SUBSTRATE CONNECTOR GUIDE

GUIDE DE CONNEXION POUR SUBSTRAT

English Abstract

SUBSTRATE CONNECTOR GUIDE
ABSTRACT
A substrate connector guide for installing and
electrically connecting an electrical substrate to a carrier
substrate. The substrate connector guide includes a plurality
of guide rails mounted on the perimeter edge of the electri-
cal substrate and at least a first electrical connector
mounted transversely between the guide rails. First and
second substrate guides are mounted to the carrier substrate
in a spaced and parallel relationship to the other. Each
substrate guide includes a channel extending longitudinally
along a substrate guide inner side, from an open end to a top
guide. The channel is further defined by a top surface and a
plurality of drop guides which in turn form a plurality of
slots. At least a second electrical connector is mounted and
electrically connected to the carrier substrate between the
first and second substrate guides. The electrical substrate
is installed by manually inserting the electrical substrate
into respective substrate guide open ends and manually
pushing the electrical substrate along the channels until the
substrate encounters a respective top guide. The top guides
then urge the substrate downward until each electrical
substrate guide rail falls into a respective substrate guide
slot. Each of the electrical substrate's plurality of guide
rails rest on the carrier substrate and align the first
electrical connector to the second electrical connector. An
electrical connection is completed between the electrical
substrate and the carrier substrate when the electrical
substrate is fully seated on the first and second substrate
guides.

Claims

WHAT IS CLAIMED IS;
1. A substrate connector guide for mounting and
electrically connecting an electrical substrate to a carrier
substrate comprising:
a first pair of guide rails each mounted on the
perimeter edge of said electrical substrate directly opposite
each other;
a second pair of guide rails located in a spaced
relationship to said first pair of guide rails and each guide
rail of said second pair of guide rails mounted on the
perimeter edge of said electrical substrate directly opposite
each other;
at least a first electrical connecting device
mounted transversely along a bottom surface of said
electrical substrate electrically connected to said
electrical substrate;
first and second substrate guides mounted to said
carrier substrate in a spaced and parallel relationship to
each other, each of said substrate guides including a channel
extending longitudinally along an inner side thereof from an
open end to a top guide, each channel further defined by a
top surface and first and second drop guides with said first
and second drop guides further defining first and second
slots, and at least a second electrical connecting device
electrically connected and mounted to said carrier substrate
transversely, between said first and said second substrate
guides: and,
said electrical substrate and said first and second
guide rails arranged to be manually inserted into respective
first and second substrate guide channels at respective
channel open ends and manually pushed along said channels
riding between respective first and second drop guides and
top surfaces until said substrate encounters said first and
second substrate guides top guide and each respective top
guide urges said electrical substrata downward, and said
first guide rail and said second guide rail fall within


respective first and second slots on each of said first and
second substrate guides resting each of said first and second
electrical substrate guide rails on said carrier substrate,
aligning and registering said first electrical connecting
device to said second electrical connecting device whereby,
said first electrical connecting device mates with said
second electrical connecting device electrically connecting
said electrical substrate to said carrier substrate.

2. A substrate connector guide for mounting and
electrically connecting an electrical substrate to a carrier
substrate comprising:
first rail means mounted on a first perimeter edge
of said electrical substrate;
second rail means mounted on a second perimeter
edge of said electrical substrate directly opposite said
first rail means;
at least a first electrical connecting device
mounted transversely along a bottom surface of said electri-
cal substrate electrically connected to said electrical
substrate;
first and second guide means mounted to said
carrier substrate in a spaced and parallel relationship to
each other, each of said guide means including a channel
extending longitudinally along an inner side thereof from an
open end to a terminating end, each channel including at
least one rail means accepting slot;
at least a second electrical connecting device
electrically connected and mounted to said carrier substrate
transversely between said first and said second guide means;
and,
said electrical substrate and said first and second
rails means arranged to be manually inserted into respective
first and second substrate guide means channels at respective
channel open ends and urged along each of said guide means
channels toward said closed end until said first rail means


and said second rail means fall within respective first and
second guide means slots resting each of said first and
second rails means on said carrier substrate, aligning and
registering said first electrical connecting device to said
second electrical connecting device whereby, said first
electrical connecting device mates with said second
electrical connecting device electrically connecting said
electrical substrate to said carrier substrate.

