Note: Descriptions are shown in the official language in which they were submitted.
TRANSPORTABLE DATACENTER
Field
[1] The described embodiments relates to transportable datacenters.
Background
[2] Many datacenter facilities have very high power requirements and can
require
substantial cooling to maintain computing equipment within its acceptable
operating
conditions. It can be advantageous to locate such datacenter facilities in
geographical
locations with relatively low-cost electrical power, cold ambient air
temperatures, or a
combination of both. In a datacenter, electrical power is used for two things:
to power
the many microprocessors within, and to drive cooling of the microprocessors
to
maintain a safe operating temperature.
[3] Active cooling (i.e. using a chiller, condenser, pump, cooling towers,
etc.) is one
commonly used option for cooling the datacenter. This approach has drawbacks
however, including high electrical power requirements, high equipment costs,
and high
maintenance costs.
[4] The economics of data processing on a large scale often vary
considerably
based on the availability of low-cost power. Cold ambient air is desirable as
an input to
reduce electrical power consumption for cooling. The opportunity to exhaust
heated air
into the atmosphere is also desirable.
[5] Conventional datacenter design has drawbacks that inhibit such designs
from
use in transportable datacenter facilities. For example, conventional
datacenter design
generally involves air intake from fans or an air conditioning unit via a
raised floor
having gratings generally in front of each rack in the cold air plenum, and
air exhausted
upwards and into a return air plenum in the ceiling. Such a design itself
presents
numerous challenges for use in transportable datacenter facilities. For
example, access
to the server racks in the datacenter requires operator access to the cold air
plenum
directly in front of the processors in the rack, and operator access to the
hot air plenum
directly behind the processors in the rack. The requirements for operator
access in
datacenters having a cold air plenum beneath the raised floor and the hot air
plenum
above the server racks mean that frequently the cold air plenum and the warm
plenum
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do not have barriers defining the plenums as between different racks. It is
desirable to
provide a more practical design for cooling a transportable datacenter.
[6] The location of low-cost power and cold ambient air is often distant
from
population centers and areas of industrial manufacturing, making the
utilization of the
low-cost power and cold ambient air difficult. It is desirable to provide
transportable
datacenter facilities that can be manufactured in convenient manufacturing
facilities and
then transported to appropriate locations where they can more efficiently be
put into
operation.
Summary
[7] In accordance with aspects of this invention, there are transportable
datacenters
and methods of assembling transportable data centers to address the above
problems.
[8] In a first aspect, some embodiments of the invention provide a
transportable
datacenter comprising: a housing having air intake openings for receiving air
from an
external environment and air exhaust openings for exhausting air to the
external
environment; a plurality of racks, each rack having a plurality of processor
bays, each
processor bay having a front face and a rear face; an electric power system
for
providing electric power at each processor bay; a data network for providing
data
communications at each processor bay; a cold air plenum between the air intake
openings and the front faces of the processor bays; at least one hot air
plenum between
the rear faces of the processor bays and the air exhaust opening, wherein the
hot air
plenum is substantially fluidically isolated from the cold air plenum; a
ventilation system
to draw air progressively through the air intake openings, the cold air
plenum, the
processor bays, the hot air plenum and the air exhaust openings; and a
transport
system for transporting the transportable datacenter.
[9] In at least one embodiment, the air intake openings may be on a first
sidewall.
[10] In at least one embodiment, the air exhaust openings may be on a second
sidewall.
[11] In at least one embodiment, the air exhaust openings may be on a roof.
[12] In at least one embodiment, the air intake openings may be on a roof.
[13] In at least one embodiment, the air intake openings may be on a second
sidewall.
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[14] In at least one embodiment, the air intake openings may be on the roof.
[15] In at least one embodiment, one or more hot air mixing fans may blow air
through
an at least one air exhaust opening into an at least one intake opening
through ducting.
[16] In at least one embodiment, the ventilation system may include exhaust
fans
mounted in at least some of the air exhaust openings.
[17] In at least one embodiment, the exhaust fans may be on an outside of the
transportable datacenter.
[18] In at least one embodiment, the ventilation system may include intake
fans
mounted in at least some of the air intake openings.
.. [19] In at least one embodiment, the intake fans may be on an outside of
the
transportable datacenter.
[20] In at least one embodiment, the ventilation system may include processor
intake
cooling fans mounted to a front face of at least some of the processor,
adjacent the cold
air plenum.
[21] In at least one embodiment, the ventilation system may include processor
exhaust cooling fans mounted to a rear face of at least some of the processor,
adjacent
the hot air plenum.
[22] In at least one embodiment, at least some of the racks may be arranged in
pairs,
with the rear faces of the processor bays in each rack in a pair adjacent to
the same hot
.. air plenum.
[23] In at least one embodiment, the processor bays may have an exhaust flap.
[24] In at least one embodiment, the processor bays may be arranged at an
oblique
angle to provide a straighter air flow path through the transportable
datacenter.
[25] In at least one embodiment, the racks may be arranged at an oblique angle
to
.. provide a straighter air flow path through the transportable datacenter.
[26] In at least one embodiment, the housing may be a freight container.
[27] In at least one embodiment, the housing may be an intermodal shipping
container.
[28] In at least one embodiment, the embodiment may further include a central
fan
controller for controlling the operation of the ventilation system in response
to one or
more measured temperatures.
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[29] In at least one embodiment, the housing may be a transportable shipping
container.
[30] In at least one embodiment, the transport system may includes mounts for
mounting the housing on a transport platform.
[31] In at least one embodiment, the mounts may be configured to allow the
transportable datacenter to be stacked on top of another similar transportable
datacenter.
[32] In at least one embodiment, the transport system may includes wheels
mounted
to the transportable datacenter.
[33] In at least one embodiment, the wheels may be detachable.
[34] In at least one embodiment, the power system may have a bus bar attached
to
each rack in the racks.
[35] In a second aspect, some embodiments of the invention provide a
transportable
datacenter comprising: a housing having air intake openings for receiving air
from an
external environment and air exhaust openings for exhausting air to the
external
environment; a plurality of racks, each rack having a plurality of processor
bays, each
processor bay having a front face and a rear face; an electric power system
for
providing electric power at each processor bay; a data network for providing
data
communications at each processor bay; a cold air plenum between the air intake
openings and the front faces of the processor bays; at least one hot air
plenum between
the rear faces of the processor bays and the air exhaust opening; a
ventilation system
to draw air progressively through the air intake openings, the cold air
plenum, the
processor bays, the hot air plenum and the air exhaust openings, and wherein
the
ventilation system includes one or more hot air mixing fans for blowing air
from one or
more hot air plenums into the cold air plenum; and a transport system for
transporting
the transportable datacenter.
[36] In at least one embodiment, the air intake openings may be on a first
sidewall.
[37] In at least one embodiment, the air exhaust openings may be on a second
sidewall.
.. [38] In at least one embodiment, the air exhaust openings may be on a roof.
[39] In at least one embodiment, the air intake openings may be on a roof.
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[40] In at least one embodiment, the air intake openings may be on a second
sidewall.
[41] In at least one embodiment, the air intake openings may be on the roof.
[42] In at least one embodiment, one or more hot air mixing fans may blow air
through
an at least one air exhaust opening into an at least one intake opening
through ducting.
[43] In at least one embodiment, the ventilation system may include exhaust
fans
mounted in at least some of the air exhaust openings.
[44] In at least one embodiment, the exhaust fans may be on an outside of the
transportable datacenter.
[45] In at least one embodiment, the ventilation system may include intake
fans
mounted in at least some of the air intake openings.
[46] In at least one embodiment, the intake fans may be on an outside of the
transportable datacenter.
[47] In at least one embodiment, the ventilation system may include processor
intake
cooling fans mounted to a front face of at least some of the processor,
adjacent the cold
air plenum.
[48] In at least one embodiment, the ventilation system may include processor
exhaust cooling fans mounted to a rear face of at least some of the processor,
adjacent
the hot air plenum.
[49] In at least one embodiment, at least some of the racks may be arranged in
pairs,
with the rear faces of the processor bays in each rack in a pair adjacent to
the same hot
air plenum.
[50] In at least one embodiment, the processor bays may have an exhaust flap.
[51] In at least one embodiment, the processor bays may be arranged at an
oblique
.. angle to provide a straighter air flow path through the transportable
datacenter.
[52] In at least one embodiment, the racks may be arranged at an oblique angle
to
provide a straighter air flow path through the transportable datacenter.
[53] In at least one embodiment, the housing may be a freight container.
[54] In at least one embodiment, the housing may be an intermodal shipping
.. container.
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[55] In at least one embodiment, the embodiment may further include a central
fan
controller for controlling the operation of the ventilation system in response
to one or
more measured temperatures.
[56] In at least one embodiment, the housing may be a transportable shipping
container.
[57] In at least one embodiment, the transport system may includes mounts for
mounting the housing on a transport platform.
[58] In at least one embodiment, the mounts may be configured to allow the
transportable datacenter to be stacked on top of another similar transportable
datacenter.
[59] In at least one embodiment, the transport system may includes wheels
mounted
to the transportable datacenter.
[60] In at least one embodiment, the wheels may be detachable.
[61] In at least one embodiment, the power system may have a bus bar attached
to
each rack in the racks.
[62] In a third aspect, some embodiments of the invention provide a method of
assembling a transportable datacenter, including: providing a housing, wherein
the
housing includes: one or more air intake openings; and one or more air exhaust
openings, installing a plurality of racks in the transportable datacenter,
each rack having
a plurality of processor bays, each of the processor bays having a front face
and a rear
face; substantially fluidically isolating a cold air plenum from one or more
hot air
plenums, wherein front faces of the processor bays are adjacent the cold air
plenum
and the rear faces of the processor bays are adjacent the hot air plenum;
installing a
ventilation system for progressively drawing air from an environment of the
transportable datacenter through the air intake openings, the cold air plenum,
the
processor bays, the hot air plenums and through the air exhaust openings back
to the
environment.
