SUBSTRATE CONNECTOR GUIDE

GUIDE DE CONNEXION POUR SUBSTRAT

English Abstract

SUBSTRATE CONNECTOR GUIDE
ABSTRACT
A substrate connector guide for installing and
electrically connecting an electrical substrate to a
carrier substrate. The substrate connector guide
includes a plurality of guide rails mounted on the
perimeter edge of the electrical substrate and at least
a first electrical connector mounted transversely
between the guide rails. First and second substrate
guides are mounted to the carrier substrate in a spaced
and parallel relationship to the other. Each substrate
guide includes a channel extending longitudinally along
a substrate guide inner side, from an open end to a top
guide. The channel is further defined by a top surface
and a plurality of drop guides which in turn form a
plurality of slots. At least a second electrical
connector is mounted and electrically connected to the
carrier substrate between the first and second substrate
guides. The electrical substrate is installed by
manually inserting the electrical substrate into
respective substrate guide open ends and manually
pushing the electrical substrate along the channels
until the substrate encounters a respective top guide.
The top guides then urge the substrate downward until
each electrical substrate guide rail falls into a
respective substrate guide slot. Each of the electrical
substrate's plurality of guide rails rest on the carrier
substrate and align the first electrical connector to
the second electrical connector. An electrical
connection is completed between the electrical substrate
and the carrier substrate when the electrical substrate
is fully seated on the first and second substrate
guides.

Claims

WHAT IS CLAIMED IS:

1. A substrate connector guide for mounting
and electrically connecting an electrical substrate to a
carrier substrate comprising:
a first pair of guide rails each mounted on
the perimeter edge of said electrical substrate directly
opposite each other;
a second pair of guide rails located in a
spaced relationship to said first pair of guide rails
and each guide rail of said second pair of guide rails
mounted on the perimeter edge of said electrical
substrate directly opposite each other;
at least a first electrical connecting device
mounted transversely along a bottom surface of said
electrical substrate electrically connected to said
electrical substrate;
first and second substrate guides mounted to
said carrier substrate in a spaced and parallel
relationship to each other, each of said substrate
guides including a channel extending longitudinally
along an inner side thereof from an open end to an end
cap mounted transversely between said first and second
substrate guides, said end cap further including a top
guide extending into a respective first and second
substrate guide channel, each channel further defined by
a top surface and first and second drop guides, with
said first and second drop guides further defining first
and second slots, and at least a second electrical
connecting device electrically connected and mounted to
said carrier substrate transversely, between said first
and said second substrate guides; and,
said electrical substrate and said first and
second guide rails arranged to be manually inserted into
respective first and second substrate guide channels at
respective channel open ends and manually pushed along
said channels riding between respective first and second


drop guides and top surfaces until said substrate
encounters said first and second substrate guides top
guide and each respective top guide urges said
electrical substrate downward, and said first guide rail
and said second guide rail fall within respective first
and second slots on each of said first and second
substrate guides resting each of said first and second
electrical substrate guide rails on said carrier
substrate, aligning and registering said first
electrical connecting device to said second electrical
connecting device whereby, said first electrical
connecting device mates with said second electrical
connecting device electrically connecting said
electrical substrate to said carrier substrate.

2. A substrate connector guide for mounting
and electrically connecting an electrical substrate to a
carrier substrate comprising:
first rail means mounted on a first perimeter
edge of said electrical substrate;
second rail means mounted on a second
perimeter edge of said electrical substrate directly
opposite said first rail means;
at least a first electrical connecting device
mounted transversely along a bottom surface of said
electrical substrate electrically connected to said
electrical substrate;
first and second guide means mounted to said
carrier substrate in a spaced and parallel relationship
to each other, each of said guide means including a
channel extending longitudinally along an inner side
thereof from an open end to a closed end, each channel
including at least one rail means accepting slot;
at least a second electrical connecting device
electrically connected and mounted to said carrier
substrate transversely between said first and said
second guide means; and,


said electrical substrate and said first and
second rails means arranged to be manually inserted into
respective first and second substrate guide means
channels at respective channel open ends and urged along
each of said guide means channels toward said closed end
until said first rail means and said second rail means
fall within respective first and second guide means
slots resting each of said first and second rails means
on said carrier substrate, aligning and registering said
first electrical connecting device to said second
electrical connecting device whereby, said first
electrical connecting device mates with said second
electrical connecting device electrically connecting
said electrical substrate to said carrier substrate.

