Canadian Patents Database / Patent 2430747 Summary

Third-party information liability

Some of the information on this Web page has been provided by external sources. The Government of Canada is not responsible for the accuracy, reliability or currency of the information supplied by external sources. Users wishing to rely upon this information should consult directly with the source of the information. Content provided by external sources is not subject to official languages, privacy and accessibility requirements.

Claims and Abstract availability

Any discrepancies in the text and image of the Claims and Abstract are due to differing posting times. Text of the Claims and Abstract are posted:

  • At the time the application is open to public inspection;
  • At the time of issue of the patent (grant).
(12) Patent: (11) CA 2430747
(54) English Title: RADIATION EMITTER DEVICES AND METHOD OF MAKING THE SAME
(54) French Title: DISPOSITIFS EMETTEURS DE RAYONNEMENTS ET LEUR PROCEDE DE FABRICATION
(51) International Patent Classification (IPC):
  • H01L 23/02 (2006.01)
  • H01L 23/28 (2006.01)
  • H01L 51/52 (2006.01)
  • H01L 33/00 (2006.01)
(72) Inventors (Country):
  • ROBERTS, JOHN K. (United States of America)
  • REESE, SPENCER D. (United States of America)
(73) Owners (Country):
  • EVERLIGHT ELECTRONICS CO., LTD. (Taiwan)
(71) Applicants (Country):
  • GENTEX CORPORATION (United States of America)
(74) Agent: MACRAE & CO.
(45) Issued: 2008-05-20
(86) PCT Filing Date: 2002-01-23
(87) PCT Publication Date: 2002-08-08
Examination requested: 2003-12-17
(30) Availability of licence: N/A
(30) Language of filing: English

(30) Application Priority Data:
Application No. Country Date
60/265,489 United States of America 2001-01-31

English Abstract




A radiation emitting device of the present invention includes at least one
radiation emitter (35), first and second electrical lead (16-14) electrically
coupled to the radiation emitter (35), and an integral encapsulant (12)
configured to encapsulate the radiation emitter (35) and portions of the
electrical leads. The encapsulant (12) has at least a first zone (30) and a
second zone (32), where the second zone exhibits at least one different
characteristic from the first zone. This different characteristics is one
selected from the group consisting of mechanical strength, thermal
conductivity, thermal expansion coefficient, specific heat, oxygen
permeability, moisture permeability, adhesive strength, and trnsmittance. The
radiation emitter is preferably a LED.


French Abstract

L'invention concerne un dispositif d'émission de rayonnements comprenant au moins un émetteur de rayonnements, des premier et second fils électriques couplés audit émetteur, et une enveloppe intégrale conçue pour envelopper ledit émetteur de rayonnements et une partie des premier et second fils électriques. L'enveloppe comporte des première et seconde zones, ladite seconde zone présentant au moins une caractéristique différente de la première zone. Ces caractéristiques peuvent être physiques, structurelles et/ou compositionnelles. De préférence, la caractéristique différente comprend au moins un des aspects suivants : une résistance mécanique, une conductivité thermique, une capacité thermique, un coefficient d'expansion thermique, une chaleur spécifique, une imperméabilité à l'oxygène et à l'humidité, une adhésion, et un facteur de transmission par rapport au rayonnement émis dudit émetteur. Cet émetteur de rayonnements peut être un émetteur et, est, de préférence, une diode électroluminescente.


Note: Claims are shown in the official language in which they were submitted.


CLAIMS:
1. A radiation emitting device comprising:
at least one radiation emitter;
first and second electrical leads electrically coupled to said radiation
emitter;
and
an integral encapsulant configured to encapsulate said radiation emitter and a
portion of said first and second electrical leads, said encapsulant having and
outer
surface and at least a first zone and a second zone, the second zone
exhibiting at
least one different characteristic from the first zone, wherein said at least
one
different characteristic is that said second zone has a higher thermal
conductivity
than said first zone, and wherein, in both said zones, said encapsulant is
made of a
material with a high electrical resistivity, and wherein said second zone of
said
encapsulant is configured to physically contact at least a portion of at least
one of
said electrical leads and to extend to the outer surface of said encapsulant.

2. The radiation emitting device of claim 1, wherein said at least one
different
characteristic is a physical characteristic.

3. The radiation emitting device of claim 1, wherein said at least one
different
characteristic is an optical characteristic.