[63] In at least one embodiment, the one or more air intake openings may be on
a
first sidewall.
[64] In at least one embodiment, the one or more air exhaust openings may be
on a
second sidewall.
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[65] In at least one embodiment, the one or more air exhaust openings may be
on a
roof.
[66] In at least one embodiment, the one or more air intake openings may be on
a
roof.
[67] In at least one embodiment, the one or more air intake openings may be on
a
second sidewall.
[68] In at least one embodiment, the one or more air intake openings may be on
the
roof.
[69] In at least one embodiment, one or more hot air mixing fans may blow air
through
an at least one air exhaust opening into an at least one intake opening
through ducting.
[70] In at least one embodiment, the ventilation system may include exhaust
fans
mounted in at least some of the air exhaust openings.
[71] In at least one embodiment, the one or more exhaust fans may be on an
outside
of the transportable datacenter.
[72] In at least one embodiment, the ventilation system may include one or
more
intake fans mounted in at least some of the one or more air intake openings.
[73] In at least one embodiment, the one or more intake fans may be on an
outside of
the transportable datacenter.
[74] In at least one embodiment, the method of assembly may further comprise
installing one or more processors; wherein the ventilation system includes
processor
intake cooling fans that may be mounted to a front face of the at least one
processors,
adjacent the cold air plenum.
[75] In at least one embodiment, the ventilation system may include processor
exhaust cooling fans mounted to a rear face of the at least one processors,
adjacent the
hot air plenum.
[76] In at least one embodiment, the method of assembly may further comprise a
plurality of racks and a plurality of hot air plenums, wherein at least some
of the racks
may be arranged in pairs, with the rear faces of the processor bays in each
rack in a
pair adjacent to the same hot air plenum.
[77] In at least one embodiment, the processor bays may have an exhaust flap.
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[78] In at least one embodiment, the processor bays may be arranged at an
oblique
angle to provide a straighter air flow path through the transportable
datacenter.
[79] In at least one embodiment, the racks may be arranged at an oblique angle
to
provide a straighter air flow path through the transportable datacenter.
[80] In at least one embodiment, the housing may be a freight container.
[81] In at least one embodiment, the housing may be an intermodal shipping
container.
[82] In at least one embodiment, the method of assembly may further include a
central fan controller for controlling the operation of the ventilation system
in response
to one or more measured temperatures.
[83] In at least one embodiment, the housing may be a transportable shipping
container.
[84] In at least one embodiment, the transport system may include mounts for
mounting the housing on a transport platform.
[85] In at least one embodiment, the mounts may be configured to allow the
transportable datacenter to be stacked on top of another similar transportable
datacenter.
[86] In at least one embodiment, the transport system may include wheels
mounted to
the transportable datacenter.
[87] In at least one embodiment, the wheels may be detachable.
[88] In at least one embodiment, the power system may have a bus bar attached
to
each rack in the racks.
[89] In a fourth aspect, some embodiments provide a transportable datacenter,
comprising: a housing having air intake openings for receiving air from an
external
environment and air exhaust openings for exhausting air to the external
environment; a
plurality of racks, each rack having a plurality of processor bays, each
processor bay
having a front face and a rear face; an electric power system for providing
electric
power at each processor bay; a data network for providing data communications
at
each processor bay; a cold air plenum between the air intake openings and the
front
faces of the processor bays; at least one hot air plenum between the rear
faces of the
processor bays and the air exhaust opening, wherein the hot air plenum is
substantially
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fluidically isolated from the cold air plenum; a ventilation system to draw
air
progressively through the air intake openings, the cold air plenum, the
processor bays,
the hot air plenum and the air exhaust openings, the ventilation system
comprising one
or more fans outside the housing, the one or more fans having a larger
diameter than
the air intake openings and the air exhaust openings; and a transport system
for
transporting the transportable datacenter.
[90] In a fifth aspect, some embodiments provide a method of assembling a
transportable datacenter, including: providing a housing, wherein the housing
includes:
one or more air intake openings; and one or more air exhaust openings,
installing a
plurality of racks in the transportable datacenter, each rack having a
plurality of
processor bays, each of the processor bays having a front face and a rear
face;
substantially fluidically isolating a cold air plenum from one or more hot air
plenums,
wherein front faces of the processor bays are adjacent the cold air plenum and
the rear
faces of the processor bays are adjacent the hot air plenum; installing a
ventilation
system for progressively drawing air from an environment of the transportable
datacenter through the air intake openings, the cold air plenum, the processor
bays, the
hot air plenums and through the air exhaust openings back to the environment,
the
ventilation system comprising one or more fans, the one or more fans having a
larger
diameter than the air intake openings and the air exhaust openings.
[91] In a sixth aspect, some embodiments provide a power distribution panel
for a
rack of processors in a transportable datacenter, the transportable datacenter
comprising an intake sidewall and an exhaust sidewall, the exhaust sidewall
and a long
direction of the rack arranged at an oblique angle, comprising: a housing
comprising a
back surface, a top surface, a bottom surface and one or more sides, the
housing
defining an open end opposite the back surface, the back surface for coupling
circuit
elements to the housing, the housing comprising one or more processor circuit
access
openings and one or more main circuit access openings; the housing defining an
open
front end for accessing the one or more circuit elements, the housing defining
an interior
of the power distribution panel, the housing shaped to define a clearance
between the
power distribution housing and the intake sidewall of the transportable
datacenter, the
housing arranged proximal to an end of the rack; one or more electric circuits
disposed
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within the interior of the housing, each of the one or more electric circuits
comprising: a
circuit element in the one or more circuit elements; an input electrically
connected to the
circuit element, the input electrically connected to a main circuit through
the one or more
main circuit access openings; and an output electrically connected to the
circuit
element, the output electrically connected to a processor circuit through the
one or more
processor circuit access openings.
[92] In at least one embodiment, the housing may further comprise a front
surface;
and the one or more electric circuits may be attached to the front surface.
[93] In at least one embodiment, the housing may further comprise a front
surface;
and the one or more electric circuits may be attached to the rear surface
within the
interior of the housing.
[94] In at least one embodiment, the housing may be generally shaped like a
triangular prism.
[95] In at least one embodiment, the housing may be attached to the end of the
rack.
[96] In at least one embodiment, the housing may be attached to the end of the
rack
using a mounting bracket, the mounting bracket comprising: a first flange for
attaching
to the rack; a first spacer extending from the first flange; a standoff
extending from the
first spacer; a second spacer extending from the standoff; and a second flange
extending from the second spacer for attaching to the rack.
[97] In at least one embodiment, the first spacer may extend further from the
rack
than the second spacer.
[98] In at least one embodiment, the power distribution panel may further
comprise: a
door substantially covering the open front end of the housing.
[99] In at least one embodiment, the one or more circuit elements may
comprise: one
or more processor circuit breakers; and one or more main circuit breakers.
[100] In at least one embodiment, the housing may be shaped to define a
clearance of
at least 36 inches.
[101] In a seventh aspect, some embodiments provide a power distribution
system for
a plurality of processors in a rack in a transportable datacenter, the
transportable
datacenter comprising an intake sidewall and an exhaust sidewall, comprising:
a
plurality of input circuits electrically connected to a power supply; a
plurality of processor
CA 3050389 2019-07-22
circuits, each of the plurality of processor circuits electrically connected
to a processor
in the plurality of processors; a power distribution panel comprising: a
plurality of circuits
for transmitting electrical power to the plurality of processors, the
plurality of circuits
positioned inside the power distribution panel, each circuit comprising: a
processor
circuit breaker attached to a back side of the power distribution panel; an
input side in
electrical connection with the processor circuit breaker; and an output side
in electrical
connection with the processor circuit breaker, the input side of each
processor circuit
breaker in electrical connection to an input circuit in the plurality of input
circuits; the
output side of each processor circuit breaker in direct electrical connection
with an
output circuit in the plurality of processor circuits.
[102] In at least one embodiment, the power distribution panel may further
comprise a
plurality of main breakers, each main breaker connected between the input
circuit and
the plurality of processor circuits.
[103] In at least one embodiment, the plurality of processor circuits may be
manually
controlled.
[104] In at least one embodiment, the plurality of processor circuits may be
remotely
controlled by an optical coupler.
[105] In an eighth aspect, some embodiments provide a cooling apparatus for a
transportable datacenter, the transportable datacenter comprising an intake
sidewall
and an exhaust sidewall, comprising: an input pipe in fluid communication with
a cooling
liquid source; a pump, an input of the pump connected to the input pipe; a
intermediate
pipe in fluid communication with the pump, the intermediate pipe connected to
an output
of the pump; one or more output pipes in fluid communication with the
intermediate
pipe, a first end of each of the one or more output pipes connected to the
intermediate
pipe; and one or more nozzles, each nozzle connected at a second end of each
of the
one or more output pipes, the one or more nozzles for generating a liquid mist
for
evaporative cooling the transportable datacenter.
[106] In a ninth aspect, some embodiments provide a cooling system for a
transportable datacenter, comprising: a pump for pumping cooling liquid; one
or more
output pipes connected to the pump, each output pipe having a nozzle at a
distal end,
the nozzles for generating a liquid mist for evaporative cooling of the
transportable
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datacenter; one or more sensors for measuring one or more environment values;
a
processor in communication with the electric motor and the sensor, the
processor
generally configured to: measure the one or more environment values using the
one or
more sensors; and operate the pump responsive to the one or more environment
values.
[107] In at least one embodiment, the one or more sensors may be at least one
of a
temperature sensor, an optical sensor, and a humidity sensor.
