Note: Descriptions are shown in the official language in which they were submitted.
WO 2022/086699
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TEMPERATURE SENSOR OF THERMAL MONITORING SYSTEM
FOR USE IN POWER DISTRIBUTION SYSTEMS
BACKGROUND
RELATED APPLICATION
This application is a continuation-in-part of U.S. patent application S er.
No.
16/111,687, filed on August 24, 2018 which is incorporated by reference herein
in its
entirety for all purposes.
1. Field
[0001]
Aspects of the present invention generally relate to a temperature sensor
of a
thermal monitoring system for use in power distribution systems. The
temperature sensor
comprises a thermally conductive, electrically insulating ceramic material.
The
temperature sensor uses a direct contact to a measured joint and uses wired
connections
to transmit a signal.
2. Description of the Related Art
[0002]
Abnormal situations, such as faulty installation and overloading, can
cause
substantial thermal rise in power distribution systems. Therefore, there is a
need to have a
continuous thermal monitoring system to monitor temperature rise in power
connection
joints, lugs and cables in various installation components. As an important
part of the
thermal monitoring system, a temperature sensor is needed. The temperature
sensor needs
to be easily installable, reliably sensing temperatures at a measured point,
capable of
withstanding the required system voltage and within a reasonable price range.
[0003]
There are three kinds of sensor design concepts that have been implemented
in
the market. First kind of thermal monitoring systems use infrared (IR) sensors
for
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temperature sensing. The infrared sensor is not in direct touch to the high
voltage system,
therefore eliminates concerns on electric breakdown. And such systems are
generally
more cost friendly. However, the measured joints need to be painted to certain
colors,
usually black, and the painting process is not user friendly. Also, the IR
sensor can also
pick up signals emitted by other than the measured joint, which can skew the
measurement.
[0004]
To avoid these drawbacks of IR sensors, second kind of thermal monitoring
systems use a thermal sensor in a direct contact with the measure joint, and
the sensing is
done with thermocouples or components alike. To avoid electric breakdown due
to the
high system voltage, there have been two ways to transmit signals between the
sensors
and the control system. First is to use fiber optics to transmit the
temperature signal back
to the controller. While achieving the requirements, such sensor design can be
costly to
the end customers. Second is to use battery to send signal from temperature
sensors
through wireless connections. Such method requires battery powered thermal
sensors to
generate an active signal, and hence has the drawback of having to replace the
battery for
maintenance. It also has to ensure good wireless connections for reliable
signal reading.
[0005]
Third kind of thermal monitoring systems use RF powered temperature
sensors. In such systems, one or more antennas are used to send RF signals to
the sensors
attached to the measured joints. At different temperatures, the sensors
reflect the RF
signal with different frequencies, but detecting the change in the reflected
frequency, the
temperature can be detected. Such systems are also costly and sensitive to the
antenna-
sensor arrangements.
[0006]
Therefore, there is an ongoing need for a suitable temperature sensor of a
thermal monitoring system for use in power distribution systems that is
capable of
providing a reliable temperature reading while being cost friendly.
SUMMARY
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[0007]
Briefly described, aspects of the present invention relate to a
temperature
sensor of a thermal monitoring system for use in power distribution systems
that is
capable of providing a reliable temperature reading while being cost friendly.
The
proposed sensor uses a direct contact to a measured joint, and uses wired
connections to
transmit a signal. Therefore, concerns on receiver arrangements (wireless, RF
or IR) are
eliminated. The temperature sensor comprises a thermally conductive,
electrically
insulating ceramic material. A ceramic printed circuit board (PCB) has a
reasonable
price point therefore utilizing such material significantly drives down the
cost of the
temperature sensor. The use of the ceramic PCB makes the temperature sensor
more cost
friendly when compared to fiber optics and all the other concepts.
