Language selection

Search

Patent 2123552 Summary

Third-party information liability

Some of the information on this Web page has been provided by external sources. The Government of Canada is not responsible for the accuracy, reliability or currency of the information supplied by external sources. Users wishing to rely upon this information should consult directly with the source of the information. Content provided by external sources is not subject to official languages, privacy and accessibility requirements.

Claims and Abstract availability

Any discrepancies in the text and image of the Claims and Abstract are due to differing posting times. Text of the Claims and Abstract are posted:

  • At the time the application is open to public inspection;
  • At the time of issue of the patent (grant).
(12) Patent: (11) CA 2123552
(54) English Title: INSOLE FOR HEEL PAIN RELIEF
(54) French Title: SEMELLE INTERIEURE POUR LE SOULAGEMENT DES TALALGIES
Status: Deemed expired
Bibliographic Data
(51) International Patent Classification (IPC):
  • A43B 13/40 (2006.01)
(72) Inventors :
  • FISHER, RANDALL K. (United States of America)
  • THOMPSON, DONALD B. (United States of America)
(73) Owners :
  • SCHERING-PLOUGH HEALTHCARE PRODUCTS, INC. (United States of America)
(71) Applicants :
(74) Agent: NORTON ROSE FULBRIGHT CANADA LLP/S.E.N.C.R.L., S.R.L.
(74) Associate agent:
(45) Issued: 1999-11-02
(22) Filed Date: 1994-05-13
(41) Open to Public Inspection: 1995-11-14
Examination requested: 1996-08-29
Availability of licence: N/A
(25) Language of filing: English

Patent Cooperation Treaty (PCT): No

(30) Application Priority Data: None

Abstracts

English Abstract






An insole and a method for relieving bottom-of-heel pain (ie. plantar heel
pain) and/or arch pain associated with bottom-of-heel pain is described.


Claims

Note: Claims are shown in the official language in which they were submitted.



-20-
The embodiments of the invention in which an exclusive
property or privilege is claimed are defined as follows:

1. A removable insole for relieving bottom of-heel pain and/or arch pain
associated with bottom-of-heel pain comprising:
a shock-absorbing material having a front portion with a forward
edge, a cupped heel portion and a broad, raised arch portion having a
maximum height at the medial edge of said insole; wherein
said front portion tapers downward from said raised arch portion
toward a first minimum thickness on a line positioned behind the
metatarsal heads of a foot when the insole is in place in a shoe;
said cupped heel portion is posted medially from about 1 to about
4 degrees so that the medial bottom side of said cupped portion is thicker
than the lateral bottom side of said cupped portion;
said insole has a substantially upright wall portion which extends
arcuately around said cupped heel portion, wherein starting at the heel
end, said wall portion gradually slopes inward on the medial side toward
the front portion at a decreasing angle from horizontal to a point
approximately one-third across the width of the insole, and continues
forward while reducing in height along said medial edge to undercut said
arch portion and allow a close fit of the undercut arch portion with the
arch portion of a shoe, wherein on the lateral side of said insole, said
upright wall portion reduces in height from said cupped heel portion to
said first mininum thickness in the front portion;
said broad, raised arch portion gradually slopes downward from
said maximum point to said first minimum thickness on a line behind the
metataral heads, to a second minimum thickness at about 55 to about 90


-21-

percent across said insole width from said maximum, raised arch portion
and to a third minimum thickness within said cupped heel portion.

2. The insole of claim 1 wherein said shock-absorbing material is made
of polyurethane.

3. The insole of claim 1 wherein the forward edge of said forward portion
is disposed just behind the first metatarsal head of a foot.

4. The insole of claim 1 wherein said forward portion is disposed in front
of said metatarsal heads.

5. The insole of claim 1 wherein said cupped heel portion is medially
posted between about 2 to 3 degrees.

6. The insole of claim 1 wherein said lateral side begins to substantially
decrease in height at a point across the width from said maximum, raised
arch point.

7. The insole of claim 1 wherein said broad, raised arch portion
gradually decreases to said third minimum thickness about 65 to about
85 percent across said insole width from said maximum, raised arch
portion.

8. The insole of claim 1 wherein said broad, raised arch portion
gradually decreases to a minimum thickness about 75 to about 80
percent across said insole width from said maximum, raised arch portion.