[108] In at least one embodiment, the cooling system may further comprise: one
or
more valves, each valve connected between the pump and the distal end of the
one or
more output pipes; one or more actuators, each of the one or more actuators
connected
to a valve in the one or more valves; the processor may be further configured
to:
operate the one or more actuators responsive to the environment value.
[109] In at least one embodiment, the one or more actuators may be solenoids.
Brief Description of the Drawings
[110] Various preferred embodiments of the present invention will now be
described in
detail with reference to the drawings, in which:
FIG. 1 is a perspective view of an example transportable datacenter;
FIG. 2 is another perspective view of the transportable datacenter of FIG. 1;
FIG. 3A is a cutaway top view of the transportable datacenter of FIG 1;
FIG. 3B is a cutaway portion view of the transportable datacenter of FIG 1;
FIG. 4A illustrates an intake side view of a rack installed in the
transportable
datacenter of FIG 1;
FIG. 4B illustrates an exhaust side view of a rack installed in the
transportable
datacenter of FIG 1;
FIG. 5 illustrates a processor;
FIG. 6 illustrates airflows in the transportable datacenter of FIG 1;
FIG. 7A illustrates an electric power system in the transportable datacenter
of
FIG 1;
FIG. 7B illustrates an electric power system in the transportable datacenter
of
FIG 1;
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FIG. 8 illustrates a data network in the transportable datacenter of FIG 1;
FIG. 9 shows a method of preparing a transportable datacenter for use;
FIG. 10 illustrates an alternative rack;
FIG. 11 illustrates another transportable datacenter;
FIG. 12 illustrates another transportable datacenter;
FIG. 13A illustrates a perspective view of another transportable datacenter;
FIG. 13B illustrates a cutaway top view of the transportable datacenter from
FIG.
13A;
FIG. 14 is a cutaway portion view of another transportable datacenter;
FIG. 15A illustrates a perspective view of another transportable datacenter;
FIG. 15B is a cutaway portion view of the transportable datacenter of FIG.
15A;
FIG. 15C illustrates a perspective view of another transportable datacenter;
FIG. 15D is a cutaway portion view of the transportable datacenter of FIG.
15C;
FIG. 16A is a cutaway portion view of another transportable datacenter;
FIG. 16B is a cutaway portion view of another transportable datacenter;
FIG. 16C is a front view of an integrated power distribution system of the
transportable datacenter of FIG. 16A;
FIG. 16D is a perspective view of a mounting bracket;
FIG. 16E is a side view of the mounting bracket in FIG. 16D;
FIG. 16F is a front view of the mounting bracket in FIG. 16D;
FIG. 16G is a perspective view of a power distribution panel of the
transportable
datacenter of FIG. 16A;
FIG. 16H is a top view of the power distribution panel of FIG. 16G;
FIG. 161 is a front view of an alternate power distribution panel having a
door;
FIG. 16J is a rear view of the power distribution panel of FIG. 16G;
FIG. 17A is a front view of the pair of racks in FIG. 16C showing the pair of
integrated power distribution systems of FIG. 16C in a connected
configuration;
FIG. 17B is a cross section view along the line 3710-3710 in FIG. 17A showing
a
plurality of processor circuits;
FIG. 18A is a cutaway portion view of another transportable datacenter having
an
evaporative cooling system;
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FIG. 18B is a side view of the transportable datacenter of FIG. 18A;
FIG. 18C is a system view of the evaporative cooling system of FIG. 18A, and
FIG. 18D is a system view of the evaporative cooling system of FIG. 18A.
Description of Exemplary Embodiments
[111] Several example embodiments are described below. Numerous specific
details
are set forth in order to provide a thorough understanding of the example
embodiments.
However, it will be understood by those of ordinary skill in the art that the
embodiments
described herein may be practiced without these specific details. In other
instances,
well-known methods, procedures and components have not been described in
detail so
as not to obscure the embodiments described herein. Furthermore, this
description and
the drawings are not to be considered as limiting the scope of the embodiments
described herein in any way, but rather as merely describing the
implementation of the
various embodiments described herein.
[112] It should be noted that terms of degree such as "substantially", "about"
and
"approximately" when used herein mean a reasonable amount of deviation of the
modified term such that the end result is not significantly changed. These
terms of
degree should be construed as including a deviation of the modified term if
this
deviation would not negate the meaning of the term it modifies.
[113] In addition, as used herein, the wording "and/or" is intended to
represent an
inclusive-or. That is, "X and/or Y" is intended to mean X or Y or both, for
example. As a
further example, "X, Y, and/or Z" is intended to mean X or Y or Z or any
combination
thereof.
[114] Reference is first made to FIGS. 1-3A, which illustrate a transportable
datacenter
100. The transportable datacenter 100 has a housing 102 which, in this
example, is a
transportable shipping container having sidewalls 104 and 106, end walls 108
and 110,
a floor 118 and a ceiling or roof 120. The housing 102 may be a typical
shipping
container suitable for transport by truck, rail or boat. The housing 102 will
typically be
made of rigid, weather resistant material capable of withstanding an outdoor
environment. The housing 102 of the transportable datacenter provides a
generally
weather resistant and enclosed volume in which other elements of the
transportable
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datacenter are installed. In some embodiments, the housing may be freight
container or
a transportable intermodal container compliant with a corresponding standard
such as
ISO 668 or ISO 1496. In some cases, multiple transportable datacenters may be
stackable one atop another.
[115] Transportable datacenter 100 has a ventilation system for cooling
processors
that may be installed in the transportable datacenter. The cooling system may
also
serve generally to provide ventilation through the transportable datacenter.
Ventilation
is provided through the transportable datacenter 100 by air flowing through
datacenter
from an air intake to an air exhaust, typically from one sidewall to the
opposing sidewall.
In transportable datacenter 100, ventilation is provided from sidewall 104 to
sidewall
106. Sidewall 104 having the air intake may be referred to as the intake side.
The
sidewall 106 having the air exhaust may be referred to as the exhaust side.
[116] Air intake sidewall 104 has one or more air intake openings 114 to allow
intake of
cool air from the environment. Each of the intake openings 114 will typically
have a
filter or other protective element installed in the intake opening to reduce
the flow of dirt,
dust and other particulate matter and contaminants into the transportable
datacenter
100. The air intake openings may have baffles or other physical protective
elements to
reduce the flow of rain and other materials into the transportable datacenter
100. In
some embodiments, some or all of the intake openings may have an air intake
fan
installed within them.
[117] The intake openings may be sized identically or differently from one
another, for
example, as shown, intake opening 114a may be smaller than the intake openings
114b, 114c, and 114d.
[118] The end wall 110 may have a door 124 that allows operator access into
the
transportable datacenter 100, typically into a cold air plenum 154.
[119] Air exhaust sidewall 106 has air exhaust openings 116 to exhaust hot air
from
within datacenter 100 to the environment. Each of the exhaust openings 116
will
typically have an exhaust fan 128 installed within it. The exhaust openings
may be
sized identically or differently from one another. For example, as shown,
exhaust
opening 116a may be smaller than exhaust openings 116b, 116c, and 116d. As
with
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the air intake openings, the air exhaust openings 116 may have a filters or
baffles or
both to protect the interior of the transportable datacenter from
contamination.
[120] A plurality of racks are installed in the interior of the transportable
datacenter
100. While seven racks are shown in this example, other numbers of racks may
similarly be installed in the transportable datacenter. Each rack 134 has a
plurality of
shelves 136, with each shelf 136 having a plurality of processor bays 138
having a front
face 140 and a rear face 142. In operation, a processor 500 (FIG. 5) may be
installed in
each of the processor bays 138.
[121] Reference is next made to FIG 3B, which shows a cutaway portion view of
a
transportable datacenter 100. In one embodiment an external intake fan 180 is
disposed outside of the transportable container 100. The external intake fan
180 may
have baffles or other physical protective elements to reduce the flow of rain
and other
materials into the transportable datacenter 100. In a similar fashion, the
exhaust fans
may be disposed outside of the transportable container 100 as well. The
external
exhaust fans may have baffles or other physical protective elements to reduce
the flow
of rain and other materials into the transportable datacenter 100. As shown in
FIG. 3B,
the external intake fan 180 may be larger than the intake opening 114, which
may allow
for larger intake fans that intake a higher airflow rate, or a higher volume
of air per
minute than an intake fan disposed inside the intake opening 114. An external
intake
fan 180 that is larger than intake opening 114 may allow for increased laminar
flow into
the transportable datacenter. The external intake fan 180 may extend and be
generally
sized to the height of the transportable container 100. The external intake
fan may
extend beyond the perimeter of the transportable container 100 (not pictured
in FIG.
3B).
[122] It is generally understood that the cross-section of the fan blade path
in an intake
fan is circular, and that the intake fan may further comprise a fan housing.
The external
positioning of the intake fan 180 may allow for the intake opening to be
completely
covered with the cross-section of the fan blade path of intake fan 180,
whereas an
intake fan disposed within the intake opening 114 would include a housing
partially
obstructing the opening 114. Further, the external intake fan 180 may provide
a higher
airflow rate by ensuring the intake opening is covered by an inner portion of
the cross-
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sectional of the fan blade path, the inner portion having a higher airflow
than an outer
portion of the cross-section of the fan blade path. The increased airflow in
the inner
portion of the cross-section of the fan blade path as compared to the outer
portion of the
cross-section of the fan blade path may be due to potential edge effects of
the fan
blades.
[123] The external intake fan 180 may be installed on the outside of the
transportable
datacenter 100 when it arrives at an operational site. The installation of the
external
intake fan 180 may be done using fasteners, straps, or any known method. The
external intake fan 180 may be removably attached to the transportable
datacenter.
[124] Similar to the above description of external intake fan 180, the exhaust
fans may
also be external to the transportable container and sized larger than the
exhaust
openings.
