Note: Descriptions are shown in the official language in which they were submitted.
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METHOD FOR PRODUCING THIN PLATE-LIKE LAMINATE HAVING FILM-LIKE
RESIN LAYER
FIELD
[0001]
The present invention relates to a method for the production of a thin plate-
like laminate
having a film-like resin layer.
BACKGROUND
[0002]
Resin films are used in an extremely wide range of applications such as
decorative materials,
packaging materials, adhesive films, and optical members because they have
excellent mechanical
properties such as moldability and corrosion resistance, are lightweight, easy
to process, and they
can easily be fused with other resin materials.
[0003]
For example, when producing a thin plate-like laminate such as a semiconductor
substrate, a
film-like resin layer is laminated on the surface of a substrate. In such a
thin plate-like laminate, a
predetermined concave/convex shape is transferred and etched onto the resin
layer on the thin
plate-like substrate, whereby a concave/convex structure corresponding to the
concave/convex
shape of the resin layer is formed on the surface of the substrate (refer to,
for example, Patent
Literature 1). In the transfer onto the resin layer of the thin plate-like
laminate described above, as
illustrated in, for example, FIG. 14, a mold 210 having a mold surface 211
having a
concave/convex surface shape is arranged on the resin layer 222 side with
respect to a workpiece
220 having a substrate 221 on which a resin layer 222 is laminated and the
workpiece is pressed
via the mold 210, whereby a concave/convex shape 223 is formed on the resin
layer 222. Note that
in the drawing, reference sign 200 represents compression means such as a
pressing device, and
reference sign 201 represents a machine base of the compression means 200.
[0004]
Since such a concave/convex structure on the surface of the substrate exhibits
a predetermined
functionality, high precision is required. However, since the film-like resin
layer of the thin plate-
like laminate is extremely thin, it is difficult to stably form a
concave/convex shape on the resin
layer with high accuracy. In particular, when the projections and concavities
on the surface of the
substrate are fine, the quality of the processing accuracy has a significant
influence on the
functionality, and thus, it is necessary that processing accuracy be improved.
Date Recue/Date Received 2021-09-17
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[CITATION LIST]
[PATENT LITERATURE]
[0005]
[Patent Literature 11 Japanese Unexamined Patent Publication (Kokai) No. 2018-
200931
SUMMARY
[TECHNICAL PROBLEM]
[0006]
The present invention is proposed in light of the above circumstances, and
provides a method
for the production of a thin plate-like laminate having a film-like resin
layer in which a
concave/convex shape can stably be formed with high accuracy on the film-like
resin layer
laminated on a thin plate-like substrate.
[SOLUTION TO PROBLEM]
[0007]
In other words, the invention according to claim 1 provides a method for the
production of a
thin plate-like laminate having a film-like resin layer, wherein molds are
arranged on both surface
sides of a workpiece in which a film-like resin composition is laminated on at
least one surface of
a substrate and the molds are compressed from outer surfaces of the molds to
integrally form the
substrate and the film-like resin composition, the method comprising the steps
of creating a mold
retention structure in which the molds, which have been heated to a thermal
deformation
temperature of the film-like resin composition, are arranged on both surface
sides of the workpiece,
and introducing the mold retention structure in which the heated molds are
arranged between two
compression rollers and compressing the outer surfaces of the molds by
rotating the compression
rollers to integrally thermocompression-bond the film-like resin composition
and the substrate to
form a thin plate-like laminate having a film-like resin layer.
[0008]
The invention according to claim 2 provides the method for the production of a
thin plate-like
laminate having a film-like resin layer according to claim 1, wherein the step
of creating the mold
retention structure comprises a setting step wherein a mold retention
structure in which the molds
are arranged on both surface sides of the workpiece is created, and a heating
step wherein entireties
of the molds, after creation of the mold retention structure, are heated to
the thermal deformation
temperature of the film-like resin composition.
[0009]
The invention according to claim 3 provides the method for the production of a
thin plate-like
laminate having a film-like resin layer according to claim 1, wherein the step
of creating the mold
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retention structure comprises a heating step wherein the molds are heated to
the thermal
deformation temperature of the film-like resin composition, and a setting step
wherein a mold
retention structure in which the molds, which were heated in the heating step,
are arranged on both
side surfaces of the workpiece, is created.
[0010]
The invention according to claim 4 provides the method for the production of a
thin plate-like
laminate having a film-like resin layer according to any one of claims 1 to 3,
further comprising a
cooling step wherein the molds compressed by the compression rollers are
cooled.
[0011]
The invention according to claim 5 provides the method for the production of a
thin plate-like
laminate having a film-like resin layer according to any one of claims 1 to 4,
wherein the substrate
is a thin plate-like material having a thickness of 1 mm or less and the
thickness of the film-like
resin composition is 500 gm or less.
[0012]
The invention according to claim 6 provides the method for the production of a
thin plate-like
laminate having a film-like resin layer according to any one of claims 1 to 5,
wherein the film-like
resin composition is laminated on each surface of the substrate.
[0013]
The invention according to claim 7 provides the method for the production of a
thin plate-like
laminate having a film-like resin layer according to any one of claims 1 to 6,
wherein a plurality
of the workpieces are arranged, and the molds are arranged on both surface
sides of each of the
workpieces.
[0014]
The invention according to claim 8 provides the method for the production of a
thin plate-like
laminate having a film-like resin layer according to any one of claims 1 to 7,
wherein the film-like
resin composition is a decorative, adhesive, or conductive functional resin
composition.
[0015]
The invention according to claim 9 provides the device for the production of a
thin plate-like
laminate having a film-like resin layer according to any one of claims 1 to 8,
wherein mold surfaces
of the molds have fine concave/convex surface shapes.
[ADVANTAGEOUS EFFECTS OF INVENTION]
[0016]
According to the method for the production of a thin plate-like laminate
having a film-like
resin layer according to claim 1, in the method wherein molds are arranged on
both surface sides
of a workpiece in which a film-like resin composition is laminated on at least
one surface of a
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substrate and the molds are compressed from outer surfaces of the molds to
integrally form the
substrate and the film-like resin composition, since there are provided the
steps of creating a mold
retention structure in which the molds, which have been heated to a thermal
deformation
temperature of the film-like resin composition, are arranged on both surface
sides of the workpiece,
and introducing the mold retention structure in which the heated molds are
arranged between two
compression rollers and compressing the outer surfaces of the molds by
rotating the compression
rollers to integrally thermocompression-bond the film-like resin composition
and the substrate to
form a thin plate-like laminate having a film-like resin layer, pressure is
applied unifoimly to the
molds to suppress the occurrence of pressure unevenness, whereby a
concave/convex shape can
be stably formed with high accuracy on the film-like resin layer laminated on
the thin plate-like
substrate.