[0008]
In accordance with one illustrative embodiment of the present invention, a
temperature sensor of a thermal monitoring system is provided for use in power
distribution systems The temperature sensor comprises a ceramic printed
circuit board
(PCB) having a first side and a second side. The ceramic PCB includes a
temperature
sensing element disposed on the second side of the ceramic PCB. The
temperature sensor
further comprises a terminal having a first end and a second end. The first
end of the
terminal is configured to be fixed directly in contact with a measured point
and the
second end of the terminal is directly in touch with the first side of the
ceramic PCB such
that heat is conducted from the terminal, through the ceramic PCB and then to
the
temperature sensing element. The temperature sensing element is configured to
generate
an electrical signal in response to the heat. The temperature sensor further
comprises a
pair of lead wires. The electrical signal generated by the temperature sensing
element is
sent through the pair of lead wires to a controller for monitoring a
temperature. The
temperature sensor further comprises an epoxy to seal a portion of the
terminal, the
ceramic PCB in its entirety and a portion of the pair of lead wires to ensure
a desired
physical strength and a desired dielectric strength.
[0009]
In accordance with one illustrative embodiment of the present invention, a
thermal monitoring system for use in power distribution systems. The thermal
monitoring system comprises a controller for temperature monitoring and a
temperature
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sensor coupled to the controller. The temperature sensor comprises a ceramic
printed
circuit board (PCB) having a first side and a second side. The ceramic PCB
includes a
temperature sensing element disposed on the second side of the ceramic PCB.
The
temperature sensor further comprises a terminal having a first end and a
second end. The
first end of the terminal is configured to be fixed directly in contact with a
measured
point and the second end of the terminal is directly in touch with the first
side of the
ceramic PCB such that heat is conducted from the terminal, through the ceramic
PCB and
then to the temperature sensing element. The temperature sensing element is
configured
to generate an electrical signal in response to the heat The temperature
sensor further
comprises a pair of lead wires. The electrical signal generated by the
temperature sensing
element is sent through the pair of lead wires to a controller for monitoring
a temperature.
The temperature sensor further comprises an epoxy to seal a portion of the
terminal, the
ceramic PCB in its entirety and a portion of the pair of lead wires to ensure
a desired
physical strength and a desired dielectric strength.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010]
FIG. 1 illustrates a top and a side view of a temperature sensor (without
epoxy
or plastic material) of a thermal monitoring system for use in power
distribution systems
in accordance with an exemplary embodiment of the present invention.
[0011]
FIG_ 2 illustrates a top and a side view of a temperature sensor (with
epoxy or
plastic material) of the thermal monitoring system for use in the power
distribution
systems in accordance with an exemplary embodiment of the present invention.
[0012]
FIG. 3 illustrates a top view of a ring lug design of a terminal for bolt-
on
applications in accordance with an exemplary embodiment of the present
invention.
[0013]
FIG. 4 illustrates a side view of the ring lug design of the terminal of
FIG. 3 in
accordance with an exemplary embodiment of the present invention.
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[0014]
FIG. 5 illustrates a top view of a tube design of a terminal for wire tie
applications in accordance with an exemplary embodiment of the present
invention.
[0015]
FIG. 6 illustrates a side view of the tube design of the terminal of FIG.
5 in
accordance with an exemplary embodiment of the present invention.
[0016]
FIG. 7 illustrates a front view of the tube design of the terminal of FIG.
5 in
accordance with an exemplary embodiment of the present invention.
[0017]
FIG. 8 illustrates a perspective view of a temperature sensor (with
overmolded
plastic material) of the thermal monitoring system for use in the power
distribution
systems in accordance with an exemplary embodiment of the present invention.
[0018]
FIG. 9 illustrates a perspective view of a temperature sensor (with
overmolded
plastic material and a metal shroud) of the thermal monitoring system for use
in the
power distribution systems in accordance with an exemplary embodiment of the
present
invention.
[0019]
FIG. 10 illustrates a perspective view of a temperature sensor (with epoxy
filled molded plastic) of the thermal monitoring system for use in the power
distribution
systems in accordance with an exemplary embodiment of the present invention.
