Note: Descriptions are shown in the official language in which they were submitted.
CA 02827450 2013-09-17
,
SUBFLOOR COMPONENT AND METHOD FOR MANUFACTURING SAME
Field of the Invention
[0001] The following is directed in general to building construction and
renovation, and more particularly to a subfloor component and a method of
manufacturing a subfloor component.
Background of the Invention
[0002] A subfloor component is a panel or other component meant to be
placed on top of a concrete floor or other foundation before a finished floor
of, for
example, hardwood or tile is installed. The subfloor component may have
projections
for permitting the flow of moisture underneath the component so as to prevent
moisture from standing underneath the subfloor component and causing problems
with mold. While subfloor components of varying types are known, improvements
are desirable.
Summary of the Invention
[0003] According to an aspect, there is provided a subfloor component
comprising an insulating foam panel having first and second opposing faces and
a
plurality of intersecting grooves to define, in cross-section, a plurality of
pedestals
having walls that extend into the panel from the first face toward the second
face; a
moisture-resistant film attached to the first face of the panel and that
conforms to the
pedestals; and a hardboard layer on the second face of the panel.
[0004] Advantageously, the subfloor component has a moisture-resistant
film
that conforms to the pedestals of the panel, such the when the pedestals are
facing
downwards against, for example, a concrete floor, moisture can travel along
the
concrete floor between the pedestals (ie. along channels formed by the grooves
of the
panel and the concrete floor) without seeping into the foam of the panel
itself.
[0005] Enabling the moisture to travel along the channels enables
drainage of
the moisture that is on the concrete floor below the panel towards the edges
of the
panels, rather than form standing-water puddles on the concrete floor.
[00061 The attaching of the moisture-resistant film to the pedestals of
the
panel provides structural integrity to particularly the foam pedestals of the
panel.
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Thus, while a subfloor component is being transported, or while the subfloor
component is being compressed against, for example, a concrete floor during
normal
use, pieces of foam do not tend to break loose of the panel. In other words,
the
moisture-resistant film, in addition to preventing ingress of moisture into
the panel,
tends to keep the foam pedestals intact.
[0007] In one embodiment, the moisture-resistant film is fused to the
panel,
providing an even more integral structure.
[0008] The hardboard layer on the second surface of the panel provides a
flat,
integrated surface upon which to overlay further flooring made of wood,
linoleum,
ceramic, stone, cork, bamboo, eucalyptus or other material. The hardboard
layer
against the foam panel provides the combination of flatness, impact-
absorption, sound
absorption, insulation and resiliency suited well for floors in dwellings.
100091 Multiple subfloor components may be installed on a concrete floor
simply by setting them down on a concrete floor adjacent to each other, or
even
somewhat spaced from each other. However, in one embodiment, each subfloor
component is shaped to connect to another subfloor component by way of tongues
and grooves on respective edges of the hardboard layer. The subfloor
components
that are so interconnected can provide an overall more uniform surface
flatness across
subfloor components and discourage shifting of the subfloor components. This
can be
useful for overlaying further flooring. Other structures for interconnecting
subfloor
components may be employed. For example, pieces of dowel may be inserted into
holes in the edges of the hardboard layers that are being installed adjacent
to each
other, with the dowel spanning between the adjacent subfloor components.
1000101 According to another aspect, there is provided a method of
manufacturing a subfloor component, comprising: providing a mold configured to
form an insulating foam panel, the mold including pedestal-forming structures
for
forming the panel to have, in cross-section, a plurality of pedestals with
walls that
extend into the panel from a first face of the panel toward a second opposing
face of
the panel; placing heat-expandable beads into the mold against the pedestal-
forming
structures; applying heat to the mold to expand the heat-expandable beads to
form the
panel, wherein the expansion of the heat-expandable beads causes the expanding
beads to enter into and conform to the pedestal-forming structures thereby to
form the
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pedestals of the panel; placing a moisture-resistant film into the mold
adjacent to the
pedestal-forming structures; applying heat to the mold to fuse the film to the
panel,
the heat causing the film to enter into and conform to the pedestals and fuse
thereto;
removing the panel with the fused moisture-resistant film from the mold;
attaching a
hardboard layer to the second face of the panel; and either prior to or after
said
attaching, forming a wove on two or more sides of said hardboard layer, each
groove
for connecting to at least one connector.
