Note: Descriptions are shown in the official language in which they were submitted.
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INFRARED SENSOR ARRAY CIRCUIT BREAKER AND HOTSPOT
MONITORING
FIELD
[0001] This disclosure relates to thermal monitoring systems and
assemblies. More
particularly, at least one of an infrared sensor and a plurality of infrared
sensors arranged
in an array are employed either alone or in combination with one or more
additional
sensors in an electrical panel. The infrared sensor, the plurality of infrared
sensors, and
the one or more additional sensors are configured to monitor various
parameters including
a temperature of electrical components within the electrical panel.
BACKGROUND
[0002] Infrared sensors can be used in a variety of applications to measure
infrared
light radiating from objects within a field of view of the infrared sensor.
For example,
objects emit heat energy in the form of radiation, and infrared sensors can
detect infrared
wavelengths radiating from the object. The heat energy can indicate a
temperature of the
object as well as a change, such as an increase or a decrease in a
temperature, of the
object or a part of the object. In some instances, electrical components
(e.g., circuit
breakers) may experience changes in temperature that are detectable by
measuring
infrared wavelengths radiating from the components.
SUMMARY
[0003] The following presents a summary of the disclosure in order to
provide a basic
understanding of some example aspects described in the detailed description.
[0004] In a first example of the disclosure, a thermal monitoring system
includes an
infrared sensor having a resolution including a plurality of pixels. The
thermal
monitoring system also includes a controller configured to create a thermal
image of an
area to be monitored based at least in part on the plurality of pixels of the
infrared sensor.
[0005] In various embodiments of the first example, the thermal monitoring
system
includes an additional sensor including at least one of a current transformer
and an
ambient temperature sensor configured to respectively determine at least one
of a current
and an ambient temperature with respect to the area to be monitored; the
infrared sensor
is arranged inside an electrical panel, and the area to be monitored includes
an electrical
component located within the electrical panel; the thermal monitoring system
further
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includes a plurality of infrared sensors arranged in an array, wherein each of
the plurality
of infrared sensors has a resolution including a plurality of pixels, the area
to be
monitored includes an entire area within the electrical panel including a
plurality of
electrical components located within the electrical panel, and the controller
is configured
to create a thermal image of the entire area to be monitored based at least in
part on the
plurality of pixels of each of the plurality of infrared sensors; the
controller is further
configured to digitally overlay the thermal image onto a visual representation
of the area
to be monitored; the visual representation of the area to be monitored
includes at least one
of a picture of the area to be monitored, a wireframe drawing of the area to
be monitored,
a block diagram of the area to be monitored, and a photograph of the area to
be
monitored; the visual representation of the area to be monitored is stored
electronically
within a memory of the controller, and the controller is configured to access
the visual
representation of the area to be monitored from the memory and digitally
overlay the
thermal image onto the visual representation of the area to be monitored to
produce a
composite thermal map of the area to be monitored; the controller is
configured to map
each of the plurality of pixels the infrared sensor to a corresponding
plurality of points,
wherein each of the corresponding plurality of points is located within the
area to be
monitored; and/or the infrared sensor is configured to determine a temperature
at each of
the corresponding plurality of points, and the controller is configured to
create a thermal
map of the area to be monitored based at least in part on the temperature at
each of the
corresponding plurality of points.
[0006] In a second example of the disclosure, a thermal monitoring assembly
includes
an electrical panel including a plurality of electrical components located
within the
electrical panel; a plurality of infrared sensors arranged in an array,
wherein each of the
plurality of infrared sensors has a resolution including a plurality of
pixels, wherein the
array is located inside the electrical panel; an additional sensor located
inside the
electrical panel configured to determine additional data with respect to an
area to be
monitored; and a controller configured to map each of the plurality of pixels
of each of
the plurality of infrared sensors to a corresponding plurality of points,
wherein each of the
plurality of infrared sensors is configured to determine a temperature at each
of the
corresponding plurality of points, and each of the corresponding plurality of
points is
located within the area to be monitored, wherein the area to be monitored is
located inside
the electrical panel and includes the plurality of electrical components, and
wherein the
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controller is further configured to determine a characteristic of the
electrical panel based
at least in part on the temperature and the additional data.
[0007] In various embodiments of the second example, the additional sensor
is at least
one of a current transformer configured to measure a current of the plurality
of electrical
components and an ambient temperature sensor configured to measure an ambient
temperature with respect to the area to be monitored; the controller is
further configured
to at least one of report and analyze the characteristic to at least one of
diagnose and
predict at least one of a status or problem of the electrical panel; the
controller is
configured to create a thermal image of the area to be monitored based at
least in part on
the temperature at each of the corresponding plurality of points; the
controller is
configured to associate the temperature at each of the corresponding plurality
of points
with the area to be monitored, and the controller is configured to create a
composite
thermal map including the thermal image and a visual representation of the
area to be
monitored; the visual representation of the area to be monitored includes a
visual
representation of the electrical components, and the controller is configured
to create the
composite thermal map by digitally overlaying the thermal image onto the
visual
representation of the electrical components; the thermal monitoring assembly
also
includes a monitor and the controller is configured to at least one of display
the thermal
image on the monitor and identify the characteristic on the monitor; and/or
the electrical
panel includes a door configured to selectively provide and restrict access to
an interior of
the electrical panel, wherein the array is arranged on at least one of the
door and a frame
structure inside the electrical panel such that each of the plurality of
infrared sensors faces
the interior of the electrical panel when the door is arranged to restrict
access to the
interior of the electrical panel, and wherein the thermal monitoring assembly
can be
configured to determine a position of the door with respect to the interior of
the electrical
panel.
