Note: Descriptions are shown in the official language in which they were submitted.
CA 02737225 2011-07-18
MULTILAYER ANTENNA ARRANGEMENT
The invention relates to a multilayer antenna arrangement, in particular of a
planar
construction.
A conventional multilayer antenna is known from DE 10 2006 027 694 B3.
The multilayer antenna of a planar construction known from this publication
comprises an
electrically conductive ground plane, a conductive radiation plane (which is
arranged parallel
to the ground plane at a distance therefrom) and a dielectric carrier, which
is provided so as
1 0 to be sandwiched between the ground plane and the radiation plane.
Above the radiation
plane a carrier means is arranged, on which an electrically conductive patch
element is
positioned. The carrier means for the patch element has a thickness or height
which is less
than the thickness or height of the patch element.
The patch element itself can be formed as a three-dimensional body, i.e. as a
solid material.
It is also possible for the patch element to consist of a metal plate or a
metal sheet, which is
provided, by cutting or punching for example, with circumferential webs, rims
or the like,
extending away from the dielectric carrier.
An antenna of this type is suitable in particular as a motor vehicle antenna,
for example also
for SDARS. For this purpose, a patch antenna of this type can be arranged on a
common
20 base arrangement alongside further emitter antennae for other services.
An antenna arrangement of this type, with a plurality of antennae which are
disposed under
a common hood, is known for example from EP 1 616 367 B1.
From the above-mentioned prior publication, a multifunctional antenna is known
which
comprises a base, on which four different antennae are arranged offset from
one another in
a longitudinal direction and are covered by a hood covering all the antennae.
This is only
one example of an antenna arrangement, in which four different antennae are
used. In many
cases, however, in a deviation therefrom, antenna arrangements are also
required which
need for example only one antenna means for SDARS and for example a further
patch
CA 02737225 2011-03-14
2
antenna for determining the geoposition, i.e. an antenna which is often
referred to in short as
a GPS antenna, independently of what principle they are based on and/or which
operators
these systems are provided by (the GPS positioning system, the Galileo system
etc. are
known).
An improved patch antenna which is superior to earlier antennae, in particular
for oceiving
SDARS or comparable services broadcast by satellite and/or terrestrially at
the same time, is
known from the category-defining DE 10 2006 027 694 B3, which was mentioned at
the
outset.
Patch antenna arrangements having a plurality of radiation planes arranged on
top of one
another are also known. Conventionally, one patch plane is arranged above the
other, a
substrate being interposed in each case. This also makes it possible to
provide antennae
which operate in different frequency bands. Antenna arrangements of this type
can be
inferred to be known for example from DE 10 2004 035 064 Al, US 7,253,770 62,
US
6,850,191 B1 or the prior publication Pigaglio, 0.; Raveu N.; Pascal, 0.,
"Design of multi-
frequency band Circularly Polarized Stacked Microstrip patch Antenna", IEEE
Antennas and
Propagation Society International Symposium, 5-11 July 2008, DOI
10.1109/APS.2008.4619109. For example, in the stacked patch antenna in this
last
document, a plurality of substrate planes in the form of plates having
conductive patch
planes formed thereon are arranged on top of one another.
For example, an antenna arrangement is known from US 2008/0218418 which is in
the form
of a housing having a conductive outer housing and is filled with substrate in
the interior and
provided with a parasitic patch on the upper side. Underneath this parasitic
patch, an
actively operated patch plane is provided embedded in the substrate, it also
being possible if
desired for a further intermediate patch plane to be formed between this
active patch and the
parasitic patch provided on the upper side of the substrate.
The fact that antenna arrangements having an active patch and a parasitic
patch located
above this are basically known, including in conjunction with the connection
of what is known
as a "horn", can be seen for example from the further prior publication
Nasimuddin; Esselle,
K.P.; Verma, A.K.; "Wideband High-Gain Circularly Polarized Stacked Microstrip
Antennas
With an Optimized C-Type Feed and a Short Horn", IEEE Transactions on Antennas
and
Propagation, Feb. 2008, Vol. 56, No. 2, 578-581.
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3
However, irrespective of these previously known embodiments, it may and should
be noted
that a fundamentally improved patch antenna which is superior to earlier
antennae, in
particular for receiving SDARS services or comparable services emitted via
satellite and/or
also terrestrially in parallel therewith, is known from the category-defining
DE 10 2006 027
694 B3 mentioned at the outset.
If a patch antenna of this type is for example used with a further patch
antenna provided for
the GPS service, this basically results in a construction of the type which
can be seen in Fig.
