required for a cabinet for a light electric product such as a
cellular phone or a notebook computer as a product is thin-walled. In this
application,
various metal chassis formed by a die casting or thixomolding is
conventionally used.
Recently, as an alternative product to a metal chassis, it becomes common to
use a plastic
chassis formed from a polycarbonate resin or a polycarbonate/ABS resin on
which a
metal is plated by an electroplating method to improve rigidity thereof.
100031
Moreover, high rigidity is required for an intrinsic chassis installed inside
an
electronic product, and thus, a metal chassis formed from magnesium, etc. is
used as an
intrinsic chassis. Recently, it has been considered to use a plastic chassis
as an
alternative product to a metal chassis for an intrinsic chassis of an
electronic product.
The reason is because a complicated shape can be formed and also thin-walling
and
weight reducing are possible.
[0004]
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Meanwhile, high rigidity, strength and durability, which are equivalent to
those
of a metal chassis formed from magnesium, are required even for a plastic
chassis with a
complicated shape, and ensuring safety is required with the achievement of
thin-walling
and weight-reducing by resinification. Ilowever, a conventional plastic
chassis does not
sufficiently satisfy these requirements.
[0005]
Patent Literature 1 proposes the plastic cabinet obtained by double-molding an
ABS resin and a resin other than an ABS resin so as to obtain a plastic
cabinet body and
plating the ABS resin part thereof. However, this plastic cabinet is intended
to shield an
electronic component mounted on a printed circuit board and has nothing to do
with a
plastic chassis.
10006_1
Also, Patent Literature 2 proposes the method of improving rigidity and
hardness by depositing a plating layer with thickness of 5-30 pm on a plastic
cabinet.
llowever, this method is not considered for an intrinsic chassis of an
electronic product,
and this method alone is not sufficient for ensuring safety associated with
shape-complicating, thin-walling and weight-reducing by resinification of an
intrinsic
chassis.
[Citation List]
[Patent Literature]
100071
'Patent Literature 11
Japanese Fxamined Utility Model Application Publication No. Hei 7-1833
[Patent Literature 21
Japanese Unexamined Patent Application, First Publication No. 2005-154864
CA 02866813 2014-09-09
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[Summary of Invention]
[Technical Problem]
[0008]
The present invention provides a plastic chassis which can be shape-
complicated,
thin-walled and weight-reduced by resinification, and has rigidity and
durability under a
high-temperature condition, which are equivalent to those of a metal chassis
formed from
magnesium even if thin-walled and weight-reduced, and can ensure product
safety by
suppressing warpage and reduction in dimensional accuracy associated with thin-
walling
and weight-reducing. Also, the present invention provides a component for an
electrical
product which is obtained by making a component substrate formed from a
thermoplastic
resin adhere to the plastic chassis.
[Solution to Problem]
[0009]
An aspect of a plated plastic chassis of the present invention including: a
plastic
chassis body obtained by molding a filler reinforced plastic in which flexural
modulus
according to ISO 178:2001 is within a range from 4,000 to 22,000 MPa; and a
plating
layer with thickness of 5 to 50 pm which is formed on at least a portion of
surface of the
plastic chassis body.
[0010]
An aspect of a plated plastic chassis of the present invention preferably
satisfies
the following condition:
flexural modulus according to ISO 178:2001 of a plated test piece, which is
obtained by forming a plating layer under the same condition as the plating
layer on the
surface of a test piece (12.5 mm x 127 mm x 1 mm thickness) obtained by
molding the
filler reinthrced plastic, is within a range from 25,000 to 60,000 MPa.
CA 02866813 2014-09-09
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In other words, an aspect of a plated plastic chassis of the present invention
preferably satisfies the following condition:
flexural modulus according to ISO 178:2001 of a plated test piece, which is
obtained by forming a plating layer under the same condition as the plating
layer on
surface of a test piece with 12.5 mm x 127 mm x 1 mm thickness obtained by
molding
the filler reinforced plastic, is within a range from 25,000 to 60,000 MPa.
[0011]
An aspect of a component for an electrical product of the present invention
includes: an aspect of a plated plastic chassis of the present invention; and
a component
substrate which is formed from a thermoplastic resin and adheres to the plated
plastic
chassis.
[Advantageous LIThets of Invention]
[0012]
An aspect of a plated plastic chassis of the present invention can be
shape-complicated, thin-walled and weight-reduced by resinification, has
rigidity and
durability under a high-temperature condition, which are equivalent to those
of a metal
chassis formed from magnesium even if thin-walled and weight-reduced, and can
ensure
product safety by suppressing warpage and reduction in dimensional accuracy
associated
with thin-walling and weight-reducing.
Also, an aspect of a component for an electrical product of the present
invention
is obtained by making a component substrate lbrmed from a thermoplastic resin
adhere
to an aspect of a plated plastic chassis of the present invention. Thus, an
aspect of a
component for an electrical product of the present invention is completed as
the
component which is much similar to a product incorporating an internal
chassis, and an
assembling process can be simplified.