9. The insole of claim 1 further comprising a topcover bonded to the
outer surface of said forward portion, said cupped heel portion and said
broad, raised arch portion.

10. The insole of claim 9 wherein the topcover is a fabric.


- 22 -

11. The insole of claim 10 wherein the fabric is a brushed knit laminate
topcloth.

12. The insole of claim 1 having perforations extending from the top
surface to the bottom surface.

13. The insole of claim 1 wherein the bottom surface is flat.

14. The insole of claim 13 wherein a non-slip coating is attached to the
bottom surface to reduce movement of the insole within the shoe.

15. The insole of claim 14 wherein the non-slip coating is a double-sided
pressure sensitive adhesive tape.

16. The insole of claim 1 which is a multilayered composite.

17. The insole of claim 1 further comprising a small lateral arch portion
which leads into the second minimum thickness from the lateral side.

18. The insole of claim 1 which is three-quarters length.

19. The insole of claim 1 which is full length.

20. A method for relieving bottom-of-heel pain and/or arch pain
associated with bottom-of-heel pain either by providing the insole of
claim 1 to a person experiencing said pain for wearing in the person's
shoes, or by wearing said insole..

Description

Note: Descriptions are shown in the official language in which they were submitted.





~~3~~~
INSOLE FOR HEEL PAIN RELIEF
FIELD OF THE INVENTION
The present invention relates to a novel insole for footwear especially
s useful for relieving heel pain. This application is related to U.S. Patent
No.
Des. 391,749.
BACKGROUND OF THE INVENTION
Pain on the bottom or side borders of the heel of the foot (in the
to center bottom, lower sides, or front of the heel) is known as plantar heel
pain
or bottom-of-heel pain. Such pain can be caused by various diseases such
as arthritis, gout or diabetes or by several mechanically induced causes.
The mechanical causes include such factors as plantar fasciitis, heel spurs,
heel bruises, thinning or loss of fat from the fat pad on the bottom of the
heel
is (the body's own natural heel cushion), strains, bursitis, nerve entrapment,
or
stress from high and rigid arches. Plantar fasciitis is an inflammation of the
plantar fascia (a fibrous sheath that encapsulates the ligament that runs
along the bottom of the foot) near the point where it attached to the front
surface of the calcaneous or heel bone. The inflammation is believed to be
2o caused by microtears of the plantar fascia caused by excessively stretching
and/or twisting of the plantar fascia. Heel spurs are calcium deposits which
grow on the front of the calcaneus and stick out into the plantar fascia and
irritate this sensitive heel tissue. Further, arch pain often accompanies or
is
associated with bottom-of-heel pain. Such arch pain can arise from a
B




_2_
sufferer's attempt to alleviate or minimize the bottom-of-heel pain by an
abnormal walking gait. A search of the literature over the past 20 years
uncovered very few patents which even addressed the subject of plantar
heel pain. Accordingly, research was conducted to develop an insole which
would relieve plantar heel pain from the various mechanical causes or
factors..
The present invention is directed towards a removable insole for
relieving either bottom-of-heel pain and/or arch pain associated with
bottom-of-heel pain comprising:
a shock-absorbing material having a front portion with a forward
edge, a cupped heel portion and a broad, raised arch portion having a
maximum height at the medial edge of said insole; wherein
said front portion tapers downward from said raised arch portion
toward a first minimum thickness on a line positioned behind the
metatarsal heads of a foot when the insole is in place in a shoe;
said cupped heel portion is posted medially from about 1 to about
4 degrees so that the medial bottom side of said cupped portion is thicker
than the lateral bottom side of said cupped portion;
said insole has a substantially upright wall portion which extends
arcuately around said cupped heel portion, wherein starting at the heel
end, said wall portion gradually slopes inward on the medial side toward
the front portion at a decreasing angle from horizontal to a point
approximately one-third across the width of the insole, and continues
forward while reducing in height towards said medial edge to undercut
said arch portion and allow a close fit of the undercut arch portion with




~~~'~~5~
-3-
the arch portion of a shoe, wherein on the lateral side of said insole, said
upright wall portion reduces in height from said cupped heel portion to
said first mininum thickness in said front portion;
said broad, raised arch portion gradually slopes downward from
said maximum point to said first minimum thickness on a line behind the
metataral heads) to a second minimum thickness at about 55 to about 90
percent across said insole width from said maximum, raised arch portion
and to a third minimum thickness within said cupped heel portion.
Preferably, the second minimum thickness is about 65 to about 85
percent, more preferably about 75 to about 80 percent.
In another embodiment, the present invention is directed towards a
method for reducing or relieving bottom-of-heel pain either by providing
the above described insole to a person experiencing said pain for
wearing in the person's shoes, or by wearing said insole.
In yet another embodiment, the present invention is
One advantage of the present invention is that it can provide a
lightweight insole that can relieve plantar heel pain resulting from its
major mechanical causes, such as plantar fasciitis, heel spurs, thinning
fat pad, heel bruises, calluses or high arches.
A second advantage of the present insole is that it provides
cushioning and shock absorption for sore, sensitive heels.
A third advantage is that the present insole can be readily used to
support and cushion normal feet in footwear that have little or no arch
support.
A fourth advantage is that the present insole has been sized to fit most
footwear styles for men and women so that it feels like part of the shoe.