[00011] The moisture-resistant film may be a film of substantially
moisture-
impervious material. The moisture-resistant film may comprise a material
selected
from the group consisting of high-impact polystyrene, polyethylene, and ABS
(Acrylonitrile Butadiene Styrene).
[00012] The heat-expandable beads may be expandable polystyrene (EPS)
beads.
[00013] Attaching the hardboard layer may comprise applying adhesive to
one
or both of the hardboard layer and the second face of the panel.
[00014] The hardboard layer may comprise material selected from the group
consisting of OSB (oriented strand board), plywood, fiber cement board, cement
board, metal sheeting, and magnesium oxide board.
[00015] Each connector may be a connector strip comprising opposing
tongues,
the connector strip being configured for connecting adjacent subfloor
components.
According to another aspect, there is provided a method of manufacturing a
subfloor
component, comprising: providing a mold configured to form an insulating foam
panel, the mold including pedestal-forming structures for forming the panel to
have,
in cross-section, a plurality of pedestals with walls that extend into the
panel from a
first face of the panel toward a second opposing face of the panel; placing
heat-
expandable beads into the mold against the pedestal-forming structures;
applying heat
to the mold to expand the heat-expandable beads to form the panel, wherein the
expansion of the heat-expandable beads causes the expanding beads to enter
into and
conform to the pedestal-forming structures thereby to form the pedestals of
the panel;
removing the panel from the mold; placing a moisture-resistant film adjacent
the first
face of the panel; applying heat to one or both of the moisture-resistant film
and the
panel, the heat causing the film to enter into and conform to the pedestals
and fuse
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thereto; attaching a hardboard layer to the second face of the panel; and
either prior to
or after said attaching, forming a groove on two or more sides of said
hardboard layer,
each groove for connecting to at least one connector.
[00016] The placing may comprise placing the moisture-resistant film in
contact with and/or in non-contact proximity with the first face of the panel.
[00017] The moisture-resistant film may be a film of substantially
moisture-
impervious material
[00018] The moisture-resistant film may comprise a material selected from
the
group consisting of: high-impact polystyrene, polyethylene, and ABS
(Acrylonitrile
Butadiene Styrene). The heat-expandable beads may be expandable polystyrene
(BPS) beads.
[00019] Attaching the hardboard layer may comprise applying adhesive to
one
or both of the hardboard layer and the second face of the panel.
[00020] The hardboard layer may comprise material selected from the group
consisting of OSB (oriented strand board), plywood, fiber cement board, cement
board, metal sheeting, and magnesium oxide board.
1000211 Each connector may be a connector strip comprising opposing
tongues,
the connector strip being configured for connecting adjacent subfloor
components.
The forming may comprise forming a groove on each of four sides of the
hardboard
layer.
[00022] According to another aspect, there is provided a method of
manufacturing a subfloor component, comprising: providing a mold configured to
form an insulating foam panel, the mold including pedestal-forming structures
for
forming the panel to have, in cross-section, a plurality of pedestals with
walls that
extend into the panel from a first face of the panel toward a second opposing
face of
the panel; placing a moisture-resistant film into the mold adjacent to the
pedestal-
forming structures; placing heat-expandable beads into the mold against the
moisture-
resistant film opposite the pedestal-forming structures; applying heat to the
mold to
expand the heat-expandable beads to form the panel, wherein the expansion of
the
heat-expandable beads causes both the film and the expanding beads to enter
into and
conform to the pedestal-forming structures thereby to form the pedestals of
the panel
with the moisture-resistant film fused thereto; removing the panel with the
fused
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moisture-resistant film from the mold; attaching a hardboard layer to the
second face
of the panel; and either prior to or after said attaching, forming a groove on
two or
more sides of said hardboard layer, each groove for connecting to at least one
connector.
[00023] The moisture-resistant film may be a film of substantially
moisture-
impervious material
[00024] The heat-expandable beads may be expandable polystyrene (EPS)
beads. The moisture-resistant film may comprise a material selected from the
group
consisting of: high-impact polystyrene, polyethylene, and ABS.
