Note: Descriptions are shown in the official language in which they were submitted.
2l~1~'3~
TITL~ OF T~IE INVENTION
Method o~ Manu~acturing Re~ln Overlay Plate
B~CKGROUND OF TH13 INVENTION
Field of th~ Inventlon
The pre~ent invention relates ~en0rally to a method of
manufacturing a re~ln overlay plate havlng polyolefin re~in
overlaid on its ~urface, and more particularly, to a method
of manufacturing a re~in overlay plate u3ed a3 a concrete
framework.
De~cription o~ the Prlor Art
It ha3 been heretofore known that polyolefin resin
having ~uperior properties a~ a ~urface mater$al of a
concrete framework i~ overlaid Dn the 3urface of a plate for
a framework, a~ disclo~ed ln, for exa~ple, Japane~e Paten-t
Publication Nos. 22334/1983, 32109~1987, ll9B4/lg88 and
533~3/198~.
The above de~cribed Jap~ne~e Patent Publication No~.
~2334!19~3, 32109/1987 and ll9B4/198B disolo~e a method of
manufacturin~ a plate for a ~ramework by thermally welding a
polyolefin re~ln shcet to a ~ub3trate u~in~ ra31n for hot
melt adh~slve,
The above dascrib~d Japane~e Patent Publication No.
~3343/198~ di~clo~e~ a me-thod of bondln~ a pol~olefin re~in
film to plywood by sub~eoting one side thereof to corona
dl3charge machining and then, applying adh~sive thereto.
2~ 367
polyolefin resin lnhere~tly ha~ the property of not
adhering to materials other than polyolefln becau~e ~t iB
non polar. Therefor~, in order to overlay the polyolefin
resin film on a wood ba~e material, it i3 nece~ary to
sub~ect the ~ide on which the polyolefin re~in film ls
bonded to corona di3charge machining to polarlze a part o~
~urface molecul~s and apply r~lativ~ly e~cpen~lv~ adhe~iv~
~uch a~ epo~y denaturated acrylic re3in adhesive thereon as
adheslve. However, thi~ method ha~ the disadvantage in that
the adhe~lve strength between the polyolefin re~in fllm and
t he wood base material i~ not ~ t i ll ~ati 8 factory.
Furthermore, in order to ~oin the polyolefin re~ln fllm
to a wood plat~, a method of thermally welding the
polyolefln re~in film to the wood plate u~in~ re~in for hot
~elt adhe~ive ha3 been known. Thi~ methnd i~ advantageous
in term3 of the adherin~ C09t and the adhe~lve strength.
~owev2r, thl~ method ha~ the disadvantage in that lt 1~
difficul~ ~o manufacture a resin overlay plate becau~e water
in the wood plate rapidly evaporate~ by heatlng, water vapor
expand3 at the ~lme o~ relea~.~n~ hot pre~slng to form vapor
bubbles on the lower side o~ molten re~ln ~or adhesive, and
the bubbles push up the polyolefln resln ~il~ to expand the
~ur~ace o~ the polyolefin re~ ilm.
Addltionally, ln th~ oonventlonal overlay plat~ for
concrete framework, natural wood 1~ used wlthout any
3 ~ 7
modifica-tion. ~ccordingly, in many ca~es, cracking,
nibbling or the like occur~ on the surface o~ the ba3e
m~-terial. Wlth re~pect to th~ quality of th~ ~urfac~ of
fir~t-clas~ plywood for a concrete fra~ework in the Japane3e
Agricultural Standard ~JAS3, crac~ing 1.5 mm in width,
nibbling 10 mm in long diame~er or th~ like i~ reco~nlzecl.
I~ such a concave portion Yuch a~ cracking or nibbling i~
directly overlaid, the concave portlon becomes a bridge of
only the polyole~in re~ln sheet, result1ng ln lowered
phy-~ical ~tren~th.
Moreover, any one of the above de~cribed conventional
method~ is not a method o~ subJecting a polyoleSin re~in
fllm to overlay proces~ing in the 3tep of primary proce~sing
~or manu~actur~ng a wood plate such a3 plywood or a partlal~
board but a method of ~ub~tin~ a polyolefin resin fil~ to
overlay proca~sin~ a~ain a8 ~eoondary proce~ln~ on a wood
plate suoh a~; plywood o~ a particle board com~ercialized
once .
5UMMARY OF THE INV~NTION
An obJect oE the pre~ent invention 1~ to provide a
method oS manuiacturin~ a re~irl overlay plate in which
polyolefln re~in ~an be ~irmly ~i~ed to a wood plate.
Another ob~ect of the pre~e:nt inventlon i3 to prc~vide a
method o~ marlufacturing a resin overlay plate ln whlch no
bubble3 are formed betwesn a wood plate and a polyolef ln
2 ~ 6 7
re~ln layer in the proces~ o~ ~orming -the polyolefin resin
layer on the wood pla-te.
Still another object o~ the pre~ent invention i~ to
provide a method of manu~acturing a resin overlay plate high
in ~trength of a sur~ace layer.
A further ob~ect of the present lnvention i9 to provlde
a method of manufacturin~ a re~in overlay plate in whiah
polyolefin re~in can be overlaid in the ~tep of primary
proces~ing for manu~ac-turing a wood plate 3uch a~ plywood or
a particle board, thereby allowlng the manufacturing cost to
be reduced.
A fir3t method o~ ~anufacturing a re~ln overlay plate
according to the pre~ent lnvention i~ ch~racterized by
f~edlng adhe~lve polyole~in copolymerlzation re~in i~ a
molten state between a polyols~in re~in film and a non woven
~abric, af~ixln~ tha above polyolefin resin film and the
abov2 non woven ~abrlc by applying pres~ure, ~ollowed by
oooling to mQke a composite ~heet havin~ the above non woven
~abrlc bonded to one ~ide oP the above polyole~in re~in fil~
through th~ above adhesive polyolofln copoly~erization
re~in, ~uperimpo~in0 th~ ~bove composite ~heet on a wood
plat~ through adheslve with the above non woven ~abria b~ing
on the slde o~ the above wood plat~, and pres~in~ the
aompo3ite ~heet to bond the above co~po~ite 3heet to the
above wood plA~e.
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2~16367
Reactlve curing adhe~lve ~uch as wood adhe~lve commonly
emp]oyed, for example, urea re~in, mela~ine resin, phenol
resin, urethane resin, epoxy re3in, ultraviolet curing
resin, their mixtures or resln formed by co-condensation i~
u~d a~ the above de~crlbed adhe~ive. In addltion,
polyvinyl acetate emul~ion re~in, flour or thQ like may be
u~ed ~or purpo~e~ such ag increase in quantity~
The re3in overlay plate i~ ~pecifically manufactured
in, for example, the following manner.
First, a polyolefin resln fllm and a non woven fabric
are continuou~ly fed toward a pre~sure roll, re~pectively.
The above polyolefin resin fllm and thè above non wove~
~abric are affixed by applyin~ pressure u~ing the pre3~ure
roll while di~charging adhe~ive polyolefin copolymerization
re~in in a molten ~tate ln a curta~n shape between the
polyole~in re~in ~ilm and ^the non woven fabrlc u~ing ~n
extruder and a T die. Consequently, the adhe~ive polyole~ln
copolymerization resin in a molten ~tate melt~ on ~he
~urface of ^the polyolefin re~in film to be welded to the
polyolefin re~in ~ilm, whlle penetratin~ into ~ap~ between
fiber~ of the non woven ~abrlc to be firmly bonded to the
~ibQr~. Thereafter, the adhesive polyolefln
copolymerization re3in i8 3011difled by coolin~, to obtaln a
composlte ~heet.
In manufacturing the compo3ite ~heet, the temperature
of the adhe~ive polyolefin copolymerization resin, the
pre~sure loadingl the time period during whlch pre~ure i~
applied and the like are ad~usted in consideration of the
relation between the melt propertie~ of the adhe~i~e
polyolefin copolymerizatlon resin and the degree o~ the gap~
between the fibers of the non woven ~abric ~o that the
adhe~ive polyolefin copolymerization re~in 3uitably
penQtrate~ into the non woven ~abric. If the adhe~ive
polyolefin copolymerization re3in in~u~iciently penetrate~
into the non woven fabric, sufflcient anchor e f ~ ect i ~ not
obtalned, resulting in lowered adhe3ive stren~th. On the
other hand, lf it exce~sively penetrate~ into the non woven
~abric, the adhe31ve polyole~in copolymeriza-tion re~ln ~
forced out on the rever~e ~ide of the non woven flber, which
i~ a problem ln bondin~ the compo~te 3heet to a wood plate.
The compo~ite sheet is bonded to the wood plate ~uch a~
plywood, a parti~le board or a wafer board in, ~or example,
tha following manner.
~ lr~t, the reactive curinç~ adhe~ive is applied to the
3urEace o~ th~ wood plate, and ths composite sheet i9
~uperimpo~ed thareon wi th the non woven ;Eabric being on the
~lde of the wood plate. The co~po~ite ~heet 1~ hot-pres~ed
at a temper~tura not exceeding the mel-ting point of re~in
con~:ti~utlny the composite !3heet u~3inçl hot pres~3ing or i~3
pre~ed at ord1nary temperature u3in~ cold pre~ln~.