[0008] In a third example of the disclosure, a method of monitoring a
temperature of a
plurality of electrical components located inside an electrical panel includes
providing a
plurality of infrared sensors arranged in an array inside the electrical
panel, wherein each
of the plurality of infrared sensors has a resolution including a plurality of
pixels; and
mapping each of the plurality of pixels from each of the plurality of infrared
sensors to a
corresponding plurality of points, wherein each of the corresponding plurality
of points is
located within an area to be monitored, and the area to be monitored is
located inside the
electrical panel and includes the plurality of electrical components.
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[0009] In various embodiments of the third example, the method further
includes
determining a temperature at each of the corresponding plurality of points and
creating a
thermal image of the area to be monitored based at least in part on the
temperature at each
of the corresponding plurality of points; the method further includes
providing an
additional sensor inside the electrical panel, where the additional sensor is
configured to
determine additional data with respect to the area to be monitored; the method
further
includes creating a composite thermal map of the area to be monitored
including digitally
overlaying the thermal image onto at least one of a picture of the area to be
monitored, a
wireframe drawing of the area to be monitored, a block diagram of the area to
be
monitored, and a photograph of the area to be monitored; and/or the method
further
includes identifying at least one of the plurality of electrical components in
the composite
thermal map based at least in part on at least one of the temperature of at
least one of the
corresponding plurality of points and the additional data.
[0010] In a fourth example of the disclosure, a thermal monitoring system
includes a
thermal monitoring device and an electrical panel, wherein the thermal
monitoring device
comprises an infrared sensor arranged inside the electrical panel, and wherein
the infrared
sensor is configured to sense a temperature of one or more electrical
components located
within the electrical panel, wherein the infrared sensor has a resolution
comprising a
plurality of pixels; and wherein the thermal monitoring system further
comprises a
controller, wherein the controller is configured to create a thermal image of
an area to be
monitored based at least in part on the plurality of pixels of the infrared
sensor.
[0011] In various embodiments of the fourth example, the thermal monitoring
device
is positioned at an angle with respect to a front face of an interior of the
electrical panel,
the front face comprising the one or more electrical components; the thermal
monitoring
device is configured to be rotatable with respect to a front face of an
interior of the
electrical panel, the front face comprising the one or more electrical
components; the
thermal monitoring device is configured to be translatable with respect to a
front face of
an interior of the electrical panel, the front face comprising the one or more
electrical
components; and/or the thermal monitoring system further includes a guide
along which
the thermal monitoring device is configured to translate.
[0012] In a fifth example of the disclosure, a method of monitoring a
temperature of
one or more electrical components located inside an electrical panel includes
providing a
thermal monitoring device comprising an infrared sensor inside the electrical
panel,
wherein the infrared sensor has a resolution comprising a plurality of pixels;
and mapping
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each of the plurality of pixels from the infrared sensor to a corresponding
plurality of
points, wherein each of the corresponding plurality of points is located
within an area to
be monitored, and wherein the area to be monitored is located inside the
electrical panel
and comprises the one or more electrical components.
[0013] In various embodiments of the fifth example, the method further
includes
determining a temperature at each of the corresponding plurality of points,
and creating a
thermal image of the area to be monitored based at least in part on the
temperature at each
of the corresponding plurality of points; the method further includes
positioning the
thermal monitoring device at an angle with respect to a front face of an
interior of the
electrical panel, the front face comprising the one or more electrical
components; the
method further includes rotating the thermal monitoring device with respect to
a front
face of an interior of the electrical panel, the front face comprising the one
or more
electrical components; and/or the method further includes translating the
thermal
monitoring device with respect to a front face of an interior of the
electrical panel, the
front face comprising the one or more electrical components.
[0014] It is to be understood that the above examples and embodiments
thereof can be
provided alone or in combination with one or any combination of other examples
and
embodiments described herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] These and other features, aspects, and advantages of the present
disclosure are
better understood when the following detailed description is read with
reference to the
accompanying drawings, in which:
[0016] FIG. 1 is an illustration of an example thermal monitoring system
arranged in
an electrical panel as described herein;
[0017] FIG. 2 is an illustration of an example thermal monitoring array
including a
plurality of infrared sensors and one or more additional sensors as described
herein;
[0018] FIG. 3 is an illustration of an infrared sensor as described herein;
[0019] FIG. 4 is an illustration of electrical components within an
electrical panel as
described herein;
[0020] FIG. 5 is an illustration of the electrical components within an
electrical panel
shown in FIG. 4 having a temperature profile determined by the example thermal
monitoring arrays as described herein;
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[0021] FIG. 6 is an illustration of an electrical component shown in FIG. 5
having a
temperature profile determined by the example thermal monitoring arrays as
described
herein;
[0022] FIG. 7 is another illustration of the electrical components within
an electrical
panel shown in FIG. 4 having a temperature profile determined by the example
thermal
monitoring arrays as described herein;
[0023] FIG. 8 is another illustration of the electrical components within
an electrical
panel shown in FIG. 4 having a temperature profile determined by the example
thermal
monitoring arrays in accordance with embodiments described herein; and
[0024] FIG. 9 is an illustration of an example user interface displaying a
temperature
profile of electrical components within an electrical panel as described
herein.