CA 02866813 2014-09-09
[Description of Embodiments]
[00131
In the present specification, a chassis refers to a base member which fixes a
printed wiring board and an electronic component, and is distinguished from a
cabinet
5 (also referred to as a case or housing) which houses the aforementioned
base member.
In the present specification, flexural modulus of a filler reinforced plastic
is
obtained by measuring a test piece with 12.5 mm x 127 mm x 4 mm thickness
according
to ISO 178:2001.
In the present specification, flexural modulus of a plated test piece is
obtained
by measuring a plated test piece, which is obtained by plating a test piece
with 12.5 mm
x 127 mm x 1 mm thickness, according to ISO 178:2001.
[0014]
<Plated Plastic Chassis>
An aspect of a plated plastic chassis of the present invention includes a
plastic
chassis body obtained by molding a filler reinforced plastic; and a plating
layer which is
tbrmcd on at least a portion of surface of the plastic chassis body.
1.0015]
(Filler Reinforced Plastic)
A filler reinforced plastic contains a thermoplastic resin, a filler, and
other
components as necessary.
100161
The kind of a thermoplastic resin is not particularly limited. Examples of a
thermoplastic resin include polyamide (such as nylon 6 or nylon 6,6),
polyolefin (such as
polyethylene or polypropylene), polyester (such as polyethylene terephthalate
or
polybutylene terephthalate), polycarbonate, polyamideimide, polyphenylene
sulfide,
CA 02866813 2014-09-09
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polyphenylene oxide, polysulfone, polyethersulfone, polyether ether ketone,
polyetherimicie, styrene-based resin (such as polystyrene or ABS resin), or
liquid-crystalline polyester.
Also, a thermoplastic resin may be a copolymer (such as a copolymer of
acrylonitrile and styrene, or a copolymer of nylon 6 and nylon 6,6), or a
mixture of the
thermoplastic resin (including an alloy).
[00171
The kind of a filler is not particularly limited. Examples of a filler include
an
inorganic filler, an organic filler and a plant-based filler.
Examples of an inorganic filler include an inorganic fiber (such as a glass
fiber
or a carbon fiber), an inorganic fiber coated with a metal, an inorganic
matter (such as
Wollastonite, talc, mica, glass flake, glass beads, potassium titanate,
calcium carbonate,
magnesium carbonate, carbon black or Ketjenblack), a metal and alloy (such as
iron,
copper, zinc or aluminum), a fiber of a metal oxide, and a powder of a metal
oxide.
Examples of an organic filler include a polyethylene terephthalate fiber, a
polyethylene naphthalate fiber, an aramid fiber and an acrylic fiber.
Examples of a plant-based filler include kenaf and a bamboo fiber.
A fiber may be a chopped fiber or a long fiber.
As a filler, a glass filler or a carbon filler is preferable because high
rigidity can
be obtained even at a small blending amount.
10018)
Examples of other components include an antistatic agent, a flame retardant
(such as a bromine-based, a phosphorus-based, a hydroxide), a flame retardant
aid (such
as antimony trioxide or polytetralluoroethylene), a surface appearance
improving agent, a
weather resistance improving agent, an antioxidant, a thermal stabilizer, an
ultraviolet
CA 02866813 2014-09-09
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absorber, an antibacterial agent, a tackifier, a plasticizer, a lubricant, a
colorant, a
compatibilizer, a conductive filler, an anti-ageing agent and an anti-fog
agent.
100191
A filler reinforced plastic can be obtained by mixing a thermoplastic resin, a
-filler, and other components as necessary using a mixer (such as Henschel
mixer, a
tumbler mixer or Nauta mixer). In addition, kneading can be carried out using
a
kneader (a single screw extruder, a twin screw extruder, Banbury mixer,
Konida).
100201
The blending amounts of a thermoplastic resin and a filler are set such that
flexural modulus of a filler reinforced plastic is within a range from 4,000
to 22,000
MPa.
Flexural modulus of a filler reinforced plastic is 4,000 MPa or higher and
preferably 8,000 MPa or higher. Also, flexural modulus of a filler reinforced
plastic is
22,000 MPa or lower and preferably 21,000 MPa or lower. In more detail,
flexural
modulus of a filler reinforced plastic is within a range from 4,000 to 22,000
MPa and
preferably from 8,000 to 21,000 MPa. When flexural modulus of a filler
reinforced
plastic is 4,000 MPa or higher, warpage of a plated plastic chassis can be
suppressed, and
heat cycle property thereof becomes excellent. When flexural modulus of a
filler
reintbreed plastic is 22,000 MPa or lower, molding processability becomes
good.
100211
(Plastic Chassis Body)
A plastic chassis body is obtained by molding a filler reinforced plastic.
Examples of a molding process include an injection molding process, an
injection
compression molding process, a press molding process, an extrusion molding
process, a
blow molding process, a vacuum molding process, a pressure molding process, a
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calender molding process, an inflation molding process. Among these molding
processes, an injection molding process and an injection compression molding
process
are preferable because mass productivity is excellent and a molded product
with high
dimensional accuracy can be obtained.