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2~1~3~l
Consequently, the adhe~lve penetrate3 into the gaps between
the flber~ of -the non woven fabric. The adhe~ive 1~ then
hardened by reaction. ~ccordingly, when the hot pre~3in0 i~
relea~e~, the adhesion of the adhesive i9 e~serted.
Co~equently, even lf water vapor 1~ emltted Pro~ the wood
plate, no bubbleR are formed ln3ide of the compo~ite ~heet,
to obtai~ a re~in overlay plate hlgh in adhe~ive strength.
The present invention i~ to firmly connect and bond the
polyole~in resin and the wood plate whlch are not inherently
bonded ea~ily in molecular ~tructure by the ~iber~ of the
non woven fabric. It is considered that the polyole~in
re~in and the wood plate are bonded in a method of heatin~
the adhe~ive poly~le~in copolymerization re~in to be bro~ht
into a ~olten ~tate and u in~ the same a~ adhesive.
~owever, if it is de~ired to overlay the polyolaf~n re~in
film on the wood plate in this method, the overlay become~
di~icult becau~ water in the wood plate evaporate~ in a
larye a~ount o~ vapor, the v~por pull~ up the adhesive
polyole~in copolymerization re~in in a molten ~-tate at the
ti~e o~ r~lea~ln~ the hot pres~ing, to form bubbles.
Acaording to the pre~ent inven-tlon, -the cnmpo~ite ~heet
¢ompri~ing the polyolefin resin and the non woven fabric i~
bonded to th~ wood plate. Accordingly, bubble~ can be
prevented ~rom being ~ormed at the time o~ releasing the
pre3~ing, ther~by allowin~ the polyole~in re~in to ~e ~irmly
2~ J ~7
bonded -to the wood pla~e. More ~peci~icall~, when -the non
woven fRbrlc and the polyolefin r~sin film are bonded u~lny
the adh~ive polyole~in copoly~erization re~in to
manufacture the compo~ite sheet, the non wove~ fabric and
the polyolefin re~in ~ilm are firmly bonded to eaah other by
the penetration of the adh~siv~ polyolefin oopolymerlzation
resin into the 0ap~ between th~ fiber~ o~ thQ no~ woven
fabric. When the composite ~hee-t is bonded to the wood
plate u~ing the reactive curing adhe~ive, the reactlon
cùring adhe~ive ea~ily penetrate~ into the gap~ between the
fibers o~ the non woven fabric, to be hardened through
re~ctivn.
In thi~ manner, the adhesive polyol~fln
copolymerization resin penetrate~ into the non woven fabr Ic
from one 31de, whlle the reactiv~ curin~ adhe~ive penatrate~
therQlnto ~ro~ the other slde. ~ccordlngly, the non woven
fabrlc per~orm~ ~uc:h a Punct ion that the~ fiber~ thereof
connect both the re~in and the adha~iv~ to each other ln a
st~te in which almo~t all the gap~ are fllled with the
adhesive polyole~ln copolymerlzatlon re~in and the reactive
curing adheslve~
Furthermore, wh~n the eompo~lte ~heet 19 bonded to tha
wood plate, wRt0r vapor 1~ emitted in~ide of the co~posite
sheet from the wood plate in the process of the hot
pre~sin~. In the pre~ent invention, however, the water
2l)~ ~3~7
vapor can be d~aerated by the non woven ~abric in the
composi-te ~heet. Mor~ ~peclfically, a few gap~ remain in
the vicinity of f.ine fiber~, although almost all -the gap~
between the flbers of the non woven fabrlc ~re lmpregnated
with the adhe~iv2 polyolefin copolvmerlzat~on resin and th~
reactive curing adhe~ive. The remaining gap become3 an
e~cape route of water vapor. Accordlngly, water vapor
remaining inside oP the compo~lte ~heet i~ ~lgnifi.cantly
decreased, thereby to avoid the occurrence of troubl~ ~uch
as expanslon and puncture of the ¢ompo~ite ~heet at the -time
o~ releaslng the hot pres~lng.
Thu~, the non woven ~abrlc has a deaeration functlonO
Accordingly, the wood plate can be eubjected to overlay
proce~in~ u~lng the composite ~heet in the proce~se~ of
manufacturing the wood plate ~uch a~ plywood, a particle
board or a wafer board.
Furthermore, even in A ca~e where there exl~t coneave
portlons such a~ crackin0 and nlbbling on the surface o~ the
wosd plate, the concave portion~ are covered with the
compo~ite ~heet integrated with the non woven fabric,
thereby to obtain a re~in overlay plate high in physical
~trength, particularly rigidity.
More ~peol~ically, accordin~ to the present lnvention,
adhe~ive commonly employed can be utilized ~or bonding th~
composite ~heet to the wood plate, and the eomposite ~heet
_ g _
20:~63~
and the wood plat0 are firmly bonded to each other at a
temperature lower than that in a hot melt method.
Furthermore, in bonding the composlte ~heet -to the wood
pla~e by heating, the non woven fabric, on the slde of which
the composite sheet i~ bonded, in the composite 3heet
becomes an e3cape route of water vapor emitted from the wood
plate, thereby causing no bubble troubles.
Furthermore, the resin overlay plate manufactured in
thi~ method ha~ polyolefin r~in on its ~urface.
Accordingly, the composition in wood which affects the
hardenin~ reaction of ready-mixed concrete ls interrupted by
resin on the sur~ace, thereby eliminatin~ the po~sibility of
harmin~ -the concrete. In addition, the re~in overlay plate
serving as a framework i9 easlly removed from the concrete
without adherin~ to the concrete aft~r hardenln~ the
conarete becau3e the polyolefin resin is non-polar, there~y
causing no hard to a molded concrete product. Furthermore,
th~ polyole~n re~in i~ chemically ~table. Accordingly, the
resln overlay plate ha~ the superior property of being able
to be repeatedly used a large number of time~ without
~han~in~ even i~ it is aub~Qcted to alkalie~, water, heat
generatlon or the like of the ready-mixed concrete for a
long ti~e.
Morsover, the fibrou3 non woven fabric l-~ formed lnside
of the polyole~in resin ~ilm. Aacordingly, the 3tr~ngth of
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~0 1 ~7
the ~ur~ace layer i3 hlgh. Even i~ -there are some
di~adv~ntages on the ~urface of the wood plate, the ~trength
can be kept relatlvely high.
Additionally, a ~cond method of ~anufacturln~ a re~in
overlay plate accordin~ to the present invention i~
characterized by sub~ecting one sid~ of a polyole~in re~in
film to oxidation proces~ing and then, a~fixin~ a non woven
fabric to the side, which i3 sub~ected to oxidation
proces~ing, of the above polyolefin resin film u~ing fir3t
adhesive to make a composite 3heet, ~uperimpo~lng the above
compo3ite ~heet on a wood plate with the abo~e non woven
fabric belng on the ~ide o~ the above wood plate, and
p~e~lng the compo~lte sheet to bond the above composite
~heet to the above wood pl~te.
A bi~lally oriented polypropylene fllm i8 u~ed, for
ex2lmple, ag the abovQ polyolefin re~in film.
Aquatic vlnyl polyur~thane adhesive, epoxy denaturated
acrylic emul~lon type adhe~ive, polye~ter polyurethan~
ela~tomeric adhe~ive or the like i~ u~ed a~ the above fir~t
adhe~lve. It i~ de~irable that the thickness to whlch the
adhe31Ve i9 applied i~ ~llghtly larg~r in con~ider~tion o~
the penetratlon to fibers of th~ non woven fabric, that i8,
3~ ~0 50 g/~2~
Reactive curlny adhe31ve 3uch a~ wood adhe31ve com~only
~mployed, for example, urea re31n, ~Qlamlne re~ln, phenol
~6~7
re~in, urethane re~ln, epoxy resin, ultrav;olet curing
resin, thelr mix-ture~ or re~in formed by co-condensation i~
used a~ the above second adheslve. If the r~in overlay
plate is us~d as a concrete framework, adhe~ive rela-tively
high in wa-ter resistance i5 used as the above reactlve
curing adhesive.
Th~ reRin o~erlay plate i~ ~peciflcally manufactured
ln, for example, the ~ollowing mannex.
Fir~t, the polyolefln resin film and the non woven
fabric are continuously fed toward a pre~sure roll,
respectively. The side on which the polyolefin resin fllm
i8 bonded 1~ previously subJeoted to oxidation proces3ing
~uch a~ corona discharge machinin~, to polarize the surface
thereo~.
Then, th~ ~irst adhe~i~e i~ applied to the side on
which the polyole~in resln film i~ bonded and ~he non woven
~bric i~ superimposed thereon, followed by heating and
pre~ing by nip roll~. Consequently, a compo~lte sheet i~
obtalned.
The compo3ite sheet i~ bonded to the wood plate such a~
plywood, a partlcle board or a wafer board in, ~or example,
the ~ollowing manner.
