Note: Descriptions are shown in the official language in which they were submitted.
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1
LED LIGHTING FIXTURE
Technical Field
The present invention relates to an LED lighting device, and more
particularly, to
an LED lighting device that is excellent in heat radiation characteristic and
which is easy to
control a light distribution.
Background Art
Illumination devices using existing light source means such as an incandescent
lamp and a fluorescent lamp have problems of high-power consumption and a
short lifespan,
for example. Considering these problems, illumination devices, using an LED as
a light
source, have been developed, in which the LEDs consume little power and have a
long
lifespan. When the LED
is used as a light source, the lifespan may increase remarkably
compared to existing illumination devices. As a result, the quantity of waste
can also be
greatly reduced to prevent environmental pollution. In addition, since the
power
consumption is reduced, it is expected that the LED illumination devices may
contribute to
energy saving.
However, despite the advantages described above, the LED has a problem in that
it
generates a large quantity of heat. When the heat generated from the LED is
not radiated
to the outside, the life span of the LED illumination devices will be reduced
and thus, the
long lifespan effect according to the use of the LED as a light source cannot
be achieved as
expected.
In addition, the LED illumination devices require a Switching Mode Power
Supply
(SMPS) which converts an external Alternating Current (AC) power into a direct
current
(DC) power to be supplied to the LED. For example, Korean Registered Utility
Model No.
20-0451090 discloses an LED landscape illumination lamp equipped with an SMPS,
in
2
which a substrate, on which an LED is mounted, and the SMPS are positioned to
be opposite to
each other with a support face being interposed therebetween. However, the
SMPS itself generates
heat. Accordingly, the LED landscape lamp has a problem in that the heat
generated from the
SMPS and the heat generated from the LED interact with each other so that the
lifespans of both the
SMPS and the LED are shortened.
Meanwhile, among LED illumination devices, in high-output LED lighting devices
(typically outputting 100 watt or more), high-power LED chips (e.g., 1 watt
LED chips) have been
used as light sources. This is because the number of LED chips required when
low-power LED
chips are used should be relatively larger than the number of LED chips
required when high-power
LED chips are used, and as a result, light distribution becomes difficult to
control. For example,
when 1 watt high-power LED chips are used, one hundred LED chips are required
in order to provide
a high output of 100 watt. However, when 0.2 watt low-power LED chips are
used, five hundred
LED chips are required and due to the increase of the number of light sources,
the light distribution
becomes difficult to control. In particular, in a case where high-output
lighting is provided within
a predetermined area in order to replace existing lighting, the light
distribution becomes more
difficult to control as the number of LED chips increases. Thus, high-power
LED chips are used.
However, since the high-power LED chips generate a lot of heat compared to the
low-power
LED chips, it is necessary to put more effort in heat radiation. Despite the
degradation of the heat
radiation characteristic, there has been no choice but to use the high-power
LED chips in order to
control the light distribution more easily.
When a high-output lighting device is implemented using high-power LED chips
as
described above, a large heat radiation means is required, and as a result,
problems occurs
in that the volume and weight of the device increase and the manufacturing
costs also
greatly increase. Especially, in a case of transparent lighting, due to a fact
that a lighting
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3
device has a large size and consumes a lot of power, what is requested is a
lighting device
that is compact and consumes little power.
Detailed Description of the Invention
Technical Problem
In order to solve the problems as described above, one embodiment of the
present
invention is intended to provide an LED lighting device which is capable of
easily radiate
heat generated from LEDs, preventing the heat generated from the LEDs from
being
transferred to the surroundings, and controlling a light distribution in a
desired form.
In addition, one embodiment of the present invention is intended to provide an
LED lighting device that is capable of blocking heat conduction between a
power supply
and a lighting unit.
Technical Solution
An LED lighting device according to one embodiment of the present invention
includes: a lighting unit provided with a plurality of LEDs as a light source
to generate light;
a housing including an opening provided on one face, a light emitting part
provided on the
other face to emit light outwardly, and an inner space; a reflecting part
provided on an inner
face of the housing to reflect light generated from the lighting unit to the
light emitting
part; and a heat radiation unit provided on a rear face of the lighting unit
to be exposed
outwardly so as to radiate heat outwardly. The lighting unit is installed to
cover the
opening such that its front face is directed toward the inner space of the
housing, and the
light emitting part is installed to emit the light generated from the lighting
unit or to emit
light reflected through the reflecting part from the lighting unit.
An LED lighting device according to another embodiment of the present
invention
4
includes: a lighting unit including a substrate, on which a plurality of low-
power LED chips are
mounted; a housing including a bottom face, a first inclined face formed an
acute angle with the bottom
face, and a second inclined face connected with the first inclined face, in
which opposite ends of the
bottom face, the first inclined face, and the second inclined face are
connected with each other to form
an inner space defined by the bottom face, the first inclined face, and the
second face as boundaries; and
a reflecting part on an inner face of the housing to reflect light generated
from the lighting unit. At least
a part of the lighting unit is inserted through a part of the first inclined
face such that the low-power LED
chips are directed to the inner space of the housing.