DETAILED DESCRIPTION
[0020]
To facilitate an understanding of embodiments, principles, and features of
the
present invention, they are explained hereinafter with reference to
implementation in
illustrative embodiments. In particular, they are described in the context of
a temperature
sensor (with epoxy or plastic material) of the thermal monitoring system for
use in the
power distribution systems. The temperature sensor comprises a ceramic printed
circuit
board (PCB) made of a thermally conductive, electrically insulating ceramic
material.
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The temperature sensor uses a direct contact to a measured joint and uses
wired
connections to transmit a signal. The temperature sensor provides a continuous
thermal
monitoring system to monitor a temperature rise in power connection joints,
lugs and
cables in various installation components. The temperature sensor is easily
installable,
reliably senses temperatures at a measured point, capable of withstanding any
required
system voltage and within a reasonable price range. Embodiments of the present
invention, however, are not limited to use in the described devices or
methods.
[0021]
The components and materials described hereinafter as making up the
various
embodiments are intended to be illustrative and not restrictive. Many suitable
components and materials that would perform the same or a similar function as
the
materials described herein are intended to be embraced within the scope of
embodiments
of the present invention.
[0022]
Consistent with one embodiment of the present invention, FIG. 1 represents
a
representation of a temperature sensor (without epoxy or plastic material) 5
of a thermal
monitoring system 7 for use in a power distribution system 10 in accordance
with an
exemplary embodiment of the present invention. The thermal monitoring system 7
comprises a controller 12 for temperature monitoring. The thermal monitoring
system 7
comprises the temperature sensor 5 coupled to the controller 12 (although this
generally
is a correct illustration, our exact setup is that each sensor goes to a
module, and a group
of modules are connected to one controller). The temperature sensor 5 includes
a ceramic
printed circuit board (PCB) 15 having a first side 17(1) and a second side
17(2). The
ceramic PCB 15 includes a temperature sensing element 20 disposed on the
second side
17(2) of the ceramic PCB 15. The temperature sensor 5 includes a terminal 22
having a
first end 25(1) and a second end 25(2). The first end 25(1) of the terminal 22
is
configured to be fixed directly in contact with a measured point 27 and the
second end
25(2) of the terminal 22 is directly in touch with the first side 17(1) of the
ceramic PCB
15 such that heat is conducted from the terminal 22, through the ceramic PCB
15 and
then to the temperature sensing element 20.
[0023] For example, the ceramic PCB 15 may be made of a ceramic material that
is an
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inorganic, non-metallic, often crystalline oxide, nitride or carbide material.
Some
elements, such as carbon or silicon, may be considered ceramics. Ceramic
materials are
brittle, hard, and strong in compression, weak in shearing and tension.
The crystallinity of ceramic materials ranges from highly oriented to semi-
crystalline, vitrified, and often completely amorphous (e.g., glasses). Most
often, fired
ceramics are either vitrified or
semi-vitrified. Varying crystallinity
and electron consumption in the ionic and covalent bonds cause most ceramic
materials
to be good thermal and electrical insulators. Ceramics generally can withstand
very high
temperatures, such as temperatures that range from 1,000 C to 1,600 C (1,800
F to
3,000 F). Glass is often not considered a ceramic because of its amorphous
(non-
crystalline) character. However, glassmaking involves several steps of the
ceramic
process and its mechanical properties are similar to ceramic materials.
Crystalline
ceramic materials are not amenable to a great range of processing. The glass
is shaped
when either fully molten, by casting, or when in a state of toffee-like
viscosity, by
methods such as blowing into a mold. If later heat treatments cause this glass
to become
partly crystalline, the resulting material is known as a glass-ceramic.
[0024]
The physical properties of a ceramic substance of the ceramic PCB 15 are a
direct result of its crystalline structure and chemical composition. Solid
state
chemistry reveals the fundamental connection between microstructure and
properties
such as localized density variations, grain size distribution, type of
porosity and second-
phase content, which can all be correlated with ceramic properties such as
mechanical
strength a by the Hall-Petch equation, hardness, toughness, dielectric
constant, and
the optical properties exhibited by transparent materials. Mechanical
properties are
important in structural and building materials as well as textile fabrics.
