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Patent 2844719 Summary

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(12) Patent Application: (11) CA 2844719
(54) English Title: HIGH POWER LED BULB
(54) French Title: AMPOULE A DIODES ELECTROLUMINESCENTES DE FORTE PUISSANCE
Status: Dead
Bibliographic Data
(51) International Patent Classification (IPC):
  • F21V 29/83 (2015.01)
  • F21V 17/00 (2006.01)
(72) Inventors :
  • NI, LIANG (China)
(73) Owners :
  • NI, LIANG (China)
(71) Applicants :
  • NI, LIANG (China)
(74) Agent: DALE & LESSMANN LLP
(74) Associate agent:
(45) Issued:
(22) Filed Date: 2014-03-04
(41) Open to Public Inspection: 2014-09-13
Availability of licence: N/A
(25) Language of filing: English

Patent Cooperation Treaty (PCT): No

(30) Application Priority Data:
Application No. Country/Territory Date
201320112307.1 China 2013-03-13

Abstracts

English Abstract



The invention relates to LED lighting technology, more particularly a high
power LED bulb
which improves heat dissipation effect by improving heat dissipation channels
of an LED bulb.
The high power LED bulb comprises a holder, a lamp housing and a lamp shade,
the holder is
internally provided with a power module, the lamp housing is internally
provided with a
substrate and radiators, LEDs are installed on the substrate, sealed in the
lamp shade and
connected with the power module, the substrate is provided with a through
hole, the holder is of
tubular shape and has a sealed end and an open end extending into the lamp
housing and
communicated with the outside through the through hole, a vent hole is
arranged on the holder
exposing the lamp housing, and the lamp housing is provided with heat
dissipation holes
communicated with the outside through the through hole. The high power LED
bulb greatly
improves heat dissipation effect of LED bulbs.


Claims

Note: Claims are shown in the official language in which they were submitted.


- 7 -
CLAIMS
WHAT IS CLAIMED IS:
1. A high power LED bulb, comprising a holder, a lamp housing and a lamp
shade, the holder
being internally provided with a power module, the lamp housing being
internally provided
with a substrate and radiators, and LEDs being installed on the substrate,
sealed in the
lamp shade and connected with the power module, characterized in that the
substrate is
provided with a through hole, the holder is of tubular shape and has a sealed
end and an
open end extending into the lamp housing and communicated with the outside
through the
through hole, a vent hole is arranged on the holder exposing the lamp housing,
and the
lamp housing is provided with heat dissipation holes communicated with the
outside
through the through hole.
2. The high power LED bulb of claim 1, characterized in that the open end of
the holder is of
conical shape and passes through the through hole.
3. The high power LED bulb of claim 1, characterized in that the LEDs are
uniformly
distributed around the through hole.
4. The high power LED bulb of claim 3, characterized in that installation
positions of the
LEDs are corresponding to installation positions of the radiators.
5. The high power LED bulb of claim 1, characterized in that the heat
dissipation holes are
arranged on the side wall and/or at the top of the lamp housing.
6. The high power LED bulb of any one of claims 1 to 5, characterized in that
the substrate is
an aluminum substrate.
7. The high power LED bulb of claim 6, characterized in that the radiators are
graphite
radiators.

Description

Note: Descriptions are shown in the official language in which they were submitted.


CA 02844719 2014-03-04
- 1 -
High Power LED Bulb
Field of the Invention
[0001] The invention relates generally to the field of LED lighting
technology, in particular
to a high power LED bulb.
Description of the Related Art
[0002] In recent years, LED lighting technology has developed rapidly, and
various high
power LED bulbs have been available in the market successively and widely
applied. An LED
bulb has comparatively similar appearance and structure to general lighting
bulbs such as
incandescent lamps and energy-saving lamps, and is composed of a holder, a
lamp housing and
a lamp shade. The holder is generally of screw structure and can be directly
connected to
alternating current. The holder is internally provided with a power module for
converting AC
voltage into LED operating voltage. The lamp housing is internally provided
with a substrate
and radiators, and LEDs of different quantities are installed on the substrate
based on different
powers and LED power capacities. In order to protect LED chips and avoid
stimulation from
strong light, the LEDs are sealed in the lamp shade, and each LED is connected
with the power
module through a circuit on the substrate. However, as high power LEDs have
large calorific
capacity in operation, LED chips will suffer from irreversible damage if heat
is untimely
exchanged with the atmosphere, accelerating light failure of LEDs. Existing
high power LED
bulbs have inappropriate heat dissipation in structural design, resulting in
abnormal light failure
of LED and shortened service life of LED drive power. In practical
application, these LED
bulbs have low heat dissipation efficiency, resulting in heat accumulation and
accelerating light
failure of LEDs. Meanwhile, heated air rises, and temperature at holder part
rises, aggravating
heat accumulation of the power modules encapsulated in the holders, thus
greatly shortening
the service life of power module components, and becoming bottleneck of the
service life of
high power LED bulbs.
Summary of the Invention
[0003] For the structural disadvantage of poor heat dissipation of high power
LED bulbs in
the prior art, a technical problem to be solved by the invention is to provide
a high power LED
bulb to improve heat dissipation effect by improving heat dissipation channels
of an LED bulb.