According to an aspect of the present invention, there is provided an LED
lighting device
comprising:
a lighting unit provided with a plurality of LEDs as a light source to
generate light;
a housing including a first face and a second face, the first face defining an
opening, the second
face being disposed opposite to the first face, the second face having a light
emitting part to emit light
outwardly, the housing defining an inner space;
a reflecting part provided on an inner face of the housing to reflect light
generated from the
lighting unit to the light emitting part; and
a heat radiation unit provided on a rear face of the lighting unit to be
exposed outwardly so as
to radiate heat outwardly,
wherein the lighting unit is installed to cover the opening such that its
front face is directed
toward the inner space of the housing, and the light emitting part is
installed to emit the light generated
from the lighting unit or to emit light reflected through the reflecting part
from the lighting unit, and
wherein the reflecting part includes a plurality of reflecting faces, the
plurality of reflecting
faces have different inclined angles, different areas, and different
curvatures with respect to the light
emitting portion to implement a pre-set light distribution characteristic when
the light is emitted through
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,
4a
the light emitting part, and formed on an inside of the housing.
According to another aspect of the present invention, there is provided an LED
lighting device
comprising:
a lighting unit including a substrate, on which a plurality of low-power LED
chips are mounted;
a housing including a bottom face, a first inclined face formed an acute angle
with the bottom
face, and a second inclined face connected with the first inclined face,
opposite ends of the bottom face,
the first inclined face, and the second inclined face being connected with
each other to form an inner
space defined by the bottom face, the first inclined face, and the second face
as boundaries; and
a reflecting part on an inner face of the housing to reflect light generated
from the lighting unit,
wherein at least a part of the lighting unit is inserted through a part of the
first inclined face such
that the low-power LED chips are directed to the inner space of the housing,
wherein the reflecting part includes a plurality of reflecting faces, the
plurality of reflecting
faces have different inclined angles, different areas, and different
curvatures with respect to the light
emitting portion to implement a pre-set light distribution characteristic when
the light is emitted through
.. the light emitting part, and formed on an inside of the housing.
Advantageous Effects
LED lighting devices according to the present invention are applicable to
various since they are
excellent in heat radiation characteristic and production efficiency, they may
be manufactured with high
productivity, they may allow an entire weight and volume of a final product to
be reduced, and they
enable a smooth light distribution control.
Brief Description of the Drawings
FIG. 1 illustrates an arrangement of LED chips of an LED lighting device
according to one
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4b
embodiment of the present invention;
FIG. 2 illustrates an arrangement of LED chips of an LED lighting device
according to
another embodiment of the present invention;
FIG. 3 is a perspective view illustrating an LED lighting device according to
one
embodiment of the present invention in a disassembled state;
FIG. 4 is a cross-sectional view illustrating the LED lighting device of FIG.
3 in the
assembled state;
FIG. 5 is a cross-sectional view illustrating an inclined angle of a
reflecting face of
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the LED lighting device of FIG. 3.
FIG. 6 is a plan view illustrating an LED lighting device according to one
embodiment of the present invention, in which reflecting parts are provided on
side faces;
FIG. 7 is a perspective view illustrating a fixing frame applied to an LED
lighting
5 device according to one embodiment of the present invention in a
disassembled state;
FIG. 8 is a perspective view of an LED lighting device according to another
embodiment of the present invention;
FIG. 9 is a side view of the LED lighting device of FIG. 8;
FIG. 10 is a view illustrating a part of the LED lighting device of FIG. 9 in
an
enlarged scale;
FIG. 11 is a cross-sectional view of an LED lighting device according to one
embodiment of the present invention;
FIG. 12 is a view illustrating light emission of an LED lighting device in a
case
where an inclined angle "a" is 0 degrees;
FIG. 13 is a view illustrating light emission of the LED lighting device when
the
inclined angle "a" is 45 degrees; and
FIG. 14 illustrates a light distribution diagram and a direct downward
illuminance
diagram of an LED lighting device according to one embodiment of the present
invention.
Mode for Carrying Out the Invention
Hereinafter, LED lighting devices of the embodiments of the present invention
will be described in detail with reference to the accompanying drawings.
FIG. 3 is a perspective view illustrating an LED lighting device according to
one
embodiment of the present invention in a disassembled state, and FIG. 4 is a
cross-sectional
2 5 view illustrating the LED lighting device of FIG. 3 in the assembled
state.