They include
many properties used to describe the strength
of materials such
as: elasticity/plasticity, tensile strength, compressive strength, shear
strength, fracture
toughness & ductility (low in brittle materials), and indentation hardness.
Some ceramics
are semiconductors Most of these are transition metal oxides that are II-VI
semiconductors, such as zinc oxide. For example, the ceramic PCB 15 may be
made of
a ceramic material that has a high dielectric strength and a high thermal
conductivity.
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[0025]
In operation, the temperature sensing element 20 is configured to generate
an
electrical signal 30 in response to the heat. The temperature sensor 5 further
includes a
pair of lead wires 32(1-2). The electrical signal 30 generated by the
temperature sensing
element 20 is sent through the pair of lead wires 32(1-2) to the controller 12
for
monitoring a temperature 35. The terminal 22 comprises a material with high
thermal
conductivity. The terminal 22 is configured to conduct the heat from the
measured point
27 to the temperature sensing element 20 and the terminal 22 provides a means
to connect
the temperature sensor 5 to the measured point 27. The terminal 22 may be a
ring lug
which is configured to be bolted onto the measured point 27. The terminal 22
may be a
cylindrical tube which is configured to be attached to cables with wire ties.
[0026]
The temperature sensor 5 further includes an epoxy (not shown) to seal a
portion of the terminal 22, the ceramic PCB 15 in its entirety and a portion
of the pair of
lead wires 32(1-.2) to ensure a desired physical strength and a desired
dielectric strength.
The epoxy is either an insulating epoxy or a plastic material. The epoxy
serves as a
mechanical stress relief when the temperature sensor 5 is being handled.
[0027]
The ceramic PCB 15 provides a dielectric insulation between the terminal
22
being a high voltage part and the temperature sensing element 20 being a low
voltage
part. The ceramic PCB 15 provides heat conduction from the terminal 22 to the
temperature sensing element 20. The ceramic PCB 15 comprises a material with
high
thermal conductivity. For example, the material with high thermal conductivity
may be
aluminum nitride.
[0028]
To ensure good heat conduction both the terminal 22 and the temperature
sensing element 20 are directly soldered to the ceramic PCB 15. A heat
conducting
grease (not shown) may be disposed in between the terminal 22 and the ceramic
PCB 15
and in between the temperature sensing element 20 and the ceramic PCB 15. In
one
embodiment, the temperature sensing element 20 may be a sensing chip, such as
TI
LMT01.
[0029] The temperature sensing element 20 may be a thermocouple.
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This thermocouple may be an electrical device consisting of two dissimilar
electrical
conductors forming electrical junctions at
differing temperatures.
Such thermocouple produces a temperature-dependent voltage as a result of the
thermoelectric effect, and this voltage can be interpreted to measure
temperature. The
thermocouple may be self powered and require no external form of excitation.
When
different metals are joined at the ends and there is a temperature difference
between the
joints, a magnetic field is observed. The magnetic field is due to a thermo-
electric current.
The voltage generated at a single junction of two different types of wire is
what is of
interest as this can be used to measure temperature at very high and low
temperatures.
The magnitude of the voltage depends on the types of wire being used.
Generally, the
voltage is in the microvolt range and care must be taken to obtain a usable
measurement
from a very little current flow. In the standard configuration for
thermocouple usage, the
desired temperature Tgence is obtained using three inputs¨the characteristic
function E(T)
of the thermocouple, the measured voltage V, and the reference junctions'
temperature Tr. The solution to the equation E(Tsense) = V + E(Tref) yields
Tsense. The
measured voltage V can be used to calculate temperature Tsense provided that
temperature
Tref is known. To obtain the desire measurement of Tsense, it is not
sufficient to just
measure V. The temperature at the reference junctions Tref must be already
known.
Thermocouples as measurement devices are characterized by a precise E(T)
curve,
independent of any other details. Characteristic functions for thermocouples
that reach
intermediate temperatures, as covered by nickel-alloy thermocouple types E, J,
K, M, N,
T.
