Note: Descriptions are shown in the official language in which they were submitted.
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TITLE OF THE Ii~VE-I~TIOM
IC ~ACXAGr EXTRACTING .~ECHA~ISM ~SED I~ IC SOCK~T
BAC~GROUND OF THE INVENTION
This invention relates to an IC package extracting
mechanism used in an IC socket in which an IC package can be
easily removed from the IC socket.
There has been ~nown the so-called zero insertion socket
in whicn an IC soc~et is provided r~Jith a discontacting
mrechanism for a contact which contacts with a contacting
element or terminal of an IC package. However, in the case
tne IC package is minute and flat, it is difficult to remove
tne IC package from the IC socket even when the contact
resistance ~ecomes zero because it has fe~7 portion which can
be grasped. If a pincette or tne like is used for the
rernoval, tnere is a possibility that the contact is damayed
by mistake. Besides, adoption of a pincette or the like
badly spoils the efficiency of tAe removiny work.
As for tne above-descriDed conventional IC packaye
removin~ device, for example, a socket is provided with a
sink-and-float table for mountiny thereon an IC package held
by a spriny so that the IC package will be pushed up.
Howe~er, since a pushing-up force is normally applied to the
IC package oy the spring, the IC package tends to be floated
evën if it is pressed by a pressure cover and thus unstable.
In addition, since the pushiny-up amount is limited, a large
pusniny-up amount is difficult to obtain and ~esigning of the
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spring s-tren~th, expanding amount, or the like is difricult
to obtain.
There has been also known another IC package removin5
device in which a cover for pressing an IC package is
providea with a suction cup member so that the attachment of
the the suction cup to the upper sur~ace of the IC pac.;age
enables to open the cover and to extract the IC package.
IIo~7ever, it taices much time and labor to remove the IC
pac'cage from the suction cup. On tne contrary, if the
suction force is too small, the IC package tends to come off.
In addition, there is such an inconvenience as that the
suction cup becornes deteriorated and unaole to be firmly
attached to tne IC pac3cage.
The present invention was accomplished in orcier to
eliminate the above-described inconveniences inherent in the
conventional devices.
SU~ lARY OF THE INVENTION
It is therefore a general object of the present
invention to provide an IC ~ackage extracting mechanism used
in an IC socicet in whicn an IC package can be always easily
and surely pushed up and a suitable amount of pushing-up
work is obtaina~le to fascilitate the extraction of the IC
pac'cage without invitation of the above-described problems.
As means for achieving the above object, a substrate
forming an IC soc,~et is provided with a seesaw lever, an IC
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package is supported by a push-up lever portion which per~orms
a seesaw motion at one end of the seesaw lever, the push-up
lever portion being sprung up by rendering force for pushing
down a push-down lever portion which per~orms a seesaw motion
at the other end of the seesaw lever to push up the IC package
from a contacting position to a discontacted position
thereabove so that the IC package can be easily removed.
Accordingly there is provided a socket substrate
which has an IC package accommodating section for receiving an
IC package in an accommodating position when it is moved from
a position outside the accommodation section into the
accommodation section. Contacts are provided which contact the
terminals of an IC package when the package is in the
accommodating position. The IC package is pushable out of the
accommodating position by a lever pivotally disposed within the
socket substrate and pivotable around a pivot point
intermediate the ends of the lever. The lever has a push-up
portion and a push-down portion, which portions are movable
alternately up and down around the pivot point as a fulcrum.
The push-up portion extends into the accommodation section for
being pushed into a lowermost position by an IC package in the
accommodating position therein. Push-down means is provided on
the socket substrate which is movable from an upper position to
a lower position. When the push-down means is pushed down to
the lower position, it engages the push-down portion of the
lever down, thereby moving the push-up portion o~ the lever to
an uppermost position by the pivoting movement of the lever and
urging an IC package to a position outside the accommodation
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section. When an IC package is placed in the position outside
the accommodating position and is supported thereat by the
push-up portion of the lever, and the IC package is pushed down
into the accommodating position, the lever pivots to move the
push-down portion of the lever and the push-down means up.
