Note: Descriptions are shown in the official language in which they were submitted.
87495106
ADDITIVELY MANUFACTURED STRUCTURE AND METHOD FOR
MAKING THE SAME
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to United States provisional
patent application,
Serial No. 62/683,527, filed on June 11, 2018.
FIELD
[0002] The disclosed embodiments relate generally to additive
manufacturing and more
particularly, but not exclusively, to additively manufactured structures and
methods for
making the same.
BACKGROUND
[0003] Three-dimensional (3D) printing, also known as additive
manufacturing, is a
technique that deposits materials only where needed, thus resulting in
significantly less
material wastage than traditional manufacturing techniques, which typically
form parts by
reducing or removing material from a bulk material. While the first three-
dimensional (3D)
printed articles were generally models, the industry is quickly advancing by
creating 3D
printed articles that may be functional parts in more complex systems, such as
hinges, tools,
structural elements.
[0004] In typical additive manufacturing processes, a 3D object is
created by forming
layers of material under computer control. An arising challenge for more
advanced 3D
printed articles is providing a print surface to print on. For example, in 3D
printing process
based on extrusion deposition, the print surface needs to provide proper
adhesion such that
the print surface can adhere strongly enough to the printed 3D object to
prevent the 3D object
from moving throughout the duration of printing. Furthermore, the print
surface should
typically allow separation from the 3D object without damaging or
contaminating the 3D
object. Existing print surfaces are often difficult and time-consuming to
remove from the 3D
object. Upon removal, remaining texture on the 3D object is not always
desirable. In
addition, when a different material needs to be incorporated with the 3D
object, a secondary
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operation (e.g., bonding or fastening a second material to the 3D object) is
required. Often,
the secondary operation requires additional pre-processing (e.g., cleaning,
abrading, and/or
priming) before adhesives or fasteners can be applied) that can be time-
consuming, introduce
additional errors from manual processes, and present challenges for accessing
the 3D object
during manufacture.
100051 Additive manufacturing for making a 3D article on a large scale
(i.e., typically
with at least one dimension greater than 5 feet) can be referred to as large-
scale additive
manufacturing. A system (or technique) for large scale additive manufacturing
can be
referred to as large scale additive manufacturing system (or technique).
Exemplary large
scale additive manufacturing systems include, for example, the Big Area
Additive
Manufacturing (BAAMTm) 100 ALPHA available from Cincinnati Incorporated
located in
Harrison, Ohio, or the Large Scale Additive Manufacturing (LSAM) machine
available from
Thermwood Corporation located in Dale, Indiana. Exemplary systems that use
extrusion
deposition for large scale additive manufacturing include the BAAMTm 100 ALPHA
and the
LSAM machine.
100061 Large-scale additive manufacturing has recently become an area of
greater
research, use, and technology advancement because of improvements in material
properties
and increased needs of customized large structures. For example, Local Motors
located in
Phoenix, Arizona was the first to use large-scale additive manufacturing, or
large-scale
extrusion deposition, to print a vehicle. However, large-scale additive
manufacturing also
faces unique challenges.
100071 Methods for making structures in smaller-scale additive
manufacturing may not
necessarily apply to large-scale additive manufacturing. Although smaller-
scale additive
manufacturing may encounter the difficulty of setting up a suitable print
surface, the
difficulty can be especially severe and present unique challenges in large-
scale additive
manufacturing. For example, in small-scale additive manufacturing, the print
surface can be
coated with glue-stick or painter's tape, which coating can be time-consuming
and
impractical on the large-scale. Furthermore, in a large-scale extrusion
deposition process,
solidification of the bead can take a long time. Therefore, each printed layer
can have
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respective solidification progress. In addition, the size of the printed
layers is large, so the
amount of relative deformation between adjacent layers is large. Stress built
up between the
adjacent layers can be significant.
[0008] In some conventional large-scale systems, an acrylonitrile butadiene
styrene
(ABS) sheet can be used to cover the print bed, be pulled by a vacuum applied
via the print
bed and provide a high adhesion. However, the print bed can be hot when being
heated,
making it difficult to place the ABS sheet down or walk on during large-scale
additive
manufacturing. The ABS sheet can leave uneven gaps on large prints because
multiple ABS
sheets have to be taped side to side to cover the print bed of a large size.
Furthermore, the
ABS sheets can be defoimed under high stress during printing. As a further
challenge, there
can be gaps between multiple ABS sheets that can affect print quality. The
unevenness of the
gaps and presence of gaps between sheets can thus significantly affect quality
of printing.
[0009] In the event of deformation, the ABS sheet is no longer held down by
the vacuum,
and can lift off from the print bed. For example, in a large-scale extrusion
deposition
process, solidification of the bead can take a long time. Therefore, each
printed layer can
have respective solidification progress. In addition, size of the printed
layers are large, so
amount of relative deformation between adjacent layers are large. Stress built
up between the
adjacent layers can be significant. The lift-off of the ABS sheet can result
in stress relief in
an abrupt manner. The object with such a deformation can appear poorly shaped.
Certain
deformation of the object can reduce distance between the object and the print
head during
printing, and width of a bead subsequently deposited on the object can be
increased, resulting
in print defects.
[0010] In some conventional large-scale systems, a board, such as a wood
particle board,
can be coated with glue and used, such as wood glue. Plastic pellets can be
spread over the
wood glue. The roughness introduced by the pellets can help to hold the object
in place
during printing. However, in large-scale additive manufacturing, spreading the
pellets over
the board can be time consuming and difficult to evenly distribute the glue
and pellets
during manufacturing. Uneven distribution of either can result in non-uniform
adhesion of
the object, which can cause deformation of the object. When the object is
removed from the
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board, large amounts of slippery pellets can fall to the ground, resulting in
a large mess.
Furthermore, the board cannot be easily reused due to the lost pellets.
Finally, this method
results in pellets stuck to the bottom layer of the print, reducing the
quality and flatness of
this layer; typically, this bottom layer will need to be removed with a
secondary operation.
100111 Another challenge is printing of large flat surfaces. For example,
in a large-scale
extrusion deposition process, time between printing of two adjacent layers can
be long. Of
the two adjacent layers, the first layer can solidify to a great extent before
the second layer is
printed. Adhesion between the two layers can thus be poor. Additionally, it
can be difficult
to achieve good overlap in the y-direction when printing large flat surfaces.
Over-filling after
only a few adjacent layers can lead to compounding errors for the print head
to potentially
crash into. Over-filling can also cause the tamper (BAAM) or roller (LSAM) to
jam and stop
working. On the other hand, under-filling can yield poor mechanics.
[0012] Another arising challenge for more advanced 3D printed articles is
printing
overhang structures. For example, many structural materials have poor ability
to bridge a gap
without deformation (e.g., drooping) or breaking under gravity. An overhang
structure can
include a portion of a printed structure that extends from a main part of the
printed structure
and into empty space in a direction at least partially orthogonal to gravity.
A bridge structure
can include an exemplary overhang structure having two opposing end regions
each
connected to a printed structure.
[0013] Although smaller-scale additive manufacturing may encounter the
difficulty of
making overhang structures, the difficulty is especially severe and presents
unique challenges
in large-scale additive manufacturing. In a large-scale extrusion deposition
process, the
overhang structure is usually of large scale. The amount of deformation of the
overhang
structure can be significant. For example, in a large-scale extrusion
deposition process, an
extruded bead at large scale can hold heat much longer and remain in a rubbery
or molten
state long after the nozzle has attempted to deposit the bead in a desired
location. During
solidification of the bead, the bead may not be able to maintain dimension
under the weight
of the bead itself and under the weight of material printed on top of the
bead. Although a
rapid solidification process may be used to speed up the solidification, such
as spraying the
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bead with liquid nitrogen, the rapid solidification process can significantly
reduce inter-
laminar adhesion between printed layers and weaken strength of the large-scale
printed
structure. In contrast, in a small-scale extrusion deposition process, fans
can be used to
rapidly solidify material as it leaves the nozzle and overhangs can be printed
more easily.
[0014] To aid in the printing of overhang structures, support structures
can be printed
concurrently with the object, and then the overhang structure can be
subsequently printed on
the support structure. However, in large-scale additive manufacturing, such a
support
structure costs significant resources such as material, print time, and energy
consumption.
Furthermore, properties of the support structure cannot be selected with
flexibility, so
removal of the support structure can be difficult. Even if a sparse infill
pattern is used to
print the support structure, it can still be difficult to remove, and the
problems discussed
above for printing across the gaps in a sparse infill support structure still
exist.
[0015] In view of the foregoing, there is a need for improvements and/or
alternative or
additional solutions to improve additive manufacturing processes to produce
print surfaces
that overcome drawbacks of existing solutions and minimize the number of
secondary
operations.
SUMMARY
[0016] The present disclosure relates to additively manufactured structures
and methods
for making and using the same.