[0017]
According to the method for the production of a thin plate-like laminate
having a film-like
resin layer according to claim 2, in the invention of claim 1, the step of
creating the mold retention
structure comprises a setting step wherein a mold retention structure in which
the molds are
arranged on both surface sides of the workpiece is created, and a heating step
wherein entireties of
the molds, after creation of the mold retention structure, are heated to the
thermal deformation
temperature of the film-like resin composition, which is economically
advantageous because
excessive heating of the molds is not necessary.
[0018]
According to the method for the production of a thin plate-like laminate
having a film-like
resin layer according to claim 3, in the invention of claim 1, since the step
of creating the mold
retention structure comprises a heating step wherein the molds are heated to
the thermal
deformation temperature of the film-like resin composition, and a setting step
wherein a mold
retention structure in which the molds, which were heated in the heating step,
are arranged on both
side surfaces of the workpiece, is created, it is possible to heat to a high
temperature in a short
time, whereby operation time can be shortened, and oxidation of the film-like
resin composition
of the workpiece due to heating is suppressed, which enables high-quality
molding.
[0019]
According to the method for the production of a thin plate-like laminate
having a film-like
resin layer according to claim 4, in the invention of claims 1 to 3, since
there is provided a cooling
step wherein the molds compressed by the compression rollers are cooled, the
shape of the
concave/convex surface of the thin plate-like laminate can be stabilized.
[0020]
According to the method for the production of a thin plate-like laminate
having a film-like
resin layer according to claim 5, in the invention of claims 1 to 4, since the
substrate is a thin plate-
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like material having a thickness of 1 mm or less and the thickness of the film-
like resin composition
is 500 gm or less, lightweight and precise products can be obtained.
[0021]
According to the method for the production of a thin plate-like laminate
having a film-like
resin layer according to claim 6, in the invention of claims 1 to 5, since the
film-like resin
composition is laminated on each surface of the substrate, products with
various functionalities
can be easily produced.
[0022]
According to the device for the production of a thin plate-like laminate
having a film-like resin
layer according to claim 7, in the invention of claims 1 to 6, since a
plurality of the workpieces are
arranged, and the molds are arranged on both surface sides of each of the
workpieces, a plurality
of thin plate-like laminates of the same type or different types can be molded
at the same time,
whereby work efficiency and production efficiency can be improved.
[0023]
According to the device for the production of a thin plate-like laminate
having a film-like resin
layer according to claim 8, in the invention of claims 1 to 7, since the film-
like resin composition
is a decorative, adhesive, or conductive functional resin composition,
products which can be used
in a very wide range of applications can be provided.
[0024]
According to the device for the production of a thin plate-like laminate
having a film-like resin
layer according to claim 9, in the invention of claims 1 to 8, since mold
surfaces of the molds have
fine concave/convex surface shapes, a fine concave/convex shape can stably be
formed with high
accuracy on the film-like resin layer.
BRIEF DESCRIPTION OF DRAWINGS
[0025]
FIG. 1 shows schematic cross-sectional views of thin plate-like laminates.
FIG. 2 shows schematic cross-sectional views showing molding states of a
workpiece.
FIG. 3 is a schematic diagram of the entirety of a device for the production
of a thin plate-like
laminate.
FIG. 4 shows perspective views of a mold retention structure.
FIG. 5 shows schematic plan views showing variations of a mold retention
structure.
FIG. 6 is a schematic diagram of a side view of a pressurization part.
FIG. 7 is a schematic diagram of a side view of a pressurization part at the
time of processing.
FIG. 8 shows schematic diagrams of a mold retention structure creation step.
FIG. 9 shows first schematic diagrams showing a workpiece compression
processing step.
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FIG. 10 shows second schematic diagrams showing a workpiece compression
processing step.
FIG. 11 shows first schematic views showing array combinations of constituent
parts of a
device for the production of a thin plate-like laminate.
FIG. 12 shows second schematic views showing array combinations of constituent
parts of
the device for the production of a thin plate-like laminate.
FIG. 13 shows first schematic cross-sectional views showing variations of the
relationship
between the laminate structure of a workpiece and molds.
FIG. 14 is a second schematic cross-sectional view showing variations of the
relationship
between the laminate structure of a workpiece and molds.
FIG. 15 is a third schematic cross-sectional view showing a variation of the
relationship
between the laminate structure of a workpiece and molds.
FIG. 16 shows schematic cross-sectional views showing the processing steps of
a thin plate-
like laminate of the prior art.
DESCRIPTION OF EMBODIMENTS
[0026]
The present invention relates to a method for the production of the thin plate-
like laminate
(80) having a film-like resin layer on which a predetermined concave/convex
surface shape is
formed on a surface thereof shown in FIG. 1. The thin plate-like laminate 80
is a laminate in which
a film-like resin layer 82 is laminated on at least one surface of a thin
plate-like substrate 81, and
the film-like resin layer 82 has a predetermined concave/convex shape 83. FIG.
1(a) shows a thin
plate-like laminate 80A in which the film-like resin layer 82 is formed on one
surface of the thin
plate-like substrate 81, and FIG. 1(b) shows a thin plate-like laminate 80B in
which the film-like
rein layer 82 is formed on both surface sides of the thin plate-like substrate
81. In the thin plate-
like laminate 80, by forming the predetermined concave/convex shape 83 on the
surface thereof,
various products such as semiconductor substrates, optical members such as
optical lenses and
optical films, separators for fuel cells, wearable electrodes, sensors,
electrostatic adsorbents,
resistance heating elements, electromagnetic wave shield materials,
connectors, solar cell
members, and separators for water electrolysis devices can be produced.
[0027]
The thin plate-like laminate 80, as shown in FIG. 2, can be obtained by
forming the
predetermined concave/convex shape 83 on a surface of a film-like resin
composition 84 laminated
on at least one surface of the thin plate-like substrate 81 of a workpiece 85
by a predetermined
mold 110. In the thin plate-like laminate 80, though the shapes, thickness,
etc., of the thin plate-
like substrate 81 and film-like resin composition 84 are determined in
accordance with the type of
the desired products, for example, the thickness of the thin plate-like
substrate 81 is 1 mm or less
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and the thickness of the film-like resin composition 84 is 500 gm or less, and
more preferably, the
thickness of the thin plate-like substrate 81 is 100 gm or less and the
thickness of the film-like
resin composition 84 is 50 to 150 gm. By setting the thicknesses of the thin
plate-like substrate 81
and the film-like resin composition 84 as described above, lightweight and
precise products can
be obtained. In particular, when imparting a conductive function, which is
described later, suitable
conductivity can be provided.