[125] Reference is next made to FIG. 4A, which illustrates the intake side of
a rack
134. The rack 134 has a plurality of shelves 136, each shelf 136 having a
plurality of
processor bays 138. Each processor bay 138 can accommodate a processor 500.
[126] Each processor bay 138 may have a liner along the intake or exhaust side
of the
processor bay. The liner may be a thermally insulating foam liner, that
provides thermal
insulation between the hot plenum and the processor bay 138. The liner may
line the
processor bays 138, and optionally the plurality of shelves 136. The liner may
act as a
gasket between the processor bay 138 and a processor 500 to provide an air
seal
around the intake edges of the processor 500. The liner may have be made from
a fire
resistant material. The liner may provide a frictional attachment between the
processor
500 and a processor bay 138.
[127] Referring to FIG. 4B, which illustrates the exhaust side of the rack 134
of FIG.
4A. The exhaust side panel 522 may have a thermally insulating foam liner
similar to
the foam liner of FIG. 4A. The exhaust side of rack 134 may have an exhaust
flap 520
for a processor bay 138. While only flaps 520 for a single row are shown,
there may be
one flap for each processor bay in the entire rack. The exhaust flap 520 may
extend
from either side of the processor bay 138. The exhaust flap 520 may have a
varying
angle compared to other processor flaps relative to the rack. The angle of the
flap 520
may be determined based on the airflow through the processor bay 138 and the
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proximity of the processor bay 138 to the container exhaust. The exhaust flap
is for
channeling the air exhaust output into the hot air plenum.
[128] Referring also to FIG 5, typically, a processor 500 will be a self-
contained or
substantially self-contained computing unit. Some processors may have an
external
power supply 518 that is mounted to or sits adjacent to the processor 500.
Other
processors may have an internal power supply or may not require a power
supply.
Each processor 500 is installed in the corresponding processor bay 138. In
transportable datacenter 100, this is accomplished by placing in the processor
(including, if present, its power supply or any other external components) in
the
processor bay 138. In other embodiments, a processor 500 may be fixedly
mounted in
a processor bay 138 with one or more fasteners. Each processor has a maximum
cross-section from its front 504 to its rear 506. In some cases, the cross-
sectional size
of a processor may be generally consistent from front to rear, such as in the
case of a
processor that has a processor housing 508 that is generally shaped as a
rectangular
cuboid with three sets of opposing generally parallel faces. Each processor
bay 138 is
preferably shaped to conform to the cross sectional shape of the processor 500
that will
be positioned in that processor bay 138. In some cases, an optional processor
bay trim
may be used to reduce or eliminate gaps between the processor and the sides of
the
processor bay. In some embodiments, the processor bays may not be specifically
shaped to conform to the cross-sections of processors. In some embodiments,
the
processor bays may be positioned sufficiently close to one another that the
majority of
air flows through the processor positioned in the processor bays, and
relatively little air
flows between the processors. In some embodiments, the processor housings may
contribute to the cooling of some or all of the processors and the processor
bays may
be spaced to allow airflow between the processor housings to cool the
processor
housings.
[129] In some cases, during the operation of transportable datacenter 100, a
processor
bay 138 may not have a processor 500 installed in it. Such empty processor
bays 138
may have a blanking panel installed in them. The blanking panel blocks all or
most of
the cross-section of the processor 138 to reduce or eliminate airflow through
the empty
processor bay 138 as is shown in relation to processor bay 138e.
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[130] In operation, each processor 500 generates heat, as is typical with
computing
devices. A processor 500 may have an optional intake cooling fan 512 that
draws cold
air into the front of the processor. As air flows through a processor 500, it
absorbs heat
generated by the processor and thereby cooling the processor. A processor may
have
an exhaust cooling fan that expels heated air from the rear of the processor
500. Some
processor may have both an intake cooling fan and an exhaust cooling fan while
other
processors may not have any such cooling or ventilation fans.
[131] Transportable datacenter 100 includes a relatively large number of
processor
bays, allowing for many processors to be installed within it. Transportable
datacenter
may be particularly suitable for tasks that require substantial parallel
processing by
many processors, such as mining cryptocurrencies, identifying large prime
numbers,
operating blockchain based information systems and many other such tasks.
[132] Reference is next made to FIG. 6, which illustrates air flows created by
the
ventilation system through transportable datacenter 100. Each rack extends
from a hot
air plenum barrier 158 to the exhaust sidewall 106 of the housing 102. The
front face
140 of each processor bay 138 opens into a cold air plenum 154 (which may also
be
referred to as a cold air zone). The rear face 142 of each processor bay 138
opens into
a hot air plenum 156 (which may also be referred to as a hot air zone). The
airflows in
transportable datacenter 100 include intake airflows 602 and exhaust airflows
604.
Intake airflows 602 extend from the intake air openings 114 on the intake side
of
housing 102 to the front of the processor bays 138 through the cold air plenum
154.
Cold intake air then flows through the processor bays 138, where it cools
processors
500 installed in the processor bays 138 and which warms the air. The warmed
air exits
from the rear of the processor bays 138 into the hot air plenum 156. The
warmed air is
then exhausted through the exhaust side of the housing as shown by exhaust
airflows
604.
[133] In transportable datacenter 100, the hot air plenums 156 are
substantially
fluidically isolated from the cold air plenum 154 so that warmed air exiting
the rear face
142 of the processor bays 138 does not substantially mix with cold air that
has not yet
reached the front face 140 of the processor bays 138 when the ventilation
system is in
operation. The ventilation system progressively draws air from the environment
of the
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transportable datacenter 100, through the air intake openings 114, the cold
air plenum
154, the processor bays 138, the hot air plenums 156 and then through the
exhaust air
openings 116 back to the environment of the transportable datacenter.
[134] For example, hot air plenum 156a is enclosed or contained within a
volume or
space defined by hot air plenum barrier 158a, end wall 110, side wall 106 and
the rear
faces 142 of the processor bays 138 on a first rack 134a. Rack 134a may extend
from
the floor 118 to the ceiling 120 of the housing, in which case, the floor and
ceiling also
define the enclosed volume of hot air plenum 156a.
[135] Hot air plenum 156b is enclosed between the rear faces of racks 134b and
134c,
a hot air plenum barrier 158b and side wall 106. Racks 134b and 134c do not
extend to
the ceiling 120 of the housing 102. Instead a hot air plenum cover 160b (shown
cut
away in FIG. 3A) is installed between the tops of racks 134b and 134c. The hot
air
plenum cover 160b also defines the enclosed volume of hot air plenum 156b. The
hot
air plenum may be enclosed in other manners, for example, if a rack does not
extend to
the ceiling 120, a hot air plenum barrier may be installed from the top of the
rack to the
ceiling. This may allow a hot zone with a larger volume, and possibly larger
exhaust
fans with greater air moving capacity to be used, provide greater air movement
through
the transportable datacenter and greater cooling for the processors 500.
[136] Similarly the other hot air plenums 156c and 156d are enclosed between
respective racks 134, a hot air plenum barrier 158 and sidewall 106, as
described
above.
[137] In transportable datacenter 100, intake airflows 602 and exhaust
airflows 604 are
generated by exhaust fans 128, which draw relatively cold air from the
environment
through the intake air openings 114, along intake airflows 602, through
processor bays
138, exhaust airflows 604 and out of the transportable datacenter 100 through
exhaust
air openings 116. Some or all of the processors 500 installed in processor
bays 138
may include processor intake fans 512 or processor exhaust fans 514 or both.
Processor fans 512 and 514 move cold air from the cold air plenum 154 to the
hot air
plenum 156 through the corresponding processors 500. When provided, the
processor
fans also contribute to generation of the intake airflows 602 and exhaust
airflows 604.
As noted above, air intake fans may be installed in some or all of the air
intake openings
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114 to blow relatively cold air from the environment of transportable
datacenter 100 into
the cold air plenum 154. In various embodiments, a transportable datacenter
100 may
include any combination of cold air intake fans, processor fans on processors
500, and
hot air exhaust fans 128. In any particular embodiment, at least one type of
fan will be
provided.
[138] Referring to FIG. 7A, transportable datacenter 100 has an electric power
terminal
714, which may include a one or three phase interface for receiving an
external power
supply from an external power source. Power terminal 714 is coupled to a
series of
power supplies 716 mounted on the hot air plenum barriers 158 facing the cold
air
plenum 154. From each power supply 716, a cable assembly 718 provides a bay
power
signal to each processor bay 138 in the adjacent racks 134. The cable assembly
may
include power cables and power cable harnesses that connect the power supply
to a
power plug 720 positioned at each processor bay. The bay power signal provided
at
each processor bay has a voltage suitable for the processor to be installed at
that bay,
with sufficient power to provide the processor's power requirements.
[139] In some embodiments, the power supply may simply couple the external
power
source to the power plug 720 positioned at each processor bay. For example,
this may
be done if the external power supply provides power at a voltage suitable for
directly
powering the processors.
[140] In other embodiments, the power supply may include one or more
transformers
to transform the external power supply to bay power supplies having one or
more
voltages suitable to power the processors. The appropriate bay power signal
for each
processor bay is provided at each respective power plug 720 at each processor
bay 138
through the cable assembly 718.
.. [141] In various embodiments, there may be any number of power supplies
716. For
example, some transportable datacenters may include a single power supply 716
that
provides power to each processor bay, while others may include a plurality of
power
supplies located proximate different groups or racks of processor bays as
shown in FIG.
7A.
[142] In the present example embodiment, each power supply includes a power
supply
panel that includes switches to selectively enable and disable the bay power
supply at
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each processor bay. Each switch may be part of a circuit breaker that can
automatically
disable a bay power supply if an over-current, over-temperature or other
trigger
condition occurs. In some embodiments, the power supply may consist of a cable
assembly that couples the external power supply to a power plug at each
processor bay
without any intervening switches, transformers or other elements.