4. The radiation emitting device of claim 3, wherein said at least one
different
optical characteristic is transparency.

5. The radiation emitting device of claim 3, wherein said at least one
different
optical characteristic is diffusivity.

6. The radiation emitting device of claim 1, wherein said at least one
different
characteristic is a thermal characteristic.



7. The radiation emitting device of claim 6, wherein said at least one
different
thermal characteristic is thermal expansion coefficient.

8. The radiation emitting device of claim 6, wherein said at least one
different
thermal characteristic is specific heat.

9. The radiation emitting device of claim 6, wherein said at least one
different
thermal characteristic is glass transition temperature.

10. The radiation emitting device of claim 1, wherein said at least one
different
characteristic is a structural characteristic.

11. The radiation emitting device of claim 10, wherein said at least one
different
characteristic includes at least one of tensile strength and compression
strength.

12. The radiation emitting device of claim 1, wherein said at least one
different
characteristic is a compositional characteristic.

13. The radiation emitting device of claim 1, wherein said radiation emitter
is
mounted on one of said first and second electrical leads.

14. The radiation emitting device of claim 1 and further including a wire bond
extending from one of said first and second electrical leads to said radiation
emitter.
15. The radiation emitting device of claim 1, wherein the at least one
different
characteristic includes at least one of the following: mechanical strength,
thermal
capacity, specific heat, coefficient of thermal expansion, adhesion, oxygen
impermeability, moisture impermeability, and transmittance for radiation
emitted
from said radiation emitter.

16. The radiation emitting device of claim 1, wherein one of said zones is at
least partially transparent to radiation emitted from said radiation emitter.

31


17. The radiation emitting device of claim 1, wherein a region of said
encapsulant is configured to function as a lens.

18. The radiation emitting device of claim 1, wherein a region of said first
zone
of said encapsulant is configured to function as a lens.

19. The radiation emitting device of claim 18, wherein said second zone of
said
encapsulant is configured to retain said electrical leads.

20. The radiation emitting device of claim 19, wherein said lens is formed on
a
side of said encapsulant different from any sides from which said electrical
leads
extend.

21. The radiation emitting device of claim 20, wherein the side on which said
lens is formed is opposite a side from which said electrical leads extend.

22. The radiation emitting device of claim 20, wherein the side on which said
lens is formed is adjacent sides from which said electrical leads extend.

23. The radiation emitting device of claim 1, wherein said electrical leads
are
wave-solderable.

24. The radiation emitting device of claim 1, wherein said radiation emitter
is an
LED chip.

25. The radiation emitting device of claim 1, wherein said radiation emitter
is a
PLED.

26. The radiation emitting device of claim 1, wherein said radiation emitter
is an
OLED.

32




27. The radiation emitting device of claim 1, wherein said radiation emitter
is an
LEP.


28. The radiation emitting device of claim 1, wherein said radiation emitter
is a
semiconductor optical radiation emitter.


29. The radiation emitting device of claim 1, wherein said at least one
radiation
emitter includes a first radiation emitter and said device further comprises a
second
radiation emitter, both of said first and second emitters are encapsulated by
said
encapsulant.


30. The radiation emitting device of claim 29, wherein said second radiation
emitter is an LED chip.


31. The radiation emitting device of claim 29, wherein said second radiation
emitter is a photoluminescent emitter.


32. The radiation emitting device of claim 29, wherein the first radiation
emitter
is an LED chip and said second radiation emitter is a photoluminescent
emitter.


33. The radiation emitting device of claim 1, wherein said first zone of said
encapsulant is optically transparent and extends from said radiation emitter
to a light
output surface of said encapsulant.


34. The radiation emitting device of claim 1, wherein said second zone has a
higher thermal capacity than said first zone.


35. The radiation emitting device of claim 1, wherein said second zone has a
greater mechanical strength than said first zone.


36. The radiation emitting device of claim 1, wherein said second zone has a
lower coefficient of thermal expansion than said first zone.



33




37. The radiation emitting device of claim 1, wherein said second zone has a
greater adhesion strength than said first zone with respect to said electrical
leads.

38. The radiation emitting device of claim 1, wherein said second zone has
lower
oxygen permeability than said first zone.


39. The radiation emitting device of claim 1, wherein said second zone has
lower
moisture permeability than said first zone.


40. The radiation emitting device of claim 1, wherein said second zone has a
higher specific heat than said first zone.


41. The radiation emitting device of claim 1, wherein said first and second
zones
of said encapsulant are cohesively bonded.