1 in a schematic vertical cross-sectional view.
Fig. 1 shows an antenna comprising a generally electrically conductive base S,
shown only
schematically in Fig. 1, which is located below and is covered by a hood H,
which allows
electromagnetic radiation to pass through, whereby the antennae disposed in
the interior of
the hood H are protected.
In this case, an improved multilayer antenna A is shown in a schematic cross-
sectional view
and has a construction of the type which is known for example from DE 10 2006
027 694 83,
which was mentioned at the outset and corresponds to WO 2007/144104 Al.
Additionally, in the antenna arrangement shown in Fig. 1 in a simplified
horizontal vertical
section, a second antenna B is conventionally provided before the arrangement
is fitted on a
vehicle in the direction of travel, i.e. a conventional patch antenna, which
comprises a
ground plane M located below, a patch plane R vertically thereabove and at a
distance
therefrom, and a dielectric substrate D in between. This patch antenna is, as
is known, fed
by a feeder L, which leads to the patch plane R from below through the ground
plane M and
the substrate D via a hole, and is attached galvanically to the patch plane R.
The substrate D
in this case preferably consists of ceramic, a material with a high dielectric
constant.
The object of the present invention is thus to improve an antenna arrangement
of this type,
optionally of a basic type which uses further antennae for further services
(for example
mobile communication services in various frequency ranges, etc.).
CA 02737225 2011-07-18
4
According to the present invention, there is provided a multilayer antenna of
a
planar construction, comprising:
a first patch antenna with a plurality of planes and/or layers which are
arranged along an axial axis with or without a lateral offset from one
another,
comprising:
a first electrically conductive ground plane,
a first conductive radiation plane arranged so as to lie offset transverse
to the first ground plane and extended parallel thereto,
a first dielectric carrier arranged between the first ground plane and the
first radiation plane at least for a partial height and/or a partial region,
wherein the
first radiation plane is electrically connected to an electrically conductive
feeder,
a first carrier provided directly or indirectly on the opposite side of the
first radiation plane from the first ground plane,
an electrically conductive parasitic patch arrangement, provided on the
opposite side of the first carrier from the first radiation plane, wherein the
first carrier
has a thickness or height smaller than a thickness or height of the parasitic
patch
arrangement, wherein the parasitic patch arrangement is configured so as to be
box-shaped or box-like and/or comprises, at least in regions, circumferential
raised
portions, rim portions, web portions or wall portions, which extend so as to
proceed
transversely from a base portion or central portion of the parasitic patch
arrangement, specifically away from the first radiation plane, and
a second patch antenna comprising a second dielectric carrier and a second
radiation plane provided above the base portion or central portion of the
parasitic
patch arrangement, the second radiation plane being provided on the upper
side,
opposite the base portion or central portion of the second dielectric carrier,
and
the second patch antenna buried at least in part in the parasitic patch
arrangement, is formed, completely or in part, as electrically conductive
planes,
which are provided on the second patch antenna at least in partial regions on
the
circumferential edge surface or outer surface thereof.
CA 02737225 2011-07-18
A surprising solution is provided in the scope of the invention whereby an
antenna
arrangement, which is comparable with the antenna arrangement of Fig. 1, but
which has a
much more compact construction than the example of Fig. 1, is produced.
Preferably, in the solution according to the invention it is proposed that as
regards
the antenna, the additional patch antenna B shown in Fig. 1 is arranged in a
(passive or parasitic) conductive patch element, which is arranged above the
radiation plane of a first or primary patch antenna and at a distance
therefrom, and
which at least in portions is provided with a circumferential rim or wall
which extends
away from the radiation plane of the antenna A.
Preferably, in other words, the additional, second or secondary patch antenna,
provided for example for GPS services, is positioned in the parasitic patch
element,
which is configured so as to be box-shaped or box-like and which is arranged,
in
relation to the first antenna A, above the associated radiation plane.
It is possible for part of the height of the further patch antenna to be
buried in the box-
shaped or.box-like element. The upper side thereof may project over the
circumferential rim
of the box-shaped or box-like patch element of the first antenna.