[143] Electric power from the external power supply is also used to power any
intake
fans (if provided in any particular embodiment) and exhaust fans 128 (if
provided in any
particular embodiment) built into the transportable datacenter 100. Each
intake fan and
exhaust fan will typically be powered from a fan power supply 722 that
provides an
appropriate power signal for each intake fan or exhaust fan. In some
embodiments, the
intake fans and exhaust fans may simply operate at full capacity when they are
powered
up.
[144] In other embodiments, some or all of the intake fans or exhaust fans may
include
an onboard speed controller that adjusts the speed of the respective fan in
response to
one or more measured air temperatures. For example, each fan may include or be
connected to temperature sensors that measure the air temperature in the
environment
of the transportable datacenter, in one or more areas of the cold air plenum,
or within
one or more areas of one or more of the hot air plenums, or a combination of
those
locations. The fan may adjust its speed in response to the measured
temperatures.
For example, an exhaust fan will typically operate at a higher speed in
response to a
higher air temperature in the corresponding hot air plenum. An intake fan may
operate
at a higher temperature in response to a higher air temperature in any of the
environment of the transportable datacenter, the cold air plenum or a hot air
plenum. In
any particular embodiment, each fan may be configured to adjust its speed in
response
to various temperature conditions, or combinations of temperature conditions
in order to
maintain a desired temperature or temperature range within one or more areas
of the
transportable datacenter.
[145] In some embodiments, some or all of the intake fans or exhaust fans may
operate under the control of a central fan controller. The central fan
controller may be
coupled to temperature sensors that sense air temperatures in the environment
of the
transportable datacenter, in one or more areas of the cold air plenum, or in
one or more
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areas of one or more of the hot air plenums, or in a combination of those
locations. The
fan controller may vary the speed of each intake fan or exhaust fan to
maintain a
desired temperature or range of temperatures within one or more areas of the
transportable datacenter.
[146] Controlling the speed of some or all of the intake fans or exhaust fans
provided in
any particular embodiment may reduce the power consumption of transportable
datacenter. For example, when a transportable datacenter operates in a colder
environment, less air flow may be required through the transportable
datacenter to
maintain desired temperatures. Other factors affecting the cooling
requirements of a
transportable datacenter may include the number of processors installed in the
transportable datacenter, the layout of racks and processor bays, heat
generated by the
processors (which may vary from processor to processor, or from rack to rack,
or both),
or the rate of change of temperatures in the environment or interior of the
transportable
datacenter.
[147] Reference is next made to FIG. 7B, where an alternate embodiment of an
electric
power system for transportable container 100 is shown. The electric power
terminal
754, includes an interface for receiving an external power supply from an
external
power source. Power terminal 754 is coupled to each of the racks 134. At each
rack
134, a bus bar 758 provides a bay power signal to each processor bay 138 in
racks
134. The bay power signal may be provided by a plug attached to the bus bar
758, the
plug connecting to a processor disposed in the processor bay 138. The bus bars
758
may be integrated with the rack 134, and may have an integrated bus connection
that
may couple with the bus bar 758 with the plug via a terminal, a clip, a
crimping
connection, or another electrical connector. The bay power signal provided at
each
processor bay has a voltage suitable for the processor to be installed at that
bay, with
sufficient power to provide the processor's power requirements. Optionally,
there is a
relay system (not shown) provided allowing a user to disable a rack, a shelf
in a rack, or
the transportable container. The electric power system having bus bars 758 may
enable easy processor installation.
[148] Reference is next made to FIG. 8, which also illustrates transportable
datacenter
100. Transportable datacenter 100 includes an external communication network
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connection 802. Typically, the external network connection 802 allows
processors and
other computing devices in transportable datacenter 100 to communicate with
external
computing devices using an external data communication network 806 such as the
Internet or another communication network.
[149] External network connection 802 is coupled to a data network 804 within
transportable datacenter 100. The data network 804 may include various network
devices such as routers, switches and cables to provide network connectivity
at some or
all of the processor bays. The data network may include wireless communication
devices 808 that facilitate wireless communication between network devices and
between processors and the data network. Any particular processor bay may be
provided with either wired or wireless network connectivity or both, allowing
a processor
in the processor bay to communicate with other devices (including other
processors)
coupled to the data network, and to communicate with external computing
devices.
[150] A transportable datacenter may be designed for transport in various
ways.
Transportable datacenter 100 has a housing 102 which is a transportable
shipping
container. The shipping container is adapted to be transported by truck, rail
or ship from
a location at which it is manufactured to a location at which the
transportable datacenter
will be put into operation. For example, the shipping container may include
twistlocks
162 (FIGS. 1, 2) or other appropriate mounts to allow the container to be
mounted on a
truck, trailer or rail car or other transport platform. In other embodiments,
a
transportable datacenter may be built on a frame or base that has or can be
equipped
with wheels for transportation. For example, a transportable datacenter may be
built on
a trailer that can be hitched to a truck for transport. In some embodiments,
the mounts
used to mount a transportable datacenter for transportation may also be used
to stack
multiple transportable datacenters.
[151] Referring to FIG. 9, a transportable datacenter may be installed by
method 900:
= At 902, manufacturing or assembling the transportable datacenter at an
assembly facility manufacturing facility is shown. Manufacturing or assembling
the transportable datacenter includes:
o Providing a housing having air intake openings and air exhaust openings.
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o Installing a plurality of racks in the transportable datacenter, with
each
rack including a plurality of processor bays.
o Substantially fluidically isolating the cold air plenum at the front face
of the
processor bays from the hot air plenum at the rear face of the processor
bays.
o Installing a cooling system for progressively drawing air from an
environment of the transportable datacenter through the air intake
openings, the cold air plenum, the processor bays, the hot air plenums
and through the air exhaust openings back to the environment.
= At 904, the assembled transportable container is transported to an operating
location.
= At 906, the transportable datacenter's external power supply is connected
to an
external power source.
= At 908, the transportable datacenter's external communication network is
connected to an external data communication network.
= At 910, installing processors in the processor bays of the transportable
datacenter, by positioning each processor in a processor bay, and connecting
each processor to a respective power plug and connecting the processor to the
transportable datacenter's data network.
[152] Once the transportable datacenter has been installed, the transportable
datacenter may be initiated in operation by activating the intake fans (if
provided),
exhaust fans (if provided), and the processors. When the processors are
activated, any
processor intake cooling fans and processor exhaust cooling fans will be
activated
under the control of a fan controller built into the respective processor.
[153] In some situations, the transportable datacenter may be substantially
assembled
prior to transport to an operating location, where assembly of the
transportable
datacenter may be completed. For example, the transportable datacenter may be
shipped with protective covers over the intake openings 114 and the exhaust
openings
116. Intake filters and exhaust fans 128 may be installed at the operating
location.
Similarly, the transportable datacenter may be shipped without other elements
installed
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in their final position, and those elements may be installed prior to putting
the
transportable datacenter into operation.
[154] Reference is next made to FIG. 10, which illustrates a rack 1134.
Elements of
rack 1134 that correspond to rack 134 are identified by corresponding
reference
numerals. In rack 134, the processor bays are arranged generally at a right
angle to the
long direction of the rack. In rack 1034, the processor bays 1038 are arranged
at an
oblique angle to provide a straighter path for air flow between the intake
airflows 1602
and the exhaust air flows 1604, potentially reducing turbulence in the air
flow in the
transportable datacenter, and potentially increasing the cooling effect of the
air flows.
Rack 1034 may be used for some or all of the racks in a transportable
datacenter.
[155] Reference is next made to FIG. 11, which illustrates another
transportable
datacenter 2100. Elements of transportable datacenter 2100 that correspond to
transportable datacenter 100 are identified by corresponding reference
numerals. In
transportable datacenter 2100, the racks 2134 extend from hot air plenum
barrier 2158
towards exhaust sidewall 2106, but are spaced apart from the exhaust sidewall
2106.
This provides a hot air plenum 2156 that extends along the length of exhaust
sidewall
2106 and allows additional exhaust fans to be installed along a greater
portion of the
length of sidewall 2106, potentially providing greater airflow and cooling
through the
transportable datacenter.
[156] Reference is next made to FIG. 12, which illustrates another
transportable
datacenter 3100. Elements of transportable datacenter 3100 that correspond to
transportable datacenters 100 and 2100 are identified by corresponding
reference
numerals. In transportable datacenter 3100, the ventilation system includes a
plurality
of hot air mixing fans 3170 that are operable, under the control of a central
fan
controller, to draw air from one or more hot air plenums 3156 into to the cold
air plenum
3154 through ducting 3172. The central fan controller may activate and control
the
speed of the hot air mixing fans 3170 in response to temperature measurements
in the
environment, in the cold air plenum, or at one or more processors, or a
combination of
these and other locations. In some environments, cold air drawn from the
environment
of a transportable datacenter into the cold air plenum may be sufficiently
cold to
negatively impact the operation of the processors or other elements of the
transportable
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datacenter. In those situations, it may be desirable to heat the air in the
cold air plenum
3154 by mixing hot air from one or more hot air plenums 3156 into the cold air
plenum.
In this example, hot air from two hot air plenums 3156b and 3156d is mixed
with cold air
in the cold air plenum 3154. In other embodiments, a greater or smaller number
of hot
air mixing fans 3170 may be provided to mix hot air from any number of hot air
plenums
into the cold air plenum.