[00025] Attaching the hardboard layer may comprise applying adhesive to
one
or both of the hardboard layer and the second face of the panel.The hardboard
layer
may comprise material selected from the group consisting of: OSB (oriented
strand
board), plywood, fiber cement board, cement board, metal sheeting, and
magnesium
oxide board.
[00026] Each connector may be a connector strip comprising opposing
tongues,
the connector strip being configured for connecting adjacent subfloor
components.
[00027] The forming may comprise forming a groove on each of four sides of
the hardboard layer.
[00028] Subfloor components may be fabricated according to these methods.
Brief Description of the Drawings
[00029] Embodiments will now be described more fully with reference to the
accompanying drawings in which:
1000301 Figure 1 is a perspective view of the underside of one embodiment
of a
subfloor component;
[00031] Figure 2 is a bottom view of the subfloor component of Figure 1;
[00032] Figure 3 is a side view of the subfloor component of Figure 1;
[00033] Figure 4 is an end view of the subfloor component of Figure 1;
[00034] Figure 5 is a top view of the subfloor component of Figure 1;
[00035] Figure 6 is a perspective view of the underside of another
embodiment
of a subfloor component;
[00036] Figure 7 is a bottom view of the subfloor component of Figure 6;
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[00037] Figure 8 is a side view of the subfloor component of Figure 6;
[00038] Figure 9 is an end view of the subfloor component of Figure 6;
[00039] Figure 10 is a top view of the subfloor component of Figure 6;
[00040] Figure 11 is a bottom view of another embodiment of a subfloor
component;
[00041] Figure 12 is a side view of the subfloor component of Figure 11;
[00042] Figure 13 is an end view of the subfloor component of Figure 11;
[00043] Figure 14 is a top view of the subfloor component of Figure 11;
[00044] Figure 15 is a bottom view of another embodiment of a subfloor
component;
[00045] Figure 16 is a side view of the subfloor component of Figure 15;
[00046] Figure 17 is an end view of the subfloor component of Figure 15;
[00047] Figure 18 is a top view of the subfloor component of Figure 15;
[00048] Figure 19 is a bottom view of another embodiment of a subfloor
component;
[00049] Figure 20 is a side view of the subfloor component of Figure 19;
[00050] Figure 21 is an end view of the subfloor component of Figure 19;
[00051] Figure 22 is a top view of the subfloor component of Figure 19;
[00052] Figure 23 is a bottom view of another embodiment of a subfloor
component;
[00053] Figure 24 is a side view of the subfloor component of Figure 22;
[00054] Figure 25 is an end view of the subfloor component of Figure 22;
[00055] Figure 26 is a top view of the subfloor component of Figure 22;
[00056] Figure 27 is a bottom view of another embodiment of a subfloor
component;
[00057] Figure 28 is a side view of the subfloor component of Figure 27;
[00058] Figure 29 is an end view of the subfloor component of Figure 28;
[00059] Figure 30 is a top view of the subfloor component of Figure 29;
[00060] Figure 31 is a bottom view of another embodiment of a subfloor
component;
[00061] Figure 32 is a side view of the subfloor component of Figure 31;
[00062] Figure 33 is an end view of the subfloor component of Figure 31;
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[00063] Figure 34 is a top view of the subfloor component of Figure 31;
[00064] Figure 35 is a perspective view of a moisture-resistant film layer
being
placed against pedestal-forming structures that are within one of the
components of a
mold structure during manufacture of the subfloor component of Figure 1;
[00065] Figure 36 is a perspective view of expandable polystyrene beads
being
poured into the mold structure atop the moisture-resistant film layer;
[00066] Figure 37 is a perspective view of a mold structure being closed
prior
to applying heat to the mold;
[00067] Figure 38 is a cutaway view of the end of the mold structure
enclosing
the moisture-resistant film layer and the expandable polystyrene beads while
the mold
structure is being heated;
[00068] Figure 39 is a perspective view of the insulating foam panel
having
been formed with pedestals within the mold and the moisture-resistant film
layer
fused to the panel's pedestals;
[00069] Figure 40 is a perspective view of the hardboard layer being
aligned
with the face of the insulating foam panel that is opposite to the panel's
pedestals;
[00070] Figure 41 is a perspective view of the subfloor component having
been
formed;
[00071] Figure 42 is a flowchart of steps for manufacturing a subfloor
component;
[00072] Figure 43 is a perspective view of expandable polystyrene beads
being
poured into a mold structure, and against pedestal-forming structures within
the mold
structure, during manufacture of the subfloor component of Figure 1, according
to
another embodiment;
[00073] Figure 44 is a perspective view of the mold structure being closed
prior
to applying heat to the mold;
[00074] Figure 45 is a cutaway view of the end of the mold structure
enclosing
the expandable polystyrene beads while the mold structure is being heated;
[00075] Figure 46 is a perspective view of a moisture-resistant film layer
placed against the pedestal-forming structures within the mold structure, and
the
insulating foam panel being placed against the moisture-resistant film layer;
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1000761 Figure 47 is a flowchart of steps for manufacturing a subfloor
component, according to the embodiment of Figures 43 to 46;
1000771 Figure 48 is a perspective view of a moisture-resistant film layer
being
placed against an insulating foam panel during manufacture of the subfloor
component of Figure 1, according to another embodiment;
1000781 Figure 49 is a flowchart of steps for manufacturing a subfloor
component, according to the embodiment of Figure 48; and
1000791 Figure 50 is an exploded side view of a portion two subfloor
components according to another embodiment, and a connector strip
therebetween.