[0022]
(Plating Layer)
Thickness of a plating layer is 5 pm or higher, preferably 10 p.m or higher,
more
preferably 15 pm, and much more preferably 25 pm. Also, thickness of a plating
layer
is 50 kim or lower, preferably 45 jam or lower and more preferably 40 1,.tm or
lower. In
more detail, thickness of a plating layer is within a range from 5 to 50
11111, preferably
from 10 to 45 pm, more preferably from 15 to 40 pm and much more preferably 25
to 40
Jim. When thickness of a plating layer is 5 Am or higher, rigidity of a plated
plastic
chassis becomes sufficiently high rigidity. When thickness of a plating layer
is 50 vim
or lower, warpage is suppressed, and heat cycle property becomes excellent.
[0023]
Examples of a measurement method of thickness of a plating layer include a
method using an electrolytic film thickness meter and cross-sectional
observation of a
plating layer using a scanning electron microscope.
A method using an electrolytic film thickness meter is based on Faraday's law
in
which a dissolution amount of a plating layer is proportional to an amount of'
conducted
electricity when electrolysis is carried out using a plating layer as an
anode. A
dissolution amount is represented by a product of a dissolution area [A] and
thickness [t],
and an amount of conducted electricity is represented by a product of a
conduction time
[Ti and a current RI.
Dissolution Amount = Axt=KxIxT
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In the above equation, K is a constant which is different by each plating
layer.
100241
Cross-sectional observation of a plating layer using a scanning electron
microscope is a method in which a cross-section of a plated plastic chassis is
cut out and
observed using a scanning electron microscope. Examples of a method of cutting
out a
cross-section include a method using a fine cutter, a method using a laser
cutter and a
method using FIB. In a method using a fine cutter, cutting surface has to be
polished,
and boundary of a multilayer coating can be clarified by subjecting boundary
after
polishing (multilayer coating (such as copper, nickel or chrome)) to nitric
acid etching.
In an aspect of the present invention, a method using an electrolytic film
thickness meter is preferable because thickness of a plating layer can be
measured
precisely.
100251
Ixamples of a plating method include a wet type plating method (such as
electroless plating, direct plating or electroplating) and a dry type plating
method (such
as vacuum deposition, a sputtering method or an ion plating method). In an
aspect of
the present invention, a wet type plating method is preferable because
flexural modulus
of a plastic chassis is excellent and good plating property can be obtained.
[0026]
Electroless plating is the method in which a reducing agent (such as sodium
hypophosphite or sodium borohydride) is added in an aqueous solution
containing a
metal ion such as nickel or copper, the aqueous solution is heated to a range
of 40 C to
100 C, and a plastic chassis body is immersed to the aqueous solution to
thereby
uniformly deposit a metal on the surface of the plastic chassis and form a
plating layer.
In electroless plating, it is preferable that surface of a plastic chassis
body be chemically
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roughened by an etching treatment (mixed solution of sulfuric acid / chrome)
and made
sensitive (catalyzed).
[0027]
Electroplating is the method in which a conductive film is formed on surface
of
5 a plastic chassis body by an electroless plating method, a body to be
plated is used as a
cathode, an insoluble anode such as plating metal or platinum is used as an
anode, DC
power supply is connected between both electrodes, and an appropriate
potential
difference is given to thereby deposit a metal obtained by reducing a metal
ion on the
surface of the cathode and form a plating layer. Examples of a metal to be
deposited
10 include copper, nickel, chrome, gold, silver and an alloy.
[0028]
(Flexural Modulus of Plated Test Piece)
A plated plastic chassis preferably satisfies the following condition.
Flexural modulus of a plated test piece, which is obtained by forming a
plating
layer with an intended thickness under the same condition as a plating layer
of a product
on surface of a test piece obtained by molding the filler reinforced plastic,
is 25,000 MPa
or higher and preferably 30,000 MPa or higher. Also, flexural modulus or a
plated test
piece is 60,000 MPa or lower and preferably 50,000 MPa or lower. In more
detail,
flexural modulus of a plated test piece is within a range from 25,000 to
60,000 MPa and
preferably from 30,000 to 50,000 MPa.
[00291
When, flexural modulus of a plated test piece is 25,000 MPa or higher, it is
possible to obtain flexural modulus corresponding to a metal chassis formed
from
magnesium, etc. When, flexural modulus of a plated test piece is 60,000 MPa or
lower,
dimensional accuracy is improved. Flexural modulus of a plated test piece is
preferably
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II
within a range from 30,000 to 50,000 MPa.
100301
(Functions and Effects)
In an aspect of a plated plastic chassis of the present invention described
above,
a filler reinforced plastic is used as a raw material, and thus, shape-
complication,
thin-walling and weight-reducing can be achieved by resinification.