[157] Reference is next made to FIGs. 13A and 13B which illustrate another
embodiment of a transportable datacenter 3200. The transportable datacenter
3200
has intake ports 3206 on the roof of the transportable datacenter for
providing
ventilation of cool air from the environment into the cold plenum. Each of the
intake
openings 3206 will typically have a filter or other protective element
installed in the
intake opening to reduce the flow of dirt, dust and other particulate matter
and
contaminants into the transportable datacenter 3200. The air intake openings
may have
baffles or other physical protective elements to reduce the flow of rain and
other
materials into the transportable datacenter 3200. In some embodiments, some or
all of
the intake openings may have an air intake fan installed within them. The
intake
openings 3206 may be sized identically or differently from one another. The
air
openings provide intake air flows 3208 from the intake opening 3206 to the
plurality of
processor bays on the rack 134.
[158] Referring to FIG. 14, there is another embodiment of a transportable
datacenter
3300. Elements of rack 3314 that correspond to rack 134 are identified by
corresponding reference numerals. In rack 134, the processor bays are arranged
generally at a right angle to the long direction of the rack. In rack 3314,
the processor
bays 3318 are arranged at an oblique angle to provide a straighter path for
air flow
between the intake airflows and the exhaust air flows, and the racks 3314 are
further
arranged at an oblique angle, potentially reducing turbulence in the air flow
in the
transportable datacenter, and potentially increasing the cooling effect of the
air flows.
Rack 3314 may be used for some or all of the racks in a transportable
datacenter.
Intake openings 3306 are provided to allow for the intake of cooler air from
the
environment. Exhaust openings 3308 are provided to allow for exhaust of hot
exhaust
air into the environment.
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[159] Referring to FIG. 15A, there is shown a perspective view of another
embodiment
of a transportable datacenter 3350. Transportable datacenter 3350 has intake
openings
3306 on the roof 3374 and exhaust openings 3318 on the roof 3374. One or more
exhaust openings 3318a may be connected by ducting to an intake opening 3306a
to
allow hot exhaust air to recirculate from the hot plenum into the cold plenum.
The
recirculation of hot air may be controlled by an independent control
mechanism. The
ducting may be internal or external to container 3350. In this embodiment, air
intake
occurs through the intake openings 3306 on roof 3374, but air may optionally
intake
through the intake openings 3306 on roof 3374 and intake openings on side wall
3372
(see FIG. 2 at 116).
[160] It is understood that there may be a transportable container with intake
openings
on the first sidewall (the intake sidewall), intake openings on the roof, or
both intake
openings of the first sidewall (the intake sidewall) and the roof. It is
further understood
that there may be a transportable container with exhaust openings on the
second
sidewall (the exhaust sidewall), exhaust openings on the roof, or exhaust
openings on
the second sidewall (the exhaust sidewall) and exhaust openings on the roof.
[161] Referring to FIG. 15B, there is shown a cutaway top portion view of the
transportable datacenter 3350 from FIG. 15A. In transportable datacenter 3350,
a
plurality of exhaust ports 3318 are provided generally directed upwards. The
plurality of
exhaust ports 3318 may be used to exhaust into the environment upwards. The
plurality of exhaust ports 3318 may have an independent control mechanism to
recirculate the exhaust air flow back into the cold air plenum 3302 via
ducting. This
independent control mechanism may be an air flow switch or a flue. The air
flow switch
may switch between recirculating hot air flow from the exhaust opening to the
intake
opening, and exhausting the hot air flow into the environment. The
recirculation may be
performed to increase the intake air temperature if the ambient air
temperature in the
environment is below an operating threshold for the processors disposed in
processor
bays 3368.
[162] Referring to FIG. 150, there is shown a perspective view of another
embodiment
of a transportable datacenter 3400. Transportable datacenter 3400 has intake
openings
3406 on the intake wall 3472 and exhaust openings 3418 on the roof 3474. One
or
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more exhaust openings 3418a may have ducting 3470 to vent hot exhaust air
proximate
to an intake opening 3406 to allow hot exhaust air to recirculate from the hot
plenum
into the cold plenum. Optionally, the ducting 3470 may be connected to an
intake
opening 3406. The recirculation of hot air may be controlled by an independent
control
mechanism. The ducting may be internal or external to container 3400.
[163] Referring to FIG. 15D, there is shown a cutaway top portion view of the
transportable datacenter 3400 from FIG. 150. In transportable datacenter 3400,
a
plurality of exhaust ports 3418 are provided generally directed upwards. The
plurality of
exhaust ports 3418 may be used to exhaust into the environment upwards. The
plurality of exhaust ports 3418 may have an independent control mechanism to
recirculate the exhaust air flow back into the cold air plenum 3406 via
ducting 3470.
This independent control mechanism may be an air flow switch or a flue. The
air flow
switch may switch between recirculating hot air flow from the exhaust opening
to the
intake opening, and exhausting the hot air flow into the environment. The
recirculation
may be performed to increase the intake air temperature if the ambient air
temperature
in the environment is below an operating threshold for the processors disposed
in
processor bays 3468.
[164] Referring to FIG. 16A there is shown a cutaway portion view 3500 of
another
transportable datacenter showing an embodiment of the rack configuration. The
transportable datacenter has two or more racks 3514, an intake sidewall 3507
having
intake openings 3506, and an exhaust sidewall 3510 having exhaust openings
3508.
Each of the two or more racks 3514 has a plurality of processor bays 3518
arranged
generally at a right angle to the long direction of the racks 3514. In racks
3514, the
processor bays 3518 are arranged at an oblique angle to provide a straighter
path for
air flow between the intake airflows and the exhaust air flows, and the racks
3514a and
3514b are further arranged at an angle from each other, potentially reducing
turbulence
in the air flow in the transportable datacenter, and potentially increasing
the cooling
effect of the air flows. The racks 3514 have generally the same configuration
of
processor bays 3518 as rack 3314 in FIG. 14. Intake openings 3506 are provided
to
allow for the intake of cooler air from the environment into cold plenum 3502
for cooling
of the processor bays. Exhaust openings 3308 are provided to allow for exhaust
of hot
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exhaust air from the processor bays into the hot plenum 3504 and finally into
the
ambient environment.
[165] A first rack 3514a may have an first end proximate to the exhaust
sidewall 3510,
and a second end proximate to the intake sidewall 3507. A second rack 3514b
may
have a first end proximate to the exhaust sidewall 3510, and a second end
proximate to
the intake sidewall 3507. The second end of the first rack 3514a and the
second end of
the second rack 3514b are arranged to form angle 3519, and generally define a
generally triangular hot plenum 3504. The first rack 3514a and the second rack
3514b
may have a generally triangular space 3517 in the cold plenum 3502 defined
where
they meet, opposite the hot plenum 3504.
[166] Each of racks 3514 are further configured with an integrated power
distribution
system 3520. The integrated power distribution system 3520 may be attached
directly
to racks 3514, or may be attached using one or more mounting brackets 3528
(see
FIGs. 16D, 16E, and 16F for more detail). The integrated power distribution
system
3520 may be shaped to fit the triangular space 3517 formed by the angle of two
racks
3514. The integrated power distribution system 3520 may be a triangular prism
as
shown, or it may be another shape.
[167] The integrated power distribution system 3520 may be shaped to provide
adequate clearance 3521 between the integrated power distribution system 3520
and
the intake sidewall 3507, such that an operator has access to the power
distribution
system 3520 within the confines of the transportable container. The clearance
3521
may be a particular distance based on a regulatory requirement such as an
electrical
regulatory requirement. In one example, the electrical regulatory requirement
may state
a minimum clearance from a power distribution panel of at least 36 inches.
[168] The integrated power distribution system 3520 provides processor power
circuits
to supply power to the processor bays 3518 (as shown in FIGs. 18A ¨ 18B) from
one or
more main circuits. Each of the processor power circuits may include processor
circuit
breakers for each of the processor bays 3518 in the rack 3514. Each of the one
or
more main circuits may include main circuit breakers.
[169] Referring to FIG. 16B, there is shown a cutaway portion view 3501 of
another
transportable datacenter having another embodiment of racks 3515. The
transportable
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datacenter has two or more racks 3515, an intake sidewall 3507 having intake
openings
3506, and an exhaust sidewall 3510 having exhaust openings 3508. The processor
bays 3519 are arranged generally at a right angle to the long direction of the
racks
3515. Each processor bay in rack 3519a is generally parallel with the other
processor
bays in the rack. The two racks 3515a and 3515b are further arranged at an
angle from
each other, potentially reducing turbulence in the air flow in the
transportable
datacenter, and potentially increasing the cooling effect of the air flows.
Intake
openings 3506 are provided to allow for the intake of cooler air from the
environment
into cold plenum 3502. Exhaust openings 3308 are provided to allow for exhaust
of hot
exhaust air from the hot plenum 3504 into the environment.
[170] It is understood that the integrated power distribution panel 3520 may
be used on
the rack configuration in the embodiment of the transportable datacenter shown
in FIG.
16A, the embodiment of the transportable datacenter shown in FIG. 16B, the
rack
configuration in the embodiment of the transportable datacenter in FIG. 3A,
the rack
configuration in the embodiment of the transportable datacenter in FIG. 10, or
another
rack configuration inside a transportable container.
[171] In FIGs. 16A and 16B, it is understood that the integrated power
distribution
panel 3520, or the pair of integrated power distribution panels 3520, may
substantially
isolate the cold plenum 3502 from the hot plenum 3504 in their attachment to
the racks
3514, and may form a plenum barrier as described above. Optionally, the pair
of
integrated power distribution panels 3520 may be attached at one end in order
to
provide the plenum barrier.
[172] Referring next to FIG. 16C, there is shown a front view 3526 of two
racks of the
transportable datacenter of FIG. 16A and FIG. 16B. In this embodiment, there
is shown
an integrated power distribution system 3525 for each of the two racks 3514a
and
3514b. As shown in FIG. 160, the processor circuits of the two integrated
power
distribution systems 3525 are not connected. The integrated power distribution
system
3525 includes an integrated power distribution panel 3520, one or more main
circuit
breakers 3707, a plurality of processor circuit breakers 3706, one or more
main circuit
access openings (not shown), and a plurality of processor circuit access
openings 3708.