The LED lighting device according to one embodiment of the present invention
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includes: a lighting unit 100 provided with a plurality of LEDs as light
sources to generate
light; a housing 200 including an opening 220 provided on one face, a light
emitting part 210
provided on the other face to emits light outwardly, and an inner space; a
reflecting part 230
provided on an inner face of the housing 200 to reflect the light generated
from the lighting
unit 100 to the light emitting part 210; and a heat radiation unit 120
provided on a rear face
of the lighting unit 100 to be exposed outwardly so as to radiate the heat
outwardly. In the
LED lighting device, the lighting unit 100 is installed to cover the opening
220 such that its
front face is directed toward the inner space of the housing 200, and the
light emitting part
210 is installed to emit the light generated from the lighting unit 100 or to
emit the light
reflected through the reflecting part 230 from the lighting unit 100.
1. Lighting Unit
As illustrated in FIG. 3, according to one embodiment of the present
invention, the
lighting unit 100 includes a substrate 110, a plurality of LEDs 111 placed on
the substrate
110, and a metal plate 130 that supports the substrate 110. As for the LED
light sources,
LED chips are preferably used. COB (chip on board) type LED chips may also be
used.
The LED chips are preferably low-power LED chips. As for the low-power LED
chips, chips of 0.1 watts to 0.6 watts, preferably 0.2 watts to 0.5 watts may
be used. Since
the number of chips when low-power LED chips are used is larger than the
number of chips
when high-power LED chips having a higher power are used to provide the same
output on
the same area, the low-power LED chips are distributed such that the intervals
between
neighboring chips are narrower.
FIGS. 1 and 2 illustrate lighting units of LED lighting devices according to
embodiments of the present invention, more specifically an arrangement of low-
power LED
chips 111 and an arrangement of high-power LED chips 111 on the substrate,
respectively.
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As illustrated in FIGS. I and 2, in the LED lighting device using the low-
power LED chips,
five 0.2 watt LED chips may be arranged in a unit area (the parts indicated by
"A'' in the
drawings) (FIG. I) while in the LED lighting device using the high-power LED
chips, one 1
watt LED chip may be arranged in the unit area (FIG. 2). Thus, the interval
between each
two adjacent low-power chips, which is indicated by "dl" in FIG. 1, is
narrower than the
interval between each two adjacent high-power chips which is indicated by "d2"
in FIG. 2.
Although not illustrated, an LED lighting device, according to a modified
embodiment of
the present invention, may include ten 0.1 watt LED chips, four 0.25 watt LED
chips, or two
0.5 watt LED chips arranged within the unit area according to desired design
specifications
and/or customers' requests.
Since each of the LED chips 111 serves as a heat transfer point that transfers
heat
and a heat source, LED lighting devices using the low-power LED chips
according to one
embodiment of the present invention may transfer or radiate heat generated
from the used
LED chips to the substrate more uniformly (evenly). The low-power LED chips
are more
inexpensive, consume less power, and generate a smaller amount of heat than
the high-
power LED chips. In addition, the low-power LED chips have a higher brightness
efficiency than the high-power LED chips. For example, theoretically, there is
a lumen
difference per watt between the light beam of each of five 0.2 watt LED chips
and the light
beam of the one 1.0 watt LED chip. That is, the 0.2 watt LED chip has about
160 1m/w
while the 1.0 watt LED chip has about 140 1m/w, which means that the optical
efficiency of
the low-power LED chips is higher than that of the high-power LED chips.
According to one embodiment of the present invention, the high-power LED chips
(e.g., LED chips, of which the power consumption is about 1 watt) may also be
used.
When the high-power LED chips are used, the heat generated from the chips has
a relatively
high temperature as compared that generated from the low-power chips, which
may
generate a heat island phenomenon. In addition, since the interval between
each two
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neighboring chips is longer than that in the low-power LED chips in the same
area, heat
conduction may become difficult. Due to this, the lifespan of the high-power
LED chips
may be shortened. Accordingly, heat radiation design is far more important in
the high-
power LED chips. Accordingly, when the high-power LED chips are used, all the
heat
radiation design factors to be described below are preferably provided if
possible. Since an
amount of generated heat and a light distribution characteristic of the chips
should be varied
depending on the types of chips, the design and structure of a lighting device
should be
adjusted accordingly.
In one embodiment of the present invention, the lighting unit 100 is
detachable
from/attachable to the housing 200 so that the lighting unit 100 can be easily
replaced and
repaired. The lighting unit 100 is installed to close an opening 220 of the
housing 200 in a
state where the front face, on which the LEDs are installed, is directed
toward the inner
space of the housing 200. For example, the lighting unit 100 may be installed
by being
inserted into and coupled to the opening 220 of the housing 200.
In one embodiment of the present invention, the metal plate 130, to which the
substrate 110 is attached, has an inclined angle of an acute angle with
respect to the ground.
As a result, the LEDs 110 mounted on the substrate 110 are arranged to be
inclined with
respect to the ground. It may be understood that this is to increase the
illuminance in a
directly downward direction of the LED lighting device according to one
embodiment of the
present invention.