3. The substrate connector guide as claimed in
claim 2, wherein: said first rail means is a pair of
guide rails mounted in tandem and extending from the
bottom surface of said electrical substrate along a
first major perimeter edge of said electrical substrate.

4. The substrate connector guide as claimed in
claim 3, wherein: said second rail means is a pair of
guide rails mounted in tandem and extending from the
bottom surface of said electrical substrate directly
opposite of said first rail means along a second major
perimeter edge of said electrical substrate.

5. The substrate connector guide as claimed in
claim 4, wherein: each of said first and second guide
means channels is defined by a top surface and first and
second drop guides positioned in tandem along said
channel, said guide means first and second drop guides
further defining first and second slots.



6. The substrate connector guide as claimed in
claim 5, wherein: said electrical substrate and said
first and second pair of guide rails are inserted within
respective first and second guide means channels at
respective channel open ends, and said electrical
substrate is manually pushed along each respective
channel with said first and second pair of guide rails
riding between respective first and second guide means
drop guides and top surfaces until each of said first
and second pair of guide rails fall within respective
first and second guide means first and second slots.

7. The substrate connector guide as claimed in
claim 6, wherein: said closed end is an end cap
transversely mounted between said first and second guide
means opposite said channel open mouth, and said end cap
includes first and second top guides extending into
respective first and second guide means channels, each
top guide arranged to contact said electrical substrate
when riding within each respective channel, thereby
urging said electrical substrate in a downward
direction.

8. A substrate connector guide for mounting
and electrically connecting an electrical substrate to a
carrier substrate comprising:
rail means mounted along the major perimeter
edges of said electrical substrate;
at least a first electrical connecting device
mounted along a bottom surface of said electrical
substrate electrically connected to said electrical
substrate;
a plurality of guide means mounted to said
carrier substrate, each of said guide means including a
channel extending longitudinally along an inner side
thereof from an open end to a closed end, each channel
including rail means accepting slots;

11

at least a second electrical connecting device
electrically connected and mounted to said carrier
substrate located adjacent said guide means; and,
said electrical substrate and said rails means
arranged to be manually inserted into said guide means
channel at respective channel open ends and urged along
said channels toward said closed end until said rail
means fall within respective guide means slots, resting
said rails means on said carrier substrate, aligning and
registering said first electrical connecting device to
said second electrical connecting device whereby, said
first electrical connecting device mates with said
second electrical connecting device electrically
connecting said electrical substrate to said carrier
substrate.

12

Description

~X~ 33
SUBST~TE CONNECTOR GUIDE
BACKGROUND OF THE INVENTION

This invention relates in general to modular
electronic circuit devices and more particularly to a
device for mounting and electrically connecting
electrical substrates to a carrier substrate.
In the past few years, the use of plug-in
units for electrical components has found favor within
the electronics industry. Such plug-in units generally
comprise a structure upon which are mounted electrical
assemblies or sub-assemblies, the structure being
arranged to be plugged in a suitable socket provided on
a base chassis. When so plugged the components carried
by the plug-in unit are electrically connected in proper
circuit relation to other electrical equipment carried
by the base chassis.
Recently however, with the coming of film
circuits, the need for a specialized carrier structure
for housing the sub-assembly has disappeaxed. This is
mainly due to the smaller size of a film circuit.
Compared to circuit fashioned in discrete components the
film circuit is appreciably smaller and lighter. It is
not uncommon to have film circuits plugged directly into
larger circuit cards or other carrier substrates and in
turn the larger substrate plugged into the base chassis
At present, most installations of film circuits to
circuit cards is done as a permanent installation.
Therefore, removal and replacement of the film circuits
though not impossible, is a tedious and labor intensive
job.
It therefor is an object of the present
invention to disclose a new structurP for mounting and
electrically connecting, electronic substrates onto
carrier substrates.