~~~J=~~N
-4-
A fifth advantage of the present insole is that because its design allows
the insole or insert to fill the void space between the foot and the shoe, the
present insole feels less bulky than other insole products having substantial
arch supports. Thus, the present insole can be comfortably wom by the
user with the user's normal size footwear without the need to resort to larger
footwear sizes.

-



DETAILED DESCRIPTION OF THE EMBODIMENTS
In the present specification, the terms "insole", "innersole" or "insert"
are considered to be synonymous and interchangeable.
Preferably, the shock-absorbing portion of the insole is one piece,
s meaning that this portion is of unitary construction. Alternatively, the
shock-
absorbing portion can be of laminate construction made of separate distinct
components or layers.
The present insole can be made to be three quarter length to full
length, preferably three quarter length. Three quarter length refers to the
io length extending from the heel to the first metatarsals of the foot,
whereas
full length refers to the entire length of the foot.
A topcover can be bonded to the outer surface of the toe portion, the
cupped heel portion and/or the broad, raised arch portion. The topcover can
be prepared from, but not limited to, materials, such as fabrics, leather,
is leatherboard) expanded vinyl foam, flocked vinyl film, coagulated
polyurethane, latex foam on scrim, supported polyurethane foam, laminated
polyurethane film or in-mold coatings such as polyurethanes, styrene-
butadiene-rubber, acrylonitrile-butadiene, acrylonitrile terpolymers and
copolymers, vinyls, or other acrylics, as integral topcovers. Desirable
2o characteristics of the topcover include good durability, stability and
visual
appearance. Also desired is that the topcover material have good flexibility,
as indicated by a low modulus, in order to be easily moldable. The bonding
surface of the topcover must provide an appropriate texture in order to
achieve a suitable mechanical bond to the insole. Preferably, the topcover




_.
-s-
material is a fabric, such as a brushed knit laminate topcloth (brushed knit
fabric/urethane film/nowoven scrim cloth laminate).
The insole can be prepared from any material which can cushion and
absorb the shock from heel strike on the insole. Suitable shock absorbing
materials can include any suitable foam, such as but not limited to: cross
linked polyethylene, polyethylene-vinyl acetate), polyvinyl chloride,
synthetic and natural latex rubbers) neoprene, block polymer elastomer of
the acrylonitrile-butadiene-styrene or styrene-butadiene-styrene type,
thermoplastic elastomers, ethylenepropylene rubbers, silicone elastomers,
polystyrene, polyurea or polyurethane; most preferably a polyurethane foam
made from flexible polyol chain and an isocyanate such as a monomeric or
prepolymerized diisocyanate based on 4,4'-diphenylmethane diisocyanate
(MDI) or toluene diisocyanate (TDI). Such foams can be blown with freon,
water, methylene chloride or other gas producing agents) as well as by
mechanically frothing to prepare the shock absorbing resilient layer. Such
foams advantageously can be molded into the desired shape or geometry.
Non-foam elastomers such as the class of materials known as viscoelastic
polymers, or silicone gels, which show high levels of damping when tested
by dynamic mechanical analysis performed in the range of -50°C to
100°C
may also be advantageously employed. U.S. Patents 3,489,594, 4,722,946
and 4,476,258 describe suitable energy absorbing polyurethane foam
compositions. A resilient polyurethane can be prepared from diisocyanate
prepolymer, polyol, catalyst and stabilizers which provide a waterblown
polyurethane foam of the desired physical attributes. Suitable diisocyanate
prepolymer and polyol components include polymeric MDI M-10 (CAS
9016-87-9) and Polymeric MDI MM-103 (CAS 25686-28-6), both available