[0025] FIG. 10 is an illustration of a top view of a first example thermal
monitoring
device as arranged at various angles in accordance with embodiments described
herein;
[0026] FIG. 11 is an illustration of a top view of a second example thermal
monitoring
device as arranged at various angles in accordance with embodiments described
herein;
and
[0027] FIG. 12 is an illustration of a top view of a third example thermal
monitoring
device as arranged at various angles in accordance with embodiments described
herein.
DETAILED DESCRIPTION
[0028] The following presents a description of the disclosure; however,
aspects may
be embodied in many different forms and should not be construed as limited to
the
embodiments set forth herein. Furthermore, the following examples may be
provided
alone or in combination with one or any combination of the examples discussed
herein.
[0029] Electrical panels can be installed or mounted in any one or more of
a variety of
locations and environments where electrical components are used, including,
but not
limited to, commercial and residential buildings, factories, industrial
plants, and other
structures or locations having electrical components. Infrared (IR) sensors
can be placed
inside such electrical cabinets or panel boards and used to remotely monitor
hotspots
within the cabinet or board. Hotspots can include regions where an increase in
temperature of a wire, connector, or other electrical component (e.g.
switchgear) occurs.
For example, an electrical load that draws excess current can generate heat.
Corroded or
loose contacts that increase contact resistance can also cause heating of the
electrical
components. Monitoring the cabinet or board for such heat can help to reduce
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maintenance costs and can also provide the ability to detect problem areas,
wires,
connectors, or other electrical components before failure or other faults
occur.
[0030] As shown in FIG. 1, a thermal monitoring system 100 is arranged
inside an
electrical panel 200. The thermal monitoring system 100 includes one or more
arrays 105
of thermal monitoring devices, examples of which are shown in FIGS. 2 and 3
and
discussed in detail below.
[0031] The electrical panel 200 includes a cabinet 205 that houses a
plurality of
electrical components 230 (e.g., circuit breakers, wires, transistors, diodes,
receivers,
circuits, semiconductors, resistors, capacitors, transducers, antennas,
terminals,
connectors, cables, switches, and any other electrical or mechanical
components or
devices). The electrical panel 200 can include a connection point 250
configured to
provide input and output connection to and from the electrical panel 200,
respectively.
For example, the electrical panel 200 can be connected to a main power source
(e.g.,
input connection) and distribute the main power to various components
connected to the
electrical power (e.g., output connection or connections). The electrical
panel 200 can
include a door 210 configured to selectively provide and restrict access to an
interior 245
of the electrical panel 200. As shown, and as further detailed with respect to
FIG. 2, the
array 105 can be arranged on the door 210, either permanently or releasably
detachable,
such that each infrared sensor 115 of the plurality of infrared sensors 110,
or other device
of the array 105, faces the interior 245 of the electrical panel 200 when the
door 210 is
arranged to restrict access to the interior 245 of the electrical panel 200
(e.g., when the
door 210 is closed). In other examples, the array 105 can be mounted in the
electrical
cabinet 200 using a bracket or other structural mount or frame that is
separate from and
not connected to the door 210. In still other examples, a single infrared
sensor 115 can be
employed. Thus, in operation, the thermal monitoring assembly 101 and the
thermal
monitoring system 100 can be employed without having to open or access the
electrical
panel 200.
[0032] The thermal monitoring system 100 can be configured to determine a
position
of the door 210 with respect to the interior 245 of the electrical panel 200.
For example,
the thermal monitoring system 100 can be configured to monitor whether the
door 210 of
the electrical panel 200 is open or closed to ensure proper closure of safety
critical
equipment. Thus, the thermal monitoring system 100 can detect the existence of
a gap or
opening between the door 210 and the interior 245 of the electrical panel 200.
In some
instances, a gap or opening may be desirable to, for example, permit heat to
escape the
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interior 245 of the electrical panel 200. In other examples, it may be
desirable to monitor
the position of the door 210 with respect to the interior 245 of the
electrical panel 200 to
ensure that the door 200 is closed and no atmospheric conditions (e.g. weather
conditions,
external heat, moisture, dirt, etc.) can enter the electrical panel 200. The
electrical panel
200 can also be configured to be explosion-proof such that in the event of an
explosion
interior to or exterior to the electrical panel 200, the explosion can be
respectively
retained within the interior 245 of the electrical panel 200 or prevented from
entering the
interior 245 of the electrical panel 200. For the electrical panel 200 to be
explosion proof,
it may be desirable to determine that the door 210 is properly closed to
restrict access to
the interior 245 of the electrical panel 200.
[0033] By arranging the thermal monitoring system 100 on the interior
portion of the
door 210 of the electrical panel 200 or inside the electrical panel 200 on a
frame or other
structure, a thermal image of the area to be monitored 215 (e.g., the entire
area 220 to be
monitored) can be created irrespective of the particular electrical components
230 located
within the electrical panel 200. As such, a thermal map of the contents or
components of
the electrical panel 200, regardless of the particular layout, orientation,
configuration, or
type of component within the electrical panel 200 can be obtained. A
controller 300 can
be configured to display the thermal image on a monitor 400 or other
communication
interface (e.g., computer, tablet, cellular phone, or any other electronic or
visual display
or screen)
[0034] Regarding the thermal monitoring arrays 105, each array 105 of the
thermal
monitoring system 100 can include at least one of an infrared sensor 115 (or a
plurality of
infrared sensors 110 as shown in FIG. 2) and/or other thermal monitoring
devices. While
the thermal monitoring system 100 is described herein with respect to arrays
105 of
devices, it should be understood that the scope of this disclosure is not
limited to
arrangement in an array. Rather, the thermal monitoring devices of the
discussed arrays
may be arranged in any number or in any geographic pattern. In other words,
the array
105 can include any number infrared sensors 115 or other devices arranged in
any pattern,
orientation, or configuration. For example, a cascaded array as illustrated in
FIG. 1 may
be desirable for application where the area to be monitored is rectangular.