Also, a plating layer with thickness of 5 to 50 gm is formed on at least a
portion
of surface of a plastic chassis body obtained by molding a filler reinforced
plastic in
which flexural modulus is within a range from 4,000 to 22,000 MPa, and thus, a
plated
plastic chassis has rigidity which is equivalent to that of a metal chassis
formed from
magnesium even if thin-walled and weight-reduced.
Also, a plastic chassis body obtained by molding a filler reinforced plastic
in
which flexural modulus is within a range from 4,000 to 22,000 MPa is used as a
base,
and thus, a plated plastic chassis has durability under a high-temperature
condition
In the aforementioned plated plastic chassis, product safety can be ensured by
suppressing warpage and reduction in dimensional accuracy associated with thin-
walling
and weight-reducing.
[00311
<Component for Electrical Product>
An aspect of a component for an electrical product of the present invention
includes: an aspect of a plated plastic chassis of the present invention; and
a component
substrate which is formed from a thermoplastic resin and adheres to the plated
plastic
chassis.
[00321
(Component Substrate)
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A component substrate is obtained by molding a thermoplastic resin. Because
adhesiveness for a plated plastic chassis is excellent, a component substrate
which is
unified with a plated plastic chassis by an in-mold process is preferable.
[0033]
The kind of a thermoplastic resin is not particularly limited. Examples of a
thermoplastic resin include polyamide (such as nylon 6 or nylon 6,6),
polyolefin (such as
polyethylene or polypropylene), polyester (such as polyethylene terephthalate
or
polybutylene terephthalate), polycarbonate, polyamideimide, polyphenylene
sulfide,
polyphenylene oxide, polysultbne, polyethersulfone, polyether ether ketone,
polyetherimide, styrene-based resin (such as polystyrene or ABS resin), or
liquid-crystalline polyester.
Also, a thermoplastic resin may be a copolymer (such as a copolymer of
acrylonitrile and styrene, or a copolymer of nylon 6 and nylon 6,6), urethane,
a soft
material or elastomer. In addition, a thermoplastic resin may be a mixture of
the
aforementioned materials (including an alloy) or a filler reinforced material
[0034]
(In-Mold Process)
An in-mold process is the molding process in which an aspect of a plated
plastic
chassis of the present invention is installed in a molding die, and a
thermoplastic resin is
injected into the molding die to thereby make a component substrate formed
from a
thermoplastic resin and a plated plastic chassis adhere to each other and
obtain a
composite component.
[00351
(Functions and Effects)
As described above, an aspect of a component for an electrical product of the
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13
present invention is obtained by making a component substrate formed from a
thermoplastic resin adhere to an aspect of a plated plastic chassis of the
present invention.
Thus, an aspect of a component for an electrical product of the present
invention is
completed as the component which is much similar to a product incorporating an
internal
chassis, and an assembling process can be simplified.
I Examples]
10036]
Hereinafter, the present invention is described in detail with reference to
Examples and Comparative Examples. The present invention is not limited to
these
specific examples.
10037]
<Measurements and [valuations>
Respective measurements and evaluation in Examples and Comparative
Examples were carried out by the following methods.
[0038]
(Flexural Modulus of Filler Reinforced Plastic)
Regarding the plastic and filler reinforced plastic shown in Table I, the test
pieces with 12.5 mm x 127 mm x 4 mm thickness were produced, and the flexural
modulus of the test pieces was measured according to ISO 178:2001.
10039]
(Flexural Modulus or Filler Reinforced Plastic)
Regarding the plastic and filler reinforced plastic shown in Table 1, the test
pieces with 12.5 mm x 127 mm x 1 mm thickness were produced, the plating
layers were
!brined with the compositions and the intended total thickness shown in 'Fable
2, and then,
the flexural modulus of the plated test pieces was measured according to 1S0
178:2001.
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[0040]
(Thickness of Plating Layer)
The thickness of the plating layer was measured by the following method using
the electrolytic film thickness meter (DENSOKU Instruments Co., Ltd., CT-2).
The plated plastic chassis was set in the electrolytic film thickness meter.
Firstly, in order to measure the thickness of chrome electroplating, the R-51
electrolyte
solution (DENSOKU Instruments Co., Ltd.) was injected into the gasket, and the
thickness of the chrome electroplating. Subsequently, in order to measure the
thickness
of nickel electroplating, the R-54 electrolyte solution (DENSOKU Instruments
Co., Ltd.)
.. was injected into the gasket, and the thickness of the nickel
electroplating.
Subsequently, in order to measure the thickness of copper electroplating, the
R-44
electrolyte solution (DENSOKU Instruments Co., Ltd.) was injected into the
gasket, and
the thickness of the copper electroplating.
[00411
(Warpage)
The plated plastic chassis was left on a smooth standard stand, the presence
or
absence of the warpage was checked by visual observation, and the plated
plastic chassis
was evaluated by the followin2, criteria.
S: the absence of the warpage
A: the presence of the slight warpage
B: the presence of the warpage
C: the presence of the large warpage
[00421
(Dimensional Accuracy)
The metal nut (the outer diameter: y 4 mm) was pressed into the boss part (the
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inner diameter: (p 4 mm, wall thickness: I mm) of the plated plastic chassis,
the presence
or absence of the crack of the plating film of the boss part was checked by
visual
observation, and the plated plastic chassis was evaluated by the following
criteria.