[0028]
The thin plate-like substrate 81 is a thin plate member composed of a material
having
corrosion resistance and heat resistance such as titanium, aluminum, and
stainless steel (SUS).
[0029]
The film-like resin composition 84 is laminated on one or both sides of the
thin plate-like
substrate 81, a predetermined concave/convex shape 83 is formed on the surface
thereof, and is
constituted as a film-like resin layer 82. Though the shape, size, etc., of
the concave/convex shape
83 of the film-like resin layer 82 are determined in accordance with the
application of the thin
plate-like laminate 80 or the like, fine protrusions and concavities may be
formed thereon.
Regarding the fine protrusions and concavities, for example, a groove depth
(H) thereof is 50 to
300 gm, a groove upper surface width (W1) thereof is 50 to 400 gm, and a
groove inner surface
width (W2) thereof is 100 to 400 gm.
[0030]
Examples of the material constituting the film-like resin composition 84
include ethylene
homopolymers, propylene homopolymers (homopolypropylene), random copolymers of
ethylene
and one or two or more cc-olefins such as propylene, 1-butene, 1-pentene, 1-
hexene, 4-methyl-l-
pentene, and block copolymers of the above components. Additionally, the
examples of the
material may include polyolefin resins such as the mixtures of the polymers
described above,
polyolefin elastomers, acid-modified polypropylene, acid-modified
polyethylene, ethylene/vinyl
alcohol copolymer resins, and hydrocarbon resins. Additional examples include
fluororesins and
fluororubbers. Furthermore, at least one type of conductive material such as a
carbon material or
a conductive ceramic may be added to these materials. Examples of the carbon
material include
carbon nanotubes, granular graphite, and carbon fibers.
[0031]
The film-like resin composition 84 is constituted as a decorative, adhesive,
or conductive
functional resin composition depending on the desired product to be produced.
Decorative
functional resin compositions are resin layers in which fine protrusions and
concavities are
subjected to surface treatment such as wrinkling (wrinkle pattern), embossing
(embossed pattern),
or reflective processing (matte tone). Adhesive functional resin compositions
are resin layers
having high adhesive strength composed of a polyethylene resin. Conductive
functional resin
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compositions are energizable resin layers in which a carbon material is added
to the resin material.
By providing these functional resin compositions, the thin plate-like laminate
80 can be used in an
extremely wide range of applications.
10032]
The mold 110 is a member which is arranged on both surface sides of the
substrate 81 of the
workpiece 85 and which holds the workpiece 85, and comprises a lower mold 120
on which the
workpiece 85 is placed and an upper mold 125 which is arranged above the
workpiece 85. In the
mold 110, predetermined concave/convex surface shapes 122, 127 are formed in
the mold surfaces
121, 126 of one or both of the lower mold 120 and the upper mold 125. In the
illustrated example,
the concave/convex surface shapes 122, 127 are formed on the mold surfaces
121, 126. By
imparting the concave/convex surface shape 122 (127) of the mold surface 121
(126) with a
particularly fine concave/convex surface shape, a fine concave/convex shape
can be stably formed
with high accuracy on the film-like resin layer. The concave/convex surface
shapes 122, 127 of
the lower mold 120 and the upper mold 125 may be the same or may be different.
Furthermore, as
shown in FIG. 2(a), interleaving paper (release paper) 115 for facilitating
release of the molded
workpiece (thin plate-like laminate 80) may be interposed between the mold
surfaces 121, 126 of
the mold 110 and the workpiece 85 as needed. Note that in FIG. 2(b),
interleaving paper has been
omitted.
[0033]
The method for the production of a thin plate-like laminate of the present
invention comprises
a mold retention structure creation step, a compression step, and an
extraction step, and if necessary,
a cooling step is performed. The method for the production of a thin plate-
like laminate can be
carried out using, for example, the device 10 for the production of a thin
plate-like laminate shown
in FIG. 3. The device 10 for the production of a thin plate-like laminate
comprises a setting part
30 having a setting device 31, a heating part 40 having a heating device 41, a
pressurization part
50 having a compression roller device 51, and an extraction part 60 having an
extraction device
61. The method for the production of a thin plate-like laminate of the present
invention will be
described below along with the device 10 for the production of a thin plate-
like laminate.
[0034]
The illustrated production device 10 comprises a machine base 11 which
connects the setting
part 30, the heating part 40, the pressurization part 50, and the extraction
part 60 by means of a
rail part 20. The rail part 20 has a rail body 21 composed of a pair of rod-
shaped members located
between the setting part 30, the heating part 40, the pressurization part 50,
and the extraction part
60, and connects the setting part 30, the heating part 40, the pressurization
part 50, and the
extraction part 60 in series. The rail body 21 is installed so as to be
capable of moving the mold
110 between the setting part 30, the heating part 40, the pressurization part
50, and the extraction
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part 60 by means of the mold retention structure 100. Reference sign 12 in the
drawing indicates
legs of the machine base 11 which support the rail part 20.
[0035]
The mold retention structure 100 is not particularly limited as long as it is
capable of moving
the mold 110 between the parts 30, 40, 50, and 60 while holding the workpiece
85. For example,
an appropriate structure such as a structure having clip members or the like
for holding the lower
mold 120 and the upper mold 125 can be adopted.
[0036]
The mold retention structure 100 shown in FIG. 4 is an example of a frame-like
structure
which retains the mold 110 in which the workpiece 85 is held, and moves
between the setting part
30, the heating part 40, the pressurization part 50, and the extraction part
60 along the rail body
21. The mold retention structure 100 comprises a retention body 101 which has
a lower opening
104, which is placed on the rail body 21, and which is capable of sliding, and
a pair of mold
retention parts 105, 105 which retain the lower mold 120 of the mold 110.
Furthermore, in the
mold 110 which is retained by the mold retention structure 100, mating
protrusions 123 are
provided at a plurality of positions of the lower mold 120, and a plurality of
mating holes 128
corresponding to the mating protrusions 123 of the lower mold 120 are provided
on the upper mold
125, and by mating the mating protrusions 123 of the lower mold 120 with
corresponding mating
holes 128 of the upper mold 125, the upper mold 125 is overlaid on the lower
mold 120 at an
appropriate position.
