Note: Descriptions are shown in the official language in which they were submitted.
WO 2022/214734
PCT/F12022/050171
1
CROSS FLOW HEAT TRANSFER APPARATUS
TECHNICAL FIELD
The present disclosure relates generally to heat transfer systems; and
more specifically to cross flow heat transfer apparatuses for combined
arrangements comprising electronic displays and integrated circuit
chambers.
BACKGROUND
Convection and conduction are generally used in heat transfer systems
for cooling display screens and integrated circuits. In this regard, cooling
fans, increasing wind speed and surface area of the heat sinks may be
used for heat transfer with the surroundings. Nowadays as technologies
evolve and the price per area of screens decreases, there has been an
increase in demand for larger screen sizes for both domestic and
industrial purposes. Notably, simple configurations of open convective
and/or conductive elements have been used and proven to be satisfactory
for relative mild outdoors environments. However, the aforementioned
configuration cannot withstand harsh environments such as direct solar
radiation that in many applications can deliver an effective heating rate
of an order of magnitude of 500W/m2. Moreover, the applied direct heat
towards the display screen of a device, while functioning at high
brightness levels, may reduce the performance of the device.
Furthermore, the natural high temperatures of tropical and desert-like
climates also account for increasing the temperature of the display
screens and thereby reducing the performance of the device.
On the other side of the outdoors temperature spectrum, low
temperatures and dark environments in which minimal brightness is
generally used for providing comfort to the eyes of the user, that
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
2
generates low heat to the display, other limitations may arise,
nevertheless an efficient heat transfer mechanism is still needed. In such
cases, the devices may suffer failure due to glass contraction cracking,
or internal display fluid freeze that can generate internal stresses on the
display and malfunctioning due to these low temperatures. Hence the
need for a heat transfer mechanism that can work ambivalently on both
high and low extreme conditions is an interesting challenge to be
addressed.
Notably, the dust issues can be addressed with the use of filters, thereby
implying a further extra maintenance step (cleaning or replacing filters).
Moreover, this makes the apparatus less cost-effective in areas with high
dust or floating particles concentrations.
Therefore, in light of the foregoing discussion, there exists a need to
overcome the aforementioned drawbacks associated with the
conventional heat transfer systems.
SUM MARY
The present disclosure seeks to provide a cross flow heat transfer
apparatus for a combined arrangement comprising an electronic display
and an integrated circuit chamber. The present disclosure seeks to
provide a solution to the existing problem of heat transfer mechanism.
An aim of the present disclosure is to provide a solution that overcomes
at least partially the problems encountered in prior art, and provides an
efficient and robust system for heat transfer.
In one aspect, an embodiment of the present disclosure provides a cross
flow heat transfer apparatus for a combined arrangement comprising an
electronic display and an integrated circuit chamber, the cross flow heat
transfer apparatus comprising:
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
3
- an external heatsink configured to be arranged between the
electronic display and the integrated circuit chamber, wherein the
external heatsink, comprising a plurality of vertically-oriented fins, is
configured to mediate a cross flow heat transfer mechanism between the
electronic display and the integrated circuit chamber, wherein the cross
flow heat transfer mechanism comprising:
- an internal flow driven by a set of internal fans associated
with an internal heatsink coupled with the integrated circuit
chamber, wherein the internal flow is directed transversally
-io towards the electronic display from the integrated circuit
chamber,
and
- an external flow driven by the plurality of vertically-oriented
fins of the external heatsink based on a temperature gradient.
Embodiments of the present disclosure substantially eliminate or at least
partially address the aforementioned problems in the prior art, and
enable effective temperature control for electronic display through cross
flow heat transfer mechanism. Beneficially, the disclosed cross flow heat
transfer apparatus is hermetically sealed and provides efficient cross-flow
heat transfer mechanism (effective heating and cooling) on demanding
conditions. Additionally, the cross flow heat transfer appararus is
configured with a heat generating element to provide the heat energy to
keep the internal temperature of the device in viable ranges at extremely
low temperatures.