[0017] In accordance with a first aspect disclosed herein, there is set
forth a method for
additive manufacturing, including:
[0018] positioning an attachment portion in a printer; and
[0019] printing an object at least partially on the attachment portion, the
attachment
portion being configured to bond to the object via absorbing heat during the
printing, via
interlocking with the object, or a combination thereof
[0020] In some embodiments of the disclosed method, the printer is a part
of a large scale
additive manufacturing system.
[0021] In some embodiments of the disclosed method, the attachment portion
is made of
a first material and the object is made of a second material different from
the first material.
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[0022] In some embodiments of the disclosed method, the positioning
includes
positioning the attachment portion at least partially made of a thermoplastic
material, a
thermoset material, or a combination thereof
[0023] In some embodiments of the disclosed method, the positioning
includes
positioning the attachment portion made of the thermoplastic material that is
fiber-reinforced.
[0024] In some embodiments of the disclosed method, the attachment portion
includes a
perforated panel defining one or more openings and placed on a backing
surface, and the
printing includes printing the object on the attachment portion such that a
part of the object
flows through the one or more openings, is forced to spread upon contacting
the backing
surface, and forms one or more caps configured to interlock with the
perforated panel.
100251 hi some embodiments of the disclosed method, the positioning
includes
positioning the attachment portion including polyetherimide (PEI) foam,
polyethersulfone
(PES) foam, or a combination thereof
[0026] In some embodiments of the disclosed method, the positioning
includes:
[0027] printing a plurality of layers stacked in a stacking direction and
collectively
forming a closed loop;
100281 filling space defined by the closed loop with a spray foam
configured to expand in
the space; and
[0029] cutting the expanded spray foam to be even with a top layer of the
plurality of
layers.
[0030] In some embodiments of the disclosed method, the method further
includes
performing, before the printing, a surface treatment on the attachment
portion.
[0031] hi some embodiments of the disclosed method, the performing includes
performing a plasma treatment on the attachment portion.
[0032] In some embodiments of the disclosed method, the performing includes
performing the plasma treatment on the attachment portion made of metal.
[0033] In some embodiments of the disclosed method, the attachment portion
is
configured to bond to the object upon absorbing the heat at least partially
from the object
during the printing.
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[0034] In some embodiments of the disclosed method, the method further
includes
preparing the attachment portion including:
[0035] a base portion; and
[0036] a bonding layer on the base portion and interfacing the object
during the printing.
[0037] In some embodiments of the disclosed method, the preparing includes
disposing
the bonding layer on the base portion, the bonding layer being configured to
bond the base
portion to the object upon absorbing the heat at least partially from the
object during the
printing.
[0038] In some embodiments of the disclosed method, the preparing includes
disposing
the bonding layer on the base portion, the bonding layer being at least
partially made of
thermoplastic polyurethane.
[0039] In some embodiments of the disclosed method, the preparing includes
disposing
the bonding layer on the base portion, the bonding layer including a honeycomb-
patterned
sheet.
[0040] In some embodiments of the disclosed method, the preparing includes
disposing
the bonding layer on the base portion, the bonding layer including a sheet
made of
polyethylene terephthalate glycol (PETG), polyethylene terephthalate (PET), or
a
combination thereof.
[0041] In some embodiments of the disclosed method,
the base portion includes a perforated panel defining one or more openings and
placed
on a backing surface,
the preparing includes printing the bonding layer on the base portion, and
a part of the bonding layer flows through the one or more openings, is forced
to
spread upon contacting the backing surface, and forms one or more caps
configured to
interlock with the perforated panel.
[0042] In some embodiments of the disclosed method, the preparing includes:
[0043] printing, via the printer, the base portion including one or more
layers; and
[0044] disposing the bonding layer on the base portion.
[0045] In some embodiments of the disclosed method, the method further
includes:
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[0046] printing a ground structure including one or more ground layers; and
[0047] disposing a secondary bonding layer on the ground structure,
[0048] wherein the positioning includes attaching the attachment portion to
the ground
structure via the secondary bonding layer.
[0049] In some embodiments of the disclosed method, the positioning
includes
positioning the attachment portion including a flat panel, and wherein the
printing includes
printing the object entirely on the flat panel.
[0050] In some embodiments of the disclosed method, the printing includes:
[0051] printing at least one first layer structure; and
[0052] printing, after the positioning, a second layer structure on the
first layer structure
and the attachment portion, the attachment portion being configured to bond to
the second
layer structure.
[0053] In some embodiments of the disclosed method, the method further
includes
positioning a support structure in the printer, wherein the positioning the
attachment portion
includes positioning the attachment portion on the support structure.
[0054] In some embodiments of the disclosed method, the method further
includes
removing, after the printing the second layer structure, the support structure
from the
attachment portion.
[0055] In some embodiments of the disclosed method, the method further
includes
preparing the support structure at least partially made of foam.
[0056] In some embodiments of the disclosed method, the method further
includes
printing the support structure using the printer.
[0057] In some embodiments of the disclosed method, the printing includes
printing the
second layer structure at least partially supported by the attachment portion
during the
printing the second layer structure.
[0058] In some embodiments of the disclosed method, the printing the at
least one first
layer structure includes printing two first layer structures, the attachment
portion being
located between the two first layer structures.
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[0059] In some embodiments of the disclosed method, the printing the second
layer
structure includes printing the second layer structure bridging the two first
layer structures
and at least partially supported by the attachment portion during the printing
the second layer
structure.
[0060] In some embodiments of the disclosed method, the printing the two
first layer
structures includes printing the two first layer structures each defining a
recess for
accommodating the attachment portion at an elevated location above, and
without contacting,
a print substrate of the printer.
[0061] In some embodiments of the disclosed method, the method further
includes
disposing a secondary bonding layer on a bottom of the recess, the secondary
bonding layer
being configured to adhere the attachment portion to the first layer
structure.
[0062] In some embodiments of the disclosed method, the second layer
structure includes
at least one securing member formed on an edge region of the attachment
portion and
configured to secure the attachment portion from moving out of the recess.
[0063] In some embodiments of the disclosed method, the second layer
structure does not
extend continuously across the attachment portion.
[0064] hi some embodiments of the disclosed method, a gap exists between
the
attachment portion and the at least one first layer structure.
[0065] In some embodiments of the disclosed method,
the printing the at least one first layer structure includes printing one or
more first
layers printed in a printing direction and stacked in a stacking direction;
and
the printing the second layer structure includes printing one or more second
layers
printed in the printing direction stacked in the stacking direction.
[0066] In some embodiments of the disclosed method, the printing the at
least one first
layer structure includes printing a first layer structure defining a side wall
at a side angle
relative to the printing direction, the side angle ranging from 35 degrees to
90 degrees.
[0067] In some embodiments of the disclosed method, the printing the at
least one first
layer structure includes printing the first layer structure defining the side
wall with the side
angle varying along the side wall.
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[0068] In some embodiments of the disclosed method, the printing the at
least one first layer
structure includes printing the first layer structure defining the side wall
that is curved, with the
side angle decreasing along the stacking direction.
[0069] In some embodiments of the disclosed method, the at least one first
layer structure
and the attachment portion respectively have interfacing sides proximal to the
second layer
structure, and the positioning includes positioning the attachment portion
such that the
interfacing sides are coplanar.
[0070] In accordance with another aspect disclosed herein, there is set
forth a structure at
least partially made via additive manufacturing, including:
[0071] an object including one or more layers being stacked in a stacking
direction; and
[0072] an attachment portion stacked with the object in the stacking
direction and bonded to
the object via absorbing heat generated during printing of the object, via
interlocking with the
object, or a combination thereof.
[0073] In some embodiments of the disclosed structure, the attachment
portion includes a
perforated panel defining one or more openings, and a part of the object
extends through the one
or more openings and forms one or more caps configured to interlock with the
perforated panel.
[0073a] In some embodiments, there is provided a method for additive
manufacturing,
comprising: positioning an attachment portion in a printer; and printing an
object at least
partially on the attachment portion, the attachment portion being configured
to bond to the object
via absorbing heat from the object during said printing, heat from a print
substrate of the printer,
or a combination thereof, wherein said printing includes: printing at least
one first layer
structure, each first layer structure including one or more first layers
stacked in a stacking
direction; and printing, after said positioning, a second layer structure on
the at least one first
layer structure and the attachment portion, wherein the second layer structure
includes one or
more second layers stacked in the stacking direction, wherein the attachment
portion at least
partially supports the second layer structure during said printing of the
second layer structure and
is configured to bond to the second layer structure.
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[0073b] In some embodiments, there is provided a structure at least partially
made via
additive manufacturing, comprising: an object including one or more layers of
a first layer
structure and one or more layers of a second layer structure, the first and
second layer structures
being stacked in a stacking direction; and an attachment portion stacked with
the object in the
stacking direction and bonded to the object via absorbing heat generated from
the object during
printing of the object, heat from a print substrate of a the printer, or a
combination thereof,
wherein the one or more layers of the second layer structure are positioned on
at least one layer
of the first layer structure and the attachment portion, wherein the
attachment portion at least
partially supports the second layer structure and is configured to bond to the
second layer
structure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0074] Fig. 1 is an exemplary diagram illustrating an embodiment of a
system for additive
manufacturing.