However, in
other applications, the array 105 can have any shape or arrangement including
arrangements not explicitly disclosed herein. Each infrared sensor 115 (shown
in FIG. 3)
of the plurality of infrared sensors 110 has a resolution of a plurality of
pixels. Thus the
controller 300 can be further configured to create the thermal image (e.g., as
shown in
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FIGS. 5-8) of an area to be monitored 215 based at least in part on at least
one of the
plurality of pixels of each infrared sensor 115 and the plurality of pixels of
each infrared
sensor 115 of the plurality of infrared sensors 110.
[0035] The thermal monitoring devices other than infrared sensors can
(schematically
illustrated as additional sensors 150, in FIG. 2) include current transformers
or ambient
temperature sensors as well as other sensors not explicitly disclosed herein.
The one or
more additional sensors 150 can be associated with one or more of the
plurality of
infrared sensors 110 or can be disposed adjacent to or within the electrical
panel 200 to
sense, for example, over-current situations where one or more of the plurality
of electrical
components 230 is experiencing a current that is above a threshold current. An
ambient
temperature sensor can be used to determine a temperature of an environment in
which
the electrical panel 200 is employed such that a comparison or determination
to
differentiate whether a temperature is attributable to an overheating of one
or more of the
plurality of electrical components 230 or a generally increased ambient
temperature from
the surrounding environment. Based at least on data measured, detected, or
otherwise
determined by the additional sensor 150 (e.g. a temperature, a current, or
other data
point), the thermal monitoring system 100 can be configured to report or
analyze the data
to predict or diagnose a status or problem of the electrical panel.
[0036] The area to be monitored 215 includes an electrical component 225
located
within the electrical panel 200. In another example, the area to be monitored
215
includes an entire area 220 within the electrical panel 200 including a
plurality of
electrical components 230 located within the electrical panel 200. In another
example,
the area to be monitored can include any portion and any portion size in the
interior of the
electrical panel, for example, the area can include a plurality of electrical
components.
[0037] The thermal monitoring system 100, including the one or more
additional
sensors 150, can therefore provide a full diagnostic assessment of the
electrical panel 200
including the plurality of electrical components 230. Thus, a specific issue
(e.g. over-
current, excessive ambient temperature, a loose connection, a corroded or poor
connection, and high resistance) can not only be detected but can be
differentiated from
other specific issues (e.g. over-current, excessive ambient temperature, a
loose
connection, a corroded or poor connection, and high resistance). Thus, unsafe
or
unreliable conditions within the electrical panel 200 can be identified and
addressed based
at least in part on the particular specific issue or issues that are detected.
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[0038] It is to be understood that, while the thermal monitoring system 100
are
described herein as being employed with respect to an electrical panel 200,
other
applications of thermal monitoring exist for the thermal monitoring system
100. For
example, the thermal monitoring system 100 can be used to monitor a
temperature of any
object or objects that emit heat energy. Because any object with a temperature
above
absolute zero emits heat energy in the form of radiation, the thermal
monitoring system
100 disclosed herein has a variety of applications that are within the scope
of the present
disclosure, including those not explicitly described herein. Moreover, it is
to be
understood that a wired or wireless connection between any one or more of the
components disclosed herein is contemplated. For example, the controller 300
can
communicate via a wired or wireless connection with the thermal monitoring
system 100.
Similarly, the thermal monitoring system 100 can communicate via a wired or
wireless
connection with the monitor 400. Such communication can occur at any distance,
including remote communication transmitted over a network or other system. Any
one or
more of the components and features of the thermal monitoring system 100 can
be
configured to operate manually or automatically as well as one time,
periodically, or
continuously.
[0039] Turning to FIG. 2, an example infrared sensor 115 of the array 105
of the
thermal monitoring system 100 are shown. The infrared sensor 115 can be
electronically
mounted onto a circuit board 140 (e.g., printed circuit board or PCB). The
circuit board
140 can include one or more additional components (e.g., a driver 130)
configured to
power or communicate with each of the infrared sensors 115 as well as
electrical
connections and terminals configured to electrically connect with each
infrared sensor
115 of the plurality of infrared sensors 110. As shown in FIG. 3, the infrared
sensor 115
includes a main body 116 that houses sensor electronics (not shown) to which
terminals
117 that connect the infrared sensor 115, including the sensor electronics to
the circuit
board 140, are attached. The infrared sensor 115 includes a sensor face 118,
which can
include a lens or filter, through which infrared radiation enters. The sensor
face 118, or
faces in a plurality or array of sensors, preferably faces the interior of the
electrical panel
200. The infrared sensor 115 detects infrared radiation emitted or reflected
from an
object, for example, electrical components 230 in the electrical panel.