[0037]
FIG. 5 is a schematic plan view showing variations of the mold retention
structure 100 and
the mold 110. FIG. 5(a) is an example of a mold retention structure 100A in
which a mold 110A
for processing a single workpiece 85 is retained. The mold retention structure
100A comprises a
frame-shaped retention body 101A composed of a pair of side edges 102, 102
which are slidably
placed on the rail body 21 and edge parts 103, 103 that extend between both
ends of the side edges
102, 102, and a pair of mold retention parts 105A, 105A extending between the
edge parts 103,
103, and the mold 110A (lower mold 120) is affixed between the mold retention
parts 105A, 105A
by means of fixation members (not illustrated) such as screw members.
[0038]
FIG. 5(b) is an example of a mold retention structure 100B in which a mold
110B for
processing of a plurality of workpieces 85 are retained by the same mold
surface. In the mold
retention structure 100B, the 110B, which is a rectangular mold in a plan
view, is arranged between
the edge parts 103, 103 of the retention body 101A, and the edge parts 103,
103 are affixed by
affixation members (not illustrated) such as screw members as mold retention
parts 105, 105.
[0039]
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FIG. 5(c) is an example of a mold retention structure 100C in which a mold
110C for
processing a comparatively-large workpiece 85 is retained. In the mold
retention structure 100C,
the mold 110C corresponding to the size of the entirety of the lower opening
104 is arranged in
the lower opening 104 of the retention body 101A, and the side edges 102, 102
and the edge parts
103, 103 of the retention body 101A are affixed by means of affixation members
(not illustrated)
such as screw members as mold retention parts 105, 105, 105, 105.
[0040]
The frame-like structure of the mold retention structure is not limited to
only the structures
100A to 100C described above, and an appropriate structure can be adopted in
accordance with
the number and size of workpieces 85, the shape of the mold, etc. For example,
a structure in which
a recess which can mate with the mold is provided in the mold retention part
of the mold retention
structure so that the mold can be retained at a predetermined position, or a
structure in which an
appropriate mold positioning member is provided can be adopted. Furthermore, a
movement
device which is capable of moving on the rail body 21 may be separately
prepared, and a mold
retention structure may be installed on the movement device to enable
movement.
[0041]
The setting part 30 comprises a setting device 31 which creates the mold
retention structure
100 in which the mold 110 is set. As the setting device 31, a known transport
means such as a robot
arm by which the retention body 101, the mold 110, and the workpiece 85 can be
appropriately
installed can suitably be used. In the setting device 31 of the Examples,
transportation of the
retention body 101, the mold 110, and the workpiece 85 between a work table
and the rail part 20
is performed, and creation of the mold retention structure 100 is performed.
[0042]
The heating part 40 comprises a heating device 41 which heats the mold 110 to
the thermal
deformation temperature of the film-like resin composition 84. The heating
device 41 is not
particularly limited as long as it is capable of efficiently heating the mold
110. The heating device
41 of the Examples comprises hot plates 42, 43 which are capable of being
raised and lowered and
which are arranged above and below the rail body 21, and the heating device 41
is configured so
as to hold and heat the mold 110 by means of the upper hot plate 42 and the
lower hot plate 43.
[0043]
The thermal deformation temperature is a sufficient temperature at which the
film-like resin
composition 84 of the workpiece 85 held by the mold 110 can be thermally
deformed and
appropriately processed, and is appropriately set in accordance with the type
of the film-like resin
composition 84. For example, the mold 110 is heated to a temperature higher
than the melting
point of the film-like resin composition 84 by 50 C or more. Note that the
upper limit thereof is
not particularly limited, but since there is a risk that the film-like resin
composition 84 of the
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workpiece 85 may react with oxygen in the atmosphere and oxidize and
deteriorate due to
excessive heating, the temperature may be set such that the film-like resin
composition 84 is less
likely to undergo oxidative deterioration due to heat.
[0044]
The heating of the mold 110 by the heating device 41 may be performed on the
mold 110 in a
state in which the workpiece 85 is held thereby, or may be performed on the
mold 110 in a state in
which the workpiece 85 is not held thereby. When the mold 110, which holds the
workpiece 85, is
heated, excessive heating of the mold 110 is unnecessary, which is
economically advantageous.
Furthermore, when heating the mold 110, which is not holding the workpiece 85,
since only the
mold 110 is heated, it can be heated to a high temperature in a short time to
shorten the operation
time, and oxidation of the film-like resin composition 84 of the workpiece 85
due to the heating is
suppressed, which enables high-quality molding.
[0045]
The pressurization part 50, as shown in FIGS. 6 and 7, comprises a compression
roller device
51 which compresses the outer surfaces of the heated mold 110 to form the thin
plate-like laminate
80. The compression roller device 51 comprises a lower compression roller 52
which is arranged
so as to be capable of rotating in a position in which it abuts the lower
surface side of the mold
111, an upper compression roller 54 which is arranged in a position directly
above the lower
compression roller 52 and so as to be capable of rotating on the upper side of
the mold retention
structure 100, and a pressurization part lifting means 56 comprising a
pressure cylinder or the like
which raises and lowers the upper compression roller 54. Furthermore, though
not illustrated, the
compression roller device 51 comprises a temperature adjusting means for
adjusting the
temperature of one or both of the lower compression roller 52 and the upper
compression roller
54. In the drawings, reference sign 53 represents a lower rotational drive
device which rotationally-
drives the lower compression roller 52, reference sign 55 represents an upper
rotational drive
device which rotationally-drives the upper compression roller 54, and
reference sign 57 represents
a rod part of the pressurization part lifting means 56.
[0046]
In the compression roller device 51, as shown in FIG. 7, the mold retention
structure 100, after
heating of the mold 110, is introduced between the two compression rollers,
and the outer surfaces
of the mold 110 are compressed by rotating the compression rollers to
integrally
thermocompression-bond the film-like resin composition 84 and the substrate 81
to form the thin
plate-like laminate 80 having the film-like resin layer 82. The compression
roller device 51 of the
Examples has a drive control device (not illustrated) which controls the
rotation of the lower
compression roller 52 and the upper compression roller 54, and when the mold
111 is compressed,
the rotation of the two compression rollers 52, 54 and the shaking of the mold
retention structure
Date Recue/Date Received 2021-09-17 11
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100 are controlled so as to be synchronized.
[0047]
The extraction part 60 comprises an extraction device 61 which extracts the
mold 110 or
workpiece 85 from the mold retention structure 100 after compression. As the
extraction device
61, a known transport means such as a robot arm is suitably used, and the
extraction device 61
transports the mold retention structure 100, the mold 110, or the workpiece 85
between the work
table on which the mold, etc., after processing are placed and the rail part
20, and extracts the mold
110 or workpiece 85 from the mold retention structure 100.