=
However, it is also possible for the at least partial circumferential rim of
the parasitic patch
element of the first patch antenna to end above the surface of the further
patch element, in
such a way that the additional patch antenna is completely buried in the
receiving space of
the patch element which is provided with a circumferential rim or with
circumferential rim
portions.
The further patch antenna, provided in particular for GPS services, can in
this case rest on
and/or be fastened on the parasitic box-shaped or box-like patch element of
the first patch
antenna, with the interposition of an insulating layer.
CA 02737225 2011-07-18
5a
It is also possible for the further patch antenna, provided in particular for
GPS services, not
to be provided with its own ground plane, but for the substrate to lie
directly on the parasitic
box-shaped or box-like patch element of the first patch antenna, in such a way
that the
parasitic patch element of the first patch antenna simultaneously also forms
the ground
plane of the further patch antenna.
Finally and preferably, it has been found within the scope of the invention
that the
parasitic patch element, which is formed at least in portions with a
circumferential
rim or a circumferential wall, can be formed on the lower side and/or on the
circumferential rim side of the further patch antenna. In this way, the
aforementioned box-shaped or box-like patch element is not actually formed as
a
separate component, i.e. completely or partially not provided as a separate
component, but the corresponding electrically conductive portions of what is
referred to as the box-shaped or box-like patch element are formed completely
or in
part as metallised layers on the corresponding portions of the further patch
antenna.
In this case, the parasitic patch element of the primary antenna may be formed
completely or
in part from a metallised layer on the lower side and/or on the
circumferential side walls of
the further patch antenna. These steps may be performed during the production
of the
further patch antenna, specifically in a manner similar to the construction of
the patch
antenna itself, if an electrically conductive patch plane is applied to the
substrate of a patch
antenna of this type so as to lie in the transmission direction, and an
electrically conductive
ground plane in the form of a metal coating on the upper and lower side of the
substrate of
the patch antenna is applied to the opposite side. In this case, the parasitic
further box-
shaped or box-like patch element, which in the state of the art is provided
above a radiation
plane of a patch antenna, would not be present as a physically independent
element.
Preferably, the aforementioned metal coatings on the patch antenna, on the
lower
side thereof and/or on one or more of the circumferential side faces, need not
be
constructed over the entire periphery, but may have gaps in the
circumferential
direction, for example at the corner regions, may be of different heights, and
may
even be galvanically separated from the ground plane below or from the
parasitic
CA 02737225 2011-07-18
5b
patch element below. The aforementioned metal coatings on the side faces may
even extend as far as the upper side of the further patch antenna, but should
be
galvanically separated at that location from the actively fed antenna patch of
the
further antenna.
The shaping in particular of the further patch antenna, i.e. predominantly the
shaping of the
substrate, of the lower ground plane which may also simultaneously be the
plane of the
parasitic patch element of the first patch antenna, but also of the active
patch plane provided
on the transmission/receiving side, need not necessarily be square or
rectangular. This
plane may be configured so as to be n-polygonal and may even have further
shapings
CA 02737225 2011-03-14
6
deviating from a regular angular shape. Ultimately, the side walls of the
substrate of the
additional patch antenna and/or the side walls or side faces, which are
provided there at
least in portions and which extend away from the first patch antenna, need not
necessarily
be formed parallel to the axial direction of the patch antenna (i.e.
perpendicular to the
various ground and/or radiation planes), but may have rounded corners, angular
corners
etc.. In this respect, too, no limitations are given.
By comparison with the previously known solution according to the prior art,
described by
way of Fig. 1, a considerable reduction in the space requirement can be
achieved within the
scope of the invention for the antenna combination according to the invention.
The reduced
overall size is of significance predominantly for vehicle roof antenna
systems, which are of a
critical design in which there is generally only a small amount of space
available because of
the design specifications provided by the vehicle manufacturer for the
construction of the
outer shell of the antenna.
This makes it all the more surprising that the inherently good electrical
properties of a
corresponding motor vehicle antenna according to the previously known DE 10
2006 027
694 B3 can be not only maintained but even further improved, in spite of the
necessary
constructional space having been reduced. This is not obvious, since a further
antenna is
introduced into the provided patch element. This is also all the more
surprising because this
antenna system is intended to be adapted for receiving SDARS services and the
corresponding antenna constructions for receiving these services have to be
assessed very
critically, since the antennae do not have the corresponding desirable good
receiving
properties.