In addition, in one embodiment of the present invention, the metal plate 130
may
be manufactured by various methods. The metal plate 130 may be an extrusion-
molded
product, which is manufactured through extrusion molding. In the case where
the metal
plate 130 is an extrusion-molded product and the housing 200 is an injection-
molded
product, the thermal conductivity of the metal plate 130 is higher than that
of the housing
200, and thus, the heat generated from the LED chips can be rapidly conducted
through the
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metal plate 130 rather than through the housing 200.
2. Heat Radiation Unit
Referring to FIG. 3, a heat radiation unit 120 is provided on the rear face of
the
.. lighting unit 100 to be exposed outwardly, thereby radiating the heat
outwardly. Heat
radiation fins may be preferably used for the heat radiation unit 120. In this
case, a
plurality of heat radiation fins 120 protrudes on the rear face 130 of the
metal plate 130, and
the substrate 110 may be fixedly installed on the front face of the metal
plate 130, as
illustrated in FIG. 4. The LED chips 111 are mounted on the substrate 110 as
light
sources. When heat generated from the LED chips 111, the heat may be rapidly
transferred to the heat radiation fins 120 through the metal plate 130. When
the thermal
conductivity of the metal plate 130 is higher than that of the housing 200 as
described
above, the heat transfer to the heat radiation fins 120 may be executed more
rapidly. The
heat transferred to the heat radiation fins 120 can be easily radiated through
heat exchange
.. with the external air from the heat radiation fins 120. The number, shapes,
and positions of
the heat radiation fins 120 may be properly selected according to design
specifications
and/or a customers' request. For example, the heat radiation fins 120 may be
formed
horizontally. In addition, as illustrated in FIG. 3, the heat radiation fins
120 may be
formed in the vertical direction or in an inclined direction. When the heat
radiation fins
.. 120 are formed in the vertical direction or in an inclined direction with
respect to the
ground, foreign matter such as dusts may fall down by gravity so that
degradation of a heat
radiation characteristic caused by deposition of foreign matter can be
prevented. In
particular, when the heat radiation fins 120 are formed in the vertical
direction, convection
of air can be facilitated. That is, when heat radiation fins 120 are formed in
the vertical
direction, the air heat-exchanged in the space formed between the heat
radiation fins 120
may smoothly ascend without resistance to form a convection flow. Thus, the
heat
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radiation fins 120 are formed preferably in an inclined direction with respect
to the ground,
more preferably in the vertical direction. At least one of the heat radiation
fins 120 may
be formed in the horizontal direction and/or at least one of the heat
radiation fins 120 may
be formed in the inclined direction or vertical direction.
5 In some embodiments, the heat radiation fins 120 and the metal plate
130 may be
separately formed and interconnected with each other through a proper method.
In other
embodiments, the heat radiation fins 120 and the metal plate 130 may be
integrally formed
through a process such as extrusion molding or injection molding. Typically,
even with
the same material, an extrusion-molded product has a thermal conductivity
higher than that
10 of an injection-molded product. Thus, the heat radiation fins 120
and the metal plate 130
are formed preferably integrally, more preferably, through extrusion molding.
In this case,
the heat radiation effect is high due to the high thermal conductivity. In
addition, the metal
plate 130 and the heat radiation fins 120 are made of, preferably a material
having a thermal
conductivity higher than that of the housing 200.
3. Housing
According to one embodiment of the present invention, the housing 200 includes
a bottom face, a first included face forming an acute angle with the bottom
face, and a
second inclined face forming an acute angle with the bottom face and connected
with the
2 0 first inclined face. In the housing 200, the ends of the bottom
face, the first inclined face,
and the second inclined face are connected with each other to form an internal
space defined
by the bottom face, the first inclined face, and the second inclined face as
boundaries. The
opening 220 is provided through the first inclined face of the housing 200 and
the light
emitting part 210 is provided on the bottom face. The angle formed by the
bottom face
and the first inclined face, the angle formed by the first inclined face and
the second inclined
face, and the angle formed by the second inclined face and the bottom face are
set to satisfy
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11
desired design specifications and/or a customers' request.
In some embodiments of the present invention, the housing 200 may be formed
through a process such as extrusion molding or injection molding. Preferably,
the housing
200 is formed through the injection molding in its entirety. This is because
the housing
200 as an injection-molded product has a relatively low thermal conductivity
so that heat
conduction of the heat generated from the LEDs 111 to a power supply 300 or
conversely,
conduction of the heat generated from the power supply 300 to the LEDs 111 may
be
reduced.
In another embodiment of the present invention, a material have a relatively
low
thermal conductivity compared to the metal plate 130 and the heat radiation
fins 120 is
preferably used for the housing 200. This is because heat conduction between
the lighting
unit 100 and the power supply 300 through the housing 200 can be further
reduced. In
order to enable molding without using an insert in an injection mold, the
first inclined face
provided with the opening 220 is formed to be inclined with respect to the
ground.