[0048]
In the device 10 for the production of a thin plate-like laminate of the
present invention, when
the cooling step is performed in the production method of the present
invention, a cooling part 70
may be arranged on the machine base 11. The cooling part 70 comprises a
cooling device 71 which
cools the mold 110 compressed by the compression roller device 51. The cooling
device 71 is not
particularly limited as long as it is capable of cooling the thin plate-like
laminate 80 via the mold
110. For example, the cooling device 71 shown in FIG. 1 comprises cooling
plates 72, 73 which
are capable of being raised and lowered and which are arranged above and below
the rail body 21,
and the cooling device 71 is configured so as to hold and cool the mold 110
retained in the mold
retention structure 100 by means of the upper cooling plate 72 and the lower
cooling plate 73. By
cooling the mold after compression in the cooling part 70, the shape of the
concave/convex surface
of the thin plate-like laminate 80 can be stabilized.
[0049]
Next, the method for the production of a thin plate-like laminate of the
present invention using
the device 10 for the production of a thin plate-like laminate described above
will be specifically
described.
[0050]
The mold retention structure creation step is a step of creating a mold
retention structure in
which the molds 110 heated to the thermal deformation temperature of the film-
like resin
composition 84 are arranged on both sides of the workpiece 85. This mold
retention structure
creation step is configured such that as shown in, for example, FIG. 8(a), the
heating step is
performed in the heating part 40 after the setting step performed in the
setting part 30.
[0051]
The setting step shown in FIG. 8(a) is a step in which, in the setting part
30, using the setting
device 31 (illustration omitted), the mold retention structure 100 in which
the molds 110 are
arranged on both surface sides of the workpiece 85 is created (setting step
prior to heating). In the
setting step, processes such as transporting the mold retention structure 100
onto the rail body 21
of the rail part 20 by the setting device 31, such as a robot arm,
transporting the lower mold 120
Date Recue/Date Received 2021-09-17 12
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and the upper mold 125 of mold 110 to the mold retention structure 100 and
retaining them therein,
and transporting the workpiece 85 to the mold are performed. In the Examples,
the lower mold
120 of the mold 110 is retained in advance in the retention body 101 of the
mold retention structure
100, and after the workpiece 85 is placed on the lower mold 120, the mold
retention structure 100
retaining the lower mold 120 is transported onto the rail body 21, and
thereafter setting processing
in which the upper mold 125 is overlaid on the lower mold 120 is performed.
[0052]
The heating step shown in FIG. 8(a) is a step in which, in the heating part
40, using the heating
device 41, the entirety of the mold 110 after creation of the mold retention
structure 100 is heated
to the thermal deformation temperature of the film-like resin composition 84
(heating step after
setting). In the heating step, a process in which the lower mold 120 and the
upper mold 125 of the
mold 110 are heated by the heating device 41, and the workpiece 85 held in the
mold 110 is heated
to the thermal deformation temperature is performed on the mold retention
structure 100, which
has moved from the setting part 30 to the heating part 40. As a result, in the
compression step,
which is described later, suitable processing of the workpiece 85 is enabled.
In the Examples, there
is performed a process in which the upper and lower hot plates 42, 43 of the
heating device 41 are
lowered and raised, respectively, and the mold 110 retained in the mold
retention structure 100 on
the rail body 21 is heated while being interposed by the hot plates 42, 43.
Note that the heating
temperature is determined in accordance with the material of the film-like
resin composition of the
workpiece.
[0053]
As described above, in the mold retention structure creation step in which
heating of the molds
110 is performed after the workpiece 85 is held in the molds 110 and the mold
retention structure
100 is set, excessive heating of the mold 110 is unnecessary, which is
economically advantageous.
[0054]
Furthermore, the mold retention structure creation step may be configured such
that the setting
step is performed in the setting part 30 after the heating step performed in
the heating part 40, as
shown in FIG. 8(b), instead of performing the heating step after the setting
step.
[0055]
The heating step shown in FIG. 8(b) is a step (heating step prior to setting)
in which, in the
heating part 40, using the heating device 41, the mold is heated to the
thermal deformation
temperature of the film-like resin composition 84. In this heating step, a
process in which the lower
mold 120 and the upper mold 125 of the mold 110 are heated by the heating
device 41 is performed
on the molds 110 which are retained in the retention body 101 and which do not
hold the workpiece
85. As a result, the mold 110 can be heated to a high temperature in a short
time, and oxidation of
the film-like resin composition 84 of the workpiece 85 by the heating is
suppressed, which enables
Date Recue/Date Received 2021-09-17 13
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high-quality molding.
[0056]
The setting step shown in FIG. 8(b) is a step (setting step after heating) in
which, in the setting
part 30 using the setting device 31 (illustration omitted), the workpiece 85
is held in the heated
mold 110, and the mold retention structure 100 is created. In this setting
step, a setting process in
which after the upper mold 125 of the mold 110 retained in the retention body
101 is temporarily
removed by the setting device 31, such as a robot arm, the workpiece 85 is
placed on the lower
mold 120, and then the upper mold 125 is overlaid on the lower mold 120 is
performed.
[0057]
As described above, in the mold retention structure creation step in which the
workpiece 85 is
held in the mold 110 and the mold retention structure 100 is set after the
mold 110 is heated, since
only the mold 110 is heated, it can be heated to a high temperature in a short
time, which reduced
operation time, and oxidation of the film-like resin composition 84 of the
workpiece 85 by the
heating is suppressed, which enables high-quality molding.
[0058]
The compression step is a step in which, in the pressurization part 50 as
shown in FIGS. 6, 7,
9, and 10, the mold retention structure 100, in which the heated mold 110 is
arranged, is introduced
between the two compression rollers 52, 54 of the compression roller device 51
and the outer
surfaces of the mold 111 are compressed by rotating the compression rollers
52, 54 to integrally
thermocompression-bond the film-like resin composition and the substrate to
form the thin plate-
like laminate 80 having the film-like resin layer 82. In the compression step,
a process in which
the entirety of the workpiece 85 held in the mold 111 is roll-pressed while
shaking the mold
retention structure 100 is performed on the heated mold 111 of the mold
retention structure 100,
which has moved from setting part 30 or the heating part 40 to the
pressurization part 50.