[0075] Fig. 2A is an exemplary diagram illustrating an alternative
embodiment of the system
of Fig. 1, wherein the system makes a structure including an object and an
attachment portion.
[0076] Fig. 2B is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the system of Fig. 2A, wherein the attachment portion defines
one or more
openings.
[0077] Fig. 2C is an exemplary trimetric diagram illustrating an
alternative embodiment of
the system of Fig. 2B, wherein the attachment portion defines an array of
openings.
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[0078] Fig. 3 is an exemplary top-level flow chart illustrating an
embodiment of a method
for additive manufacturing based on the system of Fig. 2.
[0079] Fig. 4A is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the structure of Fig. 2A, wherein the attachment portion
includes a bonding
layer and a base portion.
[0080] Fig. 4B is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the system for making the structure of Fig. 4A, wherein the base
portion
defines one or more openings.
[0081] Fig. 4C is an exemplary trimetric diagram illustrating an
alternative embodiment
of the structure of Fig. 4B, wherein the base portion defines an array of
openings.
100821 Fig. 5 is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the structure of Fig. 2A during manufacturing, wherein the
object includes a
first layer structure.
[0083] Fig. 6 is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the structure of Fig. 5 during manufacturing, wherein an
attachment portion is
positioned in the system.
100841 Fig. 7 is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the structure of Fig. 6 during manufacturing, wherein a second
layer structure
is printed on the attachment portion.
[0085] Fig. 8 is an exemplary flow chart illustrating an alternative
embodiment of the
method of Fig. 3, wherein the method includes printing a first layer
structure.
[0086] Fig. 9 is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the structure of Fig. 7, wherein the attachment portion is
attached to a support
structure.
[0087] Fig. 10 is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the structure of Fig. 9, wherein the support structure is
removed from the
attachment portion.
[0088] Fig. 11 is an exemplary cross-sectional diagram illustrating another
alternative
embodiment of the structure of Fig. 7, wherein the object includes first and
second layer
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structures and an attachment portion, the second layer structures printed on
the attachment
portion and gaps separating the first layer structure and the attachment
portion.
[0089] Fig. 12 is an exemplary cross-sectional diagram illustrating another
alternative
embodiment of the structure of Fig. 7, wherein the object includes has a
tilted sidewall.
[0090] Fig. 13 is an exemplary cross-sectional diagram illustrating another
alternative
embodiment of the structure of Fig. 7, wherein the first layer structure has a
curved sidewall.
[0091] Fig. 14 is an exemplary cross-sectional diagram illustrating another
alternative
embodiment of the structure of Fig. 7, wherein the second layer structure has
a slant angle.
[0092] Fig. 15 is an exemplary cross-sectional diagram illustrating an
alternative
embodiment of the structure of Fig. 7, wherein the structure includes a third
layer structure.
100931 Fig. 16 is an exemplary flow chart illustrating another alternative
embodiment of
the method of Fig. 3, wherein the method includes printing a third layer
structure.
[0094] Fig. 17 is an exemplary cross-sectional diagram illustrating another
alternative
embodiment of the structure of Fig. 7 during manufacturing, wherein the first
layer structure
includes a support member.
[0095] Fig. 18 is an exemplary cross-sectional diagram illustrating another
alternative
embodiment of the structure of Fig. 17, wherein the second layer structure is
printed on the
attachment portion.
[0096] Fig. 19 is an exemplary cross-sectional diagram illustrating another
alternative
embodiment of the structure of Fig. 18, wherein the support member has a non-
uniform side
wall.
[0097] Fig. 20 is an exemplary diagram illustrating another alternative
embodiment of the
structure of Fig. 17, wherein the attachment portion is attached to a
secondary bonding layer.
[0098] Fig. 21 is an exemplary diagram illustrating another alternative
embodiment of the
system of Fig. 2A, wherein the attachment portion is attached to a ground
structure.
[0099] Fig. 22 is an exemplary diagram illustrating an embodiment of a
control system
for controlling the system of Fig. 1.
[0100] It should be noted that the figures are not drawn to scale and that
elements of
similar structures or functions are generally represented by like reference
numerals for
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illustrative purposes throughout the figures. It also should be noted that the
figures are only
intended to facilitate the description of the preferred embodiments. The
figures do not
illustrate every aspect of the described embodiments and do not limit the
scope of the present
disclosure.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0101] Fig. 1 shows an exemplary system 100 for additive manufacturing. The
system
100 can include a 3D printer configured to print an object 200 via extrusion
deposition (or
material extrusion). A print head 120 is shown as including a nozzle
configured to deposit
one or more polymer layers onto a print substrate 140 to form the object 200.
The print
substrate 140 is shown in Fig. 1 as providing a print surface 110 for
receiving initial printed
material deposited from the print head 120.
[0102] The print substrate 140 is shown as including a print bed 160. The
print bed 160
can provide a uniform or flat surface. The print bed 160 can include a heated
and/or unheated
table. The print substrate 140 can include any alternative type of print bed
and any other
intermediate structures (not shown) that at least partially covers the print
bed. The stacking
direction of the layers is z-direction and the printing direction is the x-
direction.
101031 Although Fig. 1 shows additive manufacturing as being implemented by
the
system 100 using extrusion deposition, any other systems or processes for
implementing
additive manufacturing can be used in the present disclosure. Exemplary
processes for
additive manufacturing can include binder jetting, directed energy deposition,
material
jetting, powder bed fusion, sheet lamination, vat photopolymerization,
stereolithography, or a
combination thereof.
[0104] As discussed above, typically it is desirable to remove the object
200 from the
print surface 110. Accordingly, the system 100 for additive manufacturing
provides a
suitable bond between the print surface 110 and the initially printed layers
to prevent damage
or contamination to the object 200 and/or provide a temporary bond for
subsequent
attachment via fasteners and/or pins.
[0105] Furthermore, since currently-available methods and systems are
incapable of
providing a reliable print surface with appropriate adhesion, producing large
flat surfaces
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with good interlayer adhesion, and generating large-scale additively
manufactured parts with
strong overhang structures, additively manufactured structures and method for
making the
same that can overcome the drawbacks as set forth above can prove desirable
and provide a
basis for a wide range of applications, such as additive manufacturing for
vehicles and/or
architectural structures.
[0106] Although the structures and methods as set forth in the present
disclosure are
applied to solve technical problems in large-scale additive manufacturing, the
structures and
methods can be applied to any smaller-scale additive manufacturing, such as
medium-scale
and/or small-scale additive manufacturing, without limitation. For example, in
some
embodiments, due to machine size, large-scale additive manufacturing provides
easy access
(e.g., parts are larger, more room to work in the machine while printing) to
carry out the
embodiments disclosed herein. However, those of ordinary skill in the art
would understand
that the embodiments disclosed herein can be applied to smaller-scale additive
manufacturing
systems.
[0107] Turning to Fig. 2A, an alternative embodiment of the exemplary
system 100 is
shown. An attachment portion 240 is shown as being disposed on the print
substrate 140.
The attachment portion 240 can be permeable and/or non-permeable. The
attachment portion
240 is shown in Fig. 2A as having the shape of a flat panel. An exemplary
attachment
portion 240 can be made by cutting a sheet material via stamping, milling, die
cutting,
forming, casting, laser cutting and/or water jet cutting, additive
manufacturing, or a
combination thereof In one embodiment, the attachment portion 240 can be pre-
cut into a
selected shape and size prior to being positioned in the system 100.
Advantageously, the
attachment portion 240 can replace large flat sections of the object 200 that
might otherwise
be printed. In some embodiments, the attachment portion 240 comprises one or
more layers
202 of the object 200. Additionally and/or alternatively, an exemplary
attachment portion
240 can be made using additive manufacturing.
[0108] The object 200 and the attachment portion 240 can be made of uniform
and/or
different materials. In one embodiment, the object 200 can be made of a first
material and
the attachment portion 240 can be made of a second material that is different
from the first
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material. By way of example, and as further discussed below, the object 200
can comprise
printed carbon fiber filled ABS being printed on the attachment portion 240
that comprises a
polycarbonate honeycomb sheet and/or ABS honeycomb sheet. In another example,
the
object 200 can comprise a foamed polymer (e.g., PES) that can be bonded to a
plate or
structure as the attachment portion 240, such that a print on top of the
object 200 can affix the
polymer to the plate or structure. In yet another example, a closed loop can
be printed for
several layers before pausing to fill it with a two-part spray foam. After a
short time (e.g., 30
seconds), the expanded foam can be cut to be even with the top printed layer
and serve as a
print surface. Additionally and/or alternatively, the object 200 can be made
of polyethylene
terephthalate (PET), polyethylene terephthalate glycol (PETG), and/or the
like.