Additional aspects, advantages, features and objects of the present
disclosure would be made apparent from the drawings and the detailed
description of the illustrative embodiments construed in conjunction with
the appended claims that follow.
It will be appreciated that features of the present disclosure are
susceptible to being combined in various combinations without departing
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
4
from the scope of the present disclosure as defined by the appended
claims.
BRIEF DESCRIPTION OF THE DRAWINGS
The summary above, as well as the following detailed description of
illustrative embodiments, is better understood when read in conjunction
with the appended drawings. For the purpose of illustrating the present
disclosure, exemplary constructions of the disclosure are shown in the
drawings. However, the present disclosure is not limited to specific
methods and instrumentalities disclosed herein. Moreover, those skilled
in the art will understand that the drawings are not to scale. Wherever
possible, like elements have been indicated by identical numbers.
Embodiments of the present disclosure will now be described, by way of
example only, with reference to the following diagrams wherein:
FIGs. 1A, 1B and 1C are an exploded view, a schematic view and a cross-
sectional view, respectively, of a cross flow heat transfer
apparatus, in accordance with an embodiment of the present
disclosure;
FIGs. 2A and 2B are a perspective view and a cross-sectional view,
respectively, of a cross flow heat transfer apparatus depicting
an external flow, in accordance with an embodiment of the
present disclosure;
FIG. 3 is a cross-sectional view of a cross flow heat transfer apparatus
depicting an internal flow, in accordance with an embodiment
of the present disclosure;
FIG. 4 is a cross-sectional view of a venturi tube, in accordance with an
embodiment of the present disclosure; and
FIGs. 5A and 5B are tables showing various combinations of an entry
cone and an exit cone of a first set of cavities and a second
set of cavities, in accordance with various embodiments of
the present disclosure.
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
DETAILED DESCRIPTION OF EMBODIMENTS
The following detailed description illustrates embodiments of the present
disclosure and ways in which they can be implemented. Although some
modes of carrying out the present disclosure have been disclosed, those
5 skilled in the art would recognize that other embodiments for carrying
out or practising the present disclosure are also possible.
In one aspect, an embodiment of the present disclosure provides a cross
flow heat transfer apparatus for a combined arrangement comprising an
electronic display and an integrated circuit chamber, the cross flow heat
transfer apparatus comprising:
- an external heatsink configured to be arranged between the
electronic display and the integrated circuit chamber, wherein the
external heatsink, comprising a plurality of vertically-oriented fins, is
configured to mediate a cross flow heat transfer mechanism between the
electronic display and the integrated circuit chamber, wherein the cross
flow heat transfer mechanism comprising:
- an internal flow driven by a set of internal fans associated
with an internal heatsink coupled with the integrated circuit
chamber, wherein the internal flow is directed transversally
towards the electronic display from the integrated circuit chamber,
and
- an external flow driven by the plurality of vertically-oriented
fins of the external heatsink based on a temperature gradient.
The present disclosure provides the aforementioned cross flow heat
transfer apparatus configured for an efficient and rapid heat dissipation
between the electronic display and the integrated circuit chamber.
Beneficially,a combination of the internal heat sink and the external
heatsink is used to regulate heat effectively between the integrated
circuit chamber and the electronic display using internal fans, thereby
making the apparatus suitable for use in extreme environments, such as
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
6
the combined effect of high temperature and direct solar radiation, as
well as at extremely low temperature. In this regard, the disclosed
apparatus employs an internal air flow on front of the electronic display
that does not disturb the user vision due the transparency of the internal
gas chamber as well as the use of direct heat conduction element located
on the back of the electronic display to act as a heat transfer bridge
between the interior conditions of the electronic display and the external
naturally occurring air flow. Moreover, the disclosed apparatus avoids use
of refrigerating cycles that might include refrigerants and pressurized
-ici piping elelnnents that might leak to environment, thereby making the
apparatus environmental friendly. Furthermore, the disclosed apparatus
is hermetically sealed and limits the dust and external particles to enter
therein and thereby prevents the damage of electronic components of the
integrated circuit and the electronic display due to the dust and external
particles. Additionally, the disclosed apparatus is designed in such a way
to easily access the internal components for maintenance or replacement
purposes.