[0059]
In the Examples, regarding the mold 111 of the mold retention structure 100,
which has moved
to the pressurization part 50, as shown in FIG. 9(a), since the upper end of
the lower compression
roller 52 is positioned at the same height as the lower surface of the mold
111, the lower
compression roller 52 and the lower surface of the mold 111 enter a contact
state (contact position
P1). Next, the upper compression roller 54 above the mold retention structure
100 is lowered by
the pressurization part lifting means 56, the upper compression roller 54 is
pressed against the
upper surface side of the heated mold 111 retained in the mold retention
structure 100, and the
mold 111 is compressed by the two compression rollers 52, 54 (refer to FIG.
7). In the compression
by the two compression rollers 52, 54, as shown in FIG. 9(b), the upper
compression roller 54
contacts (P2) and presses the mold 111 at a position directly above the
contact position P1 between
the lower compression roller 52 and the mold 111. Thus, the mold 111 is
subjected to the
Date Recue/Date Received 2021-09-17 14
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compression force from the two compression rollers 52, 54 between the contact
position P1 with
the lower compression roller 52 and the contact position P2 with the upper
compression roller 54.
[0060]
In processing methods such as transfer molding of the prior art, as shown in
FIG. 16, since the
entirety of the mold 210 is pressed by the pressurizing means 200 such as a
pressing device, a
pressing force acts on the mold 210 in a two-dimensional (planar) manner. When
pressure is
applied in a planar manner, the pressure is dispersed so as to act on the
entirety of the mold 210,
and the pressing force does not always act uniformly on the entire mold 210,
which may cause
pressure unevenness. Conversely, in compression by the two compression rollers
52, 54 shown in
FIG. 9(b), a one-dimensional (linear) pressing force between the contact
positions P1 and P2 acts
on the mold 111 retained by the mold retention structure 100. Thus, as
compared with the
conventional method in which the pressure acts two-dimensionally (planar), the
pressure is
concentrated and it becomes easier to apply a large pressing force, and
moreover, since the
pressurized part of the mold 111 is limited to the portion between the contact
positions P1 and P2,
the pressurization acts relatively uniformly and the occurrence of pressure
unevenness is
suppressed.
[0061]
When compression by the two compression rollers 52, 54 is performed, in a
state in which the
compression is retained, as shown in FIG. 10, the mold retention structure 100
is shaken so that
the pressurized portion (between the contact positions P1, P2) of the mold 111
acts at least on the
entirety of the workpiece 85 (between positions 86, 86 of the ends of the
workpiece 85), which is
held in the mold 111 of the mold retention structure 100. In the shaking of
the mold retention
structure 100, in accordance with the movement of the mold retention structure
100 in one
direction (for example, the rearward direction in FIG. 10(a)), the two
compression rollers 52, 54
rotate in the same direction (for example, in FIG. 10(a), the lower
compression roller 52 rotates in
the counterclockwise direction and the upper compression roller 54 rotates in
the clockwise
direction) in a compressing state, and in accordance with the movement of the
mold retention
structure 100 in the other direction (for example, the frontward direction of
FIG. 10(b)), the two
compression rollers 52, 54 rotate in the same direction (for example, in FIG.
10(b), the lower
compression roller 52 rotates in the clockwise direction and the upper
compression roller 54 rotates
in the counterclockwise direction) in a compressing state.
[0062]
At this time, the shaking of the mold retention structure 100 and the
rotational driving of the
compression rollers 52, 54 are controlled so as to be performed synchronously
by the drive
controller (not illustrated) of the pressurization part 50. In other words,
the movement timing
(shaking timing) of the mold retention structure 100, the rotational timing of
the compression
Date Recue/Date Received 2021-09-17 15
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rollers 52, 54, the movement direction (shaking direction) of the mold
retention structure 100, the
rotational directions of the compression rollers 52, 54, the movement distance
(shaking range) of
the mold retention structure 100, and the rotation amounts of the compression
rollers 52, 54 are
controlled so as to match. Thus, smooth movement of the mold retention
structure 100 is enabled
in a state in which the predetermined pressure applied on the mold 111 from
the two compression
rollers 52, 54 is retained. By shaking the mold retention structure 100 in an
interposed state in this
manner, the compression position (between P1 and P2) by the two compression
rollers 52, 54
extends over the entire surface of the mold 111, whereby the entire surface of
the mold 111 can be
substantially-uniformly pressurized. The shaking of the mold retention
structure 100 is performed
as many times as necessary, including once (one round trip), depending on the
type of the resin
layer, the fineness of the concave/convex shape, the target product, etc.
Furthermore, the start
position and end position of the compression by the two compression rollers
52, 54 are
appropriately determined in accordance with the size of the workpiece 85, the
type of the
concave/convex shape, etc. When the shaking of the mold retention structure
100 is stopped, the
pressurization is completed and the upper compression roller 54 is raised to
release the interposed
state of the mold 111.
[0063]
In this compression step, if necessary, the temperature of one or both of the
lower compression
roller 52 and the upper compression roller 54 may be adjusted by the
temperature adjusting means
(not illustrated) during the compression by the compression roller device 51.
The temperature
adjustment by the temperature adjusting means may be any appropriate method
such as heating,
cooling, and heat retention. For example, in the case of continuously
processing a large number of
products, if there is a difference in temperature between the mold 110 and the
compression rollers
52, 54, the temperature of the mold 110 may change during compression, whereby
it may be
difficult to perform appropriate processing. Thus, in this temperature
adjustment, the temperature
of the mold 110 at the time of compression is appropriately maintained by
heating or maintaining
the temperature when the temperature of the mold 110 is low, or by cooling
when the temperature
is excessively high.
[0064]
The extraction step is a step in which, in the extraction part 60, using the
extraction device 61,
the mold 110 after compression is extracted from the mold retention structure
100. In the extraction
step, a process in which the mold retention structure 100 is transported from
the rail body 21 of
the rail part 20 by the extraction device 61, such as a robot arm, the lower
mold 120 and the upper
mold 125 of the mold 110 are extracted from the mold retention structure 100,
and the workpiece
85 is extracted from the mold 110 is performed on the mold retention structure
100, which has
moved from the pressurization part 50 to the extraction part 60. In the
examples, there is performed
Date Recue/Date Received 2021-09-17 16
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a process in which the upper mold 125 of the mold 110 retained in the mold
retention structure
100 is extracted from the lower mold 120, the mold retention structure 100 in
which the lower
mold 120 is retained is transported from the rail body 21 to another placement
position, such as a
work table, and the thin plate-like laminate 80 (processed workpiece) placed
on the lower mold
120 is extracted. By extracting the thin plate-like laminate 80 from the mold
110, the production
method is completed.