[0040] The infrared sensor 115 can be any suitable infrared sensor known in
the art or
otherwise available, including those infrared sensors not explicitly disclosed
herein. For
example, a MELEXIS brand infrared sensor can output 64 pixels (e.g., 16 x 4
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resolution) and can cover a 60 degree field of view. When arranged in an array
(e.g., 7
sensors wide by 1 sensor tall) a continuous 112 x 4 pixel resolution array can
be created.
Considering potential physical space limitations (e.g., inside the electrical
panel 200) a
field of view of the infrared sensor 115 can be approximately 3 inches.
Accordingly,
each infrared sensor 115 of the plurality of infrared sensors 110 arranged in
an array 105
can have approximately 5 x 4 pixel resolution dedicated to each electrical
component 225
(e.g., circuit breaker). In other examples, the specific pixel resolution
dedicated to each
electrical component 225 can be more or less than the specific example
disclosed herein
and can include other pixel resolutions including those not explicitly
described herein. It
is to be understood that by distributing each infrared sensor 115 of the
plurality of
infrared sensors 110 in an array 105 that a field of view otherwise unable to
be achieved
with, for example, traditional infrared cameras can be achieved. Moreover,
even if a wide
angle lens (e.g. an ultra-wide angle lens) were used on a traditional infrared
camera, it is
likely that distortion would limit resolution at the periphery of the field of
view. Thus, an
array 105 including a plurality of infrared sensors 110, wherein each of the
infrared
sensors 115 includes a plurality of pixels, can detect infrared radiation
emitted or
reflected from one or more objects.
[0041] The controller 300 is configured to map each of the plurality of
pixels of each
infrared sensor 115 of the plurality of infrared sensors 110 to a
corresponding plurality of
points (e.g., locations or coordinates) within the area to be monitored 215
(e.g., the entire
area 220 to be monitored). Furthermore, each infrared sensor 115 of the
plurality of
infrared sensors 110 is configured to determine a temperature (e.g., an
absolute
temperature or a relative temperature) at each of the corresponding plurality
of points.
The controller 300 is configured to create a thermal map (e.g., as shown in
FIGS. 5-8) of
the area to be monitored 215 based at least in part on the temperature at each
of the
corresponding plurality of points.
[0042] As shown in FIG. 4, the plurality of electrical components 230
within the
electrical panel 200 has a uniform temperature profile 500 (schematically
illustrated by
boundary 500 as a monitored area). That is, the temperature at any one given
point (e.g.
pixel) does not exceed a threshold temperature (e.g., a temperature at which
degradation
to the plurality of electrical components 230 may occur) although the
temperature at any
one given point (e.g. pixel) may be different. Turning to FIG. 5, an increased
temperature
profile 505 (schematically illustrated by boundary 505) where a temperature at
a
particular one or more locations (e.g., location 510) is at or above the
threshold
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temperature (e.g., a temperature at which degradation to the plurality of
electrical
components 230 may occur).
[0043] In other examples, the controller 300 is configured to associate the
temperature
at each of the corresponding plurality of points with the area to be monitored
215 (e.g.,
the entire area 220 to be monitored). For example, as illustrated in FIG. 6,
with respect to
the electrical panel 200, if a circuit breaker 600 has a loose connection 601,
there can be a
point of increased resistance that can cause increased or excessive heating
over time. The
connection can, for example, become loosened or corroded over time or can
become
loosened due to improper installation, maintenance, or replacement, rendering
the circuit
breaker 600 or the connection 601 faulty. The heat generated inside the faulty
circuit
breaker 600 or connection 601 will cause the circuit breaker 600 and any
connected wires
605 or electrically conductive components to have a temperature that is
disproportionate
to (e.g., greater than) a temperature of other circuit breakers (e.g., other
circuit breaker
610) within the electrical panel 200 with, for example, better electrical
connections. For
example, the circuit breaker 600 and any connected wires 605 or electrically
conductive
components can have first, second, and third temperature profiles
(schematically
illustrated with reference numerals 625, 630, and 635, respectively) where the
first
temperature profile 625 is greater than the second temperature profile 630,
which is
greater than the third temperature profile 635. If the disproportionate
temperature or heat
of the faulty circuit breaker 600, wire 605, or connection 601 can be
detected, the faulty
circuit breaker 600, wire 605, or connection 601 can be identified and
appropriate
correction (e.g., maintenance, repair, or replacement) can be performed. By
periodically
or continuously monitoring the plurality of electrical components 230 within
the electrical
panel 200, a maintenance interval with respect to the plurality of electrical
components
230, can be extended, and potential safety concerns arising from faulty
electrical
components or connections can be corrected, prevented, or otherwise
identified.
[0044] Turning to FIG. 7, the controller 300 is configured to create a
composite
thermal map 700 including a thermal image 705 and a visual representation 710
(e.g., a
picture, a wireframe drawing, a block diagram, a photograph, a model, a
computer or
software generated image, a simplified block diagram, a graphic, rendering,
schematic, or
other visual or pictorial representation or depiction) of the area to be
monitored 215 (e.g.,
the entire area 220 to be monitored). The visual representation 710 can also
be generated
based at least in part on a catalog, product, model, or serial number of the
electrical panel
200, including a known or predetermined configuration of the plurality of
electrical
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components 230 therein. For example, the visual representation 710 of the area
to be
monitored 215 includes a photograph 805 (schematically illustrated in FIG. 8)
of the
plurality of electrical components 230, including the electrical component
225. Such a
visual representation 710 can be stored electronically within a memory of the
controller
300, or other memory either local to or remote from the thermal monitoring
system 100.