Throughout the disclosure, the term "cross flow heat transfer" as used
herein refers to the exchange of the thermal energy between two
airstreams, such as an internal flow of air and an external flow of air.
Typically, the cross flow heat transfer is used for providing cooling and
ventilation to the electronic display and the integrated circuit chamber. It
will be appreciated that during the cross flow heat transfer one of the two
airstreams may be orthogonal to another of the two airstreams. The term
"cross flow heat transfer apparatus" as used herein refers to the
apparatus configured to perform the cross flow heat transfer. In this
regard, the cross flow heat transfer apparatus may employ a plurality of
equipment that enable cross flow heat transfer through them, and such
plurality of equipment are discussed below in detail.
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
7
The term "electronic display" as used herein refers to a display screen
that displays visual information transmitted electronically using wired or
wireless sources. Moreover, the electronic display may be connected to
an external power supply for its intended continuous use. Optionally, the
electronic display may be associated with, but is not limited to, a
television, a mobile phone, a projector, a monitor, a computer monitor,
a laptop computer, a personal computer, an appliance. The term
"integrated circuit chamber" as used herein refers to a housing configured
to hold one or more integrated circuits therein. Typically, the integrated
circuit is an assembly of electronic components with miniature devices
built up on a semiconductor substrate. It will be appreciated that the
electronic components may be a metal-oxide-semiconductor field-effect
transistor (MOSFET), Diode, capacitor, inductor, resistor, CPU,
processors, power converters, SDI modules, heat pads, heatsinks,
heaters, and other electronic components and the like integrated over
the semiconductor substrate. Moreover, the integrated circuit chamber
comprises the integrated circuit that results in the heat produced within
the apparatus. Typically, the heat may be produced due to working of the
one or more electronic components. Notably, the heat transfers from the
hotter side to the colder side. For example, if the integrated circuit
chamber is producing the heat, then the heat is transferred from the
integrated circuit chamber towards the electronic display. Furthermore,
the integrated circuit chamber is located at a separate level from the
electronic display having the external heatsink in between.
The term "external heatsink" as used herein refers to a heat exchanging
component that is used to transfer heat flow away from a hotter object
to regulate temperature thereof. Typically, the heatsink is arranged
between the electronic display and the integrated circuit chamber to
modulate the temperature of the apparatus. In this regard, the hot air
from the integrated circuit chamber gets cooled when passes through the
heatsink. Moreover, the external heatsink is configured to mediate a cross
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
8
flow heat transfer mechanism between the electronic display and the
integrated circuit chamber. In this regard, the external heat sink allows
cross flowing heat to pass through and exchange heat therebetween.
Furthermore, the external heatsink of the apparatus is in direct contact
with the electronic display acting as a bridge for the heat transfer.
Notably, the external heatsink comprises the plurality of vertically-
oriented fins. The term "vertically-oriented fins" as used herein refers to
a protruded structure, such as a flat plate for example, that extends from
the surface of the external heatsink to increase the rate of heat transfer
as the heat is dissipated from one end to another end. Typically, the
vertically-oriented fins provide a greater surface area thereby giving
more area for the heat to transfer.
Generally, the heat can be transferred in three different ways:
convection, radiation and conduction. The heat transfer in the heatsink
occurs through conduction. Notably, when two objects with different
temperatures come into contact with one another the warmer object
transfers the heat energy to the cooler object, which in turn heats the
cooler object. This process is known as thermal conductivity. Moreover,
the external heatsink is usually made of metal, having a high thermal
conductivity that carries heat away. Typically, the external heatsink may
be fabricated from, but not limited to, copper, aluminium, metal alloys,
graphite. Beneficially, the external heatsink keeps the components of the
apparatus safe from overheating and keep the temperature in the desired
range to prevent the accumulation of energy by absorbing it.