-7-
from BASF, Parsippany, NJ; Pluracol 945 (CAS 9082-00-2) and Pluracol
1003, both available from BASF, Parsippany, NJ; Multrinol 9200, available
from Mobay) Pittsburgh, PA; MDI diisocyanate prepolymer XAS 10971.02
and polyol blend XUS 18021.00 available from the Dow Chemical
Company, Midland, Michigan; and Niax 34-28, available from Union
Carbide, Danbury) CT. These urethane systems generally contain a
surfactant, a blowing agent, and an ultra-violet and/or catalyst package.
Suitable catalysts include Dabco 33-LV(CAS 280-57-9,2526-71-8), Dabco
X543 (CAS Trade Secret), Dabco T-12 (CAS 77-58-7), and Dabco TAC
(CAS 107-21-1) all obtainable from Air Products Inc., Allentown,
Pennsylvania; Fomrez UL-38 , a stannous octoid, from the Witco Chemical
Co., New York, N.Y. or A-1 (CAS 3033-62-3) is available from OSI Corp.,
Norcross) Georgia. Suitable stabilizers include Tinuvin 765 (CAS 41556-
26-7), Tinuvin 328 (CAS 25973-55-1), Tinuvin 213 (CAS 104810-48-2),
Irganox 1010 (CAS 6683-19-8)) Irganox 245 (CAS 36443-68-2), all
available from the Ciba Geigy Corporation, Greensboro, North Carolina, or
Givsorb UV-1 (CAS 057834-33-0) and Givsorb UV-2 (CAS 065816-20-8)
from Givaudan Corporation, Clifton, New Jersey. Suitable surfactants
include DC-5169 (a mixture)) DC190 (CAS68037-64-9), DC197
(CAS69430-39-3), DC-5125 (CAS 68037-62-7) all available from Air
Products Corp.) Allentown Pennsylvania and L-5302 (CAS trade secret)
from Union Carbide, Danbury Conneticut. Alternatively, the present insole
can be a laminate construction (ie. multilayered composite) of any of the
above materials. Multilayered composites are made from one or more of
the above materials such as a combination of polyethylene vinyl acetate
and polyethelene, or a combination of polyurethane and polyvinyl chloride.




Measurements of the shock-absorbing capabilities of the materials can be
made using any suitable method, such as by using an impact tester and/or a
ball rebound tester.
The bottom of the insole can be treated with adhesives or materials
s having a high coefficient of friction, or velcro-type fasteners to provide
non-
slip features or semi-permanent attachment of the device in the shoe. For
example, a high peel, high shear, double sided pressure sensitive adhesive
tape, such as 443 PC Tape of the 3M Company, St. Paul, Minnesota, could
be used to fasten the insole to an article of footwear. Such adhesives
to should not come in direct contact on a regular basis with peoples feet.
Alternatively, the bottom layer and/or undercut can be coated with a
non-slip, acrylic coating which has a low coefficient of friction. The non-
slip
coating can be pre-applied to a bottom mold cavity prior to adding a
polyurethane mixture. The coating molds integrally to the resultant
is polyurethane foam layer.
The table below summarizes characteristics of a range of materials
which can be employed in the innersole of the present invention. One of
ordinary skill in the art will appreciate that the characteristics of the
innersole
can vary from portion to portion and within each layer. For example, within
2o the heel portion, toe portion and intermediate arch portion the thickness,
hardness, density, etc. of each layer can vary within the layer.
~f>
..




_.
-s-
TOPCOVER SHOCK BOTTOM OVERALL
LAYER ABSORBING COATING INSOLE
LAYER (OPTIONAL) (COMBINED
LAYERS


THICKNESS


inches 0-0.25 0.005-0.95 0-0.25 0.005-1.0


centimeter 0-0.635 0.013-2.4130-0.635 0.013-2.54


HARDNESS


Shore 00 - 20 to 100 - 20 to 100
durometer units units



DENSITY


Ib/cu. ft. - 2-35 - 2-40


cc - 0.032-0.561- 0.032-0.641



COMPRESSION - At 25% At 25% At 25%
LOAD compressioncompression compression
DEFLECTION


Ib/s . in. - 5-50 - 5-50


k s . cm - 35.1-352 - 35.1-352



Compression Load Deflection can be measured using ASTM D3574-
86, Test method C at 25% or 50% deflection.
The innersole of the present invention can be prepared by
conventional methods such as heat sealing, ultasonic sealing, radio
frequency sealing, lamination, thermoforming, reaction injection molding,
open cast molding and compression molding and, if necessary, followed by
secondary die-cutting or in-mold die cutting. Representative methods are
~ Density of innersole can vary from portion to portion and within each layer.




