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(12) Patent Application: | (11) CA 2539733 |
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(54) English Title: | THERMAL BREAK STRUCTURAL STUD |
(54) French Title: | GOUJONS STRUCTURAUX A ISOLANT THERMIQUE |
Status: | Dead |
(51) International Patent Classification (IPC): |
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(72) Inventors : |
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(73) Owners : |
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(71) Applicants : |
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(74) Agent: | NA |
(74) Associate agent: | NA |
(45) Issued: | |
(22) Filed Date: | 2006-02-28 |
(41) Open to Public Inspection: | 2007-06-12 |
Availability of licence: | N/A |
(25) Language of filing: | English |
Patent Cooperation Treaty (PCT): | No |
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(30) Application Priority Data: | ||||||
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This invention is a structural building stud that provides interior cavity
space for
insulation. It also affords construction time savings for in-wall
infrastructure systems
such as wiring, plumbing, telephone, networking, etc.
The common building method is to use solid lumber studs which have the thermal
characteristics of conducting thermal energy between the separated air spaces.
This
invention breaks the conductivity of the two wall surfaces and also provides
time savings
during the construction period by affording the interior cavity space for in-
wall
infrastructure. Building corners and spaces behind partition ties are easily
assessable for a
complete insulation barrier.
This invention is comprised of two vertical upright pieces separated by
additional spacer blocks to maintain consistent cavity. These pieces are
connected by gang-nail plates, nails, screws, glue or other fasteners or
methods.
The interior cavity space between the two vertical upright pieces provides
a thermal break for energy efficient construction. This space can be filled
with insulation
as well as providing room for in-wall wiring, plumbing, etc. The spacer blocks
are also usable for attaching wiring to the studs.
Note: Claims are shown in the official language in which they were submitted.
Note: Descriptions are shown in the official language in which they were submitted.
Sorry, the representative drawing for patent document number 2539733 was not found.
For a clearer understanding of the status of the application/patent presented on this page, the site Disclaimer , as well as the definitions for Patent , Administrative Status , Maintenance Fee and Payment History should be consulted.
Title | Date |
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Forecasted Issue Date | Unavailable |
(22) Filed | 2006-02-28 |
(41) Open to Public Inspection | 2007-06-12 |
Dead Application | 2010-03-01 |
Abandonment Date | Reason | Reinstatement Date |
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2009-03-02 | FAILURE TO PAY APPLICATION MAINTENANCE FEE |
Fee Type | Anniversary Year | Due Date | Amount Paid | Paid Date |
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Application Fee | $200.00 | 2006-02-28 | ||
Maintenance Fee - Application - New Act | 2 | 2008-02-28 | $50.00 | 2008-01-14 |
Note: Records showing the ownership history in alphabetical order.
Current Owners on Record |
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WEDEL, DEAN |
NUSZ, DAVID |
Past Owners on Record |
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None |