101091 The attachment portion 240 can be positioned on the print substrate
140 prior to
(or during the) printing of the object 200. The attachment portion 240 can be
fixed in
position relative to the print substrate 140 in any suitable manner including,
for example,
vacuum, taping, clamping, bolting, and/or applying an adhesive (removable
and/or
permanent). Additionally and/or alternatively, the attachment portion 240 can
be fixed in
position relative to the print substrate 140 via a mechanical connection such
as a cooperating
detent including any combination of mating elements, such as blocks, tabs,
pockets, slots,
ramps, locking pins, cantilevered members, support pins, and the like, that
may be selectively
or automatically engaged and/or disengaged to couple or decouple the
attachment portion 240
and the print substrate 140 relative to one another.
[0110] The object 200 is shown as including one or more layers 202 being
stacked in the
z-direction. The object 200 can be manufactured using additive manufacturing.
The print
head 120 can print the object 200 at least partially on the attachment portion
240. An
exemplary object 200 can be made of a thermoplastic material including ABS,
polycarbonate,
polyamide, poly(p-phenylene oxide) (PPO), poly(p-phenylene ether) (PPE), or a
combination
thereof. The object 200 can also be filled with carbon and/or glass when
printed on the large-
scale to limit warpage, improve flow, and/or affect mechanics.
[0111] In one embodiment, the object 200 can be at least partially made of
thermoplastic
polyurethane (TPU). Exemplary TPU can include an ester-based TPU. h an
unlimiting
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example, the ester-based TPU can have a Shore hardness ranging from 85A to 98
A. The
TPU can be 3D printed with the print bed 160 (shown in Fig. 1) kept at room
temperature.
Advantageously, because higher operating temperatures place strain on the
print bed 160,
keeping the print bed 160 at room temperature can extend the life time of the
print bed 160
and ease print bed-related procedures performed by an operator. Additionally
and/or
alternatively, the TPU can be recyclable and result in less environmental
waste.
[0112] Upon being in contact with the object 200 during printing, the
attachment portion
240 can be bonded to the object 200. Optionally, the attachment portion 240
can be bonded
to the object 200 at optimal strength after being in contact with initially-
printed layers 202 of
the object 200 for a selected amount of time. In other words, the attachment
portion 240 can
be bonded to the object 200 at optimal strength after the initially-printed
layers 202 of the
object 200 are cooled or solidified for a selected amount of time. Stated
somewhat
differently, the object 200 can adhere to the attachment portion 240 upon
being in contact
with a bonding surface 242 of the attachment portion 240. The bonding surface
242 can be a
surface on the attachment portion 240 proximal to the object 200. A structure
300 can thus
be formed. The structure 300 can include the object 200 and the attachment
portion 240.
Stated somewhat differently, upon completion of printing the object 200, the
structure 300
can be removed from the print substrate 140 as a whole, with the attachment
portion 240
remaining adhered to the object 200. In one embodiment, the attachment portion
240 can be
permanently bonded to the object 200.
[0113] In one embodiment, the attachment portion 240 can bond with the
object 200 upon
contacting with the object 200 and/or upon being heated. For example, the
attachment
portion 240 can absorb heat from the object 200 during printing and/or absorb
heat from the
print substrate 140, for example, when the print substrate 140 includes a
heated table. In
some embodiments, the attachment portion 240 can be further secured to the
object 200 using
additional fasteners and/or attachments (not shown), for example, as a
secondary operation.
[0114] Fig. 2A shows the attachment portion 240 that includes a base
portion 243. The
base portion 243 can be a solid part of the attachment portion 240 and is
shown as being in
contact with the object 200. An exemplary base portion 243 can be made of any
material
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including metal, polymer, ceramic, semiconductor, or a combination thereof An
exemplary
base portion 243 can be made of a thermoplastic and/or thermoset material.
Exemplary base
portion 243 can be made of polyetherimide (PEI), polyethersulfone (PES), PET,
PETG, ABS,
polycarbonate, polyamide, PPO, PPE, TPU, or a combination thereof. Upon being
heated,
the base portion 243 can melt and bond with the object 200. Optionally, the
base portion 243
can have a smooth texture, foam texture, closed cell foam texture, open cell
foam texture,
corrugation texture, randomly roughened texture, patterned texture (e.g.,
dimples, pips,
geometric, and so on), and/or honeycomb texture. For example, the base portion
243 can
include PEI foam and/or PES foam. In another example, the base portion 243 can
include
cardboard and/or a surface that is roughened for printing.
101151 In one embodiment, the base portion 243 can include a thermoplastic
and/or
thermoset material in the form of a sheet or any other shape. The
thermoplastic and/or
thermoset material can optionally be fiber-reinforced. For example, a textile
can be soaked
and/or saturated in a thermoplastic material to fount the fiber-reinforced
thermoplastic sheet.
In another example, the thermoplastic material can be 3D printed and made of,
for example,
thermoplastic polyurethane (TPU). The textile can be embedded in the TPU
during the 3D
printing to form fiber-reinforced TPU. The textile can include any flexible
material including
a network of natural and/or artificial fibres. An exemplary fibre can include
yarn or thread.
The textile can be formed by any suitable processes including, for example,
weaving,
knitting, crocheting, knotting, felting, matting, condensing, and/or pressing.
The textile can
include any organic textile, semi-synthetic textile, synthetic textile, woven
textile, non-woven
textile, or a combination thereof. Exemplary organic textile can include
cotton, denim,
canvas, duck canvas, linen, silk, wool, and/or the like. Exemplary semi-
synthetic textile can
include rayon and/or the like. The exemplary synthetic textile can include
polyester, acrylic,
polyamide, polymeric microfibers, and/or the like. Additionally and/or
alternatively, the
thermoplastic and/or thermoset material can be fiber-reinforced with any
suitable
strengthening fiber, including carbon fiber, glass fiber, and/or the like.
[0116] In one embodiment, when the base portion 243 is made of the
thermoplastic
and/or thermoset material, and when the print substrate 140 is heated, a
textured and/or
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patterned sheet can be positioned between the base portion 243 and the print
substrate 140.
The texture of the sheet can be imprinted onto the base portion 243.
[0117] In some embodiments, the object 200 is not removed from the
attachment portion
240, and, therefore, the problem of providing the print surface 110 (shown in
Fig. 1) to allow
easy removal of the object 200 is advantageously eliminated. The attachment
portion 240
can include a flat panel and can advantageously eliminate the need of printing
a large flat
layer using additive manufacturing.
[0118] In addition, when the attachment portion 240 is pre-cut prior to the
printing of the
object 200, no post-part or post-printing trimming needs to be perfolmed after
the printing.
Advantageously, processing of the object 200 can be simplified. The attachment
portion 240
can be made of a mechanically strong material and thus provides a strong high
tension layer
on the object 200 that can result in a lighter and stronger structure 300.
Furthermore, the
attachment portion 240 can function as a shear panel for the printed object
200. By way of
example, the attachment portion 240 comprises a closeout panel of a lower
chassis of a three-
dimensional printed vehicle.
[0119] Additionally and/or alternatively, the attachment portion 240 can be
made of a
material that has one or more selected properties and can advantageously
expand
functionalities of the structure 300. For example, the attachment portion 240
can be
thermally insulative, semiconductive and/or conductive. Additionally and/or
alternatively,
the attachment portion 240 can be electrically insulative, semiconductive
and/or conductive.
For example, the attachment portion 240 made of PEI foam and/or PES foam can
be
thermally insulative. Additionally and/or alternatively, the attachment
portion 240 can
provide mechanical improvement to the structure 300, and/or provide a chemical
barrier
and/or a moisture barrier.
[0120] Because the attachment portion 240 can be bonded at the same time of
printing the
object 200, a secondary operation for attaching the attachment portion 240 to
the object 200
can be eliminated and/or reduced. Advantageously, time and labor cost can be
saved and
manufacturing process can be simplified. Additional problems with creating and
using/re-
using existing removable print surfaces (discussed above) can advantageously
be avoided.
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[0121] The system 100 is shown as including an optional machining tool 130.
The
machining tool 130 can remove a selected portion of the object 200 and/or the
attachment
portion 240 during and/or after printing of the object 200. Exemplary
machining tool 130 can
include a mill, lathe, any type of cutting machine, or a combination thereof.
The machining
tool 130 can be installed at any suitable location of the system 100. Fig. 2A
shows the
machining tool 130 as being directly and/or indirectly connected to the print
bed 160 for
illustrative purposes only. The print head 120 and the machining tool 130 can
be controlled
by uniform and/or different control systems 500 (shown in Fig. 22).
[0122] Although Fig. 2A shows the attachment portion 240 as being a flat
panel 240
vertical to the z-direction for illustrative purposes only, the attachment
portion 240 can have
any selected shapes positioned at any suitable orientations, without
limitation.