When the push-down means is pushed down, the lever is pivoted
to cause the push-up portion of the lever to push the IC
package up to the position outside the accommodation section.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features and advantages
of the present invention will become apparent from the
following detailed description of a preferred embodiment of the
invention with reference to the accompanying drawings, in
which:
Fig. 1 is a plan view of an IC socket according to
one embodiment of the present invention;
Fig. 2 (A) is a sectional view taken along the line
A-A of Fig. 1 showing a pushed-up state of an IC package;
Fig. 2 (B) is a sectional view likewise taken along
the line A-A of Fig. 1 showing a pushed-down state of the IC
package;
Fig. 2 (C) is a sectional view taken along the line
B-B of Fig. 1 sXowing a pushed-up state of an IC package
accommodating framework;
Fig. 2 (D) is a sectional view likewise taken along
the line B-B of Fig. 1 showing a pushed-down state of the IC
3a
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yackage accommodating framework;
Fig. 3 is plan view of a socket subs-trate according to
one embodiment of the present invention;
Fig. 4 is a sectional view taken on tne line C-C of Fig.
3;
Fig. 5 is a sectional view taken on the line D-D of Fis.
3;
Fig. 6 is a plan view of the IC package accommodating
framework;
Fig. 7 is a side view thereof;
Fig. ~ is a sectional view taken along the line E-E of
Fig. 6;
Fig. 9 is a rear view thereof;
Fis. 1~ is an exploded perspective view of an IC package
mounting taDle and a seesaw leveri
Fig. 11 is a perspective view thereof but when the~ are
assem~led;
Fig. 12 (A) is a sectional view oE a socket showing a
pusned-up state of the IC package;
Fig. 12 (B) is a sectional view of the socket showing a
pushed-down state of the IC package;
Fig. 13 (A) is a sectional view of a socket showing a
pushed-up state oi an~IC package according to second
em~odiment of the present invention;
Fig. 13 (B~) is likewise a sectional view of the socket
128~i740
showin~ d pusned-down state of the IC pac.~age;
Fig. 14 (A) is a sectional view of a socket showing a
pushed-up state of an IC paclcage according to a third
`embodiment of the present inventioni and
Fig. 1~ (B) is likewise a sectional vie~,1 of the soc~et
snowins a pushed-down state of the IC packase.
DETAILED DESCRIPTION OF TH~ EMBODIMENT
One preferred embodiment of the present invention will
~e described hereinafter with reference to the accompan~ing
~rawings .
Figs. 1 through 12 illustrate a first embodiment, Fig.
13 illustrates à second embodiment, and Fis. 14 illustrates a
third emDodiment.
Referring first to Fiys. 1 through 12, 1 denotes a
socket substrate, 2 denotes a framework, 3 denotes a seesaw
lever, and 4 denotes an IC packa~e mounting table.
Fl~s. 3 through 5 show the structure of the soc.~et
substrate 1, Fiss. 6 through 9 show the structure of the IC
package accomlnodating framework 2, and Figs. 10 and 11 show
t;ne structures of the seesaw lever 3 and the IC package
mountin~ table 4. Figs. 1 and 2 show the assemblies of the
above-mentioned various component elements.
The socket substrate 1 is provided at -the central
.
portion thereof with a generally square-sha2ed IC pac.~age
accommoaating section la and around the entire periphery or
along the two sides of the IC package accommodatlng section
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la with a plurallty of contacts lb which are to be contacted
witn a plurallty of terminals (5a) of an IC pac~age (5).
The socKet substrate 1 is also provided with the seesaw lever
3 for seesaw movement at every corner of the IC package
accommodating section la where the rows of the contacts lb
are not formed.
The seesaw lever 3 includes an IC pac~age push-up lever
portion 3b extending inside the IC pac~age accommodating
section la along the sides forming the corner thereof, and a
push-down lever portion 3c extending outside of the IC
pac.~age accommodating section la from the corner. The
seesaw lever 3 is provided on the central portion thereof
with a projection 3a which is to be snugly engaged into an
engdging sroove lc which is formed in the corner portion of
the IC pac~age accommodating section la, so that the ~ush-up
lever portion 3b and~the push-down iever portion 3c are moved
up and down in turn balancing on the snussing portion as the
support thereof.
The corner portion of the IC pac.'~age accommodating
section la provided with the seesaw lever 3 is formed with a
,
seesaw lever guiding sroove ld directins outside of the
corner alon~ the genera~lly diagonal line thereof. The
bottom surrace of the yuiding groove ld is inclined downwards
in the external~dlrectlon from the en~aging groove lc serving
as the supp^rt, so that -tae push-down lever 3c is permitted
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to be pushed down when tile pUsn-aown lever ~c is engaged in
the gulding groove l~.