The controller 300 is configured to digitally overlay the thermal image 705
onto the
visual representation 710 of the area to be monitored 215.
[0045] It is to be understood that the thermal image 705 and/or data
extracted from the
thermal image 705 can be used individually or solely without associating the
thermal
image 705 and/or the data extracted from the thermal image 705 with the visual
representation 710 and/or data extracted from the visual representation 710.
[0046] In some examples, the visual representation 710 of the area to be
monitored
215 includes a photograph 805 (schematically illustrated in FIG. 8) of the
plurality of
electrical components 230, including the electrical component 225. The
photograph 805
can be a snapshot produced with a standard optical or visual-light camera. For
example,
the photograph 805 can be taken prior to installation of the electrical panel
200. One or
more optical cameras (not shown) can be arranged inside the electrical panel
200 or
integrated with one or more of each of the infrared sensors 115 of the
plurality of infrared
sensors 110 arrange in the array 105 and can capture one or more photographs
(e.g.,
photograph 805) of the area to be monitored 215. The one or more photographs
can
capture structural details or other visual information associated with one or
more of the
plurality of electrical components 230 and can represent actual physical
components
present in the electrical panel 200. The visual representation 710 can provide
a consistent
and recognizable image upon which the thermal image 705 can be digitally
overlaid.
[0047] Accordingly, by analyzing the composite thermal map 700 and/or the
realistic
composite thermal map 800 (e.g., looking at or digitally assessing and
comparing features
of the composite thermal map 700 and/or the realistic composite thermal map
800), a user
(e.g., a person, computer, or other device) can identify a temperature at a
single point as
well as a temperature profile of one or more of a specific structural detail
or other visual
information associated with one or more of the plurality of electrical
components 230. In
other examples, a spatial or geographic coordinate of each infrared sensor 115
can be
known, assigned, or otherwise determined and associated with one or more
features of the
thermal image 705.
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[0048] In addition, the controller 300 can be configured to patch or stitch
together a
plurality of adjacent images from each infrared sensor 115 of the plurality of
infrared
sensors 110 to produce a combined thermal image from the plurality of adjacent
thermal
images. In some examples, the controller 300 can compensate for pixel overlap
or gap
between one or more of the plurality of adjacent thermal images when patching
or
stitching together the plurality of adjacent images to produce an improved
combined
thermal image. The combined thermal image is thus formed from the plurality of
pixels
from each infrared sensor 115 of the plurality of infrared sensors 110
arranged in an array
105. The controller 300 can be configured to perform additional manipulation
or
calculations with any information obtained with the one or more infrared
sensors 115 of
the plurality of infrared sensors 110. For example, the controller 300 can
store (e.g.,
save) data and information, perform image processing or rendering functions to
correct or
enhance the thermal images, provide status alerts or warnings, disable or
adjust an
operation of one or more of the plurality of electrical components 230 as well
as other
functions including those not explicitly disclosed herein.
[0049] Moreover, although illustrated as a separate controller 300, it is
to be
understood that the controller could be integral to one or more of the
infrared sensors 115
or to the plurality of infrared sensors 110 arranged in an array 105 as well
as to the one or
more additional sensors 150. Further, the controller 300 could be integral to
the electrical
panel 200, the monitor 400, or any other component of the thermal monitoring
assembly
101 and the thermal monitoring system 100. Additionally, the controller 300
can include
any one or more of a microcontroller, programmable logic controller (PLC),
discrete
controller, circuit, computer, or other controller.
[0050] As noted, the controller 300 can be configured to display the
thermal image
705 on a monitor 400 or other communication interface. For example, as shown
in FIG.
9, the controller 300 can display the thermal image (e.g., the composite
thermal map 700
or the realistic composite thermal map 800) on a user interface 900 (e.g., an
active,
passive, or interactive user interface) having a representation of the one or
more electrical
components identified as exceed a temperature threshold. As illustrated, a
user
interacting with the user interface 900 would visually see that circuit
breaker 901
(corresponding to "15 LOAD 3") requires attention (e.g. repair, replacement,
or other
maintenance).
[0051] Various example thermal monitoring devices and arrays will now be
described
with the understanding that each of the examples can be included with each
other and/or
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any one or more features of the thermal monitoring system 100 described above,
as well
as any other features including those features not explicitly disclosed
herein.
[0052] Turning to FIG. 10, a top view of the first example thermal
monitoring device
or array 1000 is shown connected to the controller 300 and the monitor 400, as
described
above. The first example device or array 1000 is positioned or mounted at an
angle with
respect to a front face of the interior 245 of the electrical panel 200. For
instance, the first
example thermal monitoring device or array 1000 is arranged at an angle 175
(e.g. 30
degrees, within a range of 1-30 degrees, 30-45 degrees, greater than 45
degrees, or any
other angle) about a plane 176 that is parallel to the front face of the
interior 245 of the
electrical panel 200. The plane 176 can be parallel to, for example, the door
(not shown)
of the electrical panel 200. When the first example device or array 1000 is
positioned or
mounted at an angle 175 with respect to the electrical components 225 (e.g. a
first
switchgear 225a, a second switchgear 225b, a third switchgear 225c, a fourth
switchgear
225d, and a fifth switchgear 225e) to be monitored, the first example device
or array 1000
can cover a larger area and therefore monitor more electrical components 225
than a
device or array (e.g. device or array 1000a schematically illustrated in
dashed lines) that
is, for example, not positioned or mounted at an angle with respect to the
electrical panel
200 and the electrical components 225 to be monitored.