[0065]
When the above extraction step is performed, the thin plate-like laminate 80
immediately after
processing is in a state in which it can be easily deformed by the heating of
the heating part 40.
Thus, before the extraction step is performed, the thin plate-like laminate 80
is cooled to a
temperature at which inadvertent deformation does not occur. At that time, it
is possible to perform
slow-cooling, such as allowing the thin plate-like laminate 80 to stand for a
predetermined time
without extracting it from the mold 110, but it is preferable that the device
10 for the production
of a thin plate-like laminate be provided with a cooling part 70 to perform
the cooling step.
[0066]
The cooling step is a step in which, in the cooling part 70, using the cooling
device 71, the
entirety of the mold 110 after compression retained in the mold retention
structure 100 is cooled.
In the cooling step, a process in which the lower mold 120 and the upper mold
125 of the mold
110 are cooled by the cooling device 71, and the processed thin plate-like
laminate 80 held in the
mold 110 is cooled to a temperature at which inadvertent deformation does not
occur is performed
on the mold retention structure 100, which has moved from the pressurization
part 50 to the cooling
part 70. As a result, the shape of the concave/convex surface of the thin
plate-like laminate 80 is
stabilized, and the molding of the thin plate-like laminate 80 in the mold 110
is complete. In the
Examples, there is performed a process in which the upper and lower cooling
plates 72, 73 of the
cooling device 71 are lowered and raised, respectively, and the mold 110
retained in the mold
retention structure 100 on the rail body 21 is cooled while being interposed
by the cooling plates
72, 73. After the cooling step has been performed, the mold retention
structure 100 is moved from
the cooling part 70 to the extraction part 60 and the extraction step
described above is performed.
Note that the cooling temperature is lower than the thermal deformation
temperature of the film-
like resin composition 84 by 20 C or more.
[0067]
An array combination of the setting part 30, the heating part 40, the
pressurization part 50, the
extraction part 60, and the cooling part 70 of the device 10 for the
production of a thin plate-like
laminate will be described. FIG. 11 shows variations (10A to 10D) of the
device for the production
of a thin plate-like laminate in which after the workpiece is held by the
molds in the setting part
30 and the mold retention structure is created, the molds holding the
workpiece are heated in the
Date Recue/Date Received 2021-09-17 17
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heating part 40. Furthermore, FIG. 12 shows variations (10E to 10H) of the
device for the
production of a thin plate-like laminate in which after the molds which are
not holding the
workpiece are heated in the heating part 40, the workpiece is held in molds in
the setting part 30
and the mold retention structure is created.
[0068]
The device 10A for the production of a thin plate-like laminate shown in FIG.
11(a) is an
example in which the setting part 30, the heating part 40, the pressurization
part 50, and the
extraction part 60 are arranged in series on the rail part 20. In the device
10A for the production of
a thin plate-like laminate, the workpiece is transported from the downstream
side of the rail part
20 (setting part 30 side) and processed, and the processed thin plate-like
laminate is transported to
the upstream side of the rail part 20 (extraction part 60 side). Thus, the
device 10A can be
incorporated into the line process of a production line of various products
using the thin plate-like
laminates, and the thin plate-like laminates extracted by the extraction part
60 can be continuously
transferred to another processing process.
[0069]
The device 10B for the production of a thin plate-like laminate shown in FIG.
11(b) is an
example in which the cooling part 70 is provided between the pressurization
part 50 and the
extraction part 60, and the setting part 30, the heating part 40, the
pressurization part 50, the cooling
part 70, and the extraction part 60 are arranged in series in this order on
the rail part 20. In the
device 10B for the production of a thin plate-like laminate, the shape of the
concave/convex
surface of the thin plate-like laminate can be stabilized by the cooling part
70, and the device 10B
for the production of a thin plate-like laminate can be incorporated into the
line process of a
production line in the same manner as the production device 10A.
[0070]
The device 10C for the production of a thin plate-like laminate shown in FIG.
11(c) is an
example in which the setting part 30 and the extraction part 60 are shared,
and the setting device
31 and the extraction device 61 are shared, and the setting part 30, which
also serves as the
extraction part 60, the heating part 40, the pressurization part 50, and the
cooling part 70 are
arranged in series on the rail part 20 in this order. In the device 10C for
the production of a thin
plate-like laminate, since the setting part 30 and the extraction part 60 are
configured so as to be
shared, the space for the production device 10C can be reduced, and equipment
to be used can be
omitted to reduce cost. Furthermore, since the workpiece transported from the
setting part 30 is
processed by the pressurization part 50 and then returned to the setting part
30 (which also serves
as the extraction part 60) and extracted, man-hours during batch work can be
reduced and work
efficiency can be improved.
[0071]
Date Recue/Date Received 2021-09-17 18
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The device 10D for the production of a thin plate-like laminate shown in FIG.
11(d) is an
example in which the setting part 30 and the extraction part 60 are shared,
and the setting device
31 and the extraction device 61 are shared, and the setting part 30, which
also serves as the
extraction part 60, the cooling part 70, the heating part 40, and the
pressurization part 50 are
arranged in series on the rail part 20 in this order. In the device 10D for
the production of a thin
plate-like laminate, since the pressurization part 50 is arranged on the
outermost side of the
production device 10D, maintenance operations such as preparation of the
compression roller
device of the pressurization part 50 becomes easy. Like the production device
10C, space can be
reduced to reduce cost, and work efficiency can be improved during batch work.
[0072]
The device 10E for the production of a thin plate-like laminate shown in FIG.
12(a) is an
example in which the heating part 40, the setting part 30, the pressurization
part 50, and the
extraction part 60 are arranged in series on the rail part 20 in this order.
In other words, the device
10E for the production of a thin plate-like laminate is configured such that
the setting part 30 and
the heating part 40 are reversed as compared to the device 10A for the
production of a thin plate-
like laminate. Thus, the workpiece is processed while being transported from
the downstream side
(the heating part 40 side) of the rail part 20 to the upstream side (the
extraction part 60 side).
Therefore, the device 10E for the production of a thin plate-like laminate can
be incorporated into
the line process of a production line of various products in the same manner
as the production
device 10A, and the produced thin plate-like laminates can be continuously
transferred to another
processing process.
[0073]
The device 1OF for the production of a thin plate-like laminate shown in FIG.
12(b) is
configured such that the setting part 30 and the heating part 40 are reversed
as compared to the
device 10B for the production of a thin plate-like laminate, and is an example
in which the heating
part 40, the setting part 30, the pressurization part 50, the cooling part 70,
and the extraction part
60 are arranged in series on the rail part 20 in this order. In the device 1OF
for the production of a
thin plate-like laminate, in the same manner as the device 10B for the
production of a thin plate-
like laminate, the shape of the concave/convex surface of the thin plate-like
laminate can be
stabilized by the cooling part 70, and the device 1OF for the production of a
thin plate-like laminate
can be incorporated into the line process of a production line.