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[173] Each integrated power distribution panel 3520 is attached to the second
end of
the racks 3514. The panel 3520 may be a triangular prism, a rectangular
cuboid, or
another shape. The panel 3520 may be made from any suitable material,
including
aluminum, steel, or plastic.
[174] The one or more main circuit breakers 3707 and the plurality of
processor circuit
breakers 3706 may be an electrical circuit breaker as is known. In one
embodiment, the
one or main circuit breakers 3707 and the plurality of processor circuit
breakers 3706
may be Deutsches Institut fur Normung (DIN) Rail Circuit Breakers, such as
those
offered by NOARKO. In one embodiment, the main circuit breakers 3707 may be
configured to interrupt the positive terminals of several individual single-
phase electrical
circuits. In an alternate embodiment, the main circuit breakers 3706 may be
configured
to electrically isolate individual phases of a three-phase electrical circuit.
The one or
more main circuit breakers 3707, and the plurality of processor circuit
breakers 3706
may be attached to the front wall of the panel 3520. In an alternate
embodiment, the
one or main circuit breakers 3707, and the plurality of processor circuit
breakers 3706
may be attached to the rear wall of the panel 3520.
[175] The one or more main circuit access openings (not shown) may be an
opening in
the panel 3520 to allow for cabling or wiring to pass through. In an alternate
embodiment, the one or more main circuit access openings may be connectors
attached through the panel for connection to the one or more main circuits.
[176] The plurality of processor circuit access openings 3708, may be an
opening in
the panel 3520 to allow for cabling or wiring to pass through. In an alternate
embodiment, the one or more processor circuit access openings may be
connectors
attached through the panel for connection to the plurality of processor
circuits.
[177] Referring next to FIG. 16D, there is shown a perspective view 3529 of a
mounting bracket 3528. The mounting bracket 3528 may be attached to the end of
a
rack, and also attached and supporting the integrated power distribution
system of the
transportable datacenter of FIG. 16A. The mounting bracket 3528 supports the
integrated power distribution system generally spaced away from the rack, and
at an
angle. The mounting bracket 3528 may be made of any suitable material for
supporting
the integrated power distribution system, for example, a rigid material such
as aluminum
32
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or steel. In one embodiment, the mounting bracket 3528 may be a single piece
of
material that is bent, formed, or cast. In an alternate embodiment, the
mounting bracket
3528 may be formed from more than one piece, for instance, using fasteners or
by
welding.
[178] The bracket 3528 may be attached to the rack using any fastener means.
For
example, as shown, the bracket 3528 may be bolted to the rack using through-
holes
3530.
[179] Referring next to FIG. 16E, there is shown a side view 3532 of the
mounting
bracket in FIG. 16D. As shown, the mounting bracket 3528 may have a first
flange
3534 for attaching the bracket to the rack, a first spacer 3536 that extends
from the first
flange, a standoff 3538 that extends from the first spacer 3536, a second
spacer 3540
extending from the standoff 3538, and a second flange 3542 extending from the
second
spacer 3540. The first flange 3534 and the second flange 3542 are for
attachment to
the rack, and may be configured to sit generally flush with the rack. The
first spacer
3536 and the second spacer 3540 are of different lengths and generally
configured to
secure the integrated power distribution system at an angle to the rack. The
standoff
3538 is for attachment to the integrated power distribution system, using any
known
fastener means.
[180] Referring next to FIG. 16F there is shown a front view 3544 of the
mounting
bracket in FIG. 16D. The mounting bracket 3528 shows that the second flange
3542,
second spacer 3540, and standoff 3538 may be generally rectangular shaped.
Similarly, the first flange 3534 and first spacer 3536 may also be generally
rectangular
shaped.
[181] Referring next to FIG. 16G is shown a perspective view of a power
distribution
panel of the transportable datacenter of FIG. 16A. The power distribution
system has a
housing 3560 having a top surface 3554, a base surface 3552, and a rear
surface 3558.
In one embodiment, the housing 3560 may not have a front surface and instead
may
generally define an opening inside the housing 3560, with the one or more main
supply
circuit breakers 3707 and the plurality of processor circuit breakers 3706
attached inside
the opening on the rear surface 3558. The housing 3560 may have an access door
as
shown in FIG. 161.
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[182] In an alternate embodiment, the housing may further include a front
surface for
attaching the one or more main supply circuit breakers 3707 and the plurality
of
processor circuit breakers 3706 are attached to the front surface 3556 of the
housing
3560.
[183] As shown, the housing 3560 may be a triangular prism shape, but may also
be
another shape as required.
[184] Referring next to FIG. 16H, there is shown a top view 3560 of the
housing 3560
of FIG. 16G. The top surface 3554 may have one or more main circuit access
openings
3562 on the top surface 3554. The main circuit access openings 3562 may be
holes or
connectors that provide access for main circuit cabling or wires to deliver
power from a
power source to the power distribution panel.
[185] Referring next to FIG. 161, there is shown a front view 3570 of an
alternate
embodiment of the housing. In this alternate embodiment the housing 3560 does
not
have a front surface 3556 and generally defines an opening inside the housing,
with the
one or more main supply circuit breakers 3707 and the plurality of processor
circuit
breakers 3706 attached inside the opening on the rear surface 3558, with a
removable
door 3574 including access element 3572, the access element may be a door knob
or a
button, or another mechanical or electrical locking device for securing the
removable
door 3574 in place.
[186] Referring next to FIG. 16J, there is shown a rear view 3580 of the
housing 3560
of FIG. 16F. The housing 3560 has a rear surface 3558 with a plurality of
processor
circuit access openings 3708. The plurality of processor circuit access
openings 3708
may be holes or connectors that provide access for main circuit cabling or
wires to
deliver power from a power source to the power distribution panel.
[187] Referring next to FIG. 17A, there is shown a front view of the pair of
racks in FIG.
16A and FIG. 16B showing the pair of integrated power distribution systems
3720 of
FIG. 16C in a connected configuration. As shown, main circuits 3702 feed power
into
the integrated power distribution system 3720 through a main circuit access
opening
(not shown). The main circuits 3702 may be provided to the integrated power
distribution systems 3720 as described in FIG. 7A. In one embodiment, the main
circuits 3702 may deliver three individual 1-phase power circuits (as shown).
In an
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CA 3050389 2019-07-22
alternate embodiment, the main circuits 3702 may be individual phases of a 3-
phase
power connection. The 3-phase power main may be converted to single phase
power
using a phase converter or a transformer in the integrated power distribution
system
(not shown). While three main circuits 3702 and three main circuit breakers
3704 are
shown, it is understood that there may be more or less than three. While
twenty five
processor circuits including twenty five processor circuit breakers 3706, and
twenty five
processor circuit access openings 3708 are shown, it is understood that there
could be
more or less than twenty five. The processor circuit openings 3708 are shown
as
groups of five in this embodiment, corresponding to the number of processor
bays
shown in FIG. 18B, however the number of processor circuit openings 3708 in
each
group may vary based on the number of processor bays on each shelf of the rack
(see
FIG. 4A).
[188] In the case where single phase power is provided to the processor bays,
the
circuits of the power distribution system 3720 includes a positive circuit, a
negative
circuit, and a ground circuit. The integrated power distribution system 3720
provides
neutral and ground circuits (not shown) interconnecting the main circuits 3702
and the
processor circuits. The neutral and ground circuits may be interconnected
using a bus
bar, or another power interconnection means.
[189] In the embodiment where three-phase power is provided, the circuits of
power
distribution system 3720 include three positive circuits, a neutral circuit
and a ground
circuit. In this three-phase embodiment, the power distribution system 3720
may
include a transformer or another conversion means to supply single-phase power
to the
processor circuits from the three-phase power provided from the main circuits
3702.
[190] An input side of the main circuit breakers 3704 is connected to a main
circuit
3702. The main circuit breakers operate to electrically isolate the main
circuits 3702
from the bus circuits 3712 if an adverse electrical condition is detected. The
adverse
electrical condition may include a bus circuit short, bus circuit voltage over
a threshold,
bus circuit voltage under a threshold, or bus circuit current over a
threshold. Similarly,
the adverse electrical condition may include a main circuit voltage over a
threshold, or
main circuit voltage under a threshold. The main circuit breakers 3704 may
generate an
alarm or monitoring signal so that status of each of the breakers can be
remotely
CA 3050389 2019-07-22
monitored. The main circuit breakers 3704 may have an optical coupling (not
shown) to
allow for the main circuit breakers to be reset remotely.
[191] An output side of the main circuit breakers 3704 is connected to the
input side of
a processor circuit breaker 3706 via bus circuit 3712. The processor circuit
breakers
3706 operate to electrically isolate the bus circuits 3712 from the processor
circuits
3714 if an adverse electrical condition is detected. The adverse electrical
condition may
include a processor circuit short, processor circuit voltage over a threshold,
processor
circuit voltage under a threshold, or processor circuit current over a
threshold. Similarly,
the adverse electrical condition may include a bus circuit voltage over a
threshold, or
bus circuit voltage under a threshold. The processor circuit breakers 3704 may
generate an alarm or monitoring signal so that status of each of the breakers
can be
remotely monitored. The processor circuit breakers 3704 may have an optical
coupling
(not shown) to allow for the processor circuit breakers to be reset remotely.
[192] An output side of a processor circuit breakers 3706 is directly
connected to a
processor circuit 3714. The direct connection to processor circuit 3714 may
allow for
space savings within the constraints of the transportable data center as
compared to a
processor circuit that plugs into an outlet, socket, or other connector. The
processor
circuits 3714 may be wires, a bus bar, or another electrical power
transmission device
that interconnect the processor circuit breaker 3706 to the plurality of
processor bays.