33
SUMMARY OF THE INVENTION
In accomplishing the object of the present
invention there is provided a substrate connector yuide
for mounting and electrically connecting an electrical
substrate to a carrier substrate. ~rhe electrical
substrate of the present invention .includes a first pair
of guide rails each mounted on the perimeter edge of the
electrical substrate directly opposite the other. A
second pair o~ guide rails located in a spaced
relationship from the ~irst pair of guide rails are also
mounted on the perimeter edge of the electrical
sukstrate directly opposite the other. At least one
~irst electrical connecting device is mounted
transv~rsely along a bottom surface of the electrical
substrate. The first electrical connecting device is
electrically connected to the electrical substrate.
First and second substrate guides are mounted
to the carrier substrate in a spaced and parallel
relationship to the other. Each of the first and second
substrate guides include a channel extending
longitudinally along a first side thereof, from an open
end to a top guide. The channel is further defined by a
top surface and first and second drop guides. The first
and second drop guides further define first and second
slots. At least one second electrical connecting device
is mounted and electrically connected to the carrier
substrate transversely between the first and second
substrate guides.
The electrical substrate is mounted to the
substrate guides by manually inserting the electrical
substrate into respective first and second substrate
guide channels open ends and manually pushing the
electrical substrate along the channels. The electrical
substrate and first and second pairs of guide rails ride
between respective first and second drop guides and top
surfaces. When the substrate encounters the ~irst and
second top guides each respective top guide urges the


~L2~32~83
electrical substrate downward~ The first guide rail and
the second guide rail then fall within respective first
and second slots on each of the first and second
substrate guides resting each of the first and second
electrical substrate guide rails on the carrier
substrate and aligning and registering the first
electrical ~onnecting device to the second electrical
connecting device. A final application of forward
pressure connects the first electrical connecting device
to the second electrical connecting device electrically
connecting the electrical substrate to the carrier sub-
strate.

BRIEF DESCRIPTION OF THE DRAWINGS
A better understanding of the invention may be
had from the consideration of the following detailed
description taken in conjunction with the accompanying
drawings in which:
FIGo 1 is a perspective view of a substrate
having the guide rails of the present invention
installed thereon;
FIG. 2 is a perspactive view of a substrate
guide of the present invention;
FIG. 3 is a sectional view of the electrical
substrate and carrier substrate showing the placement
and alignment of the first and second electrical
connecting devicas before final insertion.
FIG. 4 is a top plan view o~ the substrate
mounting device of the present invention mounted on a
carrier substrate including the placement of the second
electrical connecting devices.
FIG. 5 - 8 are sectional views of the
substrate mounting device of the present invention
illustrating the manner in which a substrate is
installed.

~;~8;~
DESCRIPTION OF THE PREFERRED EMBODIMENT
Turning now to Figs. 1 and 2 of the included
drawings the device in accordance with the invention
includes a planar substrate 10 having forward guide
rails 11 and rear guard rails 12 attached or molded onto
the substrate 10 along the edge of one of the substrates
10 major sides. A similar set of guide rails (not shown)
is also positioned on the opposite ma;or side of the
substrate. As can be seen each guard rail end 13 and 14
is anyled so as to aid insertion and extraction when
installed into guide 20 of Fig.2.
Guide 20 is an integrally molded unit
comprised of a slot or channel 24 extending
longitudinally along an inner side of guide 20. Channel
24 is defined between a planar top cap or surface 29 and
a forward drop guide 22 and rear drop guide 23.
Additionally, the channel 24 extends from an opening at
the forward end of the guide 20 to a top guide 27 at the
rear of the guide 20. Both the forward and rear drop
guides include ramped ends 28 to aid in the positioning
and removal of the substrate 10. Further, the top guide
27 includes an angled surface 26 which also aids in the
installation of substrate 10 and which will be explained
in detail later. Finally, guide 20 includes a g~nerally
planar bottom surface 25 for mounting the guide to a
carrier substrate.
To facilitate the electrical connection of the
electrical substrate 10 to the carrier substrate 50 a
bottom surface 18 of the electrical substrate 10
includes a plurality of connectors 15. As shown in FIG.
3 each connector 15 is mounted transversely across the
bottom surface 18 of electrical substrate 10. Each
connector 15 further includes a row of pins 16 extending
from one end of the connector to the other. The pins 16
are normally connected via conductors 17 to electrical
circuitry on the electrical substrate 10. The carrier
substrate 50 also includes an associated plurality of