-10-
taught, for example, in U.S. Patent Nos. 3,489,594; 3,530,489; 4,257,176;
4,185,402; 4,586,273, in the Handbook of Plastics, Herber R. Simonds and
Carleton Ellis, 1943, New York, N.Y., Reaction Injection Molding Machinery
and Processes, F. Melvin Sweeney, 1987, New York, N.Y., and Flexible
s Polyurethane Foams, George Woods, 1982, New Jersey. For example the
insole can be prepared by a foam reaction molding process such as taught
in U.S. Patent 4,694,589.
During use, the insole is placed in a shoe so that the medial side
containing the raised arch portion rests against the inside of the shoe. For a
io three quarter length insole, the front portion can be trimmed along
optional
trim lines so that the first minimum thickness is behind the metatarsal heads
of the foot when the insole is in place in a shoe. For a full length insole,
the
front portion can be trimmed so that the toe portion fits within the toe
portion
of a shoe. Optionally, a double sided pressure sensitive adhesive tape can
is be used to reduce slippage by attaching the tape to the bottom of each
insole and pressing the insole with the tape firmly into the shoe.
DETAILED DESCRIPTION OF THE DRAWINGS
In the following Figures, FIGS. 1-10 depict an insole for use with the right
2o foot.
FIG. 1 is a top front perspective view of a three-quarter length insole.
FIG. 2 is a top plan view of the insole of FIG. 1.
FIG. 3 is a contour map of the top surface of the insole of FIG. 2.




-11
FIGS. 4A, 4B) 4C and 4D show cross sectional views of the insole of FIG. 2
and 3 taken across points a--a', b--b' and c--c', also in view of F1G. 5A and
5B.
FIG. 5A is a rear end perspective view of the bottom of the insole of FIG. 1.
FIG. 5B is bottom plan view of the insole of FIG. 1 showing trimlines in the
toe portion.
FIG. 6 is a front end view of the insole of FIG. 1.
FIG. 7 is a rear end view of the insole of FIG. 1.
FIG. 8 is a view taken along the lateral side of the insole of FIG. 1.
FIG. 9 is a view taken along the medial side of the insole of FIG. 1.
FIG. 10 is a top plan view of a full length insole for use on a right foot.
In FIG. 1, insole 2 .has a front portion 4 with a forward leading edge 6) a
cupped heel portion 8 and a broad, raised arch portion 10 having a
maximum height 12 at the medial side 14 of insole 2. Optionally, and
preferably, insole 2 has a small lateral arch portion 18 which leads into the
second minimum thickness from lateral side 20. Small lateral arch portion
18 enables the insole to better fit the bottom surface of the foot.. Insole 2
is
also shown with optional perforations 15, whose number and pattern can be
fashioned into any desired configuration.
In FIGS. 2 and 3 are shown designated points a, b and c on medial side 14
and corresponding points a', b' and c' on lateral side 20 of of insole 2. A
line connecting points a and a' (ie. a--a') corresponds to a cross sectional
slice (as shown in FIG. 4A) taken across the front portion of the insole
having a first minimum thickness on a line E--E' just behind the first