Detailed Description of the Embodiments
[00080] In Figures 1 through 5, there is shown a subfloor component 10
according to an embodiment. Subfloor component 10 is rectangular in shape, and
includes a hardboard panel 12, an insulating foam panel 14, and a moisture-
resistant
film 16. The insulating foam panel 14 includes first and second opposing
faces.
Multiple intersecting grooves in the first face define, in cross-section,
multiple
pedestals 17 that have walls that extend into the insulating foam panel 14
from the
first face toward the second face. The moisture-resistant film 16 is attached
to the
first face of the panel and conforms to the pedestals 17. The hardboard layer
12 is on
the second face of the panel, which is opposite the panel 14 from the first
face.
1000811 In this embodiment, the hardboard panel 12 is oriented strand
board
(OSB), a material well-known to be employed in building construction. Also in
this
embodiment, the insulating foam panel 14 is formed of expanded polystyrene
(EPS),
and the hardboard panel 12 is glued to the insulating foam panel 14.
Furthermore, in
this embodiment the moisture-resistant film 16 is a thin layer of high-impact
polystyrene.
[00082] In this embodiment, the moisture-resistant film 16 is fused to the
insulating foam panel 14 such that the moisture-resistant film 16 is affixed
to the top
and wall of the pedestals 17 as well as to the bottom of the grooves. The
subfloor
component 10 is to be placed on a foundation floor or other such structure
with the
pedestals 17 downwards and with the moisture-resistant film 16 between the
insulating foam layer 14 and the foundation floor. Moisture on the foundation
floor is
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able to pass between the pedestals 17 and can contact the moisture-resistant
film 16 in
order to drain away from underneath the subfloor component 10. The moisture-
resistant film layer 16 effectively resists the passage of moisture into the
insulating
foam panel 14 from the foundation floor thereby keeping the insulating foam
panel 14
suitably dry.
[00083] The fusing of the moisture-resistant film 16 and the insulating
foam
panel 14 enables the pedestals 17 to which the moisture-resistant film is
conforming
to have increased resistance to breakage. As would be understood, as useful as
expanded EPS is for insulation, it can be brittle. In this embodiment, the
pedestals 17,
which are shaped as squares, each have four (4) walls meeting at four (4)
edges and
four (4) top corners. Particularly the top corners and also the edges are most
prone to
being broken away during transportation, installation, or usage. The present
inventor
has discovered that, particularly for a subfloor component 10 that will be
experiencing
various physical pressures from above, advantages are gained by employing a
moisture-resistant film 16 that not only resists moisture reaching the
insulating foam
panel 16 but conforms to the pedestals in order to provide drainage and also
increase
the structural integrity of the pedestals 17. In this way, physical pressures
both during
construction (workers, wheel barrows, other machinery) and when construction
is
complete (home owners, employees, couches, filing cabinets etc.) can be better
withstood by the pedestals 17.
[00084] In this embodiment, the walls of the intersecting grooves have a
height
of about 15 millimetres, giving the pedestals 17 a corresponding height.
