HOUSING MEMBER FOR SEMICONDUCTOR DEVICES

ENVELOPPE PROTECTRICE POUR DISPOSITIFS A SEMICONDUCTEURS

English Abstract

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ABSTRACT OF THE DISCLOSURE
The present invention is directed to a semicon-
ductor housing consisting of a cup-shaped bottom member
and a hood-shaped top member, into the interior of which
is poured a sealing compound, or filler, at least up to a
plane of separation between the top and bottom portions.
The top portion is provided with an apron or skirting
which overlaps the separation within the housing, between
the apron and the overlapped region of the bottom member
there is a clearance which is filled with the sealing
compound until below the plane of separation.

Claims

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We claim as our invention:
1. A housing for a semiconductor device
consisting of a cup-shaped bottom member, having a
base portion and a wall portion, said bottom member
including said side walls, being comprised of a metal, and
a hood-shaped top member having an apron portion which over-
laps a portion of the wall portion within the housing, the
apron and the overlapped portion of the wall forming a gap
therebetween.
2. The housing of claim 1 in which the wall
portion overlapped by the apron is of a lesser thickness
than the remainder of the wall.
3. The housing of claim 2 in which the thickness
of the top member is uniform.
4. A semiconductor housing consisting of a cup-
shaped bottom member, having a base portion and a wall
portion, said bottom member, including said side walls,
being comprised of a metal, and a hood-shaped top member
said top member being comprised of a resin, the top member
having an apron portion which overlaps a portion of the wall
portion within the housing, a plane of separation between
said top member and said wall of said bottom member, the
apron and the overlapped portion of the wall forming a gap
therebetween, said gap being filled with a sealing compound
to a point just below the plane of separation.
5. The housing of claim 4 in which the wall
portion overlapped by the apron is of lesser thickness
than the remainder of the wall.

Description

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HOUSING MEMBER FOR SEMICONDUCTOR DEVICES
BACKGROUND OE THE INVENTION
Field of the Invention:
_ _ _ _
The present invention is in the field of semi-
conductor housing or case members.
escription of the Prior Art:
Semiconductor housings having a top and bottom
member are known.
In order to seal off the plane of separation
between the top and bottom members and to prevent the
emergence of the sealing compound, it is possible with
such a semiconductor housing to stick the top and bottom
members together prior to pouring in the sealing compound.
It is also possible to lay an elastic sealing gasket in
the plane of separation. However, the above measures can
only be carried out using an additional working opera-
tions, and every additional operation increases the possi-
bility of a reduced yield.
SUMMARY OF THE INVENTION
The present invention comprises a semiconductor
housing consisting of a cup-shaped bottom member and a
hood-shaped top member, the interior of the housing being
filled with a sealing compound which is poured to a level
at least as high as the plane of separation between the
top and bottom members, the top member of the housing
being provided with an apron or skirt portion which over-
laps, within the housing, the plane of separation and
between the apron and the overlapped region of the bottom

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member there is a gap which is filled with the sealing
compound to a point just below the plane of separation.
DESCRIPTION OF THE DRAWING
_ _ _
For a better understanding of the present inven-
tion, reference should be had to the following detailed
discussion and drawing in which the single figure is a
side view in section of a semiconductor housing setting
forth the teachings of this invention.
DESCRIPTION OF PREFERRED EMBODIMENT
_ _ .
With reference to the drawing, there is shown a
housing 10 made in accordance with the teachings of this
invention for a semiconductor device.
The housing 10 is provided with a cup-shaped
bottom member 12 which includes a base portion 13 and
a sidewall portion 14. The bottom member including side-
wall 14 is constructed of a suitable metal as for example,
copper or steel.
Seated on the sidewall portion 14 is a hood-
shaped top member 16 made, for example, of a resin such
as, for example, a cured epoxy or silicone resin.
The bottom part 12 and the top part 16 meet at a
plane of separation 18.
Within the housing 10, the hood-shaped top
member 16 is provided with an apron or skirt 20 which
overlaps the plane of separation 18. Between the apron 20
and the part of the wall 14 overlapped by the apron 20 is
a gap or clearance 22. The gap 22 is filled with a seal-
ing compound as, for example, an epoxy or silicone resin
to below the plane of separation 18, thereby sealing off
the separating plane and preventing any escape of the
sealing compound without the need for sticking together
the two housing parts or using an elastic sealing gasket
in the plane of separation.
In order to effect the seal, the housing is
first filled with sealing compound to the level indicated
by the broken line 24. This level lies below the plane of
separation 18. The sealing compound is allowed to harden


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or cure so that a seal consistirlg of hardened sealing
compound henceforth lies in the gap 22. After -the harden-
ing or curing process, the housinc; is additionally ~illed
with sealing compound to the desired height, indicated by
way of example by the broken line 26. This additional
sealing compound cannot, in any way, leak out along the
plane of separation 18.
As illustrated, the wall 14 of the bottom member
12 has a smaller wall thickness in the region overlapped
by the apron 20 than the wall 14 outside the overlapped
region. On the other hand, the wall thickness of the top
member 16 is essentially the same all over. It is also
possible, however, to make the thickness of the wall 14
essentially the same all over and to allow the apron 20 to
project into the interior the housing.