First, the second adhe~lve ls applied to the 3urface o~
the wood pla~e, ~nd the composlte ~heet is ~uperimposed
thereon with the non woven ~abric bein~ on the side of the
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20~3~7
wood plate and i~ pres~ed by pre~slng at ordinary
temperature. Con~equently, the reactive curing adhe~lve
peiletrates in-to gap~ betwee~ the fiber~ of the non woven
fabric.
Thereafter, the compo~ite sheet is heated and pres~ed
using ho-t pre33ing. Consequently, the adhe~i~e i8 hardened
by reaction. Accordin01y, when the hot pressing i9
released, the adhe3ion of the adhe31~e i9 exerted.
There~ore, even i~ water vapor i~ emitted from the wood
plate, no bubble~ are ~or~ed inside of the compo~ite sheet,
thereby to obtain a re~in overlay plate high in adhe~ive
~trength.
If the type o~ the reactive curing adhe~ive ls ~uitably
~eleoted, the composite ~hee-t can be al~o bonded to the wood
pl~te by only cold pre~ing. In addltion, the resin overlay
plate can be al~o continuously manufactured using the
pre~ure roll.
If ~t i~ desired to ~1r~ly bond the polyole~ln resin
directly to the wood plate, which both are not
inher~ntly bonded ea~lly in molecular ~ruc~ure, it i~
difflault to obtain ideal adhe~ion conditions becau~e there
are many factor~ limited such a~ temperature condition~,
wat~r contained ln the wood plate or the shape of the wood
plate.
Accordin~ to the present inventlon, the polyolefin
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.
20:1~367
re~in film ~nd the non-woven fabric are ~irst bonded to
manufacture a compo~ite ~heet. Since -the composite sheet on
the ~ide of the non woven fabric is bonded to the wood
plate, sufficient adhe~ive s-trength 1~ obtained eve~ u~ing
cheap wood adhesi~e. In addition, water vapor emitted from
the wood plate i~ cau~ed to escape to the exterior through
the gap~ between the fiber~ of the non woven fabrlc at the
time of adhe3ion proce~sing, thereby allowing vapor troubles
at the time o~ adhe3ion proce3sin~ -to be avoided.
Thu~, the non woven fabrlc ha~ a deaeratlon ~unction.
Accordingly, in the processes of manufacturing the wood
plate such a~ plywood, a particle board or a w~fer board,
the wood plate can be 3ub~ected to o~erlay proce~lng u~ing
the co~posite ~heet.
Furthermore, ~ven in a ca3e where there exi~t concave
portlon~ ~uch a~ cracking and nibbling on the ~urface of the
wood pl~te, the conca~e portions are oovered w~th the
compo31te ~heet lntegrated wlth the non ~oven fabrla,
thereby to obtain a resin overl ay plate hl~h in phy~lcal
~trength, particularly rigldity.
More speci~loally, ~ccording to the present invention,
in bondin~ the composite 3heet to the wood plate by heatin~,
the non woven ~abric, on the ~ide o~ which the composite
sheet 19 bonded, in the compo~ite ~heet become~ an e~cape
route o~ water vapor emitted from the wood plate, thereby
- 14 -
2~ 3~7
causlny no bubble troubles. Con~equently, in the processes
of manufacturing the wood plate, the composite sheet can be
bonded to the wood plate 3~multaneou-qly wi-th the manufactur0
of the wood plate. In addltion, the wood plate and the
compo~ite sheet can be bonded utilizing adhesive com~only
employed. I'herefors, there can be provided a low-prlced
resin overlay plate ~uperior ln quality.
Fur-thermore, 1~ the resln overlay plate manufactured ln
this method, the ~ibrous non woven fabric i5 formed inside
of the polyolefin re~in film. Accordlngly, the 3trength of
the ~urface material i~ high. ~ven if there are some
disadvantage~ on the surface o~ the wood plate, the strength
can be ~ept relatively high.
Additionally, a third method of manufacturlng a resln
overlay plate according to the present invention i~
characterized by ~eedlng polyolefin resln onto one ~lde of a
non woven fabric usin~ a laminator, affixing the polyole~in
resin and the non woven f~bric by applying pre~ure,
Pollow~d by cooling to make a compo~ite ~heet having a
polyolefin resin layer on one ~ide of the above non woven
fabric, superimpo~ing the above composite sheet on a wood
plate through adhesive with the above non woven fabric being
on the side o~ the above wood plate, and pre~ing the
composite ~heet to bond the above compo~ite ~heet to the
above wood plate.
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3 ~ 7
A non woven fabric manufac-tured by a dry method, a span
bond method, a wet method or the like 1~ used a~ the above
non woven fabric. The non woven fabric manufactured by the
wet method i~ ~lightly inf-erior in water re~istance but i~
cheap. Furthermore, in order to improve the water
resistance of the non woven fabric and~increa~e the adhe~ion
of the non woven fabrlc to the polyolefin re~in, the non
woven fabric ~ay be previou~ly impregnated with ethylene
vinyl ace-tate re3in by a method ~uch as ~cattering or
dipping.
~ polyolefin re~in, resin for applications i~ selected
from polypropylene resin, high den~ity polyethylene re3in,
low den3ity polyethylene re~in, ethylene vinyl acetate re~in
and the like. A~ the polyolefin re~in, resin havin~ hi~h
meltlng fluldity i~ pre~erable.
Reactive curing adhe3ive such a~ wood adhe~ive commonly
employed, for example, urea reRln, melamine re~in, phenol
r~in, urethana re~in, epoxy re~in, ultraviolet curin~
re~in, their mixtures or resin formed by co-condensation is
u3ed as the above de3crlbed adhe~ive. If the re~in overlay
plate 1~ u~ed a~ a concrete framework, adhe~ive relatively
hiyh in water re3i~tancs i~ u~e~ a~ the above reactiv2
curin~ adhesive.
The re~in overlay plate 19 ~3pecifically manufactured
in, ~or example, the ~ollowing manner.
.
- 16 -
~63~'~
The polyolefin re~in i~ dl~charged ln a curtain shape
from a T die onto the non woven fabric continuously fed
u~ing an e~trusion laminator commonly employed and i9
pre3~ed by a pre~sure roll. Consequently, the polyolefin
re~in pene-trate~ into the non woven fabric and i~ cooled
after hea-t therein is carried away by the roll, thereby to
obtain a compo~ite ~hee-t compri~ing the polyoleEin re3ln
layer and the non woven fabric impregnated with the
polyolefin re~in.
The polyolefin resln does not inharently have polarity.
However, if the temperature oP the polyolefin re3in
di~charged from the T die i~ Ret to be considerably hlgh,
the sur~ace of the polyolefin re~in in a curtain shape come~
into contact with air after the di~charge. Con~equently,
oxidation proaeed~. In order to make longer the tlme period
during which thls oxldation react~on proceeds, it i~
preferable to set the air gap between a re~in discharge
opening of the r dle and the surfaee of the above non woven
Pabric to be larger. More specific~lly, it i~ pref~rable to
set this alr gap to approximately 160 to 180 mm.
In ~anu~acturing the compo~ite ~heet, the ~01ectlon o~
the polyolefin re3in, the speed o~ lamin~tion, the pre~ure
lsadlng and the like are Rd~usted in consideration of the
relatlon between the melt propertie~ of the polyolefin re~in
and the degree of gap~ between f iber~ oP the non woven
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~0~636~
fabric ~o th~t -the polyolefin rein ~ultably penetrates into
the non woven fabric. If the polyolefin re~in
insufficiently pene-trate~ into the non woven fabric,
~fficlent anchor effect is not obtaine~, resulting in
lowored adh0sive ~tre~gth. On the other hand, if it
excesRively penetrate~ into the non woven ~abric, the
polyolefin re~in i~ ~orced out on the reverse ~ide of the
non woven ~abric, which i9 a problem in bonding the
compo~ite sheet to the wood plate.
The compo~lte sheet i~ bonded to the wood plate ~uch a3
plywood, a particle board or a wafer board in, for example,
the following manner.
Fir~t, the reactive curing adhe~lve 1~ applied to the
surface o~ the wood plate, and the compo~ite sheet is
superimposed thereon with the non woven fabric being on the
side o~ the wood plate and i~ pressed by pressing at
ordinary temperature. Cons2quently, the reactive curing
adhe~lvq penetrates into the gaps between the flber~ of the
non woven fabric.
Thereafter, the compo~lte ~heet i~ heated and pre~ed
u~ing hot pre~sing. Consequently, the adhe~ive i~ hardened
through reaction. Accordin~ly, when the hot pressing is
relea~ed, the adhe~ion o~ the adhe~ive is exerted.
Therefore, eve~ if water vapor i~ emitted from the wood
plate, no bubble~ are formed in~ide of the compo3ite ~heet,
" ,. , ~, ,
~o obtain ~ resin overlay plate hiyh in adhe~ive ~trength.
If the type of the reactive curing adhesive i~ ~uitably
~elected, the compo~ite ~heet can he al~o bonded to the wood
plate by only colcl pre~sing. Irl additlon, the re~in overlay
pla-te can be al~o continuou~ly manufactured u3ing the
pressure roll.