[0123] Turning to Fig. 2B, the attachment portion 240 is shown as having a
planar shape
and defining a plurality of openings 245 (shown by dashed lines) passing
through the
attachment portion 240 in the z direction. Stated somewhat differently, the
attachment
portion 240 can include a perforated panel. The object 200 is shown as being
formed via
printing a bead on the attachment portion 240. The material of the bead is
forced, in molten
state, through the opening 245 in a direction A until contacting a backing
surface 180.
Exemplary backing surface 180 can include the print substrate 140 (shown in
Fig. 2A), a
previously printed layer 202 (shown in Fig. 2A) and/or any other suitable
sheet positioned
below the attachment portion 240.
[0124] The material that cannot flow beyond the backing surface 180 is
forced to spread
(or mushroom out) in a direction perpendicular to the direction A and is shown
as forming a
cap 247. Stated somewhat differently, the object 200 is printed on a first
side of the
attachment portion 240, and the material of the bead flows across the
attachment portion 240
and spreads on a second side of the attachment portion 240 that is opposite to
the first side.
In a bottom view in the z direction, the size (or area) of the cap 247 can be
greater than the
size (or area) of the opening 245. The cap 247 can thus form a mechanical
interlock that
binds the attachment portion 240 to the object 200. Advantageously, the
attachment portion
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240 can be bonded to the object 200 in a reliable manner even if there is no
adhesion or low
adhesion between the attachment portion 240 and the object 200.
[0125] Turning to Fig. 2C, the attachment portion 240 is shown as defining
an array of
openings 245. The bead of the object 200 is shown as being printed along a row
of the
openings 245 and forming a row of caps 247. When the object 200 is printed to
cover more
openings 245, more caps 247 can form and strength of mechanical interlocking
between the
attachment portion 240 and the object 200 can be increased further.
[0126] Although Fig. 2C shows the x direction as being aligned (parallel)
to a row of the
openings 245 for illustrative purposes only, the x direction can be oriented
relative to the
rows or columns of the openings 245, without limitation. Although Fig. 2C
shows an array
of openings 245 each having an oval shape for illustrative purposes only, the
attachment
portion 240 can define any number of openings 245 having uniform and/or
different shapes
and arranged in any selected patterns.
[0127] Turning to Fig. 3, an exemplary flow chart of an embodiment of a
method 400 of
making the structure 300 (shown in Fig. 2A) is shown. The attachment portion
240 can be
optionally positioned, at 420, in the system 100. For example, the attachment
portion 240
can be placed to be at least partially in contact with the print substrate
140. Additionally
and/or alternatively, the attachment portion 240 can be placed at a distance
from the print
substrate 140. Stated somewhat differently, the attachment portion 240 can be
placed without
contacting the print substrate 140.
[0128] The object 200 can be printed, at 430, at least partially on the
attachment portion
240. The object 200 can be bonded with the attachment portion 240 upon or
after the
printing. The bonding between the object 200 and the attachment portion 240
can be of any
suitable nature. In one embodiment, the bonding can include chemical and/or
physical
bonding such as adhesion. Additionally and/or alternatively, the bonding can
include
mechanical interlocking (shown in Fig. 2B, for example).
[0129] Optionally, the attachment portion 240 can be prepared, at 410.
Preparing the
attachment portion 240 can include one or more processes for treating (or pre-
treating the
surface of) the attachment portion 240 to allow bonding between the attachment
portion 240
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and the object 200. In one example, the preparing can include performing a
surface pre-
treatment to increase roughness of the bonding surface 242 (shown in Fig. 2A).
Additionally
and/or alternatively, the surface pre-treatment can generate active chemical
bonds on the
bonding surface 242. Exemplary surface treatment can include plasma treatment,
sputtering,
etching, ultra-violet ozone treatment, wet etching, chemical wiping, flame
treatment, sanding,
and/or milling. In one embodiment, the base portion 243 (shown in Fig. 2A) can
be made of
a material including metal, such as aluminum and/or steel. In one embodiment,
the preparing
can include a plasma treatment of the base portion 243 to clean, increase the
surface energy,
and/or roughen the bonding surface 242 for improved bonding.
[0130] Although Fig. 3 shows the preparing at 410 and the positioning at
420 as being
performed before the printing at 430 for illustrative purposes only, the
preparing at 410
and/or the positioning at 420 can be performed before and/or during the
printing at 430,
without limitation. Optionally, the method 400 can include fastening the
attachment portion
240 to the object 200 after the printing at 430. Advantageously, detachment of
the
attachment portion 240 from the object 200 can be further prevented.
[0131] Turning to Fig. 4A, the attachment portion 240 is shown as including
a bonding
layer 244 between the base portion 243 and the object 200. The bonding layer
244 can be
disposed on the base portion 243 prior to printing of the object 200 on the
attachment portion
240. Stated somewhat differently, preparing the attachment portion 240 can
include
disposing the bonding layer 244 on the base portion 243, and the bonding
surface 242
becomes the interface between the bonding layer 244 and the object 200. The
bonding
between the bonding layer 244 and the base portion 243 can be of any suitable
nature. In one
embodiment, the bonding can include chemical and/or physical bonding such as
adhesion.
Additionally and/or alternatively, the bonding can include mechanical
interlocking (shown in
Fig. 4B, for example). The bonding layer 244 can bond the attachment portion
240 with the
object 200 upon contacting with the object 200 and/or upon being heated. For
example, the
bonding layer 244 can absorb heat from the object 200 during printing and/or
absorb heat
from the print substrate 140, for example, when the print substrate 140
includes a heated
table.
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[0132] An exemplary bonding layer 244 can include an adhesive. For
example, the
adhesive can include wood glue, contact adhesive, thermoplastic and thermoset
adhesives
such as B-stage epoxy, or a combination thereof Exemplary adhesives can be
resin-based,
urethane-based, acrylate-based, butadiene-chloroprene-based, acrylic-based,
neoprene-based,
poly(vinyl alcohol)-based, or a combination thereof. For example, the adhesive
can include
any contact adhesive, wood glue, or a combination thereof. Exemplary contact
adhesives can
include natural rubber and/or polychloroprene (or neoprene). In one example,
the contact
adhesive can include 3MTm 3ONF Contact Adhesive (available from 3MTm Company
located
in Maplewood, Minnesota, U.S.), 3MTm Fastbond Pressure Sensitive Adhesive 4224
NF, Clear
(available from 3MTm Company), 3MTm Fastbond 30H Contact Adhesive (available
from
3MTm Company), 3MTm Neoprene contact Adhesive 5, Neutral Sprayable (available
from
3MTm Company). Exemplary wood glue can be poly(vinyl alcohol)-based or PVA-
based.
Furthermore, the bonding layer 244 can include acrylates, urethanes, epoxies,
polyamides,
polyimides, and other hot melt adhesives. In one embodiment, adhesives with
lower adhesive
strength¨such as a contact adhesive or wood glue¨can be used to temporarily
hold the
object 200 during printing. In this embodiment, the panel can be pre-
fabricated with
alignment features. The panel can be advantageously aligned by the printed
object and
further include alignment features for secondary alignment of fasteners,
components, and so
on after the object is removed from the print substrate. In some embodiments,
this panel can
be removed, for example, during vehicle service, by removing screws and
peeling away the
weakly bonded panel.
10133] In some embodiments, if a selected layer 202 of the object 200
becomes too
cold¨whether planned or unplanned (e.g., result of a power failure, material
feed problem,
and so on)¨an adhesive can be coated on the cold selected layer 202 before the
next layer
202 is printed. Stated somewhat differently, the base portion 243 can include
one or more
layers 202 previously printed, and the bonding layer 244 can include the
adhesive such that
newly printed layers 202 can be bonded to the previously-printed layers 202.
10134] Additionally and/or alternatively, the bonding layer 244 can
include a
thermoplastic and/or thermoset material. Exemplary bonding layer 244 can be
made of
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polyetherimide (PEI), polyethersulfone (PES), polycarbonate, ABS,
polycarbonate,
polyamide, PETG, PET, PPO, PPE, TPU, or a combination thereof. In one
embodiment, the
bonding layer 244 can be 3D printed. In that case, exemplary bonding layer 244
can be made
of TPU and/or polyamide. In one embodiment, the bonding layer 244 can be at
least partially
made of polyamide. Exemplary polyamide that can be 3D printed can include
TechnomeltTm,
available at Henkel AG & Co. KGaA located in Dasseldorf, Germany.
101351 Although Fig. 4A shows the bonding layer 244 is disposed on the
entire base
portion 243 for illustrative purposes only, the bonding layer 244 can
partially and/or entirely
cover the base portion 243, without limitation. For example, the bonding layer
244 can be
disposed on selected regions on the base portion 243 where the base portion
243 interfaces
with the object 200.
101361 The object 200 and the bonding layer 244 can be respectively made
of any
suitable materials. In one example, a carbon fiber / ABS layer can be printed
on unfilled
ABS sheets, such that increasing the sheet temperature above a predetermined
temperature
(e.g , 110 C) creates a permanent bond. In another example, PETG printed onto
PETG
sheets can be heated to create a permanent bond. Although described with
similar/like
materials, different materials can be used that interact favorably with one
another with or
without heating. By way of example, PETG can be printed onto unfilled ABS
sheets (e.g., on
the smooth side) at room temperature to create a permanent bond.