[0030]
The ceramic PCB 15 serves two purposes. First, it provides dielectric
insulation between the high voltage part (the terminal 22) and the low voltage
part
(temperature sensing element 20). Second, it provides heat conduction from the
terminal
22 to the sensing element 20. Ceramic in general has a wide range of thermal
conductivities. To achieve good heat conduction, a material with high thermal
conductivity, such as aluminum nitride, should be used. Also to ensure good
heat
conduction, both the terminal 22 and the temperature sensing element 20 are
directly
soldered to the ceramic PCB 15. If solder is not used, a heat conducting
grease or alike
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may be used in between components. The temperature sensing element 20 can be
either a
thermocouple or other type of the temperature sensor. The electrical signal 30
generated
by the temperature sensing element 20 is then transmitted through the pair of
lead wires
32(1-2) to the controller 12 for temperature monitoring.
[0031]
Referring to FIG. 2, it illustrates a representation of a temperature
sensor 200
(with epoxy or plastic material) of the thermal monitoring system 7 for use in
the power
distribution system 10 in accordance with an exemplary embodiment of the
present
invention. The temperature sensor 5 further includes an epoxy 217 to seal a
portion of
the terminal 22, the ceramic PCB 15 in its entirety and a portion of the pair
of lead wires
32(1-2) to ensure a desired physical strength and a desired dielectric
strength. The epoxy
217 is either an insulating epoxy used for sealing or a plastic material in
that sealing is
done through an injection molding process. The epoxy 217 serves as a
mechanical stress
relief when the temperature sensor 5 is being handled. The temperature sensor
200
further comprises a plastic housing 220 disposed around the epoxy 217.
[0032]
Turning now to FIG. 3, it illustrates a top view of a ring lug design 300
of the
terminal 22 for bolt-on applications in accordance with an exemplary
embodiment of the
present invention. A portion of the ring lug design 300 of the terminal 22
that is inside
the epoxy 217 has a holding slot 305 which is filled with epoxy such that when
the
terminal 22 is pulled the holding slot 305 directly acts on the epoxy 217
instead of relying
on a surface bond in order to ensure a force is not acted on a PCB joint.
[0033]
FIG. 4 illustrates a side view of the ring lug design 300 of the terminal
22 of
FIG. 3 in accordance with an exemplary embodiment of the present invention.
The ring
lug design 300 may comprise a ring 400 and a stem 405 extending away from the
ring
400. The ring 400 and the stem 405 may be made of a metal or a metal alloy
such as
copper or aluminum. The ring lug design 300 may comprise a bend 410 in between
the
ring 400 and the stem 405 such that the ring 400 and the stem 405 may not be
at a same
level. In particular, the ring 400 will be at a lower level 415(1) than a
level 415(2) of the
stem 405 when the temperature sensor 5 or 200 is laid flat on a surface.
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[0034]
As seen in FIG. 5, it illustrates a top view of a tube design 500 of the
terminal
22 for wire tie applications in accordance with an exemplary embodiment of the
present
invention. A portion of the tube design 500 of the terminal 22 that is inside
the epoxy
217 has a holding slot 505 which is filled with epoxy. The tube design 500 may
comprise
a pair of wings 510(1-2) and a stem 515 extending away from the pair of wings
510(1-2).
The pair of wings 510(1-2) and the stem 515 may be made of a metal or a metal
alloy
such as copper or aluminum. The tube design 500 may comprise a bend 520 (see
FIG. 6)
in between the pair of wings 510(1-2) and the stem 515 such that the pair of
wings 510(1-
2) and the stem 515 may not be at a same level. In particular, the pair of
wings 510(1-2)
will be at a lower level that the stem 515 when the temperature sensor 5 or
200 is laid flat
on a surface.