If it is deslred to ~irmly bond the polyole~ln resin
film directly to th~ wood plate, which both are not
inherently bonded easily ln molecular structure, it i9
difflcult to obtain ideal adhe~ion conditions becau~e there
are many factors limited ~uch a~ temperature c~nditlons,
water contained in the wood plate or the ~hape o~ the wood
plate.
Accordin~ to the pres~nt invention, one ~ide o~ the non
woven abric ls first coated with the polyole~in re~in, to
manufacture the compo~lte ~heet. Since the compo~ite ~heet
on the ~ide o~ the non woven fabric i9 bonded to the wood
plate, suf~icient adhe~ive strength i~ obtained even u~in~
cheap wood adhesive. In addition, water vapor emit~ed fro~
the wood pl~te i~ cau~ed to escape to the exterior ~hrough
th~ ~ap3 between the Plber3 of the non woven fabric at the
tlme o~ adhe~ion proaesslng, thereby allowlng vapor trouble~
at the tlme of adhe~lon prooos~ing to be avolded.
Thus, the non woven ~abric ha~ a deaeration ~unction.
Accordin~ the proce~ses oX manu~acturing the wood
- 19 -
2~ ~ 6~67
plate such ~ plywoo~, a particle b~ard or a wafer board,
the wood plate can be ~ub~ected to overlay proce3sing using
-th~ composite sheet
Furthermore, even ln a case where there exist concave
portion~ such a~ crack$ng and nibbling on the ~ur~ace of the
wood plate, the concave portions are covered with the
composite sheet lntegrated wlth the non woven f~bric,
thereby to obtain a re~in overlay plate high in phy~ical
~trength, particularly ri~idity.
In manufacturing the composlte ~heet, the o~idation of
the surface oP the polyolefin re~in film i~ 3peeded up to
increase acid radlcal~ by rai~ing the te~perature o~ the
polyolefln resin discharged Prom the T die and setti~g the
air gap between the di~char~e openlng of the T die ~nd the
~ur~ace of the non woven fabric to be large, rç~ultlng in
lmproved adhe~ive ~trength of the polyolefin resin ~ilm to a
~ilament oP the non woven .~abric.
Furthermor~, if the Pilament o~ the non woven f~bric i~
previou~ly coated with ethylene vinyl acetate emul~ion ln a
method such ~ ~aatterin~ and dipping, th* adhQ~lve ~trength
of the polyole~in re~in film to the filament of the non
woven fabric i~ improved becau~e there i~ compatib~lity o~
the ethylene vlnyl acetate emul~ion with the polyolefln
re~ln .
More speci~lcally, accordin~ to the prç~ent invention,
- 20 -
2~ ~36~
in bonding the composite ~heet to -the wood plate by heatlng,
the non woven fabric, on -the side of whlch the composite
~hee-t is bonded, in -the composite ~heet b~co~es an e~cape
route of wa-t~r vap~r emltted from the wood plate, thereby
causing no bubble troubles. Consequently, in the proce~ses
of manufacturing the wood plate, the compo~ite ~heet can be
bonded -to the wood plat~ ~imultaneou~ly with the manufacture
of th0 wood plate. In addition, the wood plate and the
composite sheet can be bonded utilizing adhe~lve commonly
employed.
Furthermore, in the re~in overlay plate manu~actured in
thi~ method, the fibrou~ non wo~en fabric i formed in~ide
of the polyolefin resin film. Accordingly, the strength of
the ~urface material i3 high. ~ven if ther~ are some
disadvantage~ on the sur~ace of the wood plate, the ~trength
can be kept relativ~ly high.
~ dditionally, even if no expensive adhe~lve
copolymerization resln i used in manu~acturing the
oomposite sheet, the adhesive ~trength can be ensur~d and
thc water re~ ance can be maintalned. Consequen-tly, the
co~t of the raw material i~ reduced, thereby allowing a low-
priced re~in overlay plate ~uperior in quality to be
provided .
Furthermore, a ~ourth method of manufacturing a resin
overlay plate accord~ng -to the present invention i~
- 21 -
characterized by feeding adhesive polyole~in
copolymerlzation resin and polyolefin resln onto one aide of
a non-wov~n ~abric using a two-coat extrus~on l~mina-tor,
affi~ing the re~ln3 and the non woven fabric by applying
pre~ure, followed by coolin~ to make a compo~ite Rhe~t
re~pectively having an adhe~ive polyole~in copolymerlzation
resin layer ~ormed on one ~ide of the above non woven fabric
and a polyolefin re3in layer formed thereon, superi~po~ing
the above compo~ite she~t on a ~ood plate with the above non
woven fabrlc being on the above wood plate, and pre~slng the
compo~lte ~heet to bond the above composite sheet to the
above wood plate.
Reactive curing adhesive ~uch as wood adhesive commonly
employed, for example, ure~ re~ln, melamine re~in, phenol
re~in, ureth~ne re3in, epoxy re31n, ultraviolet curln~
re~in, their mixture~, re~in formed by co-condensation i3
u~ed a~ th~ above described adhesive. If the resin overlsr
plate 1~ u~ed as a concrete framework, adhe~ive relatively
hl~h in water r~si2tanc~ i~ u3ed as the above reactive
curin~ adha~ive.
The rs3in overlay plate is speci~ically mad~ in, for
example, the following mann~r.
The adhesive polyoleEin copoly~erization resin and tAe
polyolefin re~in are di~charged in a curtain shape ~rom a T
die onto the non woven ~abric continuou31y fed using the two-
- 22 -
2~3~7
coat e~tru~ion lamina-tor, ancl are pre~ed by a pres~lre
roll. Consequently, the adhe~ive polyolefin
copolymerization resin penetrates into the non woven fabric
and ig cooled a~t~r heat thercin i~ carried away by the
roll, thereby to obtain a compo3ite ~heet respectively
having the adheRive polyolefin copolymerization resln layer
~ormed on onc side of -the non woven fabric and -the
polyolefin resin layer formed thereon.
In manufacturing the compo~ite ~heet, the sel~ction o~
the adhe3ive polyolefin copolymerization re3in~ the ~peed of
lamination, the pre3~ure loading and the like are ad~u~ted
in con~ideration of the relation between the melt propertle~
of the adhe~ive polyolefin copolymerization resin and the
degree of gap~ between fibers o~ the non woven ~abric ~o
that the polyolefin re~in ~uitably penetrate3 in-to the non
woven fabrlc. If tha adhesive polyolefin copolymerlzation
re~in in~ufflclently penetrates into the non woven fabric,
su~icient anchor effect i9 not obtained, resultlng in
lowered adhe~ive strength. On the other hand, i it
excesslvely p~netrate into the non wov~n fabric, -the
adhesive polyole~in copolymerization resin 1~ forced out on
~he reverse side of the non woven abric, which i~ a problem
in bondiny the composite ~heet to the wood plate.
Meanwhile, a compo~ite sheet respectively haviny the
adhesive polyolefin copolymerization re~in layor formed on
- 23 -
2~1~3~7
one ~ide of the non woven fabric and the polyolefin re~in
layer formed thereon may be manufactured by forming the
adhe~ive polyolefin copolymerizatlon resin and the
polyolefir, re~in into ~ilm~ and then, ~uperimpo~lrlg the
xe3in layers on the non woven ~abric, and heating and
melting the resln layers by hot presslng.
The compo~ite ~heet i~ bonded to the wood plate ~uch as
plywood, a particle bo~rd or a wafer board ln, for e~ample,
the following manne~.
Fir~t, the reactive curin~ adhesive i3 applied to the
~urface of the wood plate, and the composlte sheet i~
superlmposed thereon wlth the non woven fahric being on the
side o~ the wood plate and is pre~ed by pre~sing at
ordinary temperature. Con3equently, the reactlve curing
adhe~ive penetrate~ into the gaps between the fiber~ of the
non woven fabrlc.
Thereafter, the co~po~lte shee-t is heated and pressed
using hot pre33ing. Consequently, the adhesive 19 hardened
by reaction. Accordlngly, when the pressing 1~ released,
the adhesion of the adhe~ive is exerted. Therefore, even i~
a little water vapor remain~ inside of the compo~lte 3heet,
no bubbles are formed, thereby to obtain a re3in overlay
plate high in adhe3ive ~trength.
If the type o~ the react~ve curlng adhe~ive is ~uitably
~elected, the composite ~heet can be al50 bonded -to the wood
- 2~ -
~6~'7
plate by only cold pressing. In additlon, the resin overlay
plate can be al~o continuou~ly manufactured uRing the
pressure roll.
If it i3 d0~ired to firmely bond the polyolefln re~in
f.ilm directly to t:he wood plate, which both are not
inherently bonded easlly in ~olecular structure, lt i3
dif-~icult to obtain ideal adhesion condition~ becau3e there
are ~any factor~ limited ~uch a temperaturc condition~,
water contained in the wood plate or the shape of the wood
plate.
According to the pre~en-t invention, one ~ide of the non
woven fabric i~ coated with the adhesive polyolef1n
copolymerization re~in and the polyolefin resin, to
manufacture the compo~ite sheet. Since the composite sheet
on the ~ide of the non woven fabric is bonded to the wood
plate, sufPicient adhe3ive ~trenyth 1~ obtained even using
cheap wood adhesive. In addltlon, water vapor emltted from
the wood plate i~ caused to e~cape to the exterior through
the gaps between the fiber~ of the non woven fabrlc at the
time of adhesio~ proce~lng, thereby allowing vapor troubles
at the time of adhe~ion processlng to be avoided.