Optionally, the external heat sink may have different amounts of
vertically-oriented fins. Optionally, the vertically-oriented fins may be
fabricated from different materials, selected from, but not limited to
copper, aluminium, alloys of metals, graphite, and so forth. In this
regard, optionally, the vertically-oriented fins may be fabricated from a
material different from the material of the external heatsink itself. For
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
9
example, the external heatsink is made of aluminium while the vertically-
oriented fins are made of graphite. Optionally, the external heatsink may
comprise vertical holes that enable air to pass therethrough.
The term "internal now" as used herein refers to an air flow distributing
the heat between the integrated circuit chamber and the electronic
display. Moreover, the internal flow is driven transversally from the
integrated circuit chamber towards the electronic display and back. The
term "transversally" as used herein refers to a horizontal flow of air in an
axial plane in a pre-defined path, such as a closed loop. Typically, the
internal flow is initiated using the set of internal fans associated with the
internal heatsink configured within the apparatus. The term "set of
internal fans" as used herein refers to two or more fans configured to
recirculate the air flow transversally between the integrated circuit
chamber and the electronic display in a closed loop. In this regard, the
set of internal fans may be configured to drive heat concentration away
from the front screen of the electronic display that may be exposed to
direct solar radiation.
It will be appreciated that the internal heatsink is configured on the
integrated circuit chamber to absorb the heat produced by the integrated
circuit by the electronic components when in use and mediate the
absorbed heat therefrom to cool the integrated circuit. Optionally, the
internal heatsink may be fabricated from the same material as the
external heatsink. Moreover, the set of internal fans is structured in a
way to orient the flow of the direct air along with the external heatsink
thereby drawing heat away from the external heatsink. Furthermore, the
set of internal fans suck the internal flow of air and allows the flow of
heat in a defined path.
Moreover, the internal flow may be designed to be isolated in a
hermetically sealed housing, as it comprises sensitive elements of the
electronic display and the integrated circuit controlling it. Furthermore,
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
the hermetically sealed apparatus eliminates any cost on filters usage
and maintenance when used in outdoor environments, when a high
degree of suspended particles are presented in the surrounding air.
In this regard, optionally, the cross flow heat transfer apparatus
5 comprises an external shell protection to isolate the internal flow of the
apparatus from an external environment thereof. The term "external shell
protection" as used herein refers to a housing configured to cover the
electronic display and the integrated circuit chamber. It will be
appreciated that the external shell protection isolates the sensitive
10 elements of the electronic display and the integrated circuit from the
environmental influences. Typically, the external shell protection
hermetically seals the apparatus to protect the same from moisture, high
degree of suspended particles in the surrounding air, and the like.
Moreover, the hermetical sealing provided by the external shell protection
eliminates the cost of filters usage, a preventive ambient sterilization and
an overall maintenance of the apparatus.
Optionally the external shell protection comprises a first enclosure for the
electronic display device placed on the proximal end of the apparatus to
enable viewing of the screen from the outside by a viewer thereof, and a
second enclosure placed on the distal end of the apparatus. Notably, the
first enclosure may be made up of a transparent material and the second
enclosure may be made up of any of a transparent, an opaque, or a
translucent material. In this regard, the first enclosure and the second
enclosure are closed together to make the apparatus hermetically sealed.
Optionally the external shell protection comprises a lock mechanism
configured to lock first enclosure and the second enclosure to
hermetically seal the apparatus. Moreover, the locking mechanism
provides a convenient opening and closing of the apparatus. Optionally,
the locking mechanism acts as a hinged door for easy accessibility of the
integrated circuit. In this regard, the apparatus may be open for cleaning
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
11
and maintenance. Optionally, the lock mechanism may be a snap-fit
mechanism, hook lock mechanism, a magnetic lock and the like.