Within the scope of the invention, the properties of the upper GPS antenna are
also not
negatively influenced. This is also surprising. In addition, within the scope
of the invention
the upper GPS antenna can be configured to be larger, i.e. if desired even as
large as the
SDARS patch surface located below. This is a further essential difference from
the prior art,
in which the upper patch antenna always was and had to be smaller than the
lower one. The
enlargement of the GPS patch antenna also provides a considerable improvement
in the
reception of this service. Within the scope of the invention, a preferred
embodiment is even
possible in which the upper patch antenna or upper dielectric carrier is
larger than the
SDARS patch located below. This ultimately even leads to an improvement in the
properties
of the SDARS patch.
CA 02737225 2011-03-14
7
In addition, within the scope of the invention a whole antenna arrangement can
be provided
having two patch radiators, which in the context of serial production can be
fully assembled
in an upstream step and subsequently mounted as a unit on an antenna chassis
or antenna
base. This presents considerable advantages by comparison with the production
sequence
when manufacturing a conventional antenna arrangement according to the prior
art (as
described by way of Fig. 1).
The invention is described in greater detail in the following by way of
drawings, in which, in
particular:
Fig. 1 is a schematic cross-sectional view through an antenna such as may be
fitted in
particular to the roof of a motor vehicle, using a first patch antenna which
is known from the
prior art and an adjacently positioned further patch antenna for other
services;
Fig. 2 is a cross-sectional view through an antenna arrangement according to
the invention,
using a first (primary) and a second (secondary) patch antenna;
Fig. 3 is a schematic plan view of the embodiment of Fig. 3, additionally
showing the
significant components, disposed under an upper (parasitic) patch element, of
the first patch
antenna;
Fig. 4 is a schematic three-dimensional view of the patch antenna arrangement
according to
the invention with the two individual patch antennae;
Fig. 5 is a view corresponding to Fig. 4 but without the second patch antenna;
Fig. 6 is a cross-sectional view comparable with the cross-sectional view of
Fig. 2 based on
modified embodiment;
Fig. 7 is a further cross-sectional view comparable with the views of Fig. 2
or 6 based on a
further modified embodiment;
Fig. 8 is a three-dimensional view of the antenna arrangement according to the
invention
with the two patch antennae based on the antenna shown in a vertical section
in Fig. 7;
CA 02737225 2011-03-14
8
Fig. 9 shows a further modification, based on the patch antenna arrangement
according to
the invention which is shown in three dimensions in Fig. 8;
Fig. 10 is a three-dimensional view of a further modification to Fig. 9;
Fig. 11 is a further modification of the three-dimensional views shown in Fig.
9 and 10;
Fig. 12 is a three-dimensional view of a further modification, in particular
to the embodiment
shown in Fig. 8;
Fig. 13 is a cross-sectional view of a further modified embodiment to clarify
the different
substrate cross-sections for the further patch antenna;
Fig. 14 shows an embodiment varying in particular from Fig. 4 or Fig. 8, in
which the
parasitic patch arrangement is configured in part so as to be box-shaped or
box-like, and
partially metallised (electrically conductive) layers are formed, for example,
on the
circumferential or side walls of the further patch antenna; and
Fig. 15 shows a further modified embodiment, in which the box-shaped or box-
like
electrically conductive patch element is omitted for example in two opposite
corner regions,
even though the further patch antenna projects over the parasitic patch
element in these
corner regions.
In the following, reference is initially made to the embodiment of Fig. 2 to
5, which show a
patch antenna which has planes and layers arranged on top of one another along
an axial
axis Z. A patch element of this type is known in principle from DE 10 2006 027
694 B3,
reference being made to the entirety of the disclosure thereof. However, the
patch element
known from DE 10 2006 027 694 B3 does not have an additional patch antenna.
It can be seen from the schematic cross-sectional view of Fig. 2 that the
patch antenna A
has an electrically conductive ground plane 3 on what is known as the lower
side or
mounting side 1 thereof. Arranged on the ground plane 3 or with a lateral
offset therefrom is
a dielectric carrier 5, which in a plan view conventionally has an outer
contour 5' which
corresponds to the outer contour 3' of the ground plane 3. However, this
dielectric carrier 5
CA 02737225 2011-03-14
9
may also have larger or smaller dimensions and/or be provided with an outer
contour 5'
which deviates from the outer contour 3' of the ground plane 3. In general,
the outer contour
3' of the ground plane may be n-polygonal and/or even provided with curved
portions or
configured so as to be curved, even though this is unconventional.