3. The substrate connector guide as claimed in
claim 2, wherein: said first rail means is a pair of guide
rails mounted in tandem and extending from the bottom surface
of said electrical substrate along a first major perimeter
edge of said electrical substrate.

4. The substrate connector guide as claimed in
claim 3, wherein: said second rail means is a pair of guide
rails mounted in tandem and extending from the bottom surface
of said electrical substrate directly opposite of said first
rail means along a second major perimeter edge of said
electrical substrate.

5. The substrate connector guide as claimed in
claim 4, wherein: each of said first and second guide means
channels is defined by a top surface and first and second
drop guides positioned in tandem along said channel, said
guide means first and second drop guides further defining
first and second slots.

6. The substrate connector guide as claimed in
claim 5, wherein: said electrical substrate and said first
and second pair of guide rails are inserted within respective
first and second guide means channels at respective channel
open ends, and said electrical substrate is manually pushed
along each respective channel with said first and second pair
of guide rails riding between respective first and second
guide means drop guides and top surfaces until each of said
first and second pair of guide rails fall within respective
first and second guide means first and second slots.



7. The substrate connector guide as claimed in
Claim 6, wherein: each of said first and second guide means
terminating ends are first and second top guides extending
into respective first and second guide means channels, each
top guide is arranged to contact said electrical substrate
when riding within each respective channel, thereby urging
said electrical substrate in a downward direction.

8. A substrate connector guide for mounting and
electrically connecting an electrical substrate to a carrier
substrate comprising:
rail means mounted along the major perimeter edges
of said electrical substrate;
at least a first electrical connecting device
mounted along a bottom surface of said electrical substrate
electrically connected to said electrical substrate;
a plurality of guide means mounted to said carrier
substrate, each of said guide means including a channel
extending longitudinally along an inner side thereof from an
open end to a terminating end, each channel including rail
means accepting slots;
at least a second electrical connecting device
electrically connected and mounted to said carrier substrate
located adjacent said guide means; and,
said electrical substrate and said rails means
arranged to be manually inserted into said guide means
channel at respective channel open ends and urged along said
channels toward said closed end until said rail means fall
within respective guide means slots, resting said rails means
on said carrier substrate, aligning and registering said
first electrical connecting device to said second electrical
connecting device whereby, said first electrical connecting
device mates with said second electrical connecting device
electrically connecting said electrical substrate to said
carrier substrate.

Description

3L2~3%1~3~
SUBSTRATE CONNECTOR GUIDE
BACKGROUND OF THE INVENTION
This invention relates in general to modular
Plectronic circuit devices and more particularly to a device
for mounting and electrically connecting electrical sub-
strates to a carrier substrate.
In the past ~ew years, the use of plug-in units for
electrical components has ~ound favor within the electronics
industry. Such plug-in units generally comprise a structure
upon which are mounted electrical assemblies or sub-assem-
blies, the structure being arranged to be plugged in a
suitable socket provided on a base chassis. When so plugged
the components carried by the plug-in unit are electrically
connected in proper circuit relation to other electrical
equipment carried by the base chassis.
Recently however, with the coming of film circuits,
the need for a specialized carrier structure for housing the
sub-assembly has disappeared. This is mainly due to the
smaller size of a film circuit. Compared to circuit fashioned
in discrete components the film circuit is appreciably
smaller and lighter. It is not uncommon to have film circuits
plugged directly into larger circuit cards or other carrier
substrates and in turn the larger substrate plugged into the
base chassis. At present, most installations of film circuits
to circuit cards is done as a permanent installation. There~
fore, removal and replacement of the film circuits though not
impossible, is a tedious and labor intensive job.
It therefor is an object of the present invention
to disclose a new structure for mounting and electrically
connecting, electronic substrates onto carrier substrates.