Thu~, the non woven fabrlc has a deaeratlon function.
Accordln01y, ln the proces~e~ oP manuEacturing the wood
plata ~uch as plywood, a partlcle board or a wafer board,
the wood plate can be ~ub~ected to overlay processing uslng
- 25 -
201~67
the composlte sheet.
Fur-thermore, even in a case where there exist concave
portio~s ~uch a~ crack~n~ and nibbling on the surface of the
wood plate, -the concave portions are ccvered wlth the
compo3ite -~heet integrated wi-th the non woven fabric,
thereby to obtain a re~ln overaly plate high in phy~ical
~-trength, particularly rigidity.
More ~pecifically, accordlng to the pre~ent invention,
in bonding the composite ~heet to the wood plate by heating,
the non woven fabric, on the ~ide of which the composite
ghe~-t i9 bo~ded, in the composite sheet become~ an e3cape
route of water vapor emitted from the wood plate, thereby
cau~ing no bubbl~ troubles. Con~eque~tly, in the proce~ses
o~ manufacturing the wood plate, the compo~ite sheet can be
bonded to the wood plate simultaneou~ly with the manufacture
of the wood plate. In addition, the wood plate and the
compo~ite sheet can be bonded utili~ing adhesive commonly
employed.
Additionally, in the re~in overlay plats manufactured
in this method, th~ fibrou~ non woven fabric iB formed
in3ide of the polyolef~n re~in film. ~ccordinyly, the
stren~th o~ the sur~ace material i~ high. ~ven i~ there are
~ome dlsadvantage~ on the ~ur~ace of the wood plate, the
~trength can be kep~ relatively high.
In the above de~cribed first -to fourth m0-thod~ of
- 26 -
20163~7
m~nufac-turirlg the ov~rlay plate according to -the present
invention, if the above describ~d wood plate :1~ plywood
havin~ a plurality of veneer~ laminated, the composite ~heet
may be superimposed on the outermo~t surface of ~ group of
the veneer~ laminated through thermo~etting adhesive and hot-
pre~sed in the a~sembly proces~ out of the processeR of
manufacturing the above plywood, to bond the above compo~i-te
~h~et to the above plywood simultaneou~ly with bondlng o~
the veneers to each o~her. Thermo~ettlng adhes1ve employed
for plywood can be used as the above thermosetting adhesive.
Thi~ manu~acturing method will be ~pecifically
de~crlbed. In the a~sembly proce~s out of the manufacturing
processes of the plywood, the composite sheet i9
superimposed on the out~rmo~t surface of the group of the
veneer~ laminated through the adhe~ive for plywood through
the ~ame type of adhesive ~or plywood with the non woven
fabric belng on the side of the out~rmo~t sur~ace o~ the
yroup of the veneer~ and then, 1~ heated and pre~ed using
hot preYsing in the ~ame manner as that in manu~acturing
ordinary plywood. The heatin~ temperature i8 ~et to a
te~perature not exceedlng the ~elting point o~ re~in
con~tituting the composite sheet. In thi~ method, the
composit~ ~heet is bonded to the group o~ the veneer~
simultaneou~ly with bonding of the veneer~ to each other,
thereby allowing a re~in overlay plate which can be
- 2~ -
2~1~3~
manufactured by simple processes and lowered ln cost to be
provided.
In the above de3cribed first to fourth method~ of
manufacturing the overlay plate according to the present
invention, if the above describ~d wood pl~te 19 a particle
board or a wafer board having a plurality o~ wood pieces
solidified, the composite sheet may be superimpo3ed on the
surface of a layer compri~ing a group of the wood piece~
through the thermosetting adheslve and hot-pressed in the
hardenlng and moldiny proce~ out of the processe~ of
manufacturing the above particle board or wafer board, to
bond the above compo~ite sheet to the above particle board
or wafer board simultaneou~ly wlth hardening and molding of
the partl~le board or the wa~er board.
Thi~ manufacturing method will be specifically
described. The tharmoset-ting adhe~i~e is applied ta the
surface of the compo~lte ~heet on the -~ide of the non woven
fabric, a chip or wafer is ~ormed thereon, and the composite
~heet is hot~pre~ed and ormed u~ng hot pressing at a
temperatur~ not exceeding the melting point of re~in
con~tituting the compo~ite sheet. In this method, ~he
compo~ite eheet is bonded to a group of veneer~
~lmultaneously wlth hardening and molding of the particle
board or the wafer board, thereby allowing a re~in ov~rlay
plate which can be manu~actured by ~imple proces~e~ and
- 2~ -
3 ~ 7
lowered .in co~t to be provided.
The foregoing and other ob~ect3, features, aspect3 and
advantages of the pre~ent invention wlll become more
apparent from the following detailed deqcription of the
pre.eent invention when taken in conJunction with the
accompanylng drawings.
~RIE.F DESCRIPTXON OF TEI~ DRAWING5
Fig. 1 i3 a d~agram of the ~chematic constructlon
3howing a method of manufacturlng a composite ~heet;
Fig. 2 i~ a cro~ 3ectional view 3howing a re~in
overlay plate manufactured u~in~ the compo~ite sheet made in
the me-tbod ~hown in Fiy. l;
Fig. 3 i~ a cros~ ~ectional view ~howlng another re~in
overlay plate manu~actured u~ing the compo~ite ~heet made in
th~ method Qhown in F~y. l;
Fig. 4 i~ a diagram o~ th~ 3chematic con~truction
showing another method of manufacturing a compo~ite ~heet
Fi~. 5 i3 a cro~s 3ectional view showing a re3in
overlay plate m~nu~actured u~ing the compo~ite sheet made in
the me~hod shown in Fl~. 4;
Fig. 6 i3 a cro~s sectional view showing another re~in
overlay plate manufactured u~ing the composite sheet made in
the method ~hown in Fig. 4;
~ ig. 7 i~ a diagram o~ the schematic con3truction
~howing still another method o~ manufacturing a compo~ite
- 29 -
2l~367
sheet;
Fig. a is a cros~ sectional view showin~ a re~in
overlay plate manufactured u3ing the co~po3i te ~heet made in
the method shown in Flg. 7; and
Fig. ~ is a cros~ ~ectional vlew showlng another re3in
overlay plate manuPactured using the compo~ite sheet macle in
the me-thod 3hown in Fig. ~.
DESCRIPTION OF THE PREF~RRED EMBODIM~NTS
(Bmbodiment 1)
Referring now to Fig. 1, description 1~ made of a
method of manuPacturlng a composite ~heet.
A fllm 40 ~m thick oP SHOLEX 2010HF made of SHOWA D~N~O
KABUSHIKI KAISHA is used a~ a polyolefin re3in film 1.
~LT~S N-5040 made oP ~SAHI C~MICA1 INDUSTRY CO., LTD. i3
used a3 a non woven fabric 2. ~R RFSIN ~R523L made of S~IOWA
D~NRO KABUSHIKI RAISHA is used as an adhe~ive polyolefin
copoly~erization re~in 3. The te~peraturQ and the thickneQs
of the copolymerization resin 3 dl~charged Prom an extruder
4 wlth a T dle are respectiv~ly ~et to 240C and 20 ~m.
The copolymerization re~in 3 ~ dischargad onto the
film 1 while respeotlvely delivering the polyolePln res~n
Pilm 1 and the non woven fabric 2 at a 3peed of 15 m per
~inute. The polyolePln resin Pllm 1 and the non woven
fabrio 2 are aP~ixed by applying pressure betweQn a pre3~ure
roll 5 and a coolln~ roll 6 while interpo3in~ thi~
- 30 -
3 6 ~
copolymerizatlon re~ln 3 between the film 1 and the non
woven fabric 2. Con~equently, the copolymerizatio~ ré~in 3
in a mol-ten state is welded to the film 1 and cooled whlle
penetrating in-to gap~ between fibers o~ the non woven fabric
2, and i~ further cooled by cooling roll~ 7, thereby to make
a composite aheet 8 havin~ the polyolefin re~in film 1 and
the non v~oven ~abric 2 firmly integrated w~th each other.
The composite ~heet 8 is wounded by a wind-up roll 9.
Descrlption i~ now made of a method of manu~acturlng a
re~in overlay plate u~ed for a concrete framework using the
compo~ite she2t 8 thu~ made.
Five-ply plywood for a framework 12 mm thick
commercially available i-~ used as a wood plate 10. A
mlxture of 20 % flour wlth melamlne urea resln adhesive UM-
82 made o~ AICA KOGYO CO., LTD. is used a~ adhe~ive 11.
The adhesive ll i9 applied to the upper ~urface of the
plywood lO at a rate of 200 g/m2, ~nd the compo~lte sheet 8
i~ mount~d on the plywood lO with the non woven ~abric 2 in
the composlte ~heet 8 being on the side of the plywood lO.