[0035]
As shown in FIG. 6, it illustrates a side view of the tube design 500 of
the
terminal 22 of FTG. 5 in accordance with an exemplary embodiment of the
present
invention. The terminal 22 serves two purposes. First, it conducts heat from
the measured
point 27 to the temperature sensing element 20, and hence should be made of
material
with high thermal conductivity, such as copper. Second, it provides a means to
connect
the temperature sensor 5 to the measured point 27. In one configuration, as
shown in FIG.
3, the terminal 22 is a ring lug, which can be bolted onto the measured joint
27. In
another configuration, as shown in FIG. 5, the terminal 22 is a cylindrical
tube, which can
be attached to cables with wire ties.
[0036]
In FIG. 7, it illustrates a front view of the tube design 500 of the
terminal of
FIG. 5 in accordance with an exemplary embodiment of the present invention. In
the
tube design 500 the pair of wings 510(1-2) form a cylindrical tube which can
be attached
to cables with wire ties.
[0037]
An important technical challenge to address is the high dielectric
strength
needed. To ensure that, a part of the terminal 22, the whole ceramic PCB 15
and a part of
the pair of lead wires 32(1-2) are sealed in an insulating epoxy. The epoxy
217 chosen
has a high dielectric strength to create enough isolation between the low
voltage parts
inside and the high voltage part outside. The insulating epoxy can also serve
as
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mechanical stress relief when the temperature sensor 5, 200 is being handled.
An
example is shown in FIG. 3. The portion of the terminal 22 that is inside the
epoxy 217
has the holding slot 305, which is filled with epoxy, instead of being flat.
Therefore,
when the terminal 22 is pulled, the holding slot 305 can directly act on the
epoxy 217,
instead of relying on a surface bond, and can ensure the force is not acted on
the PCB
joint. Similar concepts can also be used on the lead wire side, although not
shown here.
Epoxy can be chosen to have high bonding force with the wire insulation, or
middle
components, such as crimps or terminals, can be used to isolate the joint on
the ceramic
PCB 15. If further strength is needed, the plastic housing 220 can be used
around the
epoxy.
[0038]
Products such as panel boards, switchboards, switchgears, bus bar systems
etc
are integrated with energy monitoring products. A Branch Circuit Thermal
Monitoring
System provides an expanded avenue within an ecosystem with monitoring
capabilities.
By embedding the thermal monitoring system 7 within panel boards,
switchboards,
switchgears, bus bar systems one enhances product offering from a customer's
perspective. The temperature sensor 5 is an important component of the thermal
monitoring system 7 and is crucial to the Branch Circuit Thermal Monitoring
System.
[0039]
While a thermocouple-based temperature sensor is described here a range of
one or more other types of temperature sensors are also contemplated by the
present
invention. For example, other types of temperature sensors may be implemented
based
on one or more features presented above without deviating from the spirit of
the present
invention. Thermistors are thermally sensitive resistors whose prime function
is to exhibit
a large, predictable and precise change in electrical resistance when
subjected to a
corresponding change in body temperature. Resistance thermometers, also
called resistance temperature detectors (RTDs), are sensors used to measure
temperature.
A silicon band-gap temperature sensor is an extremely common form of
temperature
sensor (thermometer) used in electronic equipment.
[0040]
The techniques described herein can be particularly useful for a thermal
monitoring system for use in power distribution systems. While particular
embodiments
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are described in terms of the thermal monitoring system embedded within panel
boards,
switchboards, switchgears, bus bar systems, the techniques described herein
are not
limited to the power distribution systems but can also be used with other
systems ¨ digital
or analog, circuits or devices.
[0041] The ceramic PCB 15 may be a metal core printed circuit
board (MCPCB).