The upper side 5a and the lower side 5b of the dielectric carrier 5 are of a
sufficient height or
thickness, which generally corresponds to a multiple of the thickness of the
ground plane 3.
In contrast with the ground plane 3, which approximately consists merely of a
two-
dimensional plane, the dielectric carrier 5 is thus configured as a three-
dimensional body
with a sufficient height and thickness.
In a deviation from the dielectric body 5, a different type of dielectric or a
different dielectric
construction may also be provided, even using air or with a layer of air in
addition to a further
dielectric body. When air is used as a dielectric, a corresponding carrier
means must then of
course be provided, for example with stilts, bolts, pillars etc., in order to
support and to hold
the further parts, which are located above and are still to be explained in
the following, of the
patch antenna.
Formed on the upper side 5a opposite the lower side 5b is an electrically
conductive
radiation plane 7, which again can also be understood approximately as a two-
dimensional
plane. This radiation plane 7 is electrically fed and excited via a feeder 9,
which preferably
extends in the transverse direction, in particular perpendicular to the
radiation plane 7, from
below, through the base (chassis) S, the ground plane 3 and the dielectric
carrier 5, in an
appropriate hole or an appropriate channel 5c.
The internal conductor of a coaxial cable (not shown) is electrogalvanically
connected to the
feeder 9 and thus to the radiation plane 7 from a terminal 11, which is
generally located
below and to which the coaxial cable, not shown in greater detail, can be
attached,. The
external line of the coaxial cable (not shown) is electrogalvanically
connected to the ground
plane 3 located below. Instead of the attached coaxial cable, a microstrip
line can also be
used and correspondingly connected.
The embodiment of Fig. 2 et seq. discloses a patch antenna which comprises a
dielectric 5
and has a square shape in a plan view. This shape or the corresponding contour
or outline 5'
=
CA 02737225 2011-03-14
may however also deviate from the square shape and in general have an n-
polygonal shape.
Although unconventional, even curved outer boundaries may be provided.
The radiation plane 7 positioned on the dielectric 5 may have the same contour
or outline 7'
as the dielectric 5 located below. In the embodiment shown, the basic shape is
likewise fitted
to the outline 5' of the dielectric 5 and formed so as to be square, but has
flat portions 7"
(only shown in the plan view of Fig. 3) on two opposite corners, which flat
portions are
formed approximately speaking by omitting an isosceles right-angled triangle.
Thus, in
general, the outline 7' may also be an n-polygonal outline or contour or even
be provided
with a curved outer boundary 7'.
The aforementioned ground plane 3, and likewise the radiation plane 7 however,
are
considered in part as a "two-dimensional" plane, because the thickness thereof
is so low that
they in effect cannot be considered "three-dimensional bodies". The thickness
of the ground
plane 3 and the radiation plane 7 is conventionally less than 1 mm, therefore
generally less
than 0.5 mm, in particular less than 0.25 mm, 0.20 mm or 0.10 mm.
The patch antenna disclosed thus far may for example consist of a patch
antenna of the
commercially conventional type, preferably of what is known as a ceramic patch
antenna
with a dielectric carrier layer 5 made of a ceramic material. In accordance
with the further
description, it results that in addition to the patch antenna disclosed thus
far, a patch
antenna in the sense of a stacked patch antenna A is further constructed, in
which a
parasitic patch element 13 is additionally provided above the upper radiation
plane 7
(preferably so as to lie perpendicular to said radiation plane 7 and offset at
a distance
parallel thereto). This parasitic patch element 13 is configured in such a way
as to have a
three-dimensional structure in contrast to the aforementioned ground plane 3
and the
radiation plane 7, with a height and thickness which are different from, i.e.
greater than,
those of the ground plane 3 or the radiation plane 7.
A carrier means 19 (in particular a dielectric carrier means) which has a
thickness or height
17, and which supports and carries the parasitic patch element 13, is
preferably used. This
dielectric carrier means 19 preferably consists of an adhesive or mounting
layer 19', which
may be formed as what is known as a double-sided adhesive or mounting layer.