CA 02844719 2014-03-04
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[0004] A technical solution to solving the technical problem is a high power
LED bulb
comprising a holder, a lamp housing and a lamp shade, the holder is internally
provided with a
power module, the lamp housing is internally provided with a substrate and
radiators, and
LEDs are installed on the substrate, sealed in the lamp shade and connected
with the power
module, and the high power LED bulb is characterized in that the substrate is
provided with a
through hole, the holder is of tubular shape and has a sealed end and an open
end extending
into the lamp housing and communicated with the outside through the through
hole, a vent hole
is arranged on the holder exposing the lamp housing, and the lamp housing is
provided with
heat dissipation holes communicated with the outside through the through hole.
[0005] The technical solution is as follows: heat generated by the power
module in the
tubular holder can be dissipated by convection through the open end and the
vent hole on the
holder, and heat generated by the radiators installed on the substrate can be
dissipated by
convection through the through hole on the substrate and the heat dissipation
holes on the lamp
housing. The two heat dissipation channels are independent, thus greatly
improving heat
dissipation effect on the premise of ensuring seal integrity of LEDs.
[0006] Preferably, the open end of the holder is of conical shape and passes
through the
through hole.
[0007] The open end of the holder is of conical shape and passes through the
through hole,
and can isolate the two heat dissipation channels in a better manner.
Increased length of the
tubular holder is favorable for improving heat dissipation of the power module
in the holder.
The conical structure of the open end of the holder can increase air
circulation and improve
heat dissipation effect of radiators in the lamp housing.
[0008] Further, the LEDs are uniformly distributed around the through hole.
[0009] Uniform distribution of the LEDs can improve luminance uniformity of
the bulb, and
improve lighting effects.
[0010] The recommended installation positions of the LEDs are corresponding to
installation
positions of the radiators.

CA 02844719 2014-03-04
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[0011] In the solution, the radiators and the LEDs are respectively installed
at both sides of
the substrate, and the installation positions of the radiators are
corresponding to the installation
positions of the and the LEDs, which is favorable for improving heat
dissipation effect of the
LEDs and reducing light failure.
[0012] Specifically, the heat dissipation holes are arranged on the side
wall and/or at the top
of the lamp housing.
[0013] The heat dissipation holes are arranged on the side wall or at the top
of the lamp
housing, and can be selected based on detailed design. Dustproof effect is
good when the heat
dissipation holes are arranged on the side wall of the lamp housing, and air
mobility is good
when the heat dissipation holes are arranged at the top of the lamp housing,
either of them has
its own advantage.
[0014] Specifically, the substrate is an aluminum substrate.
[0015] Aluminum substrate is a widely used LED lighting substrate, and
characterized by
low cost and high thermal conductivity.
[0016] Specifically, the radiators are graphite radiators.
[0017] Graphite radiators are characterized by convenient processing and good
formability,
and very suitable for heat dissipation of LED lighting devices.
[0018] The high power LED bulb has the following benefits: the power module
and heat
dissipation channels of the LED radiators are reasonably designed based on
structural features
of the bulb, thus greatly improving heat dissipation efficiency and extending
the service life of
the bulb. The high power LED bulb is also characterized by compact structure
and attractive
appearance.
Brief Description of the Drawings
[0019] Figure 1 is a schematic diagram of example 1;
[0020] Figure 2 is a top view of Figure 1;
[0021] Figure 3 is a schematic diagram of distribution of LEDs on a substrate
of example 1;

CA 02844719 2014-03-04
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[0022] Figure 4 is a schematic diagram of distribution of radiators on the
substrate of
example 1;
[0023] Figure 5 is a schematic diagram of example 2;
[0024] Figure 6 is a top view of Figure 5;
[0025] Figure 7 is a schematic diagram of distribution of LEDs on the
substrate of example
2; and
[0026] Figure 8 is a schematic diagram of distribution of radiators on the
substrate of
example 2.
[0027] In the figures, 1 represents a holder, 10 represents a vent hole, 11
represents a power
module, 2 represents a lamp housing, 20 represents heat dissipation holes, 21
represents
radiators, 3 represents a lamp shade; 30 represents LEDs, 31 represents a
substrate, 32
represents a through hole, and arrows A and B represent air flow directions.
Description of the Preferred Embodiments
[0028] The technical solution will be described in detail in combination with
drawings and
examples.
[0029] For the high power LED bulb, different heat dissipation channels are
designed for the
power module and LED radiators so as to completely avoid heat accumulation and

superposition, and greatly improve heat dissipation conditions of the bulb.
Heat generated by
the power module in the tubular holder can be dissipated by convection through
the open end
and the vent hole on the holder, and heat generated by the radiators installed
on the substrate
can be dissipated by convection through the through hole on the substrate and
the heat
dissipation holes on the lamp housing. The two heat dissipation channels are
independent, thus
greatly improving heat dissipation effect on the premise of ensuring seal
integrity of LEDs.
[0030] Example 1
[0031] Referring to Figures 1 to 4, the high power LED bulb in the example
comprises a
holder 1, a lamp housing 2 and a lamp shade 3. The holder 1 is internally
provided with a
power module 11, the lamp housing 2 is internally provided with an aluminum
substrate 31 and
graphite radiators 21, and six LEDs 30 are installed on the back of the
aluminum substrate 31,