-12-
metatarsal head of a foot when insole 2 is in place in a shoe. A line
connecting points b and b' (ie, b--b') corresponds to a cross sectional slice
(as shown in FIG. 4B) taken across the maximum height 12 of the arch
portion through the second minimum thickness at 'u' to the lateral side 20 of
insole 2. The second minimum thickness corresponds the bottom of the
valley between arch portion 12 and the small lateral arch portion 18 in FIG
1. A line connecting points c and c' (ie. c--c') corresponds to a cross
sectional slice (as shown in FIGS. 4C and 4D) taken across heel portion 8
through the third minimum thickness at 'v" at the bottom of cupped heel
portion 8.
In FIG 3 is shown a contour map of the top surface of insole 2. Each solid
line represents portions of the insole surface which are approximately at the
same height. For example, line z indicates that this portion of the insole
surface extends from the front toe portion, around the raised arch portion
and within the cupped heel portion at approximately the same height.
Generally, the closer the lines, the greater or steeper is the slope of the
contour. Conversely, the further the lines are apart, the lesser or more
gradual is the slope. For example, contours tend to be steepest near points
c and c' on the upright wall portion of cupped heel 8. Contours tend to be
least near points a and a' at the forward portion 4, especially nearer to
forward edge 6.
FIGS. 4A, 4B) 4C and 4D show cross sectional views of the insoles of FIGS.
2 and 3 taken across points a--a', b--b' and c--c', also in view of FIG. 5A
and
5B. FIG. 4A shows a cross sectional view of tapered front portion 4. The




- 13-
minimum thickness at "s" corresponds to the point of intersection between
line a--a' and the line representing the first minimum thickness, E--E' as
depicted in FIG. 2. positioned behind the metatarsal heads of a foot when
the insole is in place in a shoe.
FIG. 4B shows that arch portion 10 has a maximum arch height t--t' at
medial side 14.. Arch portion 10 slopes downward to a second minimum
thickness at "u" which can be about 55 to about 90 percent across the insole
width from a perpendicular drop to point w at the edge of maximum arch
height t--t'. Second minimum thickness at "u" is shown to be about 75
percent across the width of insole 2 as measured from point w. From
second minimum thickness at "u", the top surface of the insole slopes
upward toward lateral side 20 indicated at point b'. FIG. 4B also shows that
wall portion 24 gradually slopes inward from medial side 14 at a decreasing
angle from horizontal to a point w' approximately one-third across the width
of the insole from point w.
FIG. 4C shows the medial posting formed by making the medial bottom side
x--x' substantially thicker than the lateral bottom side y--y', so that when
worn, the heel of the foot is posted medially from about 1 to about 4
degrees, more preferably from about 2 to 3 degree, and as shown in FIGS.
4C and 4D to be at about 2 1/2 degrees. FIG. 4C also shows how the broad
arch portion has decreased to a third minimum thickness at "v" within
cupped heel portion 8. Generally, second minimum thickness at "u" in arch
portion 10 can be greater than or the same as third minimum thickness at "v"