The composlte ~heet 8 is cold-pressed ~or twenty minutes and
then, hot-pressed ~or ~ive minute~ under conditlons, that
i~, at a temp~rature o~ 105C and at a pre3sure o~ ~ kg/c~2.
Ag a result, a resin overlay plate having the compo~ite
sheet ~ and the plywood 10 fir~ly bonded to each o~her i~
obtained. In additlon, no bubbles ars ~ormed at the time of
- 31 -
2~36'7
relea~in~ the hot pres~ing.
(Embodlment 2~
Adhe~lve ohtained by m1xing 20 ~ flour with phenol
resin adhe~ive P-82 made o~ ~ICA KOGYo CO., LTD. i~ applled
to -the upper surface of wafer wood made of LOUISIANA-PACIFIC
CORPORATION at a rate of 250 ~/m . A composite sheet
obtained in the ~ame manner as that i~l the embodiment 1 i9
mounted on the wafer wood with the non woven fabric therein
being on the ~ide of the wafer w~od. Th~ co~posite sheet is
cold-pres~ed for twenty minutes and then, hot-pre~ed for
~even minutes under conditions, that i9, at a temperature ~f
110C and at a pre33ure of 5 ~g/cm2. A~ a re~ult, a re-~in
overlay wood plate for a ~oncrete framework havin~ the
compo~ite ~heet ~ a~d tbe wafer wood 10 firmly bonded to
e~ch other and haYing a ~mooth and tou~h ~ur~ace i~
obtained. I~ addltion, no bubbles are ~ormed at the time of
releasing the hot pre~in~.
~mbodlment 3)
Adhe~iva obtained by mixing 10 % flour with urea re~in
adhasive UC-120 mad~ o~ AIC~ KOGYO CO., LTD. is applied to
both ~urface~ of nlne 50uth-Sea lauan veneers 1.3 mm thick.
The veneers are superlmpo~ed on a curve woode~ pattern o~
R6gO such that their respec~ive fiber~ cros~ at right
angles. In addition, composite ~heet~ ~ obtained in the
~a~e manner a~ that in the embodi~ent 1 are superimpo3ed on
-- 32 --
3 ~ 7
both outer e,urface3 of a group 10 of the veneer~ throuyh the
same adhesive 11 with non woven .fabric~ 2 therein being on
the side of -the group 10 of the veneer~. The compo~lte
~heets 8 are bo~ded to the curve wooden patter~ by applying
pre3Yure with electrode pla-tes for high-frequen~y heating
applied to their outer sur~ace3, heated at high frequencies
while being pre3sed to at a pre~ure of approximately 5
kg/cm , and hot-pres~ed for twenty mi~utes with the interior
temperature being approximately BO to lOO~C.
~ s a re~ult, the adhe.Rive 11 i5 completely hardened, to
obtain re~in overlay plywood of R600 approximataly 12 mm
thlck who~e both surPaces are overlaid with polyol~fin re~in
sheet~ 1, as shown in Fiy. 3.
(E.mbodiment 4)
Re~in overlay plywood .t3 manufactured in the same
manner as that in -the embodiment 1 exc~pt that E.LTAS E-5340
made oP ASAHI CHE.MICAL INDUSTRY CO., LTD. ls usF~d a~ a non
woven fabric. A3 a result, re3in o~rlay plywood h~ving
~uperior properties a~ a plate for a concrate ~ramework is
obtained.
~E.mbodiment 5)
A compo~ite 3heet i9 manufactured in the same manner a~
that in the embodiment I e~cept that a ~ilm 30 ~m thick of
SHO-A~LO~R F~201 made of SHOWA DENKO KABUSHIKI K~ISH~ i~
u3ed as a polyolefin r~in ~ilm, B~.MLI~.SE'. JF-601 made o~
~ 33
2~:16367
f~Sl~llI CHEMIC~L INDU5TRY CO., I.TO. is u~ed as a non woven
fabrlc, E~ R5SIN ER 321P made of SHOWA D~NKO KABUSHIKI
~AI~HA i3 u~ed as adhe~ive polyolefin copolymerization
re3in, and the temperature and the thickness of
copolymeriza~ion resin di~charged from an ex-truder with a T
die are respectively set to 2flOC and 30 ~m.
Adhe~ive obtalned by mixlng 15 % flour with phenol
melamine re~in adhesive P~85 made of AIC~ KOGYO CO., LTD. is
applied to the ~ur~ace o~ this compo~ite sheet on the ~ide
of the non woven fabric at a rate of laO g~m2.
Furthermore, a chlp covered wlth adhesive i5 mounted on
the ~urface coated with the same adhe~ive o~ the compo~i~e
sheet by formin~ for each particle ~i~e, and the co~po~it~
sheet i9 hot-pres~ed for fifteen minute~ under condition~,
that is, at a temperature of 146C and at a pre~sure of 15
kg/cm2. A~ a re~ult, a re~in overlay particle board 12 mm
thick havlng superior propertie~ as a plate for a concre-te
framework i~ obtained.
~mbodlment 6)
A resin overlay wafer board i~ manufactured in the same
manner as that in the above desaribed embodlment 5 except
that a wafer 1~ used in place of the chlp. A9 a re~ult, a
resln overlay wafer board having superior propertie~ a3 a
plate for a concrete fr~mework i~ obtained.
(~mbodiment ~
- 34 -
201636r~)
~ dheslve obtained by mixing 20 ~ flour with melamine
urea re~in adhesive UM-82 made o~ AICA KOGYO CO., LTD. 13
applied to both ~ur~aces of five South-Se~ lauan veneer~ 2.4
mm thick at a rate of 200 g/m2. The veneers are overlapped
with each other ~uch that their re~pectlve fiber~ cros~ at
right angle~, the ~ame adhesive 1~ further applied to the
outer ~urface~ of a group oi th~ veneer~ at the same rate
and then, composlte she~ts manu~ac-tured ln the ~ame manner
as that in the embodiment 5 are superlmposed thereon with
non woven fabric~ therein being on the ~ide of the group of
the veneer~. The composlte ~he~ts are hot-pressed ~or four
minutes under condition~, that 1~, at a temperature of 120C
and at a pre~ure o~ 15kg~cm2.
A~ a re~ult, resin overlay plywood having ~uperior
properties as a plate for a ooncret~ framework i3 obtained.
In addition, no bubble trouble~ due to wa-ter vapor occur at
the time of releasing the hot pre~ing.
(~mbodiment 8)
Referring now to Fi5l. 4, description i~ made o~ a
method of manufacturing a compo~ite sheet.
A film 30 ~m thlck obtalned by sub~ecting one ~ide of a
biaxially oriented an.d reln~oraed polypropylene film
commercially available to oxidation proce~inS~ by corona
dl~charge machlning i~ used a~ a polyolefin re~in film 1.
Polye~ter polyurethane adheslve fcr dry lamlnate made of
~ 35 -
~IC~ KOGYO CO., LTD. is used as adhesive 23. B~MLIES~ JF-
601 made of ~SAHI CHEMICAL INDUSTRY CO., LT~. 60 g/m thick
is used as a non woven fabrlc 2.
The polyolefln re~in film 1 1~ dellver~d with the
~urface sub;~ected to oxidation proce~lng being on the lower
~ide, and the adhesive 23 i3 applied -to the ~urface
~ub~ected to o~ldation processlng of the polyolefin re~ln
film 1 between a gravure roll 12 and a rubb~r roll 13. The
adhe~lve 23 19 made to adhere to the ~urface of the gravure
roll 12 a~ the gravure roll 12 i~ rota-ted, an e~ce~s of -the
adhesive ls ~craped away by a doctor blade 14 and then, the
adhes~ve 23 1~ made to adhere to the polyolefln re~in fllm
1, thereby to apply the adhesive 23 on the polyolefin resln
film 1 at a rate of 50 g/m .
The polyolefin re~in film 1 coated with the adhe3ive 23
i~ heated and half-dried by a radiant dryer 15 and then, i~
superlmpo~ed on the non woven fabric 2. The polyolefin
re~in fllm 1 and the non woven fabric 2 are affixed by
applying pre~sure between a rubber roll 5 and a prq~3ure
roll 6, to be a composi-te sheet 28. The compo~ite ~heet 28
1~ wound by a wind-up roll 9.
Referring now to Fi~. 5, de~cription is made of a
method of manufacturing a resin overlay plate used for a
concre-te framework u~lng the composite 3heet 28 thu~ made.
Five-ply plywood for a framework 12 mm thlck
- 36 -
3 ~ '7
commercially available is used as a wood plate 10. Adhesive
obtalned by mi~cing 10 % f lour wi th melamine urea resln
adh~ive ~M-~2 made of ~IC~ KOGYO Co., LTD. is used as
adhe 9 i ve 11.
The adhe~lve 11 i~ applied to the upper surface of the
plywood 10 at a rate o~ 200 g/m2, and the compo~ite sheet 28
is mounted on the plywood 10 with a non woven fabric 2 i.n
the compo~ite sheet 28 being on the side of the plywood 10.
The composite sheet 28 i~ cold-pressed for twenty minutes
and then, hot-pressed for five minutes under conditions,
that i~, at a temperature of 105C and at a pressure of 5
kg~cm . A~ a re~ult, resin overlay plywood having the
composite ~heet 28 and the plywood 10 firmly bonded to each
other i~ obtained. In addition, no bubble~ are formed at
the t ime o~ relea~in~ the hot pre~ing .