CA 02844719 2014-03-04
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uniformly distributed around a through hole 32 on the aluminum substrate 31,
and sealed in the
lamp shade 3. Radiators 21 of the same number are installed at positions
corresponding to the
LEDs 30 on the front of the aluminum substrate 31 for improving heat
dissipation effect. If
power of each LED is low and installation density is low, the quantity of
radiators 21 can be
properly reduced to reduce the bulb weight and cost. The lamp shade 3 is
generally made of a
transparent material such as glass, the lamp housing 2 can be made of plastic
or metal, and the
holder 1 has metal thread for connecting to alternating current. The aluminum
substrate 31 is
provided with circuits, and the LEDs 30 are connected with the power module 11
through
leads. It can be seen from Figure 1 that the holder 1 in the example is of
tubular shape and has a
sealed end and an open end, the open end is of conical shape, extends into the
lamp housing 2
and is communicated with the outside through the through hole 32 on the
aluminum substrate
31. A vent hole 10 is arranged on the holder 1 exposing the lamp housing 2 and
communicated
with the open end of the holder 1, and air enters the holder 1 in the
direction of arrow B and
carries away heat generated by the power module 11 through the through hole
10. Heat
dissipation holes 20 arranged on the lamp housing 2 are communicated with the
outside
through the through hole 32, and air enters the lamp housing 2 in the
direction of arrow A,
exchanges heat with the radiators 21 and carries away heat through the heat
dissipation holes
20. The conical structure of the open end of the holder 1 can increase air
flow in the direction
of arrow A and improve heat dissipation effect of the radiators 21 in the lamp
housing 2. It can
be seen from Figures 1 and 2 that the heat dissipation holes 20 in the example
are arranged at
the top of the lamp housing 2, and uniformly distributed around the holder 1.
Such heat
dissipation holes can be made into heat dissipation holes of shutter type to
improve dustproof
effect. The LED bulb in the example has a cylindrical shape and a symmetrical
structure, thus
the LED bulb is beautiful and practical, and easy in processing and
manufacture.
[0032] Example 2
[0033] The LED bulb in the example has a structure as showed in Figures 5 to
8, the holder
1 is of cylindrical shape, the lamp housing 2 is of right quadrangular prism
shape, and the
corresponding aluminum substrate 31 is of square shape, as shown in Figures 7
and 8. As
shown in Figure 5, the heat dissipation holes 20 in the example are arranged
on the side wall of

CA 02844719 2014-03-04
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the lamp housing 2 for dust prevention and heat dissipation. Refer to
description of example 1
for other structures in the example.
[0034] Various embodiments of the invention have now been described in detail.
Those
skilled in the art will appreciate that numerous modifications, adaptations
and variations may
be made to the embodiments without departing from the scope of the invention,
which is
defined by the appended claims. The scope of the claims should be given the
broadest
interpretation consistent with the description as a whole and not to be
limited to these
embodiments set forth in the examples or detailed description thereof.

Representative Drawing
A single figure which represents the drawing illustrating the invention.
Administrative Status

For a clearer understanding of the status of the application/patent presented on this page, the site Disclaimer , as well as the definitions for Patent , Administrative Status , Maintenance Fee  and Payment History  should be consulted.

Administrative Status

Title Date
Forecasted Issue Date Unavailable
(22) Filed 2014-03-04
(41) Open to Public Inspection 2014-09-13
Dead Application 2017-03-06

Abandonment History

Abandonment Date Reason Reinstatement Date
2016-03-04 FAILURE TO PAY APPLICATION MAINTENANCE FEE

Payment History

Fee Type Anniversary Year Due Date Amount Paid Paid Date
Application Fee $400.00 2014-03-04
Owners on Record

Note: Records showing the ownership history in alphabetical order.

Current Owners on Record
NI, LIANG
Past Owners on Record
None
Past Owners that do not appear in the "Owners on Record" listing will appear in other documentation within the application.
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Document
Description 
Date
(yyyy-mm-dd) 
Number of pages   Size of Image (KB) 
Abstract 2014-03-04 1 23
Description 2014-03-04 6 266
Claims 2014-03-04 1 36
Drawings 2014-03-04 7 182
Representative Drawing 2014-08-18 1 32
Cover Page 2014-10-10 2 71
Assignment 2014-03-04 5 98