S: the absence of the crack
5 A: the occurrence of the small crack in a portion of the boss part
B: the occurrence of the crack
C: the occurrence of the crack in the range including the plastic side
10043 j
(Heat Cycle Property)
10 The plated plastic chassis was subjected the test under the following
heat cycle
condition, the presence or absence of the bulge of the plating Film was
checked by visual
observation, and the plated plastic chassis was evaluated by the following
criteria.
A: the absence of the bulge
AB: the presence of the small crack at the contact part
15 B: the presence of the small bulge in the vicinity of the gate
C: the presence of the bulge at the gate part
Heat Cycle Condition'
The sequence of -30 C x 1 hour ¨> 23 C x 15 minutes 80 C x 1 hour
23 C x 1 hour was defined as one cycle, and five cycles were defined as one
set, and
three sets were carried out.
[00441
<Plastic and Filler Reinforced Plastic>
The plastics and the -filler reinforced plastics used in Examples and
Comparative
Examples were as follows.
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100451
'Table 11
Material Company Name Product Name Composition
A UMGABS FA-80A PC/ASA
13 UMGABS FA-802GA PC/ASA
containing OF
at 10 mass%
C UMGABS GA-8090E PC/ASA
containing OF
at 45 mass% _______________________________________________________
D UMGABS TA-820DK PC/ASA
containing CF
_______________________________________________________ at 10 mass%
UMGARS FA-840CD PC/ASA
containing G17
at 20 mass%
F DuPont ZYTEL HTN PPA
containing GF at 50
mass%
Mitsubishi
MXD6/PPE containing
Engineering-Plastics NX05945S
GI: at 45 mass%
Corporation
1
II UMGABS FA-
860C1)PC/ASA containing CF
at 30 mass%
100461
The abbreviations in the Table represent the following meanings.
PC: polycarbonate
ASA: acrylonitrile-styrene-acrylate resin
PPA: polyphthalamide
MXD6: nylon MXD6
PPE: polyphenylene ether
OF: glass fiber
CF: carbon liber
100471
<Plating Process>
The compositions and the total thickness of the plating layer in Examples and
,
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Comparative Examples are shown in 'fable 2.
Also, the conditions for the plating processes for respective materials are
described in Plating Processes 1 and 2.
[0048]
[Table 21
Intended Intended
Intended..Intended Intended
Intended
Ital "Iota!
, Total
Thickness "Fhickness Thickness
'thickness 'rhickness
Plating Layer Thickness of. Cu of Ni of Cr
of Thick of
Composition of Plating Electro- Electro-
Electro-
Electroless Electroless
Layer
Plating
Plating
Ni Plating Ni PlatingPlating
Lam) 1}11111 [tun] 1111111
[um] [um] __
Electroless Ni
a 5 0.5 4 0.5
r
¨1
Electroless Ni
h 10 0.5 9 0.5
iNi/Cr
. Flectroless Ni
c 15 0.5 14 0.5
/Ni/Cr
Electroless Ni
d 20 0.5 19 0.5
/Ni/Cr
Thick Electroless Ni
e20 10 9 0.5
/Ni/Cr
f Thick Electroless Ni 23 23
g Thick Electroless Ni 30 30
_,.
,
,
Electroless Ni
h 35 ! ¨ 0.5 15 19 0.5
!Cu/Ni/Cr
Electroless Ni 1
i 40 1 0.5 20 19 0.5
/Cu/Ni/Cr
I
Electroless Ni
. 1 /Cu/Ni/Cr 45 0.5 20 24 0.5
Electroless Ni
k 50 0.5 25 24 0.5
/Cu/Ni/Cr
Flectroless Ni
, 1 60 0.5 30 29 0.5
/Cu/Ni/Cr
--,
: m Electroless Ni 0.5 0.5
,
1
[0049]
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(Plating Process 1)
Target materials: materials A-E and El
10050]
Electroless nickel plating
[1] degreasing (68 C x 5 minutes), processing solution: ENILEX WE
manufactured by Ebara Udylite Co., Ltd.
[21 water washing
[3] pre-etching (40 C x 5 minutes), processing solution: ENILEX PE-300A,13
manufactured by Ebara Udylite Co., Ltd.
141 water washing
151 etching (68 C x 10 minutes), processing solutions: chromic acid 400 g/L
and
sulfuric acid 200 cc/I.
161 recovery
[7] water washing.
181 neutralization (room temperature x 1 minute), processing solution: ENILEX
RD manufactured by Ebara Udylite Co., Ltd.
191 water washing.
1101 special neutralization (room temperature x 2 minutes), processing
solution:
ENILEX LEX NW manufactured by Ebara Udylite Co., Ltd.
[11] water washing
112] pre-dip (room temperature x 1 min), processing solution: 35 wt%
hydrochloric acid 100 cc/I.