~Bmbodlment 9)
Adhe~ive obtained by mixing 20 % ~lour with phenol
re~ln adhe31ve P-~2~ made of ~ICA KOGYO CO., L~D. is appl.ied
to the upper surface o wafer wood 17.2 mm thlck made of
LOUISI~NA-P~CIFIC CORPORATIOn at a rate of 250 g/m . A
composite sheet obtained ln the s~me manner a3 that in the
embodiment ~ i3 mounted on the wafer wood with a non wov~n
fabric thereln being on the ~ide o~ the wafer wood.
The compo~ite sheet i~ cold-Fressed or twenty minute~
and then, hot-pre~ed for ~even minute~ under conditions,
- 37 -
2~163~7
that is, a;t a -temperature of llOnC and a-t a pressure of 5
kg/cm2. As a re~ult, a resin overlay wood plate having the
composite sheet and the wafer wood firmly bonded to each
other and having a 3mooth and tough surface ls obta~ned. In
addition, no bubble~ are formed at the tlme of relea~ing the
pres~lng.
(~mbodiment 10)
~ dhesive obtained by mlxing 20 % flour with melamine
urea re~in adhe~ive ~M-82 made of AICA KOGYO CO., LT~. i3
applied to nine South-Sea lauan veneers 1.3 mm thick at a
rate of 200 g~m . The veneers are superimposed on a curve
wooden pattern of R600 ~uch that their respective fiber~
C~09~ at right angle$, and compo~ite shee-ts 28 obtained in
the ~me ~anner as that in the embodiment 8 are ~uperimpo~ed
on both outer ~urfaces of a group 10 of the veneers throu~h
the same adhe~ive 11 with non woven abric3 2 therein being
on the side of the veneers. The compo~ite ~heet~ 28 are
bonded to the curve wooden pattern by applying pre~3ure with
electrode plates for hlgh-frequency heating applied to thelr
outer ~urfaces, heated at hi~h ~requencie3 whlle beiny
pre~ed to a pressure o~ approximately 5 kg/cm~. and hot-
pre~sed for twenty mlnutes with the interior temperature
bein~ approximately 80 to 100C.
A~ a result, the adhesive 11 is completely hardened, to
obtain re3in overlay plywood of R600 approximatel~ 12 mm
~ 3~ -
~0~63~
thick who3e both surface~ are overlaid with polyolefi~ re~in
sheets 1, as shown in Fig. 6.
~Embodlment 11)
~ e~lr~ overlay plywood i~ manufactured in the ~ame
manner a~ that in -the embodlment ~ except that a non woven
~abrlc B05-20 made of MIKI TOKUSHU P~PER MFG. CO., LTD. 20
y/m -thick i~ used as a non woven fabric. A9 a re~ult,
re~in overlay plywood having superior properties a~ a plate
~or a concrete framework i~ obtained.
(Embodiment 12)
Adhesive obtained by mixing 20 % flour wlth phenol
melamine resin adhe~ive P-85 made of AICA KOGYO CO., LTD. i~
applied to the ~urface of a composlte sheet manufactured in
the same manner as -that in the embodiment ~ on th* side o~ a
non woven fabric at a rate of 200 g/m2.
Furthermore, a chlp covered with adhesive l~ mounted on
th~ surface coated with the same adhqsive of the composite
~heet.by forming for each partiole size, and the compo~ite
she~t is hot-pre~sed for fifteen minutes under conditlon~,
that is, at a tempera-ture o~ 1~5C and at a pres~ure of 15
kg~cm . As a re~ult, a resin overlay partlcle board 15 mm
thick having ~uperior propertie3 a~ a plate for a concrete
framewor~ is obtained.
(E,mbodiment 13)
A re~in overlay wafer board i~ manufactured ln the same
- 3~ -
2 ~ 3 ~ P~
manner a~ that in the above described embodlment 12 ~cept
that a wafer is u~ed in place of the chip. A~ a result, a
re3in overlay wa~er board 15 mm thick havlng superior
properties a~ a plate for a concrete framework ls obtained.
~Bmbodiment 14)
Adhe~lve obtained by mixincg 10 % flour with melamine
urea re~in adhe~lve UM-a2 made of AICA KOGYO CO., LTD. i3
applied to both ~urfaces of ~ive South-Sea lauan veneers 2.4
mm thick at a rate of 200 g/m . The veneers are overlapped
with each other ~uch that the~r re~pectiv~ fiber~ cro~s at
rlght angle~, the ~ame adhe~ive is further applied to the
outer surface of a group o~ the veneer~ and then, compo~lt~
~heet~ manufactured in the ~ame manner as that in the
embodiment 8 are ~uperimpo~ed thereon with non woven fabric3
2 ther~in being on the 31de ~f the veneers. The compo3ite
sheet~ ar~ hot-press2d ~or ~our minutes under condition~,
that is, ~t a temperature of 120C and at a pre3~ure of 15
kg/cm .
As a re~ult, resin overlay plywood having superlor
propertie~ as a plate for a concrete framework i~ obtained.
In additlon, no bubble troubles due to water vapor occur at
the time of relea~ing the pres~ing.
(~mbodlment 153
Re~erring now to Fig. ~, descrlption is made of a
method of manufacturing a compusite sheet.
- 40 -
, . .
2~63~7
l~igh den~ity polyet}lylene LZ0139 made of S~IOWA D~NKO
~ABUSE~IKI K~ISHA is used as polyolefin re~in 31. ~LTAS N-
5040 made of A5~I CHEMICAL INDUSTRY CO., LTD. is used as a
non woven fabric 2.
The polyole~in re~in 31 i~ di~char~ed in a curtain
~hape onto the non woven ~abric 2 through an e~-truder 4 with
a T dle at a temperature of 310C and with a thickne~s o~ 50
~m wlllle delivering the non woven fabric 2 at a ~peed of 50
m per minute. The polyolefin re31n 31 and the non woven
fabric 2 are pre3sed between a pressure roll 5 and a
cooling/pressure roll 6. Consequently, the polyolefin resin
31 in a molten ~tate is cooled and solidified whlle
penetrating lnto gaps between fiber~ of the non woven fabrlc
2, and i9 $urther cooled by cooling rolls 7, thereby to make
a composite sheet 3B having the sheet-~haped polyolefin
re~ln 31 and the non woven fabric 2 firmly lntegrated with
e~ch other. The compo~ite ~heet 38 i5 wound by a wind-up
roll 9.
Re~erring now to F1~. 8, de~cription i~ made o~ a
method o~ ma~u~acturing a xe~ln overlay plate u~ed ~or a
concrete ~ramework using the composite ~heet 3~ thu~ made.
Five-ply plywood 12 mm -thick commerc~ially available i3
used as a wood plate 10. Adhesive obtained by mixing 10 %
~lour wlth melam~ne urea re~in adhesive UM-~2 made o~ AICA
~0~0 C0., LTD. ia u~ed a~ reactive curlng adhe~ive 11.
- 41 -
3 ~ ~1
The ~he3ive 11 i~ applied to -the upper ~urface of the
plywood 10 at a rate of 200 g/m2, and the composite sheet 38
is mounted on the plywood 10 with the non woven fabric 2 in
the compo~ite ~heet 3a being on the side of the plywood 10.
The composite ~h~e~ 3a i~ ~old-pre~sed ~or twen-ty minute~
and then, bot-pressed for flve mlnutes under condition~,
that is, at a temperature o~ 105nC and a-t a pre~aure of 5
kg/cm2. A~ a reault, re~ln overlay plywood having -the
compoaite sheet 38 and the plywood 10 firmly bonded to each
other ls obtalned. In addltion, no bubbles are formed at
the time of releasing the hot pressing.
~Rmbodiment 16)
Adhe~lve obtained by mlxing 20 % flour wlth phenol
re~in adhesive P-~H ~ade of AIC~ KOBYO CO., LTD. ls applied
to the upper ~urEace of wafer wood 17.2 mm thick made of
LOUISIANA-PACIFIC CORPORATION at a rate of 250 g~m2.
composite ~heet obtalned in th~ same manner as that in the
e~bodiment 15 i~ mounted on the wafer wood with a non woven
fabric therein being on the 31de of the wafer wood. The
compo~lte ~heet i9 cold-pre~3ed ~or twenty minute~ and then,
hot-pre33ed ~or seven minutes under conditions, that i~, at
a temperature of 110C and at a pre~3ure of 5 kg/cm2. A~ a
re3ult, a resin ~verlay wood plate having the compo3ite
3heet and the wafer wood flrml~ bonded to each other and
h~ving a smooth and tou~h ~ur~ace i~ obtained. In addition,
- 42 -
~0~636'7
no bubbles are formed at the time of relQasing the pre~siny.