According to one embodiment of the present invention, in the lighting unit
100, in
particular between the metal plate 130, on which the LED chips are mounted,
and the
housing 200, a heat insulation sealing unit 140 is disposed. The heat
insulation sealing unit
140 is formed of, preferably, a material having a low thermal conductivity.
The heat
insulation sealing unit 140 prevents infiltration of water into the inside of
the housing 200
2 0 and at the same
time, blocks the conduction of the heat generated from the LEDs 111 to the
housing 200. In addition, the heat insulation sealing unit 140 blocks the
conduction of the
heat generated from the power supply 300 to the lighting unit 100.
4. Reflecting Part
According to one embodiment of the present invention, a reflecting part 230
may
be installed on an inner face of the housing 200 to reflect the light
generated from the
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lighting unit 100 to the light emitting part (see FIG. 3).
As illustrated in FIG. 5, the reflecting part 230 may be formed of a plurality
of
reflecting faces 231, in which the respective reflecting faces 231 have
different inclined
angles 01, 02, 03,..., different curvatures, different areas, or at least two
of these features so
as to implement a pre-set light distribution characteristic when light is
emitted through the
light emitting part 210. By using the reflecting part 230 having the plurality
of reflecting
faces 231 with different inclined angles, the light distribution may be
efficiently controlled.
In particular, even in a case where low-power LED chips are used as light
sources, i.e., in a
case where the number of chips increases further so that the light
distribution is difficult to
control, a desired light distribution can be easily obtained. In order to
implement the pre-
set light distribution characteristic as described above, the number of the
low-power LED
chips 111 and the interval between each two neighboring chips can be adjusted.
Furthermore, the structure and shape of the reflecting part 230 can be
preferably designed.
For example, the LED chips may be mounted on the lighting unit 100 so that at
least a part
of light generated from the LED chips 111 can reach the reflecting part 230.
According to
one embodiment of the present invention, as illustrated in FIG. 5, the
reflecting faces may
be designed such that a reflecting face nearer to the lighting unit 100 has a
narrower area
and a reflecting face farther away from the lighting unit has a wider area.
As illustrated in FIG. 5, the reflecting part 230 may be formed on the ceiling
within the housing 200, on the opposite side faces of the housing 200, or on
the ceiling and
the opposite side faces of the housing 200. FIG. 6 is a plan view of a
lighting device
according to one embodiment of the present invention. As illustrated, the
light generated
from the LED chips I 1 1 on the substrate 110 are reflected laterally and then
emitted
outwardly through the light emitting part 210.
In addition, since the reflecting part 230 is provided to be attachable
to/detachable
from the housing 200, replacement and repair are easy to perform and further,
the light
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13
distribution characteristic can be freely adjusted.
Various materials, such as aluminum, may be used for the reflecting part 230.
In
addition, various coating methods may be used for forming the reflecting part
230. For
example, a method of depositing silver (Ag) on a Poly Carbonate (PC) to be
coated or
laminated may be used.
5. Light Emitting Part
According to one embodiment of the present invention, a cover 240 is installed
on
the light emitting part 210 to cover the light emitting part 240. The cover
240 prevents
foreign matter such as dusts from infiltrating into the housing 200. The cover
240 may be
fixed to the housing 200 through a method known in the corresponding technical
field. An
LED lighting device according to one embodiment of the present invention
includes a fixing
frame 250 that fixes the cover 240. The configuration and actions of the
fixing frame 250
will be described in more detail below.
6. Power Supply
According to one embodiment of the present invention, the power supply 300
that
supplies power to the lighting unit 100 is mounted on an outer face of the
housing 200. At
least one power supply port 201 is provided on the outer face of the power
supply 300 so as
to supply power to the substrate 110. The power supply 300 may be detachably
or non-
detachably mounted. In view of replacement or repair, the detachable type is
more
preferable. As illustrated in FIG. 4, since the power supply 300 is installed
on the upper
portion of the housing 200 so that the entire outer face of the power supply
300 is exposed
to the atmosphere, the LED lighting device according to one embodiment of the
present
invention may have an excellent heat radiation characteristic. In particular,
the power
supply 300 may be installed to be inclined with respect to the ground as
illustrated in FIG. 4
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14
and as a result, deposition of foreign matter, such as dusts, and resistance
by wind may be
reduced.
According to one embodiment of the present invention, the power supply 300 is
provided with fastening lugs 310 protruding downwardly (FIG. 4). The fastening
lug 310
may be mounted on the outer face of the housing 200 to be in contact with the
top face of
the housing 200 with a gap being interposed between the power supply 300 and
the outer
top surface of the housing 200. Since the power supply 300 and the housing 200
are in
contact with each other only through the fastening lugs, heat conduction
between the power
supply 300 and the housing 200 may be reduced. In addition, a space exists
between the
power supply 300 and the housing 200 except for the portion connected through
the
fastening lugs, the heat radiation effect can be enhanced. In another modified
embodiment,
as illustrated in FIG. 4, a heat radiation part 320 is also provided on the
outer face of the
power supply 300 so that heat radiation from the power supply 300 itself to
the outside may
be performed. As for the heat radiation part 320, heat radiation fins may be
preferably
used. The heat radiation fins are formed preferably to be inclined with
respect to the
ground, more preferably, in the vertical direction.