A pair of seesaw levers 3 are disposed on each corner on
one diagonal line of the IC package accommodatincJ section la.
The IC pac.cage accommodating section la is provided on its
bottom surface with a partition wall li for partitioning both
tAe seesaw levers 3 in order to prevent tne respective seesaw
levers from playing within the IC pac~age accommodating
section la.
-~ithin the IC package accommodating section la with the
sees`aw levers 3 disposed as described, the IC pac~age
inounting -table 4 of a generally sal~e shape as the IC pac~age
accommodating section la is contained, and the corner
portions of the mounting ta~le (4) are super~osed on the
upper surfaces of the lever portions 3b. By this, one
seesaw lever 3 supports on tne push-up lever portion 3o the
area along one side forming the corner of the IC package
mounting table ~, while~the other seesaw lever 3 supports the
area aion~ the otner side forming the corner of the IC
package mountinc; table 4. The seesaw motion of -the seesaw
lever 3 causes the IC package mounting table 4 to move up and
down. I~10re specificaliy, tne pUsil-Up lever portion 3b is
sprung up by~pushing ~own the push-down lever portion 3c of
tlle~seesaw lever~3~thereby to push up both ends of the IC
pac'~age mounting~table 4 and an IC pac~age 5 mounted thereon
to brinq them r the disconta~t rq po9ition (9ee ~ig- 12
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(A)), and, on the contrary, the IC package mounting table 4
is lowered by pushing down the IC package 5 thereby to turn
the push-up lever portion 3b downwards to spring U? the push-
down lever portion 3c to bring it to the contacting position
(see ~ig. 12 (B)).
In ordèr to have the IC packase mounting table perform
the vertical movement smoothly, a guiding piece 4a projecting
~sidewards from a pair of angle portions on the dia~onal line
of the IC package mounting table 4 is snugly engaged in a
yuiding groove le formed in the external direction from the
corner portions on the diagonal line of the IC package
accommoàating section la.
A plurallty of legs 4b are erected downwards from the IC
package mounting table L~ and the legs 4b are inserted along
the inner wall of a window lf formed in the central portion
of the IC pdc.~aye accommodating section la, so that when the
IC package mounting table 4 is lifted up, a hook 4c formed on
the front ends of the legs 4b are engaged with the peripheral
portion of the wall defining the window lf to regulate the
lifting amount thereof;and to prevent the same from coming
off.
The framewor.~ 2 15 provided on the soc.~et substrate 1
wnich is Eormed such as described above.
The framework 2 has an opening 2a directly a~ove the IC
package accommodating section la oE the socket substrate 1.
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The opening 2a are formed at four sides or two si~es thereof
witn a plurality of contact accommodatins grooves 2b. By
placing the framework 2 on tne socket substrate 1, the IC
2ac~age accommodating section la and the opening 2a are
`orought to positions vertically corresponding to each other,
and the contact lb are inserted in the contact accommodating
5roove 2~.
In order to form the corresponding state of the
framework 2, the guiding piece 2c is formed 'oy the side wall
of the framewor'~ 2, and the guiding piece 2c is snugly
engased in a guiding groove ly formed in tne side wall of the
soc.cet substrate 1 to set the position where the framework 2
is providec', and the vertical movernent is obtained by serving
t~is as a yuide.
~ urtAermore, a plurality of legs 2d are erected
~ownwards from the fraraework 2, the legs 2 are inserted into
a guiding hole lh formed in the socket substrate 1 for use of
a c3uide for vertical movement, and a hook 2e formed on the
front end of each leg 2d is engaged with a hole wall when
lirtin5 to set the lifting position~
Furtnermore, as means for rendering a push~down force to
the pus.~-down lever port~ion of the seesar" lever 3, a push-
down fincJer 2f are erected downwards from the fralnewor~ 2 to
bring it into ;abut cont~act witb the upper surface of the end
portion of the push-down lever portion 3c.
As is shown ln Fiy. 12 (A), when the IC packase (5) is
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loadea or removed, the framework 2 is in a pusned-down state.