The term "external flow" as used herein refers to a natural air flow due
to an external air temperature gradient established between the
apparatus and external environment thereof. Typically, the external flow
occurs as the air between the external heatsink heats the surrounding
air, which rises as it becomes hotter than the surrounding air. It will be
appreciated that the external heatsink comprises an inlet for the external
flow to pass therethrough and an outlet to reject the air therefrom.
lci Optionally, the inlet and the outlet for the external flow may be a hole,
a
cavity, an opening and the like. Notably, the cooler air enters from the
inlet of the external heatsink due to the temperature gradient to cool the
external heatsink exits the external heatsink from the outlet as hot air.
The term "temperature gradient" as used herein refers to a physical
quantity that describes in which direction and at what rate the air flows
with respect to the temperature change around the external heatsink.
Optionally, the external flow may be mediated between a pair of
vertically-oriented fins.
Optionally, the internal flow and the external flow are perpendicular. The
direction of the internal flow and the direction of the external flow are at
an angle of 90 degrees to each other. For example, if the internal flow
flowing in the horizontal direction in the axial plane parallel to the ground,
then the external flow flows vertically making an angle of 90 degrees with
the internal flow. Notably, the internal flow flows transversally around the
integrated chamber and the electronic display and back, and the external
flow, separated from the internal flow, passes orthogonally through the
internal flow and in the process the heat is much more efficiently
exchanged thereby resulting in a cross flow heat transfer.
Optionally, the external heatsink is in direct contact with a back metal
plaque of the electronic display. The term "back metal plaque" as used
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
12
herein refers to the back cover over which the electronic display is
typically placed. In this regard, the back metal plate is in direct contact
with the electronic display. Optionally, the back metal plaque occupies
more than 70% area of the electronic display. Beneficially, the back metal
plate absorbs the heat and cools the electronic display by transferring the
heat produced thereby (due to its operation and/or due to the solar
radiation) towards the external heatsink. Optionally, the back metal
plaque is fabricated from, but not limited to, aluminum, brass, bronze,
zinc, stainless steel.
Optionally, between the electronic display and the external heatsink,
there may be a layer of thermal protection sheet. Optionally, such
thermal protection sheet may be a graphite sheet (such as PGS graphite
sheets, a PGS applied products (NASBIS)), or a grease. A technical
advantage of using a graphite thermal protection sheet between the
electronic display and the external heatsink is that it provides excellent
thermal conductivity, almost 2 times as high as copper, 3 to 5 time as
high as aluminum, is lightweight and is flexible and easy to be cut or
trimmed.
Optionally, the integrated circuit chamber includes a heat generation
element configured to inject the necessary amount of heat energy needed
to keep the internal temperature of the integrated circuit chamber in
viable ranges at extremely low temperatures, wherein the heat energy is
directed, by convection, transversally towards the electronic display. The
term "heat generation element" used herein refers to a component or a
device configured to produce heat by converting electrical energy into
heat energy. Notably, during cold weather conditions, the heat generation
element is configured to inject the necessary amount of heat energy
required by electronic components for their functioning to keep the
apparatus under defined temperature limits. Typically, the set of internal
fans blows heat generated by the heat generation element and deliver
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
13
the warm air towards the electronic display. Optionally, the heat
generation element may be a heater, heating coil, heating tube and the
like. Optionally viable range of the internal temperature of the integrated
circuit chamber may be 0 C to 70 C.
It will be appreciated that when the external temperature is below 0 C
the heat generation element starts to work to keep the electronic display
within the internal temperature (namely, the operation temperature
window) of the apparatus in a range of 0 C to 50 C. In simulations with
external temperatiure of -30 C the heat generating element makes the
-ici internal temperature of the apparatus in a range of -5 C - 0 C, thereby
making it possible to use the electronic display effectively in the outside
environment.
Similarly, in hot environment the heat is transferred from the electronic
display to the external heat sink, otherwise the hot air would be
concentrated between the electronic display front panel and the covering
protecting glass in the case of hot climates and direct solar radiation.