Ceramic printed circuit boards are a type of metal core PCB. One of the main
reasons
why one would avoid other PCBs vs. a ceramic circuit board or other MCPCB
board has
to do with heat transfer. Metal cores like aluminum nitride and beryllium
oxide are
extremely thermally conductive. Other metal core PCB materials in addition
aluminum
and beryllium can include copper and steel alloy. Steel alloys provide a
stiffness that one
will not get with copper and aluminum, but are not as effective at heat
transfer. Copper
has the best ability to transfer and dissipate heat as part of printed circuit
boards, but it is
somewhat expensive ¨ so one can opt for aluminum as a cheaper but still highly
effective heat-dissipating alternative. The most cost-effective solution will
be metal core
printed circuit boards with an aluminum base. One gets good rigidity and
thermal
conductivity at a more reasonable price. The reason metal core PCBs are so
much more
effective at dissipating heat than fr4 boards is due to their thermal
conductivity dielectric
material, which serves as a thermal bridge from the IC components to the metal
plate,
automatically conducting heat through the core to a heat sink. Metal core
printed circuit
boards are available as single-layer PCBs, single-layer Chip-on-Board PCBs,
double-
layer PCBs, double-sided PCBs, and multi-layer PCBs.
[0042] With regard to FIG. 8, it illustrates a perspective view
of a temperature sensor
805 (with an overmolded plastic material 807) of the thermal monitoring system
7 for use
in the power distribution system 10 in accordance with an exemplary embodiment
of the
present invention. One of the changes is to change epoxy to plastics, this is
a material
change for easier process control, but both achieve the same level of
performance. A
sealing material may be used to seal a portion of the terminal, the ceramic
PCB in its
entirety and a portion of the pair of lead wires to ensure a desired physical
strength and a
desired dielectric strength. A metal shroud may be disposed on top of the
sealing material
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for increased heat transfer to the temperature sensor 805. The sealing
material may be
epoxy filled molded plastic or the overmolded plastic material 807. The
overmolded
plastic material 807 serves as a mechanical stress relief when the temperature
sensor 805
is being handled.
[0043]
With respect to FIG. 9, it illustrates a perspective view of a temperature
sensor
905 (with an overmolded plastic material 907 and a metal cap or shroud 910) of
the
thermal monitoring system 7 for use in the power distribution system 10 in
accordance
with an exemplary embodiment of the present invention. The metal shroud 910 is
disposed on top of the overmolded plastic material 907 for increased heat
transfer to the
temperature sensor 905. The overmolded plastic material 907 is used as a
sealing
material and is located at the same location where the epoxy is at. Basically,
the epoxy is
changed to plastics while both materials work for the temperature sensor 905.
Secondly,
the metal shroud 910 is used on top of the overmold/epoxy for some
configurations for
better heat transfer to the temperature sensor 905. The metal shroud 910 is
optional as the
temperature sensor 905 can work without it in some cases. Adding the metal
shroud 910
however does increase the accuracy of the temperature sensor 905.
[0044]
FIG. 10 illustrates a perspective view of a temperature sensor 1005 (with
epoxy filled molded plastic) of the thermal monitoring system 7 for use in the
power
distribution system 10 in accordance with an exemplary embodiment of the
present
invention. In FIG. 10, an epoxy 1007 is present in the middle area and the
rest that looks
like a bathtub is a molded plastic 1010.
[0045]
While embodiments of the present invention have been disclosed in
exemplary
forms, it will be apparent to those skilled in the art that many
modifications, additions,
and deletions can be made therein without departing from the spirit and scope
of the
invention and its equivalents, as set forth in the following claims.
[0046]
Embodiments and the various features and advantageous details thereof are
explained more fully with reference to the non-limiting embodiments that are
illustrated
in the accompanying drawings and detailed in the following description.
Descriptions of
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well-known starting materials, processing techniques, components and equipment
are
omitted so as not to unnecessarily obscure embodiments in detail. It should be
understood, however, that the detailed description and the specific examples,
while
indicating preferred embodiments, are given by way of illustration only and
not by way
of limitation. Various substitutions, modifications, additions and/or
rearrangements
within the spirit and/or scope of the underlying inventive concept will become
apparent to
those skilled in the art from this disclosure.
[0047]
As used herein, the terms "comprises," "comprising," "includes,"
"including,"
"has," "having" or any other variation thereof', are intended to cover a non-
exclusive
inclusion. For example, a process, article, or apparatus that comprises a list
of elements
is not necessarily limited to only those elements but may include other
elements not
expressly listed or inherent to such process, article, or apparatus.