In another modified embodiment, the power supply 300 may be provided with an
antenna 340 that receives a wireless signal so that the power supplied to the
substrate 110
can be adjusted wirelessly from the outside (FIG. 3), and may include a
controller that
2 0 controls supply of the power according to the wireless signal received
through the antenna
340.
The positions of the light emitting part 210, the opening 220, and the power
supply
300 mounted on the outer face of the housing 200 may be determined depending
on design
specifications and/or customers' requests. For example, in some embodiments,
as
illustrated in FIGS. 3 and 4, the light emitting part 210 may be provided on
the bottom face
of the housing 200, and the opening 200 may be formed to be inclined from one
end of the
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bottom face toward the top side, and the outer face, on which the power supply
300 is
mounted, may be formed to be inclined from the other end of the bottom face
toward the top
side.
5 7. Fixing Frame
FIG. 3 illustrates a fixing frame 250 applied to an LED lighting device
according
to one embodiment of the present invention, and FIG. 7 illustrates the fixing
frame 250 in a
disassembled state.
As illustrated in FIG. 7, according to one embodiment of the present
invention, the
10 fixing frame 250 has a configuration that is divided into a plurality of
frames. That is, the
fixing frame 250 is formed generally in a window frame shape by assembling a
plurality of
bent frames 251 and linear frames 252 with each other.
The bent frames 251 come in contact with apexes of the cover 240 and edges
around the apexes, respectively, and the linear frames 252 come in contact
with the edges of
15 the cover 240 between the bent frames 251, respectively (see FIGS. 3 and
7). In addition,
each of the bent frames 251 and the linear frames 252 is coupled around the
bottom light
emitting part 210 of the housing 200 through coupling mechanisms, such as
bolts. In
particular, the bent frames 251 and the linear frames 252 may be coupled to be
partly
overlapped, and the overlapped parts may be provided with stepped portions 253
having
complementary shapes to be engaged with each other.
In this structure, the bent frames 251 may be assembled to the housing 200
with
the cover 240 being interposed therebetween, and the linear frames 252 may be
assembled
to the housing 200. At this time, the stepped portion 253 formed in each end
portion of a
linear frame 252 may be in contact with the corresponding stepped portion 253
of a bent
frame 251 to be engaged with the stepped portion 253, and the edge of the
linear frame 252
may be substantially in close contact with the bent frame 251 to be fixed.
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Since the bent frames 251 and the linear frames 252 are fixed to each other
through the close contact and fixation between the stepped portions 253, the
use of bolts for
fixing opposite end portions of the bent frames 251 and the opposite end
portions of the
linear frames 252 may be omitted. Thus, the time required for an assembling
process can
be shortened and the manufacturing costs can be reduced.
In the case of the divided fixing frame 250 as described above, even if a
lighting
device with a different size is changed, the fixing frame 250 can be used
merely by
changing the lengths of the linear frames 252 to be suitable for the size.
Thus, with the
divided fixing frame 250, it is not necessary to produce various frames by
models so that the
production costs can be reduced. In addition, although a fixing frame produced
in an
integral form may be deformed during production, the divided fixing frame 250
according to
one embodiment of the present invention does not tend to be deformed since it
is divided.
In addition, the divided fixing frame 250 may be easily stored by reducing the
volume
thereof.
8. Miscellaneous
FIG. 8 is a perspective view of an LED lighting device according to another
embodiment of the present invention, FIG. 9 is a side view of the LED lighting
device of
FIG. 8, FIG. 10 is a view illustrating a part of the LED lighting device of
FIG. 9 in an
2 0 enlarged scale.
Referring to FIGS. 8 to 10, an LED lighting device according to another
embodiment of the present invention further includes an angle adjusting unit
400 coupled to
the lighting unit 100 so as to tilt and pivot the LED lighting device
according to the above-
mentioned embodiments.
According to one embodiment of the present invention, the angle adjusting unit
400 includes a first pivot bracket 410 fixed to one side end of the rear face
of the lighting
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17
unit 100, a second pivot bracket 410 fixed to the other side end of the rear
face of the
lighting unit 100, a pivot fame 420 pivotally connected with the first pivot
bracket 410 at
one end and pivotally connected with the second pivot bracket at the other
end, and an arm
socket 430 coupled to a part of the pivot frame 420 to be
attachable/detachable, and joined
with a light stem (see FIGS. 8 and 9). The arm socket 430 allows an assembled
structure
of the lighting unit 100, the housing 200, and the power supply 300 to be
pivoted according
to the joined angle.