Optionally, the integrated circuit chamber has a first set of cavities,
wherein the first set of cavities has an entry cone (A) on the first end and
an exit cone (B) on the second end, and the electronic display arranged
in a metal casing having a second set of cavities, wherein the second set
of cavities have an entry cone (A) on the first end and an exit cone (B)
on the second end, corresponding to the first set of cavities, for allowing
the internal flow to pass therethrough. The terms "first set of cavities"
and "second set of cavities" as used herein refer to openings within the
integrated circuit chamber and the metal casing of the electronic display,
respectively, that are configured to allow the internal flow to pass
therethrough while driven transversally by the set of internal fans from
the integrated circuit chamber towards the electronic display and back.
Notably, the first and second set of cavities are placed on vertical ends of
the integrated circuit chamber and the metal casing of the electronic
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
14
display, respectively. Optionally, the first and second set of cavities may
be implemented as slits, such that the first and second set of cavities
correspond to each other. Optionally, cross-sections of the slit are in a
range from 15 to 35% of cross-sections of a side walls of the integrated
circuit chamber and the metal casing having the slits, respectively.
Optionally, the cross-section of the slit is 26% of the cross-section of the
side walls of the integrated circuit chamber and the metal casing. In an
example, when the side wall of the integrated circuit chamber has a
cross-section of 614mm x 80mm, then the cross-section of the slit is
370nnrn x 35nrini.
Typically, each of the first and second set of cavities have an entry cone
and an exit cone at their respective first end and the second end. In
addition, between the entry cone and the exit cone there may be provided
a choke section. When the fluid, i.e. air, flows through the choke section,
the shrunken cross-section will accelerate the fluid accompanied by a
pressure drop. The term "entry cone" as used herein refers to an angle
of convergence for a fluid, such as air of the internal flow, passing
therethrough. Notably, due to convergence, the cross-sectional area
decreases and the internal flow accelerates. The term "exit cone" as used
herein refers to an angle of divergence for a fluid, such as air of the
internal flow, passing therethrough. Notably, due to divergence, the
cross-sectional area increases and the internal flow deaccelerates. It will
be appreciated that entry cone and the exit cones of the first and second
sets of the cavities provide higher surface area for the internal flow to
transfer heat from the hotter object to the colder object within the
apparatus.
Optionally, the first set of cavities have the entry cone in different
geometry than the exit cone of the second end. Optionally, the entry cone
may be greater, smaller or equal to the exit cone. Optionally, the entry
cone is in a range of 20 to 40 degrees. The entry cone may typically be
CA 03212052 2023- 9- 13
WO 2022/214734
PCT/F12022/050171
from 20, 25, 30 or 35 degrees up to 25, 30, 35 or 40 degrees. Optionally,
the entry cone may be of 30 degrees.
Optionally, the second set of cavities have the entry cone in different
geometry than the exit cone. Optionally, the exit cone may be greater,
5 smaller or equal to the entry cone. Optionally, the exit cone is in a range
of 0 to 10 degrees. The exit cone may typically be from 0, 1, 2, 3, 4, 5,
6, 7, 8 or 9 degrees up to 2, 3, 4, 5, 6, 7, 8, 9 or 10 degrees. Optionally,
the exit cone may be of 5 degrees.
Optionally, each of the first set of cavities and the second set of cavities
10 are filled in with venturi tubes, wherein the venture tubes have an entry
cone in different geometry than an exit cone. The term "venturi tube" as
used herein refers to a tube having a short pipe consisting of two conical
parts with a short portion of a uniform cross-section in between. Notably,
the venturi tube is placed inside the first and second set of cavities.