101371 Optionally, the bonding layer 244 can have a texture when viewed
in the z-
direction. Stated somewhat differently, the bonding layer 244 can have a
physical roughness
to increase grip force that enhances adhesion to the object 200. In one
embodiment, the
bonding layer 244 can have a honeycomb pattern when viewed in the z-direction.
For
example, the bonding layer 244 can include a honeycomb patterned (or
structured)
polycarbonate sheet. In another example, the bonding layer 244 can include PEI
foam and/or
PFS foam having a foam texture. In one embodiment, the bonding layer 244 can
be fixed to
the base portion 243 in any suitable manner including, for example, by using a
selected
adhesive,
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[0138] Turning to Fig. 4B, the base portion 243 is shown as having a planar
shape and
defining a plurality of openings 249 (shown by dashed lines) passing through
the base portion
243 in the z direction. The bonding layer 244 is shown as being formed via
printing a bead
on the base portion 243. The material of the bead is forced, in molten state,
through the
opening 249 in the direction A until contacting the backing surface 180.
[0139] The material that cannot flow beyond the backing surface 180 can be
forced to
spread (or mushroom out) in a direction perpendicular to the direction A and
is shown as
forming a cap 246. In a bottom view in the z direction, the size (or area) of
the cap 246 can
be greater than the size (or area) of the opening 249. The cap 246 can thus
form a mechanical
interlock that binds the bonding layer 244 to the base portion 243.
Advantageously, the
bonding layer 244 can be bonded to base portion 243 in a reliable manner even
if there is no
adhesion or low adhesion between the bonding layer 244 and the base portion
243.
[0140] Turning to Fig. 4C, the base portion 243 is shown as defining an
array of openings
249. The bead of the bonding layer 244 is shown as being printed along a row
of the
openings 249 and forming a row of caps 246. When the bonding layer 244 is
printed to cover
more openings 249, more caps 246 can form and strength of mechanical
interlocking between
the bonding layer 244 and the base portion 243 can be increased further.
[0141] Although Fig. 4C shows the x direction as being aligned (parallel)
to a row of the
openings 249 for illustrative purposes only, the x direction can be oriented
relative to the
rows or columns of the openings 249, without limitation. Although Fig. 4C
shows an array
of openings 249 each having an oval shape for illustrative purposes only, the
base portion 243
can define any number of openings 249 having uniform and/or different shapes
and arranged
in any selected patterns, without limitation.
[0142] Turning to Fig. 5, a cross section of the structure 300 is shown. Of
the structure
300, the object 200 is shown as including a first layer structure 210. The
first layer structure
210 is shown as including one or more layers 202 being stacked in the z-
direction. The first
layer structure 210 can be manufactured using additive manufacturing.
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[0143] The first layer structure 210 is shown as having a sidewall 214. The
sidewall 214
is shown as being at a side angle A relative to the x-direction. Stated
somewhat differently,
the sidewall 214 is at the side angle A relative to the print substrate 140.
[0144] Turning to Fig. 6, the attachment portion 240 is shown as being
positioned at a
distance d from the sidewall 214. Although Fig. 6 shows the attachment portion
240 and the
first layer structure 210 as being placed on the print substrate 140 for
illustrative purposes
only, the attachment portion 240 and the first layer structure 210 can be
positioned on any
uniform and/or different planes, without limitation.
[0145] The attachment portion 240 is shown as providing the bonding surface
242 that is
distal to the print substrate 140. The first layer structure 210 can include
an interfacing side
216 distal to the print substrate 140. As illustratively shown in Fig. 6, the
interfacing side
216 and the bonding surface 242 can be coplanar.
[0146] The distance d can be spacing between any points on the first layer
structure 210
and the attachment portion 240. As illustratively shown in Fig. 6, the
distance d can be a size
of a gap 241 between the interfacing side 216 and the bonding surface 242.
Stated somewhat
differently, the distance d can be the spacing measured between regions of the
attachment
portion 240 and the first layer structure 210 that subsequent layers can be
printed on.
[0147] Fig. 6 shows the gap 241 to be uniform for illustrative purposes
only. The gap
241 can be uniform and/or different at various locations along the sidewall
214. For
example, the sidewall 214 can have a curved, slanted and/or irregular shape,
resulting in a
non-uniform gap 241 and a non-uniform distance d along the sidewall 214. In
one example,
the distance d can be zero and/or non-zero at different locations. In other
words, the sidewall
214 can be partially in contact with the attachment portion 240.
[0148] Although Fig. 6 shows the first layer structure 210 and the
attachment portion 240
as having the gap 241 in a plane defined by z- and x-directions, the first
layer structure 210
and the attachment portion 240 can be separated and/or in contact in a plane
defined by z-
and y-directions and/or any other planes, without limitation.
[0149] Turning to Fig. 7, a second layer structure 220 is shown as being
disposed on the
attachment portion 240 and the first layer structure 210. The second layer
structure 220 is
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shown as including one or more layers 202 being stacked in the z-direction. In
one
embodiment, the second layer structure 220 can be manufactured using the same
additive
manufacturing techniques that manufacture the first layer structure 210.
[0150] The second layer structure 220 is shown as spanning the gap 241. The
distance d
can be any suitable length. A small distance d can advantageously reduce
possibility of
deformation of the second layer structure 220 that spans the gap 241. The
distance d can be
determined by bridging capability of the second layer structure 220, that is,
ability of the
material of the second layer structure 220 to overhang without any support in
a vertical
direction from space below the second layer structure 220. In one embodiment,
the distance
d can be zero. Advantageously, the second layer structure 220 can be fully
supported during
printing and deformation can be reduced or prevented.
[0151] Turning to Fig. 8, an exemplary flow chart of an alternative
embodiment of the
method 400 for making the structure 300 (shown in Fig. 7) is shown. The first
layer structure
210 can be printed, at 432. The second layer structure 220 can be printed, at
434, on the
attachment portion 240 and the first layer structure 210. Upon being printed,
the second layer
structure 220 can be bonded to the attachment portion 240. Advantageously, the
attachment
portion 240 can replace printed infill / support in the structure 300.
Advantageously, the
attachment portion 240 can provide structural strength and/or any other
selected properties to
the structure 300, and a secondary operation for attaching the attachment
portion 240 to the
second layer structure 220 can be eliminated.
[0152] Optionally, the attachment portion 240 can be positioned, at 420, in
the system
100. The attachment portion 240 can be positioned at the selected distance d
from the first
layer structure 210. Although Fig. 8 shows the optional positioning at 420 as
being
performed before the printing at 432 for illustrative purposes only, the
positioning at 420 can
be performed after and/or during the printing at 432, without limitation. In
other words, the
attachment portion 240 can be positioned after printing the first layer
structure 210 and before
printing the second layer structure 220. For example, the printing process can
have a pause
or time interval after printing the first layer structure 210 and before
printing the second layer
structure 220. The attachment portion 240 can be positioned during the time
interval
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manually by an operator and/or in a machine-assisted manner (for example,
robotically).
Advantageously, the attachment portion 240 can be positioned without impeding
the process
of printing the first layer structure 210. Additionally and/or alternatively,
the attachment
portion 240 can be placed prior to finishing the printing of the first layer
structure 210. The
process of positioning the attachment portion 240 can be significantly shorter
than the
process of printing the first layer structure 210.
101531 Turning to Fig. 9, the attachment portion 240 is shown as being
attached to a
support structure 248. Stated somewhat differently, the support structure 248
can support the
attachment portion 240 such that the attachment portion 240 can be elevated
from the print
substrate 140 by a selected height.
101541 The support structure 248 can have any selected shape and size. The
support
structure 248 can be made using any suitable materials and processes. In one
embodiment,
the support structure 248 can be made using 3D printing. Advantageously, 3D
printing can
make the support structure 248 that has complex contours. Additionally and/or
alternatively,
the support structure 248 can be made of a material including foam. The foam
can be
machined to obtain selected size and shape. Advantageously, the support
structure 248 can
be made in an inexpensive manner.
[0155] The attachment portion 240 can be fixed in position relative to the
support
structure 248 in any suitable manner including, for example, vacuum, taping,
clamping,
bolting, and/or applying a removable adhesive. Additionally and/or
alternatively, the
attachment portion 240 can be fixed in position relative to the support
structure 248 via a
mechanical connection such as a cooperating detent. In one embodiment, the
attachment
portion 240 can be temporarily attached to the support structure 248.
[0156] Turning to Fig. 10, the support structure 248 is shown as being
removed from the
attachment portion 240. The portion of the second layer structure 220 that
extends beyond
the first layer structure 210 and the attachment portion 240 can form an
overhang structure
224. The overhang structure 224 can maintain shape before and/or after removal
of the
support structure 248. Stated somewhat differently, even though being
unsupported and
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positioned on empty space, the overhang structure 224 does not deform or break
away from
the second layer structure 220 under gravity.