By pivoting the pivot frame 420, a reflection angle of the light emitted from
the
LEDs 111 through the reflecting part 230, and an emission angle of the light
through the
light emitting part 210 may be adjusted (see FIG. 9). As illustrated in FIG.
10, the pivot
brackets 410 include a rotation shaft 412 at the centers thereof, in which the
rotation shaft
penetrates a part of the pivot frame 420 to be fixed to a side face of the
lighting unit 100.
Each of the pivot brackets 410 is provided with a circular arc-shaped
penetration part 411
with the rotation shaft 412 as the center. Thus, the pivot frame 420 may be
fixed not to be
.. pivoted by tightening an anchoring bolt 421 coupled to one or each of the
pivot brackets 410
through the penetration part 411 in a state where the pivot angle of the pivot
frame 420 is
properly adjusted.
The pivot brackets 410 has a "U" shape in a plan view, and the arm socket 430
may be coupled to the face of the pivot frame 420, which is parallel with the
lighting unit
100. The arm socket 430 may be substituted by sockets or fastening members
having
various shapes or profiles as needed.
When the angle adjusting unit 400 configured as described above is used with
the
lighting device according to one embodiment of the present invention, the
light emission
direction may be adjusted regardless of an installation position (FIG. 8). As
a result, the
LED lighting devices according to the embodiments of the present invention are
applicable
to various fields including a street lamp, a ceiling lamp, a harbor lamp, and
a park lamp.
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18
That is, the LED lighting devices according to the embodiments of the present
invention
may be installed on a pillar of a street lamp, a wall or a ceiling, for
example. The LED
lighting device according to one embodiment of the present invention may be
freely
adjusted vertically so as to achieve a proper light distribution. For example,
the LED
lighting device may be adjusted from 70 degrees to 110 degrees.
FIG. 11 is a cross-sectional view of an LED lighting device according to one
embodiment of the present invention.
Referring to FIG. 11, according to one embodiment of the present invention, in
an
LED lighting device, the metal plate 130 is inclined with respect to the
ground as described
above, and inclined by an angle "a" with respect to a direction perpendicular
to the light
emitting part 210. As described above, the inclined angle "a" is determined by
taking the
illuminance in the directly downward direction of the light emitting part 210
and the range
of the inclined angle "a" may be properly adjusted with reference to design
specifications
such as a predetermined light distribution.
When the inclined angle "a" is too small, the amount of light directly emitted
from
the LED chips 111 to the light emitting part 210 is too little to obtain a
desired light
distribution. For example, when the inclined angle "a" is zero (0) degrees as
illustrated in
FIG. 12, most of the emitted light will be the light reflected through the
reflecting part 230
and merely a part of the emitted light will be directly emitted from the
lighting unit. Thus,
it will be difficult to obtain a suitable light distribution. Whereas, when
the inclined angle
"a" is too large, the amount of light directly emitted from the light emitting
part 210 will be
too large to obtain the desired light distribution. For example, when the
inclined angle "a"
is 45 degrees as illustrated in FIG. 13, most of the emitted will be direct
light directly
emitted to the light emitting part 210 and the light reflected through the
reflecting part 230
will be merely a part of the emitted light, so that it is difficult to obtain
the desired light
distribution. According to one embodiment of the present invention, the
inclined angle "a"
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=
19
may be but not exclusively larger than zero (0) degrees and smaller than 45
degrees. This
limit for the inclined angle "a" is determined in consideration of the fact
that due to the use
of low power LEDs, the present invention uses more LEDs than the prior art,
and thus, the
necessity to control the light distribution is high.
According to one embodiment of the present invention, when a straight line is
indicated vertically from the peak of the reflecting part 230 from the light
emitting part 210,
the ratio between the height "x" of the peak of the reflecting part 230 from
the light emitting
part 210 and the length "y" from the intersection point between the reflecting
part 230 and
the light emitting part 210 to the intersection point of the light emitting
part 210 and the
straight line also has an influence on the light distribution characteristic
of the present
invention (FIG. 11). For
example, it can be seen that the ratio of y/x in the lighting device
of FIG. 13 is relatively large compared to that in the lighting device of FIG.
12 and thus,
the lighting devices become different from each other in terms of the light
distribution
characteristic. The length "y" and the height "x" may be preferably set to
implement the
pre-set light distribution characteristic when the light emitted through the
light emitting part
210. In particular, it is preferable that the reflecting part 230 is designed
such that the
length "y" exceeds two times the height "x" and smaller than seven times the
height "x".
A more excellent light distribution characteristic can be obtained in this
aspect ratio.
According to one embodiment of the present invention, the ratio in luminous
flux
2 0 between the
light directly distributed from the light sources (direct light) and the light
distributed by being reflected through the reflecting part (reflected light)
may be adjusted
in a range of 4:6 to 6:4.