Commercially conventional double-sided adhesive tapes or double-sided adhesive
foam
tapes, adhesive pads or the like, which have an appropriate thickness as
specified above,
CA 02737225 2011-03-14
11
may be used for this purpose. This provides the option of simply fastening and
mounting the
aforementioned patch element 13 on the upper side of a commercially
conventional patch
antenna, in particular a commercially conventional ceramic patch antenna, by
this means.
The stacked patch antenna A thus described is positioned on a chassis S, shown
merely as
a line in Fig. 2, i.e. on a base, which is also additionally denoted by the
reference numeral
20. This base may for example be the base chassis 20 for a motor vehicle
antenna, on
which chassis the antenna according to the invention can be installed,
optionally in addition
to further antennae for other services. The stacked patch antenna A according
to the
invention may for example be used in particular as an antenna for receiving
satellite or
terrestrial signals, for example what is known as SDARS. However, no
restrictions are
placed on the use for other services.
The patch element 13 may for example consist of an electrically conductive,
upwardly open
box-shaped metal body with a corresponding longitudinal and transverse extent
and
sufficient height.
As can be seen from the three-dimensional view of Fig. 4 and 5, this patch
element 13 may
have a rectangular or square construction with the corresponding outline 53',
but is not
limited to this shaping. Thus, in Fig. 4 the upper patch element 13 is shown
as rectangular or
square in a plan view, including the circumferential rims or walls, which will
later be further
discussed. The plan view in Fig. 3 shows that the parasitic patch element 13
may also be
shaped differently therefrom and may have an n-polygonal form for example. For
this
reason, Fig. 3 shows that the patch element 13 can be provided with flat
portions 13", for
example at two opposite corner points, which are disposed for example adjacent
to the flat
portions 7" of the upper active radiation plane 7 of the patch antenna A.
In the embodiment shown, the patch element 13 has a longitudinal extent and a
transverse
extent which on the one hand are greater than the longitudinal and transverse
extent of the
radiation plane 7 and/or on the other hand are also greater than the
transverse and
longitudinal extent of the dielectric carrier 5 and/or of the ground plane 3
disposed below.
As can be seen from the figures, the parasitic patch element, which rests or
is fastened on
the carrier means 19 in the manner of an upwardly open box, comprises a base
plane or
central plane 53", which in the embodiment shown is provided with a
circumferential rim or a
=
CA 02737225 2011-03-14
12
circumferential web 53d (thus in general with an appropriate raised portion
53d), which rises
transversely, in particular perpendicularly, from the plane of the base plane
53", which is
also parallel to the ground plane. A patch element 13 of this type may for
example be
produced by cutting and edging procedures from an electrically conductive
metal sheet, it
being possible for the circumferential webs 53d to be connected to one another
in the corner
regions electrically/galvanically, for example by soldering (it further being
possible for more
recesses to be formed in the central portion 53", although this will not be
discussed further in
the following).
Above this secondary patch element 13 is disposed, as is shown in the further
figures, a
second patch antenna B. The second patch antenna B is dimensioned, in terms of
the length
and width thereof, in such a way that the measurements thereof are for example
at least
slightly smaller than the free internal longitudinal and transverse extent
between the
circumferential webs 53d of the parasitic patch element 13. This specifically
provides the
option of burying the patch antenna B in the interior 53a of the patch element
13 to various
extents. In other words, the lowest level, i.e. the lowest boundary plane 101,
is located in the
interior 53a of the parasitic patch element 13, i.e. below the upper boundary
plane 53c,
which is defined by the upper circumferential edges of the webs, rims or outer
walls 53d of
the parasitic patch.
The second patch antenna B also in turn comprises a substrate (dielectric
body) 105
comprising an upper side 105a and a lower side 105b, the active radiation
plane 107 of the
second or secondary patch antenna B being formed so as to lie in the
transmission/receiving
direction (i.e. remote from the patch antenna A) as an electrically conductive
plane on the
upper side 105a of the substrate 105, and the associated second ground plane
103 of the
second patch antenna B being provided so as to lie facing the patch antenna A
(i.e. on the
lower side 105b).
It can be inferred from the drawings that a further channel or a further hole
105c is provided
transverse, and in particular perpendicular, to the patch radiation planes
(i.e. in the axial Z-
direction of the whole antenna arrangement). This channel extends through the
chassis 20,
through the first or primary patch antenna A (i.e. through the ground plane
thereof, the
dielectric body and the radiation plane above), through the carrier means 19
attached
thereto and the parasitic patch element 13, through an optionally following
carrier layer for
the second patch antenna B, and through the second ground plane 103 of the
patch antenna
CA 02737225 2011-03-14
13
B and through the dielectric carrier 105 up to the second radiation plane 107
above, i.e. to
the second radiation plane 107 of the second patch antenna B.