However,
other heights are possible. For example, other embodiments may provide heights
of
between about 15 millimetres to about 20 millimetres. Furthermore, in this
embodiment, the intersecting grooves have a width of about 15 millimetres,
giving the
pedestals 17 a corresponding spacing. However, other widths are possible. For
example, other embodiments may provide widths of between about 15 millimetres
to
about 20 millimetres. It will be understood that having all grooves have the
same
width is not required.
[00085] While the above-described subfloor component 10 can be useful for
many purposes, the present inventor has also developed additional embodiments.
For
example, Figures 6 through 10 show a subfloor component 10a according to
another
CA 02827450 2013-09-17
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- 10 -
embodiment. Subfloor component 10a is square in shape, and includes a
hardboard
panel 12a, an insulating foam panel 14a, and a moisture-resistant film 16a.
Like the
embodiment described in Figures 1 through 5, the insulating foam panel 14a
includes
first and second opposing faces. Multiple intersecting grooves in the first
face define,
in cross-section, multiple pedestals 17a that have walls that extend into the
insulating
foam panel 14a from the first face toward the second face. The moisture-
resistant
film 16a is attached to the first face of the panel and conforms to the
pedestals 17a.
The hardboard layer 12a is on the second face of the panel, which is opposite
the
panel 14a from the first face. As can be seen, subfloor component 10a is
similar to
subfloor component 10, but is square instead of rectangular.
[00086] Figures 11 through 14 show a subfloor component 10b
according to
another embodiment. Subfloor component 10b is square in shape, and includes a
hardboard panel 12b, an insulating foam panel 14b, and a moisture-resistant
film 16b.
Like the embodiment described in Figures 1 through 5, the insulating foam
panel 14b
includes first and second opposing faces. Multiple intersecting grooves in the
first
face define, in cross-section, multiple pedestals 17b that have walls that
extend into
the insulating foam panel 14b from the first face toward the second face. The
moisture-resistant film 16b is attached to the first face of the panel and
conforms to
the pedestals 17b. The hardboard layer 12b is on the second face of the panel,
which
is opposite the panel 14b from the first face. As can be seen, subfloor
component 10b
is similar to subfloor component 10, but is square instead of rectangular.
Furthermore, each of the pedestals 17b are circular, rather than square. The
pedestals
17b being circular means that each pedestal 17b only has one wall, and thus
there are
no top corners. Because pedestal 17b does not have any top comers, breakage
due to
handling or use of the subfloor component lob is even less likely.
[00087] Figures 15 through 18 show a subfloor component 10c
according to
another embodiment. Subfloor component 10c is square in shape, and includes a
hardboard panel 12c, an insulating foam panel 14c, and a moisture-resistant
film 16c.
Like the embodiment described in Figures 1 through 5, the insulating foam
panel 14c
includes first and second opposing faces. Multiple intersecting grooves in the
first
face define, in cross-section, multiple pedestals 17c that have walls that
extend into
the insulating foam panel 14c from the first face toward the second face. The
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moisture-resistant film 16c is attached to the first face of the panel and
conforms to
the pedestals 17c. The hardboard layer 12c is on the second face of the panel,
which
is opposite the panel 14c from the first face. As can be seen, subfloor
component 10c
is similar to subfloor component 10, but is square instead of rectangular.
Furthermore, each of the pedestals 17c are oval-shaped, rather than square.
The
pedestals 17c being oval-shaped means that each pedestal 17c only has one
wall, and
thus there are no top corners. Because pedestal 17c does not have any top
corners,
breakage due to handling or use of the subfloor component 10c is less likely.
[00088] Figures 19 through 22 show a subfloor component 10d according to
another embodiment. Subfloor component 10d is square in shape, and includes a
hardboard panel 12d, an insulating foam panel 14d, and a moisture-resistant
film 16d.
Like the embodiment described in Figures 1 through 5, the insulating foam
panel 14d
includes first and second opposing faces. Multiple intersecting grooves in the
first
face define, in cross-section, multiple pedestals 17d that have walls that
extend into
the insulating foam panel 14d from the first face toward the second face. The
moisture-resistant film 16d is attached to the first face of the panel and
conforms to
the pedestals 17d. The hardboard layer 12a is on the second face of the panel,
which
is opposite the panel 14d from the first face. As can be seen, subfloor
component 10d
is similar to subfloor component 10, but is square instead of rectangular.