SUMMARY OF THE INVENTION
In accomplishing the ob~ect of the present inven-
tion there is provided a substrate connector guide for
mounting and electrically connecting an electrical substrate
to a carrier substrate. The electrical substrate of the
present invention includes a first pair of guide rails each

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~-ounted on the perimeter edge of the electrical substrate
~ractly opposite the other. A second pair of guide rails
located in a spaced relationship ~rom the first pair of guide
rails are also mounted on the perimeter edge of the electri-
cal substrate directly opposite the other. At least one first
electrical connecting device is mounted transversely along a
bottom surface of the electrical substrate. The first elec-
trical connecting device is electrically connected to theelectrical substrate.
First and second substrate yuides are mounted to
the carrier substrate in a spaced and parallel relationship
to the olher. Each o~ the first and second substrate guides
include a channel extending longitudinally along a first side
thereof, from an open end to a top guide. The channel is
further defined by a top surface and first and second drop
guides. The first and second drop guides further define first
and second slots. At least one second electrical connecting
device is mounted and electrically connected to the carrier
substrate transversely between the first and second substrate
guides.
The electrical substrate is mounted to the sub-
strate guides by manually inserting the electrical substrate
into raspective first and second substrate guide channels
open ends and manually pushing the electrical substrate along
the channels. The electrical substrate and first and second
pairs of guide rails ride between respective first and second
drop guides and top surfaces. When the substrate encounters
the first and second top guides each respective top guide
urges the electrical substrate downward. The first guide rail
and the second guide rail then fall within respective first
and second slots on each of the first and second substrate
guides resting each of the first and second electrical
substrate guide rails on the carrier substrate and aligning
and registering the first electrical connecting device to the
second electrical connecting device. A final application of
forward pressure connects the first electrical connecting
device to the second electrical connecting device


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electrically connecting the electrical substrate to the
rrier substrate.




BRIEF DESCRIPTION OF THE DRAWINGS
A better understanding of the invention may be had
from the consideration of the following detailed description
taken in conjunction with the accompanying drawings in which:
FIG. 1 is a perspective view of a substrate having
the guide rails of the present invention installed thereon;
FIG. 2 is a perspective view of a substrate guide
of the present invention;
FIG. 3 is a sectional view of the electrical
substrate and carrier substrate showing the placement and
alignment of the first and second electrical connecting
device~ before final insertion.
FIG. 4 i5 a top plan view of the substrate mounting
device of the present invention mounted on a carrier sub~
strate including the placement of the second electrical
connecting devices.
FIG. 5 - 8 are sectional views of the substrate
mounting device of the present invention illustrating the
manner in which a substrate is installed.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Turning now to Figs. 1 and 2 of the included
drawings the device in accordance with the invention includes
a planar substrat~ 10 having forward guide rails 11 and rear
guard rails 12 attached or molded onto the substrate 10 along
the edge of one of the substrates 10 major sides. A similar
set of guide rails (not shown) is also positioned on the
opposite ma;or side of the substrate. As can be seen each
guard rail end 13 and 14 is angled so as to aid insertion and
extraction when installed into guide 20 of Fig.2.
Guide 20 is an integrally molded unit comprised of
a slot or channel 24 extending longitudinally along an inner
side of guide 20. Channel 24 is defined between a planar top
cap or surface 2~ and a forward drop guide 22 and rear drop