[0053] That is, a field of view 177 of the first example thermal monitoring
device or
array 1000 that is positioned at an angle 175 is increased with respect to the
area and
electrical components 225 to be monitored without compromising pixel
resolution. As
shown, the field of view 177 of the first example thermal monitoring device or
array 1000
covers (e.g. monitors or distinguishes) four electrical components 225,
including the first
switchgear 225a, the second switchgear 225b, the third switchgear 225c, and
the fourth
switchgear 225d, as compared to a field of view 117' of the device or array
1000a which
covers three electrical components 225, including the third switchgear 225c,
the fourth
switchgear 225d, and the fifth switchgear 225e. Accordingly, by mounting the
first
example thermal monitoring device or array 1000 at an angle 175, fewer thermal
monitoring devices are required to monitor a comparative area. It is to be
understood that
the specific number and arrangement of electrical components 225 is provided
for
exemplary purposes and is not intended to limit the number or arranged of
electrical
device to be monitored by the first example thermal monitoring device or array
1000 that
is positioned or mounted at an angle with respect to the electrical panel 200.
Further, it is
to be understood that the first example thermal monitoring device or array
1000 can be
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positioned or mounted at an angle 175 using any fastener, hardware, or other
structural
component configured to support the first example thermal monitoring device or
array
1000 at the angle 175.
[0054] Turning to FIG. 11, a top view of the second example thermal
monitoring
device or array 1100 is shown connected to the controller 300 and the monitor
400, as
described above. The second example thermal monitoring device or array 1100 is
attached to a rail, moveable head, or other mounting hardware 180 and is
configured to
rotate or swivel with respect to a front face of the interior 245 of the
electrical panel 200
as illustrated by arrows 181. For example, various rotated positions of the
second
example thermal monitoring device or array 1100 are shown using dashed lines
including
a first rotated position 1100a, a second rotated position 1100b, a third
rotated position
1100c, and a fourth rotated position 1100d. A corresponding field of view of
the second
example thermal monitoring device or array 1100 is illustrated as field of
view 178
corresponding to a non-rotated position, where the second example thermal
monitoring
device or array 1100 is parallel with the plane 176 that is parallel to a
front face of the
interior 245 of the electrical panel 200. By rotating the second example
thermal
monitoring device or array 1100 with respect to the area to be monitored, the
field of
view of the second example thermal monitoring device or array 1100 also
rotates.
Therefore, a first rotated field of view 178 corresponding to the first
rotated position
1100a, a second rotated field of view 178b corresponding to the second rotated
position
1100b, a third rotated field of view 178c corresponding to the third rotated
position
1100c, and a fourth rotated field of view 178d corresponding to the fourth
rotated position
1100d are provided. Accordingly, the second example thermal monitoring device
or
array 1100 can cover a larger area and therefore monitor more electrical
components 225
than, for example, a stationary device that does not rotate. It is to be
understood that the
various rotated position of the second example thermal monitoring device or
array 1100
are exemplary of examples of non-limiting rotated positions.
[0055] A stepper motor, actuator, servo, or other mechanism (not shown) may
be used
to control the rotation of the second example thermal monitoring device or
array 1100
about the mounting hardware 180. The rotation can be controlled in
predetermined
increments (e.g. 10 degrees, 20 degrees, 30 degrees, or any other angle) to
cover (e.g.
monitor or distinguish) five electrical components 225, including the first
switchgear
225a, the second switchgear 225b, the third switchgear 225c, the fourth
switchgear 225d,
and the fifth switchgear 225e. For example, when in the first rotated position
1100a, the
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second example thermal monitoring device or array 1100 can cover the first
switchgear
225a and the second switchgear 225b¨corresponding to the first rotated field
of view
178a. When in the second rotated position 1100b, the second example thermal
monitoring
device or array 1100 can cover the first switchgear 225a, the second
switchgear 225b,
and the third switchgear 225c¨corresponding to the second rotated field of
view 178b.
When parallel to the front face of the interior 245 of the electrical panel,
the second
example thermal monitoring device or array 1100 can cover the second
switchgear 225b,
the third switchgear 225c, and the fourth switchgear 225d¨corresponding to
field of
view 178. When in the third rotated position 1100c, the second example thermal
monitoring device or array 1100 can cover the third switchgear 225c, the
fourth
switchgear 225d, and the fifth switchgear 225e¨corresponding to the third
rotated field
of view 178c. Likewise, when in the fourth rotated position 1100d, the second
example
thermal monitoring device or array 1100 can cover the fourth switchgear 225d
and the
fifth switchgear 225e¨corresponding to the fourth rotated field of view 178d.
[0056] Accordingly, by configuring the second example thermal monitoring
device or
array 1100 to be pivotable or rotatable with respect to the electrical panel
200, fewer
thermal monitoring devices and/or arrays are required to fully monitor a
comparative
area. It is to be understood that the specific number and arrangement of
electrical
components 225 is provided for exemplary purposes and is not intended to limit
the
number or arrangement of electrical devices and/or arrays to be monitored by
the second
example thermal monitoring device or array 1100 that is configured to be
pivotable or
rotatable with respect to the electrical panel 200. Further, it is to be
understood that the
second example thermal monitoring device or array 1100 can be positioned or
mounted in
a pivotable or rotatable configuration using any fastener, hardware, or other
structural
component such that the second example thermal monitoring device or array 1100
is
rotatable with respect to the electrical panel 200.