[0048]
Additionally, any examples or illustrations given herein are not to be
regarded
in any way as restrictions on, limits to, or express definitions of, any term
or terms with
which they are utilized. Instead, these examples or illustrations are to be
regarded as
being described with respect to one particular embodiment and as illustrative
only. Those
of ordinary skill in the art will appreciate that any term or terms with which
these
examples or illustrations are utilized will encompass other embodiments which
may or
may not be given therewith or elsewhere in the specification and all such
embodiments
are intended to be included within the scope of that term or terms.
[0049]
In the foregoing specification, the invention has been described with
reference
to specific embodiments. However, one of ordinary skill in the art appreciates
that
various modifications and changes can be made without departing from the scope
of the
invention. Accordingly, the specification and figures are to be regarded in an
illustrative
rather than a restrictive sense, and all such modifications are intended to be
included
within the scope of invention.
[0050] Although the invention has been described with respect to specific
embodiments thereof, these embodiments are merely illustrative, and not
restrictive of the
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invention. The description herein of illustrated embodiments of the invention
is not
intended to be exhaustive or to limit the invention to the precise forms
disclosed herein
(and in particular, the inclusion of any particular embodiment, feature or
function is not
intended to limit the scope of the invention to such embodiment, feature or
function). Rather, the description is intended to describe illustrative
embodiments,
features and functions in order to provide a person of ordinary skill in the
art context to
understand the invention without limiting the invention to any particularly
described
embodiment, feature or function. While specific embodiments of, and examples
for, the
invention are described herein for illustrative purposes only, various
equivalent
modifications are possible within the spirit and scope of the invention, as
those skilled in
the relevant art will recognize and appreciate. As indicated, these
modifications may be
made to the invention in light of the foregoing description of illustrated
embodiments of
the invention and are to be included within the spirit and scope of the
invention. Thus,
while the invention has been described herein with reference to particular
embodiments
thereof, a latitude of modification, various changes and substitutions are
intended in the
foregoing disclosures, and it will be appreciated that in some instances some
features of
embodiments of the invention will be employed without a corresponding use of
other
features without departing from the scope and spirit of the invention as set
forth.
Therefore, many modifications may be made to adapt a particular situation or
material to
the essential scope and spirit of the invention.
[0051]
Respective appearances of the phrases "in one embodiment," "in an
embodiment," or "in a specific embodiment" or similar terminology in various
places
throughout this specification are not necessarily referring to the same
embodiment. Furthermore, the particular features, structures, or
characteristics of
any particular embodiment may be combined in any suitable manner with one or
more
other embodiments. It is to be understood that other variations and
modifications of the
embodiments described and illustrated herein are possible in light of the
teachings herein
and are to be considered as part of the spirit and scope of the invention.
[0052]
In the description herein, numerous specific details are provided, such as
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examples of components and/or methods, to provide a thorough understanding of
embodiments of the invention. One skilled in the relevant art will recognize,
however,
that an embodiment may be able to be practiced without one or more of the
specific
details, or with other apparatus, systems, assemblies, methods, components,
materials,
parts, and/or the like. In other instances, well-known structures, components,
systems,
materials, or operations are not specifically shown or described in detail to
avoid
obscuring aspects of embodiments of the invention. While the invention may be
illustrated by using a particular embodiment, this is not and does not limit
the invention
to any particular embodiment and a person of ordinary skill in the art will
recognize that
additional embodiments are readily understandable and are a part of this
invention.
[0053]
It will also be appreciated that one or more of the elements depicted in
the
drawings/figures can also be implemented in a more separated or integrated
manner, or
even removed or rendered as inoperable in certain cases, as is useful in
accordance with a
particular application.
[0054]
Benefits, other advantages, and solutions to problems have been described
above with regard to specific embodiments. However, the benefits, advantages,
solutions
to problems, and any component(s) that may cause any benefit, advantage, or
solution to
occur or become more pronounced are not to be construed as a critical,
required, or
essential feature or component.
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