~L28~ 33
connector sockets 51 each located transversely along the
carrier substrate 50. Each socket 51 includes a
plurality of pin receiving receptacles (not shown) with
each pin receiving receptacle arranged to accept an
associated electrical pin 16. The connector sockets 51
are eleckrically connected to the carrier substrate 50
via conductors 54.
Turning now to FIG. 4, a pair of guides 20 and
30 and a end cap 40 are molded as a single unik forming
the substrate mounting device of the present invention.
~uide 30 is a mirror image in structure to guide 20 and
end cap 30 extends the top guide 27 transversely across
to a similar top guide on guide 30. End cap 40 further
includes a back wall 41 and a bottom member 42 shown on
Figs. 5 - a. The sockets shown on FIG. 3 are also shown
arranged transversely on carrier substrate 50 between
guides 20 and 30.
The substrate mounting device of the present
invention is attached by any convenient means to the top
surface of the carrier substrate 50 such as a circuit
card, backplane, or other electrical substrate.
Turning now to Figs. 5 - 8 an explanation o~
the installation of the substrate 10 within the
substrate mounting device of the present invention will
be explained in detail. It should be noted that FIGS. 5
- 8 show the installation in sectional view and
therefore for reasons vf clarity only guide 20 is shown.
It will be appreciated by those skilled in the art that
an identical insertion procedure occurs simultaneously
in guide 30 as the substrate is installed.
Beginning at FIG. 5 the substrate 10 including
forward guide rail 12 and rear guard rail 11 is inserted
into channel 24 of guide 20 and pushed ~orward within
the guide. As can be seen the forward rail 12 rides
within the channel between the rear drop guide 23,
forward drop guide 22 and the top cap 29. The forward
guide rail 12 being longer than the forward slot 53,

which is defined by the forward drop guide 22 and rear
drop guide 23, rides over the forward slot 53 on
insertion. ~onnectors 16 (not shown) ~lso ride above the
connector sockets 51 due to their vertical pro~ile which
does not extend lower than the guide rails 11, 12.
As the substrate 10 is installed further into
guide 20, substrate guide rail 11 and 12 begin falling
into slots 53 and 52 respectively, as illustrated in
FIG. 6. This is aided by angled surfaces 13 of guide
rails 11 and 12 sliding down angled surfaces 28 of drop
guides 23 and 22. The slots are keyed to the connector
sockets 51 allowing connectors 15 to register in front
of a respective connector socket 51 as guide rails 11
and 12 fall into slots 53 and 52 respectively~
Angled surface 26 of top guide 27 insures that
substrate 10 follows a downward motion as it is further
pushed within the guide as shown in FIG. 7. This also
aids in providing a good horizontal force along
electrical substrate 10 during the insertion of pins 16
into the pin receiving receptacles of sockets 51.
Finally, the substrate becomes fully installed
when the forward rail 12 and rear rail 11 rest on the
carrier substrate 50 top sur*ace within respective slots
52 and 53. At this time, each connactor pin 16 is
aligned and registered with an associated pin receiving
receptacle on each connector sockets 51. A final
application o~ manual pressure mates each pin 16 with an
associated socket 51 pin receiving receptacle.
The subs~rate is easily removed by pulling the
substrate 10 out of the guide 20 in an opposite
direction to that of installation. A lifting action is
provided by angled ends 13 of substrate rails 11 and 12
riding on angled ends 28 of drop guides 23 and 22. Once
the substrate 10 and rails 11 and 12 are within channel
24 the substrate is pulled and withdrawn ~rom the guide.
Although the preferred embodiment of the
invention has b~en illustrated, and that form described

~L2~%~L~3
in detail, it will be readily apparent to those skilled
in the art that various modifications may be made
therein without departing from the spirit of the
invention or from the scope sf the appended claims.




, , .

Representative Drawing