FIG. 14 illustrates a light distribution diagram and a direct downward
illuminance
diagram of a lighting device according to one embodiment of the present
invention. The
lighting device used 0.2 watt low-power LED chips, the power consumption of
the lighting
device was 300 watt, and the ratio in luminous flux between direct light and
reflected light
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was 51.4:48.6. The light distribution diagram and the directly downward
illuminance
diagram illustrated in FIG. 14 and the ratio in luminous flux between the
direct light and the
reflected light can be obtained by properly adjusting, for example, the
inclined angle "a" and
the ratio of y/x as described above.
5 Still another
embodiment of the present invention provides an LED lighting device
including: a lighting unit including a substrate, on which a plurality of low-
power LED
chips are mounted; a housing including a bottom face, a first inclined face
formed an acute
angle with the bottom face, and a second inclined face connected with the
first inclined face,
opposite ends of the bottom face, the first inclined face, and the second
inclined face are
10 connected with
each other to form an inner space defined by the bottom face, the first
inclined face, and the second face as boundaries; and a reflecting part on an
inner face of the
housing to reflect light generated from the lighting unit. At least a part of
the lighting unit
is inserted through a part of the first inclined face such that the low-power
LED chips are
directed to the inner space of the housing.
15 The LED lighting
devices according to the above-described embodiments of the
present invention have various advantages. For example, each of the lighting
unit and the
power supply is capable of being thermally isolated from the other structural
elements and
individually releasing (radiating) heat so that thermal conduction between the
lighting unit
and the power supply and hence reduction of the lifespan can be suppressed. In
addition,
2 0 since the housing
may be made of a material having a relatively low thermal conductivity
through injection molding, the thermal conduction between the lighting unit
and the power
supply can be suppressed. Furthermore, since the heat insulation sealing unit
configured to
block thermal conduction is disposed between the lighting unit and the
housing, the thermal
conduction between the lighting unit and the housing (and the power supply)
can be
suppressed. Moreover, since the housing includes a modified type of a frame
that fixes the
cover that covers the light emitting face, the deformation and damage of the
frame can be
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21
prevented, thereby improving the productivity.
In addition, since the lighting unit and the power supply can be manufactured
in
the form of separated pieces, an optimized weight and structure can be
implemented. In
particular, since the housing, the lighting unit, and the power supply can be
manufactured in
the form of separated pieces, the productivity can be enhanced at the time of
mass
production and hence the manufacturing costs can be reduced.
[96] In addition, the LED lighting devices of some embodiments may
further include
the angle adjusting unit pivotally coupled with the lighting unit, in which
since the structure
or shape of the arm socket assembled with the pivot bracket of the angle
adjusting unit is
variable, the illumination direction may be maintained regardless of the
installation position
of the lighting device, such as a ground, a ceiling, or a wall. Accordingly,
the LED
lighting devices can be applicable to various illumination fields and can be
used for various
purposes. In addition, even if low-power LED chips are used, the LED lighting
devices
may obtain a desired light distribution, heat generation caused by the use of
the high-power
LED chips can be reduced, and the weight and volume of the LED lighting
devices can be
reduced. In addition, since the LED lighting devices can be wirelessly
controlled in terms
of illumination, it is very convenient to operate the LED lighting devices.
The lighting device according to one embodiment of the present invention may
be
used for a floodlighting device with high-output illumination of 100 watts or
more. The
2 0 floodlighting device refers to a lighting device that collects light
emitted from a light source
so as to illuminate a distant place and is mainly used as a lamp for a vehicle
or a ship which
illuminates a distant location or lamps for external walls of building, an
outdoor work area
or a sport facility, for example. In particular, an outdoor floodlighting
device has a large
scale and consumes a very large amount of resource and power. Thus, it is
necessary to
reduce the consumption of resource and power as much as possible. The lighting
devices
according to the embodiments of the present invention can achieve desired heat
radiation
22
and light distribution characteristics with a relatively size, and thus, can
be used more efficiently
in floodlighting.
Although the present invention has been described with reference embodiments,
a
person ordinarily skilled in the art to which the present invention belongs
will understand that
the present invention is not limited to the embodiments and can be variously
changed or
modified without departing from the scope of the present invention.
[Reference Numerals]
100: lighting unit 110: substrate
111: LED (chip) 120: heat radiation unit, heat radiation fin
130: metal plate 140: heat insulation sealing unit
200: housing 210: light emitting part
220: opening, insertion hole 230: reflecting part
240: cover 250: fixing frame
251: bent frame 252: linear frame
253: stepped portion 300: power supply
310: fastening lug 320: heat radiation unit, heat radiation
fin
340: antenna 400: angle adjusting unit
410: pivot bracket 411: penetration part
412: rotation shaft 420: pivot frame
421: anchoring bolt 430: arm socket
CA 2931358 2017-11-02