42. The radiation emitting device of claim 1, wherein said integral
encapsulant is
heterogeneous.


43. The radiation emitting device of claim 1, wherein said electrical leads
extend
from said encapsulant substantially non-perpendicular to the optical axis of
the
device.


44. The radiation emitting device of claim 1, wherein said first and second
zones
are made of different compositions and wherein a gradient mix of the different

compositions exists between said zones.


45. The radiation emitting device of claim 1, wherein both said zones of said
encapsulant are made of a thermoset material.


46. The radiation emitting device of claim 1, wherein said encapsulant is
integrally molded.



34




47. The radiation emitting device of claim 1 and further including a glob-top
disposed over said radiation emitter.


48. The radiation emitting device of claim 48, wherein said glob-top includes
a
photoluminescent material.


49. The radiation emitting device of claim 1, wherein, in said second zone,
said
encapsulant physically contacts said electrical leads.


50. The radiation emitting device of claim 1, wherein, in said second zone,
said
encapsulant is an epoxy.


51. An optical radiation emitting device comprising:
an optical radiation emitter;
first and second electrical leads electrically coupled to said optical
radiation
emitter; and

an integrally molded encapsulant configured to encapsulate said optical
radiation emitter and a portion of said first and second electrical leads,
said
encapsulant having an outer surface and being made of a first composition that
is
substantially optically transparent to radiation emitted by said radiation
emitter, and
a second composition having different properties than said first composition
including a higher thermal conductivity than said first composition, wherein
said
encapsulant is made of a material with a high electrical resistivity, and
wherein said
second composition physically contacts at least a portion of at least one of
said
electrical leads and extends to the outer surface of said encapsulant.


52. The radiation emitting device of claim 51, wherein said first and second
compositions are substantially segregated into different regions of said
encapsulant.

53. The radiation emitting device of claim 51, wherein said second composition

is substantially opaque.



35




54. The radiation emitting device of claim 51, wherein said first composition
is
substantially transparent.


55. The radiation emitting device of claim 51, wherein said second composition

has a higher thermal capacity than said first composition.


56. The radiation emitting device of claim 51, wherein said second composition

has a greater mechanical strength than said first composition.


57. The radiation emitting device of claim 51, wherein said second composition

has a lower coefficient of thermal expansion than said first composition.


58. The radiation emitting device of claim 51, wherein said second composition

has a greater adhesion strength than said first composition with respect to
said
electrical leads.


59. The radiation emitting device of claim 51, wherein said second composition

has lower oxygen permeability than said first composition.


60. The radiation emitting device of claim 51, wherein said second composition

has lower moisture permeability than said first composition.


61. The radiation emitting device of claim 51, wherein said second composition

has a higher specific heat than said first composition.


62. The radiation emitting device of claim 51, wherein said first and second
compositions are substantially segregated into different zones of said
encapsulant
and are cohesively bonded at an interface of those zones.


63. The radiation emitting device of claim 51, wherein said optical radiation
emitter is mounted on one of said first and second electrical leads.



36




64. The radiation emitting device of claim 51, wherein said radiation emitter
is
an LED chip.


65. The radiation emitting device of claim 51, wherein said radiation emitter
is a
semiconductor optical radiation emitter.


66. The radiation emitting device of claim 51 and further including a glob-top

disposed over said optical radiation emitter.


67. The radiation emitting device of claim 66, wherein said glob-top includes
a
photoluminescent material.


68. The radiation emitting device of claim 51, wherein said second composition

physically contacts both said electrical leads.


69. The radiation emitting device of claim 51, wherein said second composition

is an epoxy.


70. A method of making a radiation emitting device comprising the steps of:
attaching and electrically coupling at least one radiation emitter to a lead
frame to form a subassembly;
inserting said subassembly into a mold cavity;
partially filling the mold cavity with a first encapsulant material;
filling the remainder of the mold cavity with a second encapsulant material;
and
removing the encapsulated subassembly from the mold cavity.


71. The method of claim 70 and further including the step of partially curing
the
first encapsulant material before filling the remainder of the mold cavity
with the
second encapsulant material.



37




72. The method of claim 70 and further including the step of curing the first
and
second encapsulant materials before removing the encapsulated subassembly from

the mold assembly.


73. The method of claim 70, wherein the first encapsulation material is
substantially transparent to radiation emitted by the radiation emitter.