As a result, the push-down finger 2f pushes and turns the
push-down lever portion 3c to spring up the pusA-up lever
portion 3b, thereby to hold the IC pac~age mounting table 4
in its lifted position.
In the above-mentioned state, the IC package 5 is
mounted on the IC package mounting table ~ thereby to render
the latter a push-do~n force. As a result, as is shown in
Fig. 12 (B), the IC package mounting table 4 turns the pusA-
up lever portion 3b of the seesaw lever 3 do.~nwards, and
springs up the pusA-down lever portion 3c by tAe reaction
t.hereof, and, at the same time, pushes up the push-down
finger 2f of tne framewor.k 2 to bring the frame-~ork 2 in the
pushed-u~ ~osition.
In the above-mentioned state, terminals 5a arranged on
each siae~of the IC package 5 are resiliently caught from
both sides thereof and contacted under pressure by tAe
contacts 1D~ That is, they are brougAt to be contacted with
each other.
When the framework 2 is pushed down from the contacting
state, the seesa~ lever 3 performs the seesaw motion as
de~cribed. ~ As a result, tAe IC pac,cage mounting table 4 and
the IC package 5 mounted thereon are pushed up again in the
lirted-position shown ln Fiy. 12 (A) to cancel the contacted
state. In tne foregoing sta-te, the IC package 5 can be
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easily removed from and mounted on the IC package mountiny
table 4.
~ eferring now to Fi5. 13, a second embodiment or the
present invention will be described. In the illustrated
ernbodiMent, there is no provision of the IC package mounting
table 4 which is used in the first embodiment, and the IC
pac~age 5 is directly supported by the push-up lever portion
3b of the seesaw lever 3. By seesaw motion of the seesaw
lever 3, tne lower contacting position shown in Fig. 13 (A)
an~ the IC pac~age ?ushed-up position shown in Fig. 13 (B)
are o~taine~.
~ eferring to Fig. 14, a third embodiment of the present
invention will be described. In the illustrated embodiment,
tnere is no provision OL the frarnework 2~,7hich is usea in the
first embodiment, and a push-down finser 2f' is vertically
operatably mounted on the soc~ket substrate 1. The front end
of the push-down finger 2f' is abutted against and pushed
down the push-down lever portion 3c of the seesaw lever 3.
T~e pushing down of the push-down portion 3c of the seesaw
lever 3 causes the IC pac!age push-up lever portion or the
seesaw lever 3 to spring up to the IC package pushed-up
po~ition snown in Fig. 14 (A). On the contrar~, the pushing
down of tne LC pdc.cage causes the push-do"n Einger 2f' to the
pusned-u~ ~osition shown in Fig. 14 (~).
In the a~ove-aescribea embodiment, the IC yackage
mountin~ table a may of course be used. Furtnermore, the
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pusii-down flnger 2f' and tne end portion of the push-do~,1n
lever portion 3c of the seesaw lever 3 are brought to be
contacted with each otner as described. In the above-
descriDed ernbodiments, the push-down finger (25) or (25') and
the seesar" lever (3) may be linked with each other by a
shaft.
As described in tAe foregoing, a socKet substrate is
provided with a seesaw lever, an IC package is supported by a
;~ush-up lever portion which performs a seesaw motion at one
enà of the seesaw lever, the push-up lever portion being
spruns up by rendering force for pushing cown a push-Zown
lever portion whicn performs a seesaw motion at the other end
or the seesaw lever to push up the IC package. ~ccorZinyly,
tne IC package is alwa~s easily and surely pusned up in
association with the seesaw motion of the seesaw lever and
pushed up to a high position by a predetermined amount,
tnereby to fascilitate the removal of the IC packase.
Furthermore, the IC package pushing up amount can be
optionally set oy setting the seesaw motion amount of the
seesaw lever. Besides, tne setting can be easily and
satisfactorlly performed. Accordingly, it is very easy to
manufac-ture.
From the foreyoing description on the preferred
e~-nbodiments of the present invention with reference to the
accompanying ~rawinys, various modification and chan~es in
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construction T.~ill easily occur to those having ordinally
~nowled~e in the art and furthermore, the present invention
may be embodie~ in su~stantially similar rnodes ThThich fulfill
substantially the same object and attain substantially the
same effec-ts as those described in connection ~ith the
preferred embodiments.
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