101571 The support structure 248 can be removed from the attachment portion
240.
Removing the support structure 248 from the attachment portion 240 can include
detaching
the support structure 248 from direct contact with the attachment portion 240.
The support
structure 248 can be removed at any suitable time. In one embodiment, the
second layer
structure 220 can be cooled to room temperature and/or solidified before the
support structure
248 is removed from the attachment portion 240. Advantageously, the support
structure 248,
in combination with the attachment portion 240, can provide support to the
second layer
structure 220 during the cooling and/or solidification to avoid deformation of
the second
layer structure 220. Upon completion of the cooling and/or solidification, the
second layer
structure 220 can gain sufficient structural strength and does not deform even
after the
support structure 248 is removed.
[0158] Turning to Fig. 11, the first layer structure 210 is shown as
including first layer
structures 210A, 210B. Each of the first layer structures 210A, 210B is shown
as including
one or more layers 202 being stacked in the z-direction. The first layer
structures 210A,
210B can include uniform and/or different numbers of the layers 202. In one
embodiment,
the first layer structures 210A, 210B can include the same number of the
layers 202.
Advantageously the first layer structures 210A, 210B can be printed
concurrently, and
surfaces of the first layer structures 210A, 210B that are exposed to
subsequent printing
layers can be flush and/or co-planar.
[0159] Fig. 11 shows the attachment portion 240 as being located between
the first layer
structures 210A, 210B. The attachment portion 240 is shown as being at
distances dl, d2
from the first layer structures 210A, 210B, respectively. The distances dl, d2
can be uniform
and/or different. Fig. 11 shows the second layer structure 220 as being
disposed on the first
layer structures 210A, 210B and the attachment portion 240.
[0160] Turning to Fig. 12, the side wall 214 of the first layer structure
210 is shown as
being a surface that tilts away from the z-direction. Stated somewhat
differently, the side
angle A is not a right angle. Fig. 12 shows the side angle A as being smaller
than 90 degrees.
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[0161] The side angle A can have any suitable values. The minimum value of
the side
angle A can be determined by the material, the printing process, and/or the
aspect ratio. In
one embodiment, when beads (not shown) for printing the first layer structure
210 are wide,
the side angle A can be small. For example, when the beads have a great aspect
ratio, the
side angle A can be small. The aspect ratio can include a width (or size in y-
direction) to
height (or size in z-direction) ratio of the bead. Additionally and/or
alternatively, when there
is great solidification time between the layers 202, the side angle A can be
small. An
exemplary side angle A can range from 35 degrees to 90 degrees.
[0162] Turning to Fig. 13, the side wall 214 of the first layer structure
210 is shown as
including a curved surface tilting away from the z-direction. The side wall
214 can have a
plurality of side angles A at respective locations along the side wall 214. As
illustrated in
Fig. 13, the side angles A are shown as including a side angle Al at an end
region of the side
wall 214 and a side angle A2 at a middle region of the side wall 214. The side
angles Al and
A2 can be uniform and/or different.
[0163] The minimum value of each of the side angles Al, A2 can be
determined by the
material, printing process, and/or the aspect ratio. In one embodiment, when
beads (not
shown) for printing the first layer structure 210 are wide, the side angles
Al, A2 can be small.
For example, when the beads have a great aspect ratio, the side angles Al, A2
can be small.
The aspect ratio can include a width (or size in y-direction) to height (or
size in z-direction)
ratio of the bead. Additionally and/or alternatively, when there is great
solidification time
between the layers 202, the side angles Al, A2 can be small. Exemplary side
angles Al, A2
can each range from 35 degrees to 90 degrees.
[0164] Although the side wall 214 is shown as being straight in Fig. 12 and
curved in Fig.
13 for illustrative purposes only, the side wall 214 can be straight, curved,
or a combination
thereof, without limitation.
[0165] Turning to Fig. 14, the bonding surface 242 is shown as interfacing
with the
second layer structure 220. Morphology and/or shape of the bonding surface 242
can
determine the second layer structure 220 that is printed on the attachment
portion 240. Fig.
14 shows a slant angle B as existing between the bonding surface 242 and the
print substrate
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140. Effectively, the overhang structure 224 formed on the attachment portion
240 can have
a side wall at the slant angle B relative to the print substrate 140.
101661 The slant angle B can have any suitable values. In one embodiment,
the slant
angle B can have a value that is difficult and/or impossible to achieve in 3D
printing without
being supported by the attachment portion 240. An exemplary slant angle B can
range from
0 degree to 45 degrees or from 0 degree to 35 degrees. Advantageously, when
the second
layer structure 220 is made of a material that has limited over-hanging
capability, or made
using a process that allows limited over-hanging, and cannot form the slant
angle B at a small
value without any support, the attachment portion 240 can provide support to
make such
small slant angle B feasible.
101671 In one embodiment, the slant angle B can be zero. The bonding
surface 242 can
thus be parallel to the print substrate 140. For example, the bonding surface
242 can be co-
planar with the interfacing side 216 (shown in Fig. 6) of the first layer
structure 210.
[0168] Turning to Fig. 15, the attachment portion 240 is shown as including
an
attachment portion 240A and an attachment portion 240B stacked on the
attachment portion
240A. The attachment portion 240B is shown as having a bonding surface 242B
that is more
distal to the print substrate 140 than a bonding surface 242A of the
attachment portion 240A.
The object 200 is shown as including a third layer structure 230 formed on the
second layer
structure 220 and on the attachment portion 240B. Upon being printed, the
second layer
structure 220 can be bonded to the attachment portion 240A. Additionally
and/or
alternatively, upon being printed, the third layer structure 230 can be bonded
to the
attachment portion 240B.
101691 Although Fig. 15 shows the attachment portion 240B as being stacked
on the
attachment portion 240A, the attachment portion 240B can be located on any
surface, such as
the print substrate 140 and/or on any previously-printed layers, without
limitation. For
example, the attachment portion 240B can be located on a support structure 248
(shown in
Fig. 9) and the support structure 248 can be stacked on the attachment portion
240A.
Optionally, the support structure 248 can be removed from the attachment
portion 240B upon
bonding between the attachment portion 240B and the third layer structure 230.
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Fig. 15 shows the attachment portions 240A, 240B, any number of uniform and/or
different
attachment portions 240 can be used.
[0170] Turning to Fig. 16, an exemplary flow chart of an embodiment of the
method 400
for manufacturing the structure 300 (shown in Fig. 15) is shown. The method
400 is shown
as including further details of the printing at 430. The first layer structure
210 can be printed,
at 432. The second layer structure 220 can be printed, at 434, on the first
layer structure 210
and the attachment portion 240A. The attachment portion 240A can be bonded to
the second
layer structure 220. The third layer structure 230 can be printed, at 436, on
the second layer
structure 220 and the attachment portion 240B. The attachment portion 240B can
be bonded
to the third layer structure 230.
101711 Stated somewhat differently, the printing at 434 can be repeatedly
performed, as
shown at 436, by positioning additional attachment portions 240 to print on,
to create
multiple overhang structures 224, 234 (shown in Fig. 15) of the object 200
(shown in Fig. 15)
at different height and/or distances from the print substrate 140 (shown in
Fig. 15). Although
shown as being repeatedly performed once in Fig. 16, the printing at 434 can
be repeatedly
performed for any number of times, without limitation.
101721 Turning to Fig. 17, an exemplary cross section of the structure 300
is shown. Of
the structure 300, the object 200 is shown as including the first layer
structure 210. The first
layer structure 210 is shown as including a support member 212. The support
member 212
can include a portion of one or more selected layers 202 of the first layer
structure 210 that
are adjacent to the sidewall 214 or a peripheral region of the first layer
structure 210. The
support member 212, in combination with the layers 202 of the first layer
structure 210 that
are adjacent to the support member 212, can define a recess 215 that can at
least partially
accommodate the attachment portion 240. The support member 212 can thus allow
the
attachment portion 240 to be positioned (and/or bonded in place) at an
elevated location at
least partially above empty space. Stated somewhat differently, the support
member 212 can
be located on the first layer structure 210 without contacting the print
substrate 140. In some
embodiments, adhesives can be applied to the bottom surface and/or sides of
the attachment
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portion 240 for at least temporary bonding with the object 200, for example,
within the recess
215.
[0173] The support member 212 can have any suitable shapes. Fig. 17 shows
the support
member 212 as including a wall that includes a portion of one or more layers
202 that are
proximal to the print substrate 140. The attachment portion 240 can be located
on an end
region of the wall distal to the print substrate 140.
[0174] Although Fig. 17 shows two first layer structures 210A, 210B each
including the
support member 212A, 212B for illustrative purposes only, the object 200 can
include one
first layer structure 210, or one or more uniform and/or different first layer
structures 210.