74. The method of claim 70, wherein said second encapsulation material is
opaque.


75. A radiation emitter device constructed by the method of claim 70.

76. A light emitting device comprising:
at least one LED chip;
first and second electrical leads electrically coupled to said LED chip; and
an integral encapsulant configured to encapsulate said LED chip and a
portion of said first and second electrical leads, said encapsulant having and
outer
surface and at least a transparent first zone and a second zone, the second
zone
having a higher thermal conductivity than said first zone, wherein, in both
said
zones, said encapsulant is made of a material with a high electrical
resistivity, and
wherein, in said second zone, said encapsulant physically contacts at least
one of
said electrical leads and extends to the outer surface of said encapsulant.


77. The light emitting device of claim 76, wherein, in said second zone, said
encapsulant physically contacts both said electrical leads.


78. The light emitting device of claim 76, wherein, in said second zone, said
encapsulant is an epoxy.



38


A single figure which represents the drawing illustrating the invention.

For a clearer understanding of the status of the application/patent presented on this page, the site Disclaimer , as well as the definitions for Patent , Administrative Status , Maintenance Fee  and Payment History  should be consulted.

Admin Status

Title Date
(86) PCT Filing Date 2002-01-23
(87) PCT Publication Date 2002-08-08
(85) National Entry 2003-06-05
Examination Requested 2003-12-17
(45) Issued 2008-05-20

Maintenance Fee

Description Date Amount
Last Payment 2016-11-15 $450.00
Next Payment if small entity fee 2018-01-23 $225.00
Next Payment if standard fee 2018-01-23 $450.00

Note : If the full payment has not been received on or before the date indicated, a further fee may be required which may be one of the following

  • the reinstatement fee set out in Item 7 of Schedule II of the Patent Rules;
  • the late payment fee set out in Item 22.1 of Schedule II of the Patent Rules; or
  • the additional fee for late payment set out in Items 31 and 32 of Schedule II of the Patent Rules.

Payment History

Fee Type Anniversary Year Due Date Amount Paid Paid Date
Registration of Documents $100.00 2003-06-05
Filing $300.00 2003-06-05
Request for Examination $400.00 2003-12-17
Maintenance Fee - Application - New Act 2 2004-01-23 $100.00 2004-01-07
Maintenance Fee - Application - New Act 3 2005-01-24 $100.00 2005-01-05
Maintenance Fee - Application - New Act 4 2006-01-23 $100.00 2006-01-05
Maintenance Fee - Application - New Act 5 2007-01-23 $200.00 2007-01-05
Maintenance Fee - Application - New Act 6 2008-01-23 $200.00 2008-01-07
Final $300.00 2008-02-29
Maintenance Fee - Patent - New Act 7 2009-01-23 $200.00 2008-12-30
Maintenance Fee - Patent - New Act 8 2010-01-25 $200.00 2009-12-30
Maintenance Fee - Patent - New Act 9 2011-01-24 $200.00 2010-12-30
Maintenance Fee - Patent - New Act 10 2012-01-23 $250.00 2011-12-30
Maintenance Fee - Patent - New Act 11 2013-01-23 $250.00 2012-12-31
Maintenance Fee - Patent - New Act 12 2014-01-23 $250.00 2013-12-30
Maintenance Fee - Patent - New Act 13 2015-01-23 $250.00 2015-01-19
Maintenance Fee - Patent - New Act 14 2016-01-25 $250.00 2016-01-18
Registration of Documents $100.00 2016-10-13
Maintenance Fee - Patent - New Act 15 2017-01-23 $450.00 2016-11-15

To view selected files, please enter reCAPTCHA code :




Filter Download Selected in PDF format (Zip Archive)
Document
Description
Date
(yyyy-mm-dd)
Number of pages Size of Image (KB)
Abstract 2003-06-05 2 63
Claims 2003-06-05 9 380
Drawings 2003-06-05 9 187
Description 2003-06-05 29 1,864
Representative Drawing 2003-06-05 1 12
Cover Page 2003-07-31 1 41
Claims 2007-02-28 9 294
Description 2007-02-28 29 1,825
Representative Drawing 2008-04-28 1 7
Cover Page 2008-04-28 2 45
PCT 2003-06-05 18 821
PCT 2003-06-06 15 686
Prosecution-Amendment 2003-12-17 1 28
Prosecution-Amendment 2004-02-12 1 42
PCT 2003-06-06 13 628
Prosecution-Amendment 2004-05-26 1 33
PCT 2003-06-05 14 614
Correspondence 2008-02-29 1 31
Prosecution-Amendment 2006-08-30 2 66
Prosecution-Amendment 2007-02-28 22 1,007
Fees 2016-11-15 1 56