Disposed on the lower side of the chassis 20 is a coaxial terminal, in such a
way that the
radiation plane 107 is fed via a feeder 109 extending in the channel. The
external line of a
coaxial connection cable is galvanically connected to the ground plane 3 at
the terminal. A
microstrip connection cable may of course also be provided in this embodiment
instead of a
coaxial connection cable.
In the embodiments disclosed thus far, the height 115 of the second patch
antenna B
(including a support and/or fastening and/or adhesive layer 111 optionally
located on the
lower side of the ground plane 103 adjacent to the upper side of the parasitic
patch element
13) is greater than the height 117, i.e. greater than the circumferential rims
53d of the
parasitic patch element 13. The height of the patch element may however also
be the same
height as the circumferential rims 53d of the parasitic patch element 13.
Fig. 6 shows that the circumferential rims 53d of the parasitic patch element
13 may even be
higher than the height of the second patch antenna B in such a way that the
second patch
antenna B is fully buried in the interior 53a of the parasitic patch element
13. Moreover, Fig.
6 shows in contrast to Fig. 2, that the longitudinal and transverse extent of
the further patch
antenna B extending in relation to the Z axis are dimensioned so as to be
greater and can at
least almost completely fill out the interior of the parasitic patch element
13.
The sectional view of Fig. 7 shows that the parasitic patch element 13 (which
serves to
shape the beam from the patch antenna A) is now connected directly to the
second patch
antenna B. The upper patch element 13 of the first or primary patch antenna A
may for
example consist of a metallised layer 253, which is formed directly on the
surface of the
second patch antenna B. The application of this metallised layer may be
carried out during
the production of the second patch antenna B, much as the patch plane or the
ground plane
or the metal coating on the upper or lower side of the second patch antenna
may
correspondingly be applied during the production thereof. The parasitic patch
element 13 is
thus no longer present as a physically independent element, but is a fixed
component of the
second patch antenna B.
CA 02737225 2011-03-14
14
It can thus be seen from Fig. 7 and 8 that even the separate lower ground
plane 103 of the
second patch antenna B has been dispensed with, in such a way that the
metallised layer
253 on the lower side 105b of the dielectric carrier 105 replaces and/or forms
the ground
plane 103 of the second patch antenna B as a layer 253d and this metallised
layer 253
simultaneously also forms the parasitic patch element 13. In this embodiment
the metallised
layer 253 is thus also formed, for at least part of the height thereof, on the
circumferential
rims 105d, i.e. on the outer surfaces 105d, of the second patch antenna B, and
there covers
the dielectric carrier 105. In this case the lower layer 253b, which is formed
on the dielectric
carrier 105 of the second patch antenna B on the lower side 105b, is
galvanically connected
completely or at least in portions to the metallised layers 253d, which are
provided on at
least part of the height of the outer circumferential surfaces.
It can be seen from the view of Fig. 9 that the metal coatings 253, which are
formed on the
outer sides 105d of the second dielectric carrier 105, i.e. in the
circumferential direction on
the second patch antenna B, need not always be of the same height. It can be
seen for
example that the metallised layer 253d, which is formed on one circumferential
edge 105d,
comprises recesses 253', in such a way that a metallised layer with a low
height remains,
whereas on the outer side 105d, on the right in Fig. 9, a metallised layer
which extends as
far as the upper side 105a of the substrate 105 is formed on the carrier 105.
In the variant of Fig. 10, it is shown that the circumferential metallised
layer 253d need not
be formed over the entire periphery, but the individual metallised layers 253d
on the
circumferential rims 105d of the dielectric carrier 105 may have gaps 253",
which are formed
up to the level of the lower side 105b on the dielectric carrier 105. These
gaps or recesses
253" are provided in the corner regions of the substrate in the variant of
Fig. 10.
A further variant shown in Fig. 11 demonstrates that the circumferential
metallised layers
253d, which are formed on the dielectric carrier 105, are even separated from
the metallised
layer 253b, which is formed on the lower side 105a of the dielectric carrier
105, by a
separation portion 253e, i.e. are galvanically separated in this embodiment.