Each first layer structure 210 can include one support member 212, or any
number of uniform
and/or different support members 212, without limitation. Although Fig. 17
shows the first
layer structures 210A, 210B each being in contact with the attachment portion
240 in x-
direction, any uniform and/or different distances d (shown in Fig. 7) can
exist between the
first layer structure 210 and the attachment portion 240 in x- and/or y-
directions.
[0175] Turning to Fig. 18, the second layer structure 220 is shown as being
disposed on
the attachment portion 240 and the first layer structure 210. Upon being
printed, the second
layer structure 220 can bond with the attachment portion 240. Advantageously,
the second
layer structure 220 can be supported during printing, and deformation of the
second layer
structure 220 due to the gap between the first layer structures 210A, 210B can
be reduced or
prevented.
[0176] Advantageously, because the attachment portion 240 can be supported
by the first
layer structure 210, the attachment portion 240 can be positioned with minimal
need of any
support (e.g., the support structure 248 (shown in Fig. 9)). When printed
infill or other
support structure between the attachment portion 240 and the print substrate
140 is not
desired, additional steps of positioning and removing the support structure
248 can
advantageously be eliminated. The size of the attachment portion 240 in the z-
direction can
be smaller than, and does not need to be equal to, the size of the first layer
structure 210.
Therefore, the size of the attachment portion 240 can be selected with greater
flexibility.
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[0177] Turning to Fig. 19, the support member 212 is shown as having the
side wall 214
as being non-uniform. Stated somewhat differently, the side wall 214 of the
first layer
structure 210 is shown as including a surface that tilts away from the z-
direction and being
non-vertical to the print substrate 140. In other words, the support member
212 can include
one or more layers 202 that branch out distally from the print substrate 140
to form a shelf
Because the first layer structure 210 can still define the recess 215, the
attachment portion
240 can still be supported by the support member 212.
[0178] Although Fig. 19 shows part of the side wall 214 to deviate from z-
direction for
illustrative purposes only, the side wall 214 can be partially and/or entirely
deviated from the
z-direction, without limitation. Although Fig. 19 shows the side wall 214 to
include a
plurality of straight sections for illustrative purposes only, the side wall
214 can include any
number of uniform and/or different sections that are each straight and/
curved, without
limitation.
[0179] The disclosed embodiments further disclose the structure 300 (shown
in Fig. 2A)
that is made via additive manufacturing. The structure 300 can include the
object 200 (shown
in Fig. 2A) and the attachment portion 240 (shown in Fig. 2A) bonded to the
object 200. The
disclosed embodiments further disclose the structure 300 as shown in Figs. 4,
7, 9, 10, 11-15
and 17-19.
[0180] Turning to Fig. 20, an optional secondary bonding layer 262 is shown
as being
disposed on the support member 212. Exemplary secondary bonding layer 262 can
be made
of an adhesive material. For example, the secondary bonding layer 262 can be
the same or
similar to various examples of the bonding layer 244 (shown in Fig. 4A) as
disclosed above.
The attachment portion 240 can be attached to the support member 212 via the
secondary
bonding layer 262.
[0181] Although Fig. 20 shows the secondary bonding layer 262 as being
disposed at a
bottom of the recess 215 that is parallel to the print substrate 140 for
illustrative purposes
only, the secondary bonding layer 262 can be applied to any surface(s) of the
recess 215 that
is not parallel to the print substrate 140. For example, the secondary bonding
layer 262 can
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be applied to side surfaces of the attachment portion 240 that can be vertical
to, and/or at any
angle with, the print substrate 140.
[0182] Additionally and/or alternatively, the second layer structure 220 is
shown as
including a securing member 222. The securing member 212 can include a portion
of one or
more selected layers 202 of the second layer structure 220 that forms on an
edge region of the
attachment portion 240. Stated somewhat differently, the securing member 212
can include a
peripheral region of the second layer structure 220 formed on the attachment
portion 240.
The securing member 212 can capture the attachment portion 240 and prevent the
attachment
portion 240 from moving in the z direction. Advantageously, the attachment
portion 240 can
be secured in place.
101831 Additionally and/or alternatively, a plurality of second layer
structures 220,
including second layer structures 220A-220C, are shown as being formed to
partially cover
the attachment portion 240. Stated somewhat differently, a gap 225 is defined
between
neighboring second layer structures 220 and thus the plurality of second layer
structures 220
are not continuously connected across the attachment portion 240.
Advantageously, the
second layer structure 220 does not necessarily bridge the two first layer
structures 210 and
the attachment portion 240 can enable a great variety of shapes for overhang
structures.
[0184] Although Figs. 21-24 shows the cross section of the system 100 in
the x-z plane.
The structure 300 (shown in Fig. 2) can be printed in alternative manners such
that the cross
section of the system 100 in the y-z plane can be the same and/or similar to
the cross section
as shown in Figs. 21-24.
[0185] Turning to Fig. 21, a ground structure 260 is shown as being
positioned on the
print substrate 140. The ground structure 260 can include any suitable
structures. Fig. 21
shows the ground structure 260 as including one or more ground layers 202A. In
one
embodiment, the ground layers 202A can be 3D printed. The optional secondary
bonding
layer 262 is shown as being disposed on the ground structure 260. The
attachment portion
240 can be attached to the ground structure 260 via the secondary bonding
layer 262.
[0186] As shown in Fig. 21, the ground structure 260 can be an integral
part of the object
200. Stated somewhat differently, the layers 202 of the object 200 can be at
least partially
34
87495106
stacked on the ground structure 260. However, the object 200 can be entirely
printed on the
attachment portion and separated from the ground structure 260, without
limitation.
[0187] Turning to Fig. 22, a control system 500 for additive
manufacturing is shown.
The control system 500 can be configured for controlling the print head 120
(shown in Fig.
1). The control system 500 can include a processor 510. The processor 510 can
include one
or more general-purpose microprocessors (for example, single or multi-core
processors),
application-specific integrated circuits, application-specific instruction-set
processors,
graphics processing units, physics processing units, digital signal processing
units,
coprocessors, network processing units, encryption processing units, and the
like.
[0188] The processor 510 can execute instructions for implementing the
control system
500 and/or computerized model of the object 200 (shown in Fig. 2A). In an un-
limiting
example, the instructions includes one or more additive manufacturing software
programs.
The programs can operate to control the system 100 with multiple printing
options, settings
and techniques for implementing additive printing of large components.
[0189] The programs can include a computer-aided design (CAD) program to
generate a
3D computer model of the object 200. Additionally and/or alternatively, the 3D
computer
model can be imported from another computer system (not shown). The 3D
computer model
can be solid, surface or mesh file format in an industry standard.
[0190] The programs can load the 3D computer model, create a print model
and generate
the machine code for controlling the system 100 to print the object 200.
Exemplary programs
can include LSAMTm Print 3D, available from Thermwood Corporation located in
Dale, Indiana.
Additionally and/or alternatively, exemplary programs can include Unfolder
Module
Software, Bend Simulation Software, Laser Programming and/or Nesting Software
available
from Cincinnati Incorporated located in Harrison, Ohio.
[0191] As shown in Fig. 22, the control system 500 can include one or
more additional
hardware components as desired. Exemplary additional hardware components
include, but
are not limited to, a memory 520 (alternatively referred to herein as a non-
transitory
computer readable medium). Exemplary memory 520 can include, for example,
random
access memory (RAM), static RAM, dynamic RAM, read-only memory (ROM),
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programmable ROM, erasable programmable ROM, electrically erasable
programmable
ROM, flash memory, secure digital (SD) card, and/or the like. Instructions for
implementing
the control system 500 and/or computerized model of the object 200 can be
stored on the
memory 520 to be executed by the processor 510.
[0192] Additionally and/or alternatively, the control system 500 can
include a
communication module 530. The communication module 530 can include any
conventional
hardware and software that operates to exchange data and/or instruction
between the control
system 500 and another computer system (not shown) using any wired and/or
wireless
communication methods. For example, the control system 500 can receive
computer-design
data corresponding to the object 200 via the communication module 530.
Exemplary
communication methods include, for example, radio, Wireless Fidelity (Wi-Fi),
cellular,
satellite, broadcasting, or a combination thereof.
[0193] Additionally and/or alternatively, the control system 500 can
include a display
device 540. The display device 540 can include any device that operates to
present
programming instructions for operating the control system 500 and/or present
data related to
the print head 120. Additionally and/or alternatively, the control system 500
can include one
or more input/output devices 550 (for example, buttons, a keyboard, keypad,
trackball), as
desired.
[0194] The processor 510, the memory 520, the communication module 530, the
display
device 540, and/or the input/output device 550 can be configured to
communicate, for
example, using hardware connectors and buses and/or in a wireless manner.
[0195] The disclosed embodiments are susceptible to various modifications
and
alternative forms, and specific examples thereof have been shown by way of
example in the
drawings and are herein described in detail. It should be understood, however,
that the
disclosed embodiments are not to be limited to the particular forms or methods
disclosed, but
to the contrary, the disclosed embodiments are to cover all modifications,
equivalents, and
alternatives.
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