1131 catalyzing treatment (30 C x 4 minutes), processing solution: ENILEX
CT-580 manufactured by Ebara Udylite Co., Ltd.
1141 water washing
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19
[15] activation treatment (40 C x 3 minutes), processing solution: 35 wt%
hydrochloric acid 100 cc/1.
[161 water washing
1171 electroless nickel plating (40 C x 5 minutes, intended thickness: 0.5
um),
processing solution: ENILEX NI-100 manufactured by Ebara Udylite Co., Ltd.
1181 water washing
[00511
Thick electroless nickel plating
111 degreasing (68 C x 5 minutes), processing solution: ENILEX WE
manufactured by Ebara Udylite Co., Ltd.
12] water washing
[3] pre-etching (40 C x 5 minutes), processing solution: ENILEX PE-300A,B
manufactured by Ebara Udylite Co., Ltd.
[4] water washing
151 etching (68 C x 10 minutes), processing solutions: chromic acid 400 g/L
and
sulfuric acid 200 cc/I.
161 recovery
171 water washing.
[8] neutralization (room temperature x 1 minute), processing solution: ENILEX
RI) manufactured by Ebara Udylite Co., Ltd.
[9] water washing.
1101 special neutralization (room temperature x 2 minutes), processing
solution:
ENILEX LEX NW manufactured by Ebara Udylite Co., Ltd.
[11] water washing
112] pre-dip (room temperature x 1 min), processing solution: 35 wt%
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hydrochloric acid 100 cc/L
1131 catalyzing treatment (30 C x 4 minutcs), processing solution: ENILEX
CT-580 manufactured by Ebara tidylite Co., Ltd.
1141 water washing
5 [15] activation treatment (40 C x 3 minutes), processing solution: 35
wt%
hydrochloric acid 100 cc/L
[16] water washing
1171 thick electroless nickel plating (90 C x 60 minutes in the case where the
intended thickness is 20 tint), processing solution: EN1PAC MM manufactured by
Ebara
10 tidy] ite Co., 1.td.
[18] water washing
[00521
Electroplating:
[1.1 copper sulfate plating (25 C x 4 A/dm2 x 20 minutes in the case where the
15 intended thickness is 20 pm), processing solutions: copper sulfate 200
g/L and sulfuric
acid 60 g/L, brightening agent of an appropriate amount
[2] bright nickel plating (55 C x 3.5 A/dm2 x 30 minutes in the case where the
intended thickness is 20 um), processing solutions: nickel sulfate 300 g/L,
nickel chloride
50g/1, and boric acid 40 g/l.õ brightening agent of an appropriate amount
20 131 chrome plating (45 C x 30 A/dm2 x 2 minutes, intended thickness:
0.5 m),
processing solutions: chromic acid anhydride 200 g/I. and sulfuric acid 2 WI.,
additive of
an appropriate amount
[0053]
(Plating Process 2)
Target materials: materials F and G
CA 02866813 2014-09-09
21
[0054]
Electrolcss nickel plating
111 degreasing (68 C x 5 minutes), processing solution: EN1LEX WE
manufactured by [Mara Udylite Co., Ltd.
121 water washing
[3] etching (35 C x 7 minutes), processing solutions: 35 mass% hydrochloric
acid 220 cc/L and TN etch ant 200 cc/1_,
141 post-etching (25 C x 2 minutes), processing solution: 35 mass%
hydrochloric acid 60 cc/I.
[5] water washing
[6] catalyzing treatment (25 C x 3 minutes), processing solution: EN1LEX
CT-580 manufactured by Ebara Udylite Co., Ltd.
171 water washing
181 accelerator (40 C X 3 minutes), processing solution: 98 mass% sulfuric
acid
50 cc/1,
191 water washing
1101 post-accelerator (40 C x 2 minutes), processing solution: sodium
hydroxide
g/L
111] water washing
20 1121 electroless nickel plating (40 C x 5 minutes, intended thickness:
0.5 um),
processing solution: ENILEX NI-100 manufactured by Ebara Udylite Co., Ltd.
[13] water washing
100551
Electroplating:
111 copper sulfate plating (25 C x 4 A/dm2 20 minutes in the case where the
CA 02866813 2014-09-09
22
intended thickness is 20 lam), processing solutions: copper sulfate 200 g/L
and sulfuric
acid 60 g/L, brightening agent of an appropriate amount
[2] bright nickel plating (55 C x 3.5 A/dm2 x 30 minutes in the case where the
intended thickness is 20 um), processing solutions: nickel sulfate 300 g/L,
nickel chloride
50g/L and boric acid 40 g/L, brightening agent of an appropriate amount
[3] chrome plating (45 C x 30 A/dm2 x 2 minutes in the case where the intended
thickness is 0.5 um), processing solutions: chromic acid anhydride 200 g/L and
sulfuric
acid 2 R/1õ additive of an appropriate amount
100561
[Example 11
(Flexural Modulus of Filler Reinforced Plastic)
The material F was molded by the injection molding machine so as to obtain the
test piece with 12.5 mm x 127 mm x 4 mm thickness. The flexural modulus of the
test
piece was measured. The results are shown in Table 3.