~2~
~uide 23. Additionally, the channel 24 extends from an
~ening at the forward end of khe guide 20 to a top guide 27
at the rear of the guide 20. Both the forward and rear drop
guides include ramped ends 28 to aid in the positioning and
removal of the substrate 10. Further, the top guide 27
includes an angled surface 26 which also aids in the instal~
lation of substrate 10 and which will be explained in detail
later. Finally, guide 20 includes a generally planar bottom
surface ~5 for mounting the guide to a carrier ~ubstrate.
To facilitate the electrical connection of the
electrical substrate 10 to the carrier substrate 50 a bottom
surface 18 of the electrical substrate 10 includes a plurali-
ty of connectors 15. As shown in FIG. 3 each connector 15 is
mounted transversely across the bottom surface 18 of electri-
cal substrate 10. Each connector 15 further includes a row of
pins 16 extending from one end of the connector to the other.
The pins 16 are normally connected via conductors 17 to
electrical circuitry on the electrical substrate 10. The
carrier substrate 50 also includes an associated plurality of
connector sockets 51 each located transversely along the
carrier substrate 50. Each socket 51 includes a plurality of
pin receiving receptacles (not shown) with each pin receiving
receptacle arranged to accept an associated electrical pin
16. The connector sockets 51 are electrically connected to
the carrier substrate 50 via conductors 54.
Tuxning now to F~G. 4, a pair of guides 20 and 30
form the substrate mounting device of the present invention.
Guide 30 is a mirror imagP in structure to guide 20. The
sockets shown on FIG. 3 are also shown arranged transversely
on carrier substrate 50 between guides 20 and 30.
The substrate mounting device of the present
invention is attached by any convenient means to the top
surface of the carrier substrate 50 such as a circuit card,
backplane, or other electrical substrate.
Turning now to Figs. 5 - 8 an explanation of
the installation of the substrate 10 within the substrate
mounting device of the present invention will be explained in

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~etail. It should be noted that FIGS. 5 - 8 show the instal-
ation in sectional view and therefore for reasons of clarity
only guide 20 is shown. It will be appreciated by those
skilled in the art that an identical insertion procedure
occurs simultaneously in guide 30 as the substrate is in-
stalled.
Beginning at FIG. 5 the substrate 10 including rear
guide rail 12 and forward guard rail 11 is inserted into
channel 24 of guide 20 and pushed ~orward within the yuide.
As can be seen the rear rail 12 rides within the channel
between the forward drop guide 23, rear drop guide 22 and the
top cap 29. The rear guide rail 12 being longer than the
forward slot 53, which is de~ined by the rear drop guide 22
and forward drop guide 23, rides over the forward slot 53 on
insertion. Connectors 16 (not shown) also ride above the
connector sockets 51 due to their vertical profile which does
not xtend lower than the guide rails 11, 12~
As the substrate 10 is installed further into guide
20, substrate guide rail 11 and 12 begin falling into slots
53 and 52 respectively, as illustrated in FIG. 6. This is
aided by angled surfaces 13 of guide rails 11 and 12 sliding
down angled surfaces 28 of drop guides 23 and 22. The slots are
keyed to the connector sockets 51 allowing connectors 15 to
register in front of a respective connector socket 51 as
guide rails 11 and 12 fall into slots 53 and 52 respectively.
Angled surface 26 of top guide 27 insures that
substrate 10 follows a downward motion as it is further
pushed within the guide as shown in FIG. 7. This also aids in
providing a good horizontal force along electrical substrate
10 during the insertion of pins 16 into the pin receiving
receptacles of sockets 51.
Finally, the substrate becomes fully installed when
the rear rail 12 and forward rail 11 rest on the carrier sub-
strate 50 top surface within respective slots 52 and 53. At
this time, each connector pin 16 is aligned and registered
with an associated pin receiving receptacle on each connector

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~ockets 51. A final application of manual pressure mates each
~ln 16 with an associated socket 51 pin receiving receptacle.
lo The substrate is easily removed by pulling the
substrate 10 out of the guide 20 in an opposite direction to
that of installation. A lifting action is provided by angled ends
13 of substrate rails 11 and 12 riding on angled ends 28 of
drop guides 23 and 22. Qnce the substrate 10 and rails 11 and 12
are within channel 24 the substrate is pulled and withdrawn
from the guide.
Although the preferred embodiment of the invention
has been illustrated, and that form described in detail, it
will be readily apparent to those skilled in the art that
various modifications may be made tharein without departing
from the spirit of the invention or from the scope of the
appended claims.

Representative Drawing