Furthermore, there are two different sizes of pedestals 17d, namely a thin
rectangle
and a thick rectangle.
[00089] Figures 23 through 26 show a subfloor component 10d according to
another embodiment. Subfloor component 10e is square in shape, and includes a
hardboard panel 12e, an insulating foam panel 14e, and a moisture-resistant
film 16e.
Like the embodiment described in Figures 1 through 5, the insulating foam
panel 14e
includes first and second opposing faces. Multiple intersecting grooves in the
first
face define, in cross-section, multiple pedestals 17e that have walls that
extend into
the insulating foam panel 14e from the first face toward the second face. The
moisture-resistant film 16e is attached to the first face of the panel and
conforms to
the pedestals 17e. The hardboard layer 12e is on the second face of the panel,
which
is opposite the panel 14e from the first face. As can be seen, subfloor
component 10e
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is similar to subfloor component 10, but is square instead of rectangular.
Furthermore, the pedestals 17e are diamond-shaped.
[00090] Figures 27 through 30 show a subfloor component 10f according to
another embodiment. Subfloor component 10f is square in shape, and includes a
hardboard panel 12f, an insulating foam panel 14f, and a moisture-resistant
film 16f.
Like the embodiment described in Figures 1 through 5, the insulating foam
panel 14f
includes first and second opposing faces. Multiple intersecting grooves in the
first
face define, in cross-section, multiple pedestals 17f that have walls that
extend into
the insulating foam panel 14f from the first face toward the second face. The
moisture-resistant film 16f is attached to the first face of the panel and
conforms to
the pedestals 17f. The hardboard layer 12f is on the second face of the panel,
which is
opposite the panel 14f from the first face. As can be seen, subfloor component
10f is
similar to subfloor component 10, but is square instead of rectangular.
Furthermore,
the pedestals 17f are all rectangles.
[00091] Figures 31 through 34 show a subfloor component lOg according to
another embodiment. Subfloor component lOg is square in shape, and includes a
hardboard panel 12g, an insulating foam panel 14g, and a moisture-resistant
film 16g.
Like the embodiment described in Figures 1 through 5, the insulating foam
panel 14g
includes first and second opposing faces. Multiple intersecting grooves in the
first
face define, in cross-section, multiple pedestals 17g that have walls that
extend into
the insulating foam panel 14g from the first face toward the second face. The
moisture-resistant film 16g is attached to the first face of the panel and
conforms to
the pedestals 17g. The hardboard layer 12g is on the second face of the panel,
which
is opposite the panel 14g from the first face. As can be seen, subfloor
component 10g
is similar to subfloor component 10, but is square instead of rectangular.
Furthermore, the pedestals 17g are all hexagons.
[00092] It will be understood that a subfloor component with pedestals of
different shapes, including others not disclosed above, or mixtures of
differently-
shaped pedestals such as those described above, may be provided.
[00093] The various subfloor components described herein may generally be
used alongside each other in a particular installation, provided that the
overall
thicknesses of two different panels are similar, and provided that using
differently-
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shaped pedestals in two different subfloor components does not unduly impede
the
flow of moisture beneath the subfloor components. In one embodiment, subfloor
components have tongue and groove configurations along the edges which abut
against each other, such that the tongue of one panel can be received within
the
groove of the adjacent panel. The tongues/grooves may have square, rectangular
configurations with or without rounded distal corners. The tongue and groove
configuration may be formed prior to, or after, attaching the hardboard panel
to the
insulating foam panel.
[00094] Figure 42 shows a flowchart of steps of a method of manufacturing
a
subfloor component such as subfloor component 10 described above. The
treatment
of the materials involved in the steps are illustrated in Figures 35 through
41. In
Figure 35, a mold structure is shown have a top portion 50 and a bottom
portion 52. It
will be understood that the terms top and bottom may be interchanged with left
and
right, for example, in the case of a mold structure that stands vertically.