-14-
in heel portion 8, and either thickness at "u or v' is greater than the first
minimum thickness along line E--E' in forward portion 4.
FIG. 4D shows the same cross section as FIG. 4C through heel portion 8
through third minimum thickness at "v'. Line RP' represents a line passing
through the bottom of the insole and starting at a point P', which is a point
directly vertically below point c'. MM' is a line tangent to the top heel cup
surface at its center point Q) which is midway horizontally between vertical
lines passing through c and c'. Line PP' is a line parallel to line MM' and
passing through point P'. The degree of posting, represented by the angle
alpha (a) is represented by the angle formed between lines PP' and RP'. As
a result of the posting, third minimum thickness at "v' is moved laterally
away from midpoint Q.
FIG. 5A shows a bottom rear end view of insole 2 having a substantially
upright wall portion 24 which extends arcuately around cupped heel portion
8. On medial side 14, wall portion 24 gradually slopes inward from 24A to
24B at a decreasing angle from horizontal to approximately one-third across
the width of the insole to point w' and continues forward to 24C while
reducing in height on said medial side 14 to undercut arch portion 10 (not
shown), in order to allow a close fit of undercut portion 24B with the arch
portion of a shoe. On lateral side 20, wall portion 24 gradually reduces in
height from the cupped heel portion 8 from 24D to near the first minimum
thickness at line E--E' in the toe portion at 24E. Also shown is a flat bottom
surface 30 which rests upon the shoe sockliner or inside bottom surface.




~~~,.~~t~
-15-
Fig. 5B shows a bottom plan view of insole 2 in which trimlines 22 represent
lines in front portion 4 for trimming to a more comfortable fit in a shoe.
Generally, forward edge 6 of front portion 4 should be positioned either
behind or in front of the metatarsal heads of the user's foot. The placement
of
forward edge 6 directly beneath the metatarsal heads may cause discomfort
to the user. In Fig. 5B shows the preferred embodiment in which forward
edge 6 ends just in front of the metatarsal heads. If edge edge ends directly
beneath the metatarsal heads on a user's foot, the trimlines provide the
pattern for properly trimming forward portion 4. In this figure, point w')
undercut 24B) medial side 14, medial wall portion 24A, lateral wall portion
24D, lateral side 20 and flat bottom 30 are also illustrated.
FIG. 6 shows a front end view of insole 2 in which front edge 6, medial side
14 and lateral side 20 are depicted.
FIG. 7 shows a rear end view of insole 2 in which the rear edge 32 shows
the top edge of the back of heel cup portion 8 together with lateral side 20
and medial side 14. Point 24C depicts the front of the wall portion on the
medial side in the foward portion of the insole, while point 24E depicts the
front of the wall portion on the lateral side in the forward portion of the
insole.
FIG. 8 shows a view taken along the lateral side of insole 2 in which wall
portion 24 on lateral side 20 reduces in height from the cupped heel portion
8 to the forward edge in forward portion 4. Point 12 depicts the peak or
maximum height of arch portion 10.



~~.~3~~~
- 16-
FIG. 9 shows a view taken along the medial side 14 having undercut 24B
beneath arch 10 (not shown) of insole 2..
FIG. 10 is a top plan view of a full length insole 40 for use on a right foot.
in
which extended forward portion 42 extends into the toe area. Arch portion
and cupped heel portion 8 are also depicted.
The following table provide dimensions for various portions within a 3/4
10 length insole for normal adult shoe sizes.
Ranges for Normal Adult Shoe Sizes in Inches
Dimensions Women's Size Men's Size
Widths orizontal)


a--a' 2.3-3.9 2.6-4.4


b--b' 2.1-3.5 2.0-4.0


c--c' 1.6-2.8 1.9-3.1


b--a 1.6-2.8 1.9-3.1


c--v 1.0-1.8 1.2-2.0


Lengths (horizontal)


Overall Length(3/4)5.5-9.3 6.2-10.4


a--b 1.6-2.8 1.8-3.2


b--c 1.9-3.1 2.1-3.5


Thickness (vertical)
s--s' 0.04-0.10 0.04-0.12


t--t' 0.31-0.84 0.38-0.94


u--u' 0.12-0.26 0.15-0.29


v--v' 0.17-0.33 0.19-0.37






-17-
EXAMPLE 1. Preparation of Insole
A pre-warmed two-part mold is used having a top core mold half
and a bottom cavity mold half. A thin topcover of brushed knit) urethane)
scrim laminate fabric is attached to the top core mold half. The bottom
cavity, is spray coated with a release coating. After the coating has dried)
polyurethane is poured into the bottom cavity and the mold is closed. The
foam expands and the part is cured. The part is demolded and die-cut,
yielding a molded insole having two layers that are integrally bound into
one article. A double sided adhesive tape may be attached to the bottom of
each insole to provide a means of holding the insole in place in the shoe.
EXAMPLE 2. Testing of Insole for Relieving Bottom-of-Heel Pain
Subjects were selected who suffered from plantar heel pain or Heel
Spur Syndrome. (a condition that consists of severe pain when first walking
after a period of rest, which subsides quickly as the individual continues to
walk, but may return when the foot tires after extended use). The subjects
were chosen with plantar heel pain due to plantar fasciitis, heel spurs) heel
bruises or high arches. Subjects were adult males or females 18 year of
age or older who routinely wore shoes for which the insole is designed (ie.