(Embodlment 1'~)
Adheslve obtalned by mixing 20 % flour with melamine
urea re~i~ adhe~ive VM-82 made o~ AIC~ KOGYO CO., LTD. 1~
applied to both ~urfaces of nine South-Sea lauan ~eneer~ 1.3
mm thlck at a rate of 200 g/mZ. The veneers are
~uperimposed on a ourved wooden pattern o~ R600 with their
r~peotive ~iber~ cro~s at right angle~, and compo~lte
~heets 3n ob-talned in the same manner as that in the
embodiment 15 are further ~uperimpo~ed on both outer
surfaoe~ o~ a ~roup 10 of ~he veneer~ through the ~ame
adhe~ive~ 11 with non woven fabrio~ 2 therein being on ~he
~ide of the group of the veneer~.
The compo~ite ~heets 38 are bonded to the curve wooden
pattern by applying pres~urs with electrode plate~ ~or high-
fre~uency heating applled to their outer surface~, heated at
high fre~ue~cie~ while being pre~sed to a pres~ure of
approximately 5 ~g/cm2, and hot-pres~ed for twenty minutes
with the interior temperature being approximately 80 to
lOUC.
A~ a re~ult, the adhes.ive 11 1~ oomple-tely har~ened, to
obtain resin overlay plywood o~ R~OO approxlmately 12 mm
thick whose both ~urface~ are overlald wlth polyolefin re~in
3 1, as ~howrl in Fig . ~ .
~mbodlmen-t 18)
- 43 -
2~367
Re~in overlay plywood i~ man~factured in the same
manner a~ that in the embodiment 15 except that ~EMLIES~ JF-
404 mad~ of I~SI~HI CHEMICAL INDUSTRY CO., LTD. 40 g/m thick
i~ used as a non woven fabric. A~ a re~ult, re~.tn overlay
plywood having ~uperior propertie~ a~ a plate for a concrete
~ramework i~ obtained.
~mbodiment 19)
Wet non woven fabric 805-20 made of MIKI TOKVSHU PAPER
MFG. CO., LTD. 20 g/m thick i~ u~ed as a non woven fabric
2. Polypropylene LR510 made o~ SHOWA DENRO RABUSHIKI ~AISHA
ig u~ed as polyolefin resin 31.
~ shown in Fig. ~, the polyol~fin resin 31 i9
discharged in a curtain ~hape onto the non woven fabric 2
through an extruder 4 with a T die at a temperature of 300nc
and with a thickne~ o~ 70 ~m whlle dellvering the non woven
~abric 2 at a ~peed of 50 m per minute. The polyolePln
re~in 31 and the non woven fabriQ 2 are pre3sed between a
pre~ure roll 5 and a cooling/pressure roll 6.
Con~equently, the polyolefln resin 31 in a molten ~tate i~
cooled and ~olldified while penetrating into gap~ between
fiber~ o~ the non woven fabrlo 2, and is ~urther cooled by
cooling roll~ ~, thereby to make a composite ~heet 3~ having
the ~heet-~haped polyolefin resin 31 and the non woven
fabrlc 2 ~irmly integratQd with eaoh other. The compo~lte
sheet 38 1~ wounded by a wind-up roll g.
- 44 -
3 ~ 7
Adheslve obtalned by mi~ing 20 % flour wlth phenol
melamine resin adhesive P-85 made of AICA ~OGYO CO., LTD. ls
applied to th~ s~r-face of -th~ compo~i te ~heet thus made on
the side of th~ non woven fabrlc at a rate of 200 g/m2.
Furthermore, a chip covered with adhe~lve i~ mo~nted on
th~ surface coated with the same adhesive of the composite
~heet by for~in0 for each partlcle ~ize, and the composite
sheet is hot-pre~sed for ~ifteen minutes under condition~,
that i9, at a temperature of 145C and at a pressure of 15
kg/cm . A~ a result, an under-floor particle board, whose
~urface l~ not per~eable to water, covered with the
composite sheet i5 obtained. In addition, no bubble~ are
formed at -the time oP rel~a~ing the pres~ing.
(~mbodl~ent 20)
A r~in overlay wafer board i3 ~anufactured in the same
manner as that ln the above described embodiment 19 except
that a wafer i~ u3ed in place of the chip. As a result, a
re~in overlay wafer bo~rd 15 mm thick having superior
properties as a plate for a concrete Pramework 19 obtained.
(~mbodiment 21)
A re~in overlay wafer board is manu~actured in the Rame
manner a~ that in the ~mbodl~ent 20 except that a non woven
fabric obtalned by spraying a 20-fold dilute 901ution of
ethylene vinyl acetate resin e~ulsion ~F200 made of S~OWA
HIGHPOLYM~R CO., LTD. on a wet non woven fabrlc 805-20 made
- 4~ -
20~367
of MIKI TOKUS~U PAPER MF~. CO., LTD. 2u g/m thick at a rate
of 20 g/m2 and then, drying the same l~ used a~ a non woven
fabric. A~ a re~ult, a resln overlay wafer board having
water resistance further strengthened i~. obtained.
(Embodiment Z2)
~ dhesive obtained by m1~1n~ 10 ~ flour with melamine
urea resin adhesive UM-82 made of AICA KOGYO CO., LTD. is
applied to both surfa~e~ o~ five South-Sea lauan veneers 2.4
mm thick at a rate of 200 g/m2, the veneer~ are overlapped
with each other such that their re3pective fiber~ cro~s at
ri~ht angle~, the same adhesi~e is further applied to the
outer ~urface3 of a group o~ the veneers at the same rate
and then, composite ~heets manufactured ln the ~ame manner
a~ that in the embodiment 19 are superlmpo~ed ther~o~ wlth
non woven ~abrics therein being on the side o~ the group of
the veneer~. The compo~ite ~heet~ are bot-pressed for fou~
minute~ under conditions, that iB, at a temperature of 120~C
and at a pre~sure of 15 kg/cm .
As a re~ult, resin overlay plywood having ~uperior
propertie~ a~ a plate for a concrete framework i~ obtainQd.
In addition, no bubble trouble~ due to water vapor occur at
the time of relea~ing the pre~sing.
(~mbodiment ~3~
two-coat extrusion type extruder i~ u~ed ln place of
- 46 ~
-- :
2~163~
-the extru~er ~hown in Fig. 'I, to di~charge adhe~ive
polyolefil1 copolymerization re~in and polyolefin resin onto
a non wo~en fabric by th:1~ extruder.
SHOI.E~ I,ZOl3s made of SHO~A DENKO K~BUS}~IKI KAISHA i~
used a3 the polyolefln resin. ~ R~SIN ~R 420H made of
S~lOWA D~NKO ~ABUSHIKI K~ISli~ i~ used a~ the ~dhe~ive
polyolefin copolymerlzation re~in. B~MLIE.S~ WP252 made of
AS~II CHEMIC~L INDUSTRY CO., LTD. is u~ed as the non woven
fabric.
The adhesive polyolefin copolymerization resin 30 ~m
thick and the polyolefin re~in ~0 ~m thic~ are di~charyed in
a curtain ~hape onto the non woven fabric through the two-
coat extrusion type extruder with the total thickne~ of lO0
~m and at a temperature of 290~C with the adhesive
polyolefin copolymerizatlon resln being on the ~ide of the
non woven fabric while dellvering the non woven fabrlc at a
3peed of 50 m per minute, and are pre~sed between a pressure
roll and a cooling/pre~ure roll. Con~equently, the adhe~ive
polyole~in copolymerization resin in a molten state 19
cooled and qolldified while penetratiny into yap~ between
fibers of the non woven ~abric, and i3 ~urther cooled by
cooling roll~, thereby to make a compo~lte ~heet h~lng the
~heet-~haped polyolefin resin and the non woven fabric
firmly integrated with each other through the adhesive
polyole~in copolymerlzation resin. The compo~ite sheet i~
~L6367
wount-l by a wlnd-up roll.
De3cription is now made of a method of ~anufacturing ~
resin overlay plate u~ed for a concrete framework using the
composi te s~leet thu~ made .
Adhesive obtained by mixing 10 % ~lour with melamine
urea resin aclhe~ive UM-82 made of AICA ROGYO CO., LTD. at a
rate of ~00 g/m2 is appli0d to both ~urface~ of five South-
Sea lauan veneer~ 2.4 mm thick at a rate of Z00 g/m2. The
veneer~ are overlapped with each other ~uch that -their
re~pective fibers cross at right angle~, the ~ame adhesive
is further applied to the ou-ter surfaces of a group of the
veneers at the 3ame rate and th~n, the composite ~hee-ts made
in the foregoing manner are superimposed thereon with the
non woven fabric~ therein being on the side of the veneers.
The composite ~heet3 are hot-pre~ed for four minute3 under
conditions, that i~, at a temperature of 110C and a-t a
pre~ure of 1~ kg/cm~.
~ s a re~ult, re3in overlay plywood having superior
properties as a plate for a concrete ~ramework i~ obtained.
No troubles due to water vapor occur at the time of
relea~in~ the pressin~.
Althou~h the pre3ent ~nvention ha~ been de~cribed and
lllustrated in detail, it i9 clearly under~tood that the
~ame i9 by way of illustratlon and example only and iB not
to be taken by way of limitation, the spirit and scope o~
- ~8 -
-the present inven-tion belng limited only by the -term~ of the
appended claim~.
_ ~9 _