[00095] First, a generally-flat piece of moisture-resistant film 16 is
placed
within the bottom portion 52 of the mold structure on top of and therefore
adjacent to
pedestal-forming structures 54 (step 100), as shown in Figure 35. The pedestal
forming structures 52 are part of the mold structure and have a shape
corresponding to
the shape of the desired pedestals 17. With the moisture-resistant film 16
adjacent to
the pedestal-forming structures 54, heat-expandable beads 56 are then placed
into the
mold structure on top of the moisture-resistant film 16 (step 200), as shown
in Figure
36. The heat-expandable beads are thus placed against a side of the moisture-
resistant
film 16 that is opposite the pedestal forming structures 54. As shown in
Figure 37,
with the moisture-resistant film 16 and the heat-expandable beads 56 within
the mold
structure between top 50 and bottom 52 portions, the mold structure is then
closed.
At this point, heat is then applied to the mold structure (step 300) so as to
cause the
heat-expandable beads 56 to expand and fuse together. While the heat-
expandable
beads 56 are expanding to form the insulating foam panel 14, the pressure of
the
expansion causes both the moisture-resistant film 16 and the expanding beads
56 to
enter into and conform to the pedestal-forming structures 54, as shown in the
cutaway
view of Figure 38. The moisture-resistant film being of high-impact
polystyrene
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fuses at its surface under the applied heat to the facing surface of the
insulating foam
panel 14 being formed.
[00096] With the insulating foam panel 14 having been formed with
pedestals
17 and having been fused to moisture-resistant film 16, as shown in Figure 39,
the
combination is then removed from the mold structure (step 400). As shown in
Figures 40 and 41, the hardboard layer 12 is then adhered to the combination
that was
removed from the mold structure, thereby to form the subfloor component 10.
[00097] Other methods may be used to manufacture a subfloor component,
such as the subfloor component 10 described above. For example, Figure 47
shows a
flowchart of steps of a method of manufacturing a subfloor component such as
subfloor component 10 described above. The treatment of the materials involved
in
some of the steps is illustrated in Figures 43 through 46. In Figure 43, a
mold
structure is shown as having a top portion 50 and a bottom portion 52. It will
be
understood that the terms top and bottom may be interchanged with left and
right, for
example, in the case of a mold structure that stands vertically.
[00098] First, heat-expandable beads 56 are placed into the mold structure
within the bottom portion 52 of the mold structure on top of and therefore
adjacent to
pedestal-forming structures 54 (step 610), as shown in Figure 43. As shown in
Figure
44, with the heat-expandable beads 56 within the mold structure between top 50
and
bottom 52 portions, the mold structure is then closed. At this point, heat is
then
applied to the mold structure (step 620) so as to cause the heat-expandable
beads 56 to
expand and fuse together. While the heat-expandable beads 56 are expanding to
form
the insulating foam panel 14, the pressure of the expansion causes the
expanding
beads 56 to enter into and conform to the pedestal-forming structures 54, as
shown in
the cutaway view of Figure 45.
[00099] With the insulating foam panel 14 having been formed with
pedestals
17, the mold structure is then opened and a generally-flat piece of moisture-
resistant
film 16 is placed within the bottom portion 52 of the mold structure on top of
and
therefore adjacent to pedestal-forming structures 54 (step 630), and under the
pedestals 17 of the insulating foam panel 14, as shown in Figure 46. With the
moisture-resistant film 16 within the mold structure between the insulating
foam
panel 14 and bottom portion 52, the mold structure is then closed either
partially or
CA 02827450 2013-09-17
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completely. Heat is applied to the mold structure (step 640) so as to cause
the
moisture-resistant film 16 to enter into and conform to the pedestal-forming
structures
54 and to the pedestals 17. The moisture-resistant film being of high-impact
polystyrene fuses at its surface under the applied heat to the facing surface
of the
insulating foam panel 14.
[000100] With the insulating foam panel 14 having been fused to moisture-
resistant film 16, the combination is then removed from the mold structure
(step 650).
The hardboard layer 12 is then adhered to the combination that was removed
from the
mold structure (step 660), thereby to form the subfloor component 10.
[000101] Still other methods may be used to manufacture a subfloor
component,
such as the subfloor component 10 described above. For example, Figure 49
shows a
flowchart of steps of a method of manufacturing a subfloor component such as
subfloor component 10 described above.