men's dress shoes, work shoes or boots) or women's low heel shoes, flats)
loafers, tie style shoes or athletic shoes). Subjects were excluded who had
either a painful heel exostosis (outward projecting bony growth on the back
of the heel), painful cracked skin on the heel, diabetes, circulatory
disorders
of the feet) lack of sensation in their feet, or any foot condition which
would
make it uncomfortable or impossible to wear 3/4 length contoured insoles,
such as painful bunions, excessively painful corns, etc. Also excluded were



- 18-
subjects wearing specially designed prescription orthodic devices or
prescription shoes, or those using any medication which would interfere
with product evaluation. One hundred subjects comprised of fifty men and
fifty women were provided with a suitably sized insole, taking into account
foot length, shoe size and width. Subjects were instructed to wear the
insoles for two weeks, at least 5 days per week for at least 6 hours per day,
in shoes for which the insole is designed. Subjects then answered a
questionaire regarding comfort, fit and pain relief. The overall results are
shown in the Table below;
of subjects% of subjects% of subjects% of subjects


who liked who reportedwho reported who reported
the


insole immediate effectivenessimprovement
in in


decreased relieving reducing heel
heel


heel pain pain all day pain over the


two week stud



Men 86 82 80 74


Women 88 80 84 88


The results of the above study indicated that at least 86% of both the men
and the women liked the insole. Further, at least 80% of both the men and
the women reported immediate decreased heel pain and/or effectiveness in
relieving heel pain all day. At the end of the two week study, 74% of the
men and 88% of the women had a reduction in their overall level of heel
pain.




~12~~ ~2
-19-
A study was conducted under conditions similar as described in
Example 2) except that at least 60% of the subjects were to have plantar
fasciitis, heel spurs or both as the causative factor of bottom-of-heel pain
and the subjects were instructed to wear the insoles for six weeks. The
results of the above study indicated that 82% of the men and women liked
the insole. Further, at least 84% of the men and women noted pain relief
within one minute. At the end of the 6-week study, 84% of the subjects had
a reduction in their overall level of heel pain. In addition, 34% of the
subjects had arch pain in addition to bottom-of-heel pain. Of these, 70%
had a reduction in arch pain as well a reduction in heel pain.

Representative Drawing
A single figure which represents the drawing illustrating the invention.
Administrative Status

For a clearer understanding of the status of the application/patent presented on this page, the site Disclaimer , as well as the definitions for Patent , Administrative Status , Maintenance Fee  and Payment History  should be consulted.

Administrative Status

Title Date
Forecasted Issue Date 1999-11-02
(22) Filed 1994-05-13
(41) Open to Public Inspection 1995-11-14
Examination Requested 1996-08-29
(45) Issued 1999-11-02
Deemed Expired 2004-05-13

Abandonment History

There is no abandonment history.

Payment History

Fee Type Anniversary Year Due Date Amount Paid Paid Date
Application Fee $0.00 1994-05-13
Registration of a document - section 124 $0.00 1995-03-17
Maintenance Fee - Application - New Act 2 1996-05-13 $100.00 1996-05-01
Maintenance Fee - Application - New Act 3 1997-05-13 $100.00 1997-05-06
Maintenance Fee - Application - New Act 4 1998-05-13 $100.00 1998-04-29
Maintenance Fee - Application - New Act 5 1999-05-13 $150.00 1999-05-11
Final Fee $300.00 1999-08-03
Maintenance Fee - Patent - New Act 6 2000-05-15 $150.00 2000-04-13
Maintenance Fee - Patent - New Act 7 2001-05-14 $150.00 2001-04-04
Maintenance Fee - Patent - New Act 8 2002-05-13 $150.00 2002-04-03
Owners on Record

Note: Records showing the ownership history in alphabetical order.

Current Owners on Record
SCHERING-PLOUGH HEALTHCARE PRODUCTS, INC.
Past Owners on Record
FISHER, RANDALL K.
THOMPSON, DONALD B.
Past Owners that do not appear in the "Owners on Record" listing will appear in other documentation within the application.
Documents

To view selected files, please enter reCAPTCHA code :



To view images, click a link in the Document Description column. To download the documents, select one or more checkboxes in the first column and then click the "Download Selected in PDF format (Zip Archive)" or the "Download Selected as Single PDF" button.

List of published and non-published patent-specific documents on the CPD .

If you have any difficulty accessing content, you can call the Client Service Centre at 1-866-997-1936 or send them an e-mail at CIPO Client Service Centre.


Document
Description 
Date
(yyyy-mm-dd) 
Number of pages   Size of Image (KB) 
Cover Page 1996-01-10 1 14
Abstract 1995-11-14 1 5
Description 1995-11-14 19 684
Claims 1995-11-14 3 101
Drawings 1995-11-14 5 271
Representative Drawing 1999-10-25 1 40
Representative Drawing 1998-05-22 1 41
Description 1998-11-25 19 689
Cover Page 1999-10-25 1 56
Correspondence 1999-08-03 1 34
Examiner Requisition 1998-04-03 1 33
Prosecution Correspondence 1996-08-29 1 49
Prosecution Correspondence 1996-12-16 3 70
Prosecution Correspondence 1998-09-18 1 40
Office Letter 1996-09-13 1 50
Fees 1997-05-06 1 47
Fees 1996-05-01 1 45