15 Optionally, the venturi tubes are designed in such a way that it allows the
internal flow to pass therethrough by increasing the cooling by twisting
the air flow. In addition, the conical part of the venturi tube act as an
inlet and outlet. It will be appreciated that the inlet act as the convergent
and the outlet act as the divergent. In this way the inlet act as the entry
cone and the outlet act as the exit cone. Optionally, the entry cone of the
venturi tubes is in a range of 20 to 40 degrees. The entry cone of the
venturi tubes may typically be from 20, 25, 30 or 35 degrees up to 25,
30, 35 or 40 degrees. Optionally, the entry cone of the venturi tubes may
be of 30 degrees. Optionally, the exit cone of the venturi tubes is in a
range of 0 to 10 degrees. The exit cone of the venturi tubes may typically
be from 0, 1, 2, 3, 4, 5, 6, 7, 8 or 9 degrees up to 2, 3, 4, 5, 6, 7, 8, 9
or 10 degrees. Optionally, the exit cone of the venturi tubes may be of 5
degrees. In this regard, it will be appreciated that the entry and exit cones
of the venturi tube may be same or different from the entry and exit
cones of the first and second set of cavities.
CA 03212052 2023- 9- 13
WO 2022/214734 PC
T/FI2022/050171
16
Alternatively, the first set of cavities and the second set of cavities are
designed to mimic venturi effect, without actually having the venturi
tubes filled therein, to create air circulation beyond the first and second
set of cavities for more efficient cooling or warming effect. Alternatively,
optionally, the first set of cavities may have venturi tubes therein, while
the second set of cavities may not have the venturi tubes therein.
Beneficially, said design would save cost of including the venturi tubes in
the first and/or second set of cavities.
It will be appreciated that the venturi effect may provide best results
when used in the second set of cavities while the air flow turbulence (air
twist) happens on the front of the electronic display.
Optionally, the transversal internal flow occurs in a closed loop between
the electronic display and the integrated circuit chamber, and wherein
the transversal internal flow passes through the first set of cavities and
the second set of cavities in the closed loop. In this regard, the internal
flow occurs in the predefined path around the electronic display and the
integrated circuit chamber, initiating from the integrated circuit chamber
and ending at the integrated circuit chamber while passing through the
electronic display in a closed loop. Operatively, the internal flow first
passes through the first set of cavities placed on the integrated circuit
chamber then passes to the second set cavities in the metal casing of the
electronic display where it cools the electronic display then again passes
to the oppositely placed second set of cavities in the metal casing and
then finally passes through the oppositely placed first set of cavities in
the integrated circuit chamber to complete one heat transfer loop.
DETAILED DESCRIPTION OF THE DRAWINGS
Referring to FIGs. 1A, 1B and 1C, illustrated are an exploded view, a
schematic view and a cross-sectional view, respectively, of a cross flow
heat transfer apparatus 100, in accordance with an embodiment of the
CA 03212052 2023- 9- 13
WO 2022/214734 PC
T/FI2022/050171
17
present disclosure. The cross flow heat transfer apparatus 100 comprises
an electronic display 102, an integrated circuit chamber 104, and an
external heatsink 106 configured to be arranged between the electronic
display 102 and the integrated circuit chamber 104. In this regard, the
external heatsink 106, comprising a plurality of vertically-oriented fins
108, is configured to mediate a cross flow heat transfer mechanism
between the electronic display 102 and the integrated circuit chamber
104. Moreover, the cross flow heat transfer mechanism comprises an
internal flow 110 driven by a set of internal fans 112 associated with an
internal heatsink 114 coupled with the integrated circuit chamber 104,
wherein the internal flow 110 is directed transversally towards the
electronic display 102 from the integrated circuit chamber 104, and an
external flow 116 driven by the plurality of vertically-oriented fins 108
of the external heatsink based on a temperature gradient. The integrated
circuit chamber 104 has a first set of cavities (104A, 10413) placed on
opposite vertical edges thereof. The electronic display 102 is arranged in
a metal casing 118 having a second set of cavities (118A (not visible),
1188) placed on opposite edges thereof. Furthermore, the cross flow
heat transfer apparatus 100 comprises an external shell protection to
isolate the internal flow 110. The external shell protection having
proximal end 120A covering the electronic display 102 and the distal end
12013 covering the integrated circuit chamber 104.