In the corner
regions of the substrate, the metallised layers 253d are circumferentially
galvanically
connected in this embodiment.
In the embodiment of Fig. 12, it can be seen that the metallised layers 253
extend not only
on the lower side 105b and on the circumferential edge surfaces or outer
surfaces 105d, but
CA 02737225 2011-03-14
also continue from the outer rim 105d for a particular distance on the upper
side 105a of the
dielectric carrier 105, but end at a distance before the upper radiation plane
107 of the
second patch antenna B, in such a way that the radiation plane 107, provided
on the upper
side 105a of the substrate 105, and the metal coatings 253 are galvanically
separated. In the
embodiment shown, the electrically conductive layer 253a, which is formed on
the upper
side 105a of the substrate 105, is galvanically connected to the electrically
conductive layers
105d on the outer periphery of the substrate 105.
The cross-sectional view of Fig. 13 is intended to show that the dielectric
carrier 105 of the
second patch antenna B also need not necessarily have a rectangular form in
the vertical
cross-section (perpendicular to the individual radiation planes), but chamfers
305 may be
formed on the upper and lower side or curved elements may be formed on the
substrate
105. In the case of correspondingly applied metallised layers 253, these
layers are formed in
accordance with the corresponding outer contour of the substrate.
For the sake of completeness, it should further be noted that the dielectric
carrier 5, the
associated ground plane 3 below and the radiation plane 7, located above
opposite the
ground plane, of the first patch antenna A, as well as the dielectric carrier
105 of the second
patch antenna B and the optionally provided ground plane 103, as well as the
associated
radiation plane 107, also need not necessarily have a square or rectangular
shape, but may
be provided so as to be quite generally n-polygonal or even have curved edge
surfaces.
From the embodiments shown, in particular with reference to Fig. 3, it can be
seen that for
example the radiation plane 7 is provided with flat portions 7" in two
diagonally opposite
corner regions (i.e. formed on the first patch antenna A), whilst
corresponding flat portions
107", formed in two diagonally opposite corner regions, may also be formed in
relation to the
radiation plane 107 on the second patch antenna B. These two flat portions
107" of the
second patch antenna B are formed so as to lie at 900 to the flat portions
107" of the first
patch antenna A. Likewise, the parasitic patch element may even, for example,
be provided
with opposite flat portions 13" (as shown in Fig. 3), in a deviation from Fig.
2 and 4. The
dielectric carriers 5 and 105 may also be formed with irregular contours, in
particular
opposite flat portions, avoiding corresponding corner regions.
In the following, reference is made to yet another embodiment in accordance
with Fig. 14,
which ultimately shows an embodiment which can be described as a combination
of the
embodiment of Fig. 4 and of Fig. 11.
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This is because, in the embodiment of Fig. 14, it can be seen that an upper
parasitic patch
arrangement 13 is provided, similar to the one disclosed in Fig. 4 and the
other
embodiments. However, the further patch antenna B additionally comprises, on
the
circumferential side walls thereof, i.e. on the outer circumferential surface
105d, metallising
portions, i.e. metal coatings 253d, which in this embodiment extend only to a
partial height
(but may also be formed over the entire height of the further patch antenna
B). In the
embodiment shown, the metal coatings 253d thus extend to a height which
projects, at least
for a partial height, over the circumferential edge 13' of the upper patch
arrangement 13,
when viewed precisely from the side, but also end below this height. This
metal coating 253d
may also have portions of a different height along the circumferential
surface, with gaps, in
part with connections to a metal coating formed on the lower side of the
further patch
antenna B, etc.. Further limitations are therefore likewise not given here.
Figure 15 shows that for example the parasitic patch arrangement 13 under
discussion may
be provided, for example in two opposite corner regions, with flat portions,
recesses or what
are known as omissions 13", as has already been indicated in a plan view in
Fig. 3 and in a
three-dimensional view in Fig. 15. In other words, in this embodiment the
circumferential
rims, walls or webs 53d are also interrupted by the flat portions 13" in these
corner regions,
it being possible for the further patch antenna B, disposed in this box-shaped
or box-like
parasitic patch element 13, to project outwards in these corner regions over
the opening
regions 13a thus created, between two adjacent rim portions 53d, in such a way
that the
circumferential rim 105d of the further patch antenna B is visible.