[000102] First, heat-expandable beads 56 are placed into the mold structure
within the bottom portion 52 of the mold structure on top of and therefore
adjacent to
pedestal-forming structures 54 (step 710), as described above and with
reference to
Figure 43. With the heat-expandable beads 56 within the mold structure between
top
50 and bottom 52 portions, the mold structure is then closed. Again, it will
be
understood that the terms top and bottom may be interchanged with left and
right, for
example, in the case of a mold structure that stands vertically. At this
point, heat is
then applied to the mold structure (step 720) so as to cause the heat-
expandable beads
56 to expand and fuse together. While the heat-expandable beads 56 are
expanding to
form the insulating foam panel 14, the pressure of the expansion causes the
expanding
beads 56 to enter into and conform to the pedestal-forming structures 54, as
described
above and with reference to Figure 45.
[000103] With the insulating foam panel 14 having been formed with
pedestals
17, the mold is then opened and the insulating foam panel 14 is then removed
from
the mold structure (step 730). A generally-flat piece of moisture-resistant
film 16 is
placed adjacent the tops of the pedestals 17 of the insulating foam panel 14
(step 740).
It will be understood that the moisture-resistant film 16 may be placed in
contact with
and/or in non-contact proximity with tops of the pedestals 17 of the
insulating foam
panel 14. Heat is then applied to one or both of the moisture-resistant film
16 and the
CA 02827450 2013-09-17
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insulating foam panel 14 (step 750), so as to cause the moisture-resistant
film 16 to
enter into and conform to the pedestals 17 of the insulating foam panel 14.
The
moisture-resistant film being of high-impact polystyrene fuses at its surface
under the
applied heat to the facing surface of the insulating foam panel 14. During
this step,
the heat may be applied by any suitable heat source, such as for example a hot
air
blower, one or more heating elements, an oven, and the like.
[000104] With the insulating foam panel 14 having been fused to moisture-
resistant film 16, the hardboard layer 12 is then adhered to the combination
that was
removed from the mold structure (step 750), thereby to form the subfloor
component
10.
[000105] Although in embodiments described above, the subfloor components
have tongue and groove configurations along the edges which abut against each
other,
in other embodiments, other configurations may be used. For example, in other
embodiments, the subfloor components may alternatively have grooves along the
edges, and with each groove being configured to receive a connector for
connecting
adjacent subfloor components. The connector may be, for example, a
longitudinal
connector strip comprising opposing tongues, with each tongue being shaped to
be
received by a respective groove.
[000106] For example, Figure 50 shows two adjacent subfloor components 10,
each subfloor component 10 including a hardboard panel 12, an insulating foam
panel
14, and a moisture-resistant film (not shown). The insulating foam panel 14
includes
first and second opposing faces, with multiple intersecting grooves in the
first face
defining, in cross-section, multiple pedestals (not shown), as in subfloor
component
described above and with reference to Figures 1 to 5. Each hardboard panel 12
has
two (2) grooves 882 formed therein on opposing sides. In this embodiment, the
adjacent subfloor components 10 are configured to be connected by a connector
in the
form of a longitudinal connector strip 890. The connector strip 890 comprises
two (2)
opposing tongues 894, with each tongue 894 being shaped to be received by a
respective groove 882 for connecting the adjacent subfloor components 10.
[000107] Although in the embodiment shown in Figure 50, there are grooves
formed along two (2) opposing sides of the hardboard panel, in other
embodiments,
there may alternatively be grooves formed along the four (4) sides of the
hardboard
CA 02827450 2014-04-17
- 17 -
panel. The grooves may be formed prior to, or after, attaching the hardboard
panel to
the insulating foam panel.
[000108] In other embodiments, the moisture-resistant film may be made of
other materials, such as polyethylene, or ABS (Acrylonitrile Butadiene
Styrene).
Furthermore, materials for the hardboard layer may be selected from plywood,
fiber
cement board, cement board, metal sheeting, and magnesium oxide board. Other
materials, provided that they may be adhered to the insulating foam panel and
provide
a suitable amount of rigidity, may be employed for a hardboard layer.
[000109] Furthermore, while in the embodiments disclosed above the
pedestals
are generally uniformly distributed across the insulating foam panel,
alternatives may
be provided having pedestals that are not so uniformly distributed.
[000110] Although embodiments have been described above with reference to
the accompanying drawings, those of skill in the art will appreciate that
variations and
modifications may be made without departing from the scope thereof as defined
by
the appended claims.