10057]
(Flexural Modulus of Filler Reinforced Plastic)
The material F was molded by the injection molding machine so as to obtain the
test piece with 12.5 mm x 127 mm x 1 mm thickness. The plating layer was
formed in
accordance with the composition and the intended total thickness a shown in
Table 2, so
as to obtain the plated test piece. The flexural modulus of the plated test
piece was
measured. The results are shown in Table 3.
[00581
(Plated Plastic Chassis)
The material F was molded by the injection molding machine so as to obtain the
plastic chassis body (the internal chassis test piece for a mobile device)
with 80 mm
CA 02866813 2014-09-09
23
125 mm x 1.5 mm thickness. 'fhe plating layer was formed in accordance with
the
composition and the intended total thickness a shown in Table 2, so as to
obtain the
plated plastic chassis. The flexural modulus of the plated plastic chassis was
measured,
and the warpage, dimensional accuracy and heat cycle property were evaluated.
The
results are shown in Table 3.
[0059]
'Examples 2-25 and Comparative Examples 1-51
The test pieces, plated test pieces and the plated plastic chassis were
obtained in
the same manner as Example I except that the material F was changed with the
material
shown in Tables 3 and 4 and the composition and intended total thickness a
were changed
with the composition and intended total thickness shown in Tables 3 and 4. The
results
are shown in Tables 3 and 4.
. 7
' Conipo-P
. Plating Layer (gm)
Evaluation
salon
o-
,
Flexural l, and ' Flexural FT
'
,
. ! , Modulus
Measured It..../
Modulus : Intended Measured Measured Measured
_
, Mate- of Plated Measured
Value of . Heat Cycle Property _
of ' Total Value of Value of
Value of C
, rial 1 Material Thick- Cu Ni Cr Test i
Value of Thick Dimon- C
! .
Piece Total Electro- Warpage
tional
(MPa) ness of Elcctro- Elcctro- Elcctro-
Plating
C
' iN Plating Plating Plating
IPal Thick- less Ni Accuracy .
First 1 Second Third ---,
[gnu] [pm] [
Layer ]
ness*11 Plating
: Time Time Time
, pm
,
1 F 17900 a 25000 . 6 5.5 0.5 A
S A A B
i
1 .
,
,
. 2 C 14300 ; b 25500 , 11 10 0.5 S
S A A B
_____________________________________________________________________________
I-----
,
P
3 E 14800 b 26000 12 11 0.5 S
S A A B tv
00
0,
0,
00
Exam-1-
4 C 14300 c 29700 16 15 0.5 S
S A A AB L.
ple I I
1.,
0
1-
A.
1
E 14800 c 30200 '' 16 15 0.5 S S A
A A 0
,.0
1
0
6 F 17900 c 33300 15 14 0.5 A
S A A A
1
_______________________________________________________________________________
__________________
7 G 13500 c 28900 16 l - - 1 15 0.5
A S .A A AB
1
_______________________________________________________________________________
__________________
*1.) The thickness of all the usual electroless Ni plating was considered as
0.5 p.m.
*2) The measured value of the thick electro-less Ni plating was considered as
the sum of the thick electro-less Ni plating and the Ni electroplating.
-
, Plating Layer (pm) Evaluation o--
sition
Flexural F.:
, Flexural and
1 Modulus i Measured
c...,...)
' Modulus Intended , Measured
Measured Measured
Mate- of Plated Measured
Value of , Heat Cycle Property <1:,
, of Total Value of Value of Value
of
, rial Material Thick- C Cr Test Value of
Thick Dunce-
PieceElectro- 0
. u : Ni
=
Total Warpaae tional
(MPa) ness of . Electro- Electro- Elcctro-
Plating ( MPa)
¨.
Thick- less Ni - Plating Plating Plating Accuracy First
Second Third 72.'
=
ness" Plating Time Time Time n
Lay er [um] I ttin]
[tun] ra..
[tunl :
8 D 8300 e 27900 21 20*2) - ,k2)
. - ' 0.5 S
S A A AB
7
,
, 9 D 8300 f 30400 23 23
S S A A A
,
1
P
D 8300 g 36200 30 30 , S S A A
A
LA 2
0
0,
0
' 11 B 4300 h 36400 36 16 19 0.5 A
S A A A 1-
L.
Exam- I
I1.,
0
pie ,
1-
A.
12 C I 14300 h 46400 35 15 19 0.5
S S A A A ,
0
,.0
,
0
,.0
13 D 8300 h 40400 37 16 20 0.5 S
S A A A
,
14 E 14800 h 46900 36 15 20 0.5 S
S A A A
,
,
,
,
' 15 F 17900 h 50000 37 15 21 0.5 S
S A A A
*1) The thickness of all the usual electroless Ni plating was considered as
0.5 rim.