Referring to FIGs. 2A and 2B illustrated are a perspective view and a
cross-sectional view, respectively, of a cross flow heat transfer apparatus
200 depicting an external flow, in accordance with an embodiment of the
present disclosure. As shown, the external flow 202 is driven by a
temperature gradient through the plurality of vertically-oriented fins 204
of the external heatsink 206. In this regard, the surrounding air of the
environment passes through the vertically-oriented fins 204 of the
external heatsink 206. Moreover, the electronic display is arranged in a
metal casing 208 having a second set of cavities (208A (not visible),
CA 03212052 2023- 9- 13
WO 2022/214734 PC
T/FI2022/050171
18
208B). Notably, the cross flow heat transfer apparatus 200 comprises
external shell protection having proximal end 210A and distal end 210B.
Referring to FIG. 3 illustrated is a cross-sectional view of a cross flow
heat transfer apparatus 300 depicting an internal flow, in accordance
with an embodiment of the present disclosure. The cross flow heat
transfer mechanism comprising an internal flow 302 driven by a set of
internal fans 304 associated with an internal heatsink 306 coupled with
the integrated circuit chamber 308, wherein the internal flow 302 is
directed transversally towards the electronic display (not shown) from
the integrated circuit chamber 308 having external heatsink 310 in
between having vertically-oriented fins 312. The internal flow 302 occurs
in a closed loop between the electronic display arranged in a metal casing
314 and the integrated circuit chamber 308. The cross flow heat transfer
apparatus 300 comprises the external shell protection having proximal
end 316A covering the electronic display and proximal end 316B
covering the integrated circuit chamber 308.
Referring to FIG 4 is a cross-sectional view of a venturi tube 400, in
accordance with an embodiment of the present disclosure. As shown, the
venture tube 400 has an entry cone A and an exit cone B. Typically, the
internal flow 402 passes through the entry cone A and leaves the exit
cone B of the venturi tube 400. Moreover, the first set of cavities and the
second set of cavities of the integrated circuit chamber and the metal
casing, respectively are filled in with venturi tubes, such as the venturi
tube 400.
Referring to FIG 5A and 5B are tables showing various combinations of
an entry cone and an exit cone of a first set of cavities and a second set
of cavities, in accordance with various embodiments of the present
disclosure. As shown in the FIG 5A, "1" represents that the entry cone is
greater than the exit cone of the cavity and "0" represents that the entry
cone and the exit cone of the cavity are the same. For example, in
CA 03212052 2023- 9- 13
WO 2022/214734 PC
T/FI2022/050171
19
combination "0", the cavities 104A and 104B of the first set of cavities
104 and the cavities 118A and 118B of the second set of cavities 118
have entry cone equal to/same as the exit cone thereof. In combination
the cavity 104A of the first set of cavities 104 has the entry cone
same as the exit cone thereof. Moreover, the cavities 118A and 118B of
the second set of cavities 118 and the cavity 104B of the first set of
cavities 104 has the entry cone greater than the exit cone thereof.
As shown, the FIG 55, "1" represents that the entry cone is smaller than
the exit cone of the cavity and "0" represents the entry cone and exit
cone of the cavity to be the same. In combination "0", the cavities 104A
and 104B of the first set of cavities 104 and the cavities 118A and 118B
of the second set of cavities 118 has the entry cone same as the exit
cone thereof. In combination "7", the cavity 104A of the first set of
cavities 104 has the entry cone equal to/same as the exit cone thereof.
Moreover, the cavities 118A and 118B of the second set of cavities 118
and the cavity 104B of the first set of cavities 104 has the entry cone
smaller than the exit cone thereof.
Modifications to embodiments of the present disclosure described in the
foregoing are possible without departing from the scope of the present
disclosure as defined by the accompanying claims. Expressions such as
"including", "comprising", "incorporating", "have", "is" used to describe
and claim the present disclosure are intended to be construed in a non-
exclusive manner, namely allowing for items, components or elements
not explicitly described also to be present. Reference to the singular is
also to be construed to relate to the plural.
CA 03212052 2023- 9- 13