[0057] Turning to FIG. 12, a top view of the third example thermal
monitoring device
or array 1200 is shown connected to the controller 300 and the monitor 400, as
described
above. The third example thermal monitoring device or array 1200 is mounted to
a rail or
guide 185 and is linearly moveable along the guide 185 as shown by arrow 183.
The
guide 185 can include a stepper motor (schematically illustrated as motor 186)
configured
to linearly translate the third example thermal monitoring device or array
1200 with
respect to the front face of the interior 245 of the electrical panel 200. A
belt 188 and
pulley 187 assembly may also be used to translate the third example thermal
monitoring
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device or array 1200. In another example, a threaded screw and linear support
bar system
assembly (not shown) may be used to translate the third example thermal
monitoring
device or array 1200, including the guide 185 in a horizontal direction (e.g.
arrow 183)
and/or a vertical direction (e.g. in and out of the plane of the paper) to
adjust an elevation
of the guide 185 and third example thermal monitoring device or array 1200.
For
example, one rotation of the threaded screw can translate the third example
thermal
monitoring device or array 1200 along the guide 185 or along the linear
support bar
system a predetermined distance. The third example thermal monitoring device
or array
1200 can be translated vertically and/or horizontally to cover an entire area
or a portion of
an entire area to be monitored. For example, the third example thermal
monitoring device
or array 1200 can have a field of view 182 that covers an area to be
monitored. By
translating the third example thermal monitoring device or array 1200 along
the guide
185, multiple electrical components 225 can be covered (e.g. monitored or
distinguished),
including the first switchgear 225a, and the second switchgear 225b, the third
switchgear
225c, the fourth switchgear 225d, and the fifth switchgear 225e.
[0058] Accordingly, by configuring the third example thermal monitoring
device or
array 1200 to be translatable with respect to the electrical panel 200, fewer
thermal
monitoring devices are required to monitor a comparative area. It is to be
understood that
the specific number and arrangement of electrical components 225 is provided
for
exemplary purposes and is not intended to limit the number or arrangement of
electrical
device to be monitored by the third example thermal monitoring device or array
1200 that
is configured to be translatable with respect to the electrical panel 200.
Further, it is to be
understood that the third example thermal monitoring device or array 1200 can
be
positioned or mounted a translatable configuration using any fastener,
hardware, or other
structural component such that the third example thermal monitoring device or
array 1200
is translatable with respect to the electrical panel 200.
[0059] Moreover, it is to be understood that any one or more features of
any one or
more of the thermal monitoring system 100, the thermal monitoring array 105,
the first
example thermal monitoring device or array 1000, the second example thermal
monitoring device or array 1100, and the third example thermal monitoring
device or
array 1200, can be combined together to form a hotspot monitoring system in
accordance
with the examples disclosed herein.
[0060] A method of monitoring a temperature of a plurality of electrical
components
230 located inside an electrical panel 200 includes providing one or more
thermal
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monitoring devices 105, 1000, 1100, 1200 inside the electrical panel 200. Each
of the
one or more thermal monitoring devices or arrays 105, 1000, 1100, 1200 can
include an
infrared sensor 115 with a resolution including a plurality of pixels. The
method further
includes mapping each of the plurality of pixels from each infrared sensor 115
to a
corresponding plurality of points. Each of the corresponding plurality of
points is located
within an area to be monitored 215. The area to be monitored 215 is located
inside the
electrical panel 200 and includes an electrical component 225 (e.g. the first
switchgear
225a, and the second switchgear 225b, the third switchgear 225c, the fourth
switchgear
225d, and the fifth switchgear 225e) of the plurality of electrical components
230. The
method can include mounting or positioning the one or more thermal monitoring
devices
or arrays 105, 1000, 1100, 1200 at an angle with respect to the electrical
panel 200,
configuring the one or more thermal monitoring devices or array 105, 1000,
1100, 1200
to be pivotable or rotatable with respect to the electrical panel 200, and
configuring the
one or more thermal monitoring devices or array 1200 105, 1000, 1100, 1200 to
be
translatable with respect to the electrical panel.
[0061] The method also includes determining a temperature at each of the
corresponding plurality of points and creating a thermal image (shown in FIGS.
5-8) of
the area to be monitored 215 (e.g., the entire area 220 to be monitored) based
at least in
part on the temperature at each of the corresponding plurality of points. In
one example,
the method includes providing an additional sensor 150 inside the electrical
panel 200.
The additional sensor 150 is configured to determine additional data with
respect to the
area to be monitored 215 (e.g., the entire area 220 to be monitored). In
another example,
the method includes creating a composite thermal map (shown in FIGS. 5-8) of
the area
to be monitored 215 including digitally overlaying the thermal image onto a
picture of the
area to be monitored. The method also includes identifying at least one of the
plurality of
electrical components 230 in the composite thermal map based at least in part
on at least
one of the temperature of at least one of the corresponding plurality of
points and the
additional data.
[0062] It will
be apparent to those skilled in the art that various modifications and
variations can be made without departing from the spirit and scope of the
claimed
invention.
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