[193] Referring next to FIG. 17B, there is shown a cross section view 3750
along the
line 3710-3710 in FIG. 17A showing a plurality of processor circuits. The
plurality of
processor circuits 3708 extend from the integrated power system 3720 to each
of the
processor bays in the single shelf level of the rack (see e.g. FIG. 4A). The
plurality of
processor circuits 3708 distribute power from the integrated power system 3720
to the
processor bays.
[194] Referring next to FIG. 18A, there is shown a cutaway portion view 3600
of
another transportable datacenter having an evaporative cooling system. The
transportable datacenter shown in the cutaway portion view 3600 has two or
more racks
3614 inside the transportable datacenter. Intake sidewall 3607 has intake
openings
3606, and exhaust sidewall 3608 has exhaust openings 3608. A cold plenum 3602
is
generally defined by the end walls (not shown), the intake side of the
plurality of
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processors disposed on racks 3614, and the intake sidewall. Intake fans may be
positioned inside the intake openings 3606.
[195] Air from the ambient environment is drawn into the cold plenum using
intake fans
in the intake openings, and provides cooling as it passes through the
plurality of
processors in racks 3614, and then the hot exhaust air exhausts the hot plenum
3604
via the exhaust openings 3608 in exhaust sidewall 3610.
[196] The transportable datacenter in FIG. 18A further comprises an
evaporative
cooling system, having a pump 3617 in fluid communication with a fluid source,
a
intermediate pipe 3615 in fluid communication with the pump, and one or more
output
pipes 3612 in fluid communication with the intermediate pipe 3615. The pump
3617
includes a motor, such as an electric motor, an internal combustion engine, or
another
motor means. The pump 3617 draws fluid from a fluid source, and has an output
providing the fluid to the intermediate pipe 3615 at an increased pressure.
The one or
more output pipes 3612 extend from the intake sidewall 3607. In one embodiment
the
output pipes 3612 extend generally in front of the intake openings 3606. There
may be
an output pipe 3612 in front of each intake opening 3606. The distal end of
each of the
output pipes 3612 has a nozzle (not shown) for providing a mist, or an aerosol
3616, of
the liquid pumped through the evaporative cooling system.
[197] In one embodiment, the fluid used in the evaporative cooling system is
water. In
another embodiment, other fluids having higher values of enthalpy of
vaporization may
also be used, such as methanol or ethanol
[198] In one embodiment, an optional collection pan 3632 may be provided to
recover
liquid from the one or more output pipes 3612.
[199] The nozzle of the output pipe 3612 receives pressurized cooling liquid
through
the output pipe 3612 and the intermediate pipe 3615 from the pump 3617. The
received liquid produces a mist 3616 as is exits through the nozzle of the
output pipe
3612 into the ambient environment proximate to the intake sidewall 3607. The
mist
3616 exits as liquid droplets and evaporates to generate liquid vapor. The
evaporation
is done using heat from the air in the ambient environment, thus cooling the
air
proximate to the intake openings 3606 of intake sidewall 3607.
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[200] Optionally, a collection pan 3632 may be positioned underneath each of
the one
or more output pipes 3612 to collect water from the mist 3616 that does not
evaporate.
The collection pan 3632 may return the water to a reservoir to be reused.
[201] The evaporative cooling system of FIG. 18A may further be used in
conjunction
with the embodiments of the transportable datacenter shown in FIGs 1, 2, 3A,
3B, 6, 7A,
10, 11, 12, 1313, 14, 15B, 15D, 16A, and 16B.
[202] Referring next to FIG. 18B there is shown a side view 3630 of the
transportable
datacenter of FIG. 18A. The transportable container has end wall 110 having
access
door 124. Extending from the intake sidewall of the transportable container,
the one or
more output pipes 3612 are shown extending generally parallel to the
supporting
surface below the transportable container. The output pipes 3612 each have a
nozzle
at the distal end, and generate a mist 3616 from liquid pressurized through
the
transmission pipe to the one or more output pipes 3612.
[203] In one embodiment, a collection pan 3632 is positioned below the output
pipe
3612 to collect cooling liquid that does not evaporate.
[204] Referring next to FIG. 18C, there is shown a system view 3660 of the
evaporative cooling system of FIG. 18A. The evaporative cooling system has a
pump
3617, intermediate pipe 3615, output pipe valves 3618, processor 3634, sensor
3636,
one or more output pipes 3612.
[205] The pump 3617 is a liquid pump such as a positive displacement pump, and
includes a motor means such as an electric motor or internal combustion engine
to drive
it. The pump operates to draw liquid from a reservoir or liquid source into an
input, and
urge the liquid under pressure into the intermediate pipe 3615. The pump may
be in
communication with the processor 3634, for example, through the use of a
relay, in
order to enable the processor to programmatically control the operation of the
pump.
The control of the pump may be simply on/off, or may be a variable speed
control.
[206] The intermediate pipe 3615 carries pressurized cooling liquid from the
pump
3617 to the one or more output pipes 3612. The intermediate pipe 3615 may be a
pipe
or hose as is known, including for example polyvinyl chloride (PVC) piping.
[207] Each of the one or more output pipes 3612 carry pressurized cooling
liquid from
the intermediate pipe 3615 to the distal end of the one or more output pipes
3612. The
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distal end of the one or more output pipes 3612 includes a nozzle to produce a
mist or
aerosol 3616 of the cooling liquid in the ambient atmosphere proximate to the
intake
side of the transportable datacenter.
[208] Each of the one or more output pipes 3612 may have an output pipe valve
3618.
The output pipe valve 3618 may have an actuator for operation of the valve to
open,
close, partially open, or partially close the valve. The closure of the valve
may stop the
flow of cooling liquid through the output pipe. The actuator for the output
pipe valve
3618 may be in communication with the processor 3634. The connection of the
processor 3634 with the actuators of the output pipe valves may be done using
a
solenoid, or similar means, and may allow for the programmatic control of the
fluid flow
through the output pipes 3612. The output pipe valves 3618 may be
independently
controlled by the processor 3634, or may be operated together.
[209] Each of the one or more output pipes 3612 may be generally aligned with
an
intake opening 3606 of the intake sidewall 3607 of the transportable
datacenter. The
operation of the evaporative cooling system generates a mist or aerosol 3616
of cooling
liquid 3616 that evaporates in the ambient atmosphere to cool the ambient air
prior to
intake into intake openings 3606 of the intake sidewall 3607 of the
transportable
datacenter.
[210] The sensor 3636 may be a temperature sensor, a light sensor, a humidity
sensor, an optical sensor, or a combination of a light sensor, a humidity
sensor, and an
optical sensor. The sensor 3636 is in communication with the processor 3634
for
providing sensor data on the ambient atmosphere.
[211] The processor 3634 may be any computer having one or more processors
that
can provide processing power for controlling the evaporative cooling system
and a
memory for storing program instructions. Processor 3634 may be a desktop
processor,
for example, an Intel Xeon , or AMD Opteron TM. In another embodiment, the
processor may be an embedded computer system such as an Arduino or a
Raspberry
Pi . In another embodiment, the processor may be a Field-Programmable Gate
Array
(FPGA), or a purpose built controller. In one embodiment, the processor is a
proportional-integral-derivative controller (PID controller) that operates a
control loop for
the evaporative cooling system.
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CA 3050389 2019-07-22
[212] The processor 3634 receives sensor data from the sensor 3636, and
controls the
actuators of the valves 3618 of the one or more output pipes 3612 and the pump
3617.
The processor control 3634 of the evaporative cooling system may begin cooling
as the
ambient temperature of the air entering the intake openings exceeds a
threshold.
Similarly, the processor control 3634 may reduce or disable the evaporative
cooling
system if the humidity at the intake openings exceeds a threshold.
[213] The processor 3634 may further comprise a network controller. The
network
controller is any interface that enables the processor 3634 to communicate
with other
devices and systems. In some embodiments, the network controller can include a
serial
port, a parallel port, and/or a Universal Serial Bus (USB) port. The network
controller
156 may also include at least one of an Internet, Local Area Network (LAN),
Ethernet,
Firewire, modem, or digital subscriber line connection. Various combinations
of these
elements may be incorporated within the network controller.
[214] The processor 3634 may be in communication with the one or more intake
fans
.. (not shown) and the one or more exhaust fans (not shown) in conjunction
with the pump
3617, and the actuator of the output pipe valves 3618. The processor 3634 may
function to control the fan speed of the intake fans, and the exhaust fans
based on the
operation of the output pipe actuators.
[215] Referring next to FIG. 18D, there is shown a system diagram 3680 of the
evaporative cooling system. The processor 3634 may be available for connection
for
remote administration via network 3682. A user at user device 3684 may connect
to the
processor remotely and administer the evaporative cooling system.
[216] The network 3682 may be the Internet, Ethernet, a point to point
connection,
plain old telephone service (POTS) line, public switch telephone network
(PSTN),
integrated services digital network (ISDN), digital subscriber line (DSL),
coaxial cable,
fiber optics, satellite, mobile, wireless (e.g. Wi-Fi, WiMAX), SS7 signaling
network, fixed
line, local area network, wide area network, and others, including any
combination of
these, capable of interfacing with, and enabling communication between the
processor
3634 and the user device 3684.
[217] The user device 3684 may be a personal computer, a smartphone, an
electronic
tablet device, a laptop, a workstation, server, portable computer, mobile
device,
CA 3050389 2019-07-22
personal digital assistant, Wireless Application Protocol (WAP) phone, an
interactive
television, video display terminals, gaming consoles, and portable electronic
devices.
The client system may operate to access the processor using a web browser, or
using a
client-server application, in order to administer the evaporative cooling
system.
[218] The present invention has been described here by way of example and with
reference to several example embodiments. These embodiments are merely
exemplary
and do not limit the scope of the invention, which is limited only by claims.
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CA 3050389 2019-07-22