*2) The measured value of the thick electro-less Ni plating was considered as
the sum of the thick electro-less Ni plating and the Ni electroplating.
_
:
Compo- ,1 Plating Layer Olin)
Evaluation P
cr
saion . Flexural
F;
Flexural and Modulus ,
______________ ,
, Measured '
-F
Modulus Intended : Measured Measured i
Measured !
, Mate- Material Thick-
Total hick- Cu Ni Cr of Plated , Measured Value of
: Heat Cycle Property ¨ _
:
C
1 rial T Value of Value of Value of lest
Value of Thick Dimen- C
Piece ' Total Electro-
Warpage tional C"5
, (MPa) ness of i Elcctro- i
Elect-0- Electro-¨i
I \Val Thick- less Ni
Accurae First
Plating Plating Plating Plating
Second Third
ness" g
, Time Time Time
Layer [tun] [um] [urn]
' Platin1111-111
:
' 16 G 13500 h 45600 36 IS 20 0.5
S S '. A A A
,
17 H 20500 h i 52600 37 1 - 15 21 i 0.5 S
S A A A
18 C 14300 i 50600 41 20 20 0.5 S S
A ' A A I.) Q
as .
1.,
0
0,
19 E 14800 i 51100 42 21 20 0.5 S I
S A A A 0,
0
1-
L.
__________________________ ¨
-H--
_______________________________________________________________________________
________________________________ 1.,
0
20 I F 17900 i 54200 42 21 20 0.5
S S A ' A A
.i.
I
Exam-LI
0
,.0
1
ple
0
21 G 13500 i 49800 41 21 19 0.5 S S A ' A A
,
'221 C 14300-
54800 46 20 /5 0.5 S
A A A A
'r--
-1
i' 23 E 14800 j 55300 45 20 24 0.5 S A
' A A A
, 24 C 14300 k 58900 50 25 24 0.5 A A
A A A
L __________________________
= 15 E 14800 k 59400 50 /5 24 0.5
A A .A , A A
I
*1) The thickness of all the usual electroless Ni plating was considered as
0.5 pm.
_
^:.
' Compo- :
I'lating Laver Gun)
Evaluation
sition
0-
,
' FlexuralF-7
Flexural and . ,
, ,
==
Modulus Intended Modulus Measured Measured ', Measured
Measured
Mate- of Plated Measured
Value of Heat Cycle Property (1-:
of Total Test Value of I Value of
Value of .
' rial Value of
Thick , Dimen- 0
Material Thick- Piece Cu Ni
Cr =
Total Electro- Warpage ' tional
' (MPal ness of ' ova.) Electro- Elcctro-
Elcctro-
. Accurael,,
First 1 Second Third "5.
Thick- less Ni
Plating Platinu Plating Plating
ness*I.1 Plating *- Time I Time Time
et;
, Layer [Ka] 1.1.tm]
[um] C,...
T ________________________________________ 1lT1111 ,
¨
,
1
' 1 C 14300 m , 17600 0.5 - -I S
S A A A
1
. .
2 E 14800 , m 18100 0.5 S ,
S A A A
:
Coin-
'
1
parati VC 3
F 17900 m 21200 0.5 A A A
S A IV p
Exam- I
--A
0
'
_______________________________________________________________________________
_______________________________ Iv
pie -----
ix,
,os
4 A 2300 ' h 34400 36 15 19 0.5 B
B C 0,
1-
,..
1.,
0
11-
1 5 A 2300 ! 1 63580 62 31 30 0.5 C
C C .,.
,
,.0
,
0
,.0
*I) The thickness of all the usual electroless Ni plating was considered as
0.5 n.m.
_
CA 02866813 2014-09-09
28
10062-1
!Discussion]
In the plated plastic chassis of Examples 1-25, the flexural modulus was
25,000
MPa or higher, and the high rigidity was ensured. In addition, the plating
properties
such as the warpage, dimensional accuracy and heat cycle property were
excellent.
By contrast, in Comparative Examples 1-3 wherein the plating layers were thin,
the flexural modulus was 25,000 MPa or lower, and the rigidity was
insufficient. In the
plated plastic chassis of Comparative Examples 4 and Sin which the rigidity of
the
materials was less than 4,000 MPa, the flexural modulus was 25,000 MPa or
higher, and
the high rigidity was ensured. However, the plating properties were very poor.
[Industrial Applicability"
[00631
A plated plastic chassis of the present invention can be used as an internal
chassis of various electrical products such as a notebook type PC, a tablet
type PC, a
personal digital assistance, a cellular phone, a smart phone, a portable game
machine, an
electronic dictionary, an electronic book terminal, a portable audio/video
player, and a
car navigation system. Therelbre, the present invention is very useful in
industry.
In addition, a component for an electrical product obtained by installing a
plated
plastic chassis in a molding die and making a plated plastic chassis adhere to
a
component substrate is completed as the component which is much similar to a
product
incorporating an internal chassis, and an assembling process can be
simplified.
Therefore, the present invention is very useful in industry.