[0074]
The device 10G for the production of a thin plate-like laminate shown in FIG.
12(c) is
configured such that the setting part 30 and the heating part 40 are reversed
as compared to the
device 10C for the production of a thin plate-like laminate, and is an example
in which the heating
part 40, the setting part 30, which serves as the extraction part 60, the
pressurization part 50, and
Date Recue/Date Received 2021-09-17 19
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the cooling part 70, are arranged in series on the rail part 20 in this order.
In the device 10G for the
production of a thin plate-like laminate, in the same manner as the device 10C
for the production
of a thin plate-like laminate, the space for the production device 10G can be
reduced, equipment
to be used can be omitted to reduce the cost, man-hours during batch work can
be reduced, and
work efficiency can be improved.
[0075]
The device 10H for the production of a thin plate-like laminate shown in FIG.
12(d) is an
example in which the heating part 40, the setting part 30, which serves as the
extraction part 60,
the cooling part 70, and the pressurization part 50 are arranged in series on
the rail part 20 in this
order. In the device 10H for the production of a thin plate-like laminate,
maintenance operations
such as preparation of the compression roller device of pressurization part 50
becomes easy.
Furthermore, like the production device 10G, space can be reduced to reduce
cost, and work
efficiency can be improved during batch work.
[0076]
Next, variations in the relationship between the laminate structure of the
workpiece and the
mold therefor will be described using FIGS. 13 to 15. FIG. 13(a) is an example
of a mold structure
150A in which a mold 112A for single-side processing is arranged relative to a
workpiece 85A in
which a film-like resin composition 84A is laminated on one surface side (the
upper surface side
in the example of the drawing) of the substrate 81. The mold 112A comprises a
lower mold 120A
having a mold surface 121A, which is a smooth surface, and an upper mold 125A
having a mold
surface 126A on which the concave/convex surface shape 127 is formed. In the
mold structure
150A, the smooth lower mold 120A contacts the second side (the lower surface
side) of the
substrate 81 of the workpiece 85A, the upper mold 125A on which the
concave/convex surface
shape 127 is formed contacts the resin composition 84A on the first side
(upper surface side) of
the substrate 81, whereby the concave/convex shape can be formed on only the
resin composition
84A on the first surface side (upper surface side) of the substrate 81.
[0077]
FIG. 13(b) is an example of a mold structure 150B in which a mold 112A for
single-side
processing is arranged relative to a workpiece 85B in which film-like resin
compositions 84A, 84B
are laminated on both surfaces of the substrate 81. In the mold structure
150B, the smooth lower
mold 120A contacts the resin composition 84B on the second side (lower surface
side) of the
substrate 81 of the workpiece 85A, and the upper mold 125A on which the
concave/convex surface
shape 127 is formed contacts the resin composition 84A on the first side
(upper surface side) of
the substrate 81. Thus, the resin composition 84B on the second side (lower
surface side) of the
substrate 81 is formed into a smooth resin layer by the lower mold 120A, and a
concave/convex
shape can be formed on only the resin composition 84A on the first side (upper
surface side).
Date Recue/Date Received 2021-09-17 20
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[0078]
FIG. 13(c) is an example of a mold structure 150C in which a mold 112B for
double-sided
processing is arranged relative to a workpiece 85B in which film-like resin
compositions 84A, 84B
are laminated on both surfaces of the substrate 81. The mold 112B comprises a
lower mold 120B
having a mold surface 121B on which the concave/convex surface shape 122 is
formed, and an
upper mold 125A having a mold surface 126A on which the concave/convex surface
shape 127 is
formed. In the mold structure 150C, the lower mold 120B on which the
concave/convex surface
shape 122 is formed contacts the resin composition 84B on the second side
(lower surface side) of
the substrate 81, and the upper mold 125A on which the concave/convex surface
shape 127 is
formed contacts the resin composition 84A on the first side (upper surface
side) of the substrate
81. Thus, concave/convex shapes can be formed on the resin compositions 84B,
84A on the
surfaces of the substrate 81 by the lower mold 120B and the upper mold 125A.
[0079]
According to the mold structure 150A shown in FIG. 13(a), a single resin layer
having a
concave/convex shape can be appropriately formed on the substrate 81. The mold
structures 150B,
150C shown in FIGS. 13(b) and 13(c) are examples of processing of a workpiece
85B in which
the film-like resin compositions 84A, 84B are laminated on both surfaces of
the substrate 81. In
the mold structure 150B, a resin layer having a concave/convex shape and
having a predetermined
functionality can be formed on one side of the substrate 81, and a resin layer
such as a smooth
adhesive layer can be formed on the other side. Furthermore, in the mold
structure 150C, resin
layers having concave/convex shapes and predetermined functionalities can be
formed on both
surfaces of the substrate 81. In particular, in the mold structure 150C, by
providing the lower mold
120B and the upper mold 125A with different concave/convex shapes,
concave/convex shapes
having different patterns can be formed on the surfaces of the substrate 81.
By laminating the resin
compositions 84A, 84B on the surfaces of the substrate 81 in this manner,
products with various
functionalities can easily be produced.
[0080]
FIGS. 14 and 15 are examples of mold structures 150D, 150E in which processing
is
performed simultaneously on a plurality (two in the examples of the drawings)
of workpieces. In
the mold structure 150D shown in FIG. 14, a mold 112C which is capable of
processing a plurality
of workpieces is arranged relative to a workpiece 85C in which the film-like
resin composition
84A is laminated on one surface side (the upper surface side in the example of
the drawing) of the
substrate 81 and another workpiece 85D in which film-like resin compositions
84A, 84B are
laminated on both surfaces of the substrate 81. The mold 112C comprises a
lower mold 120B
having a mold surface 121B on which the concave/convex surface shape 122 is
formed, an upper
mold 125A having a mold surface 126A on which the concave/convex surface shape
127 is formed,
Date Recue/Date Received 2021-09-17 21
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and a middle mold 130A having smooth mold surfaces 131A, 136A on both surfaces
thereof.
[0081]
In the mold structure 150D, the lower mold 120B on which the concave/convex
surface shape
122 is formed contacts the resin composition 84B on the second side (lower
surface side) of the
substrate 81 of the second workpiece 85D, the upper mold 125A on which the
concave/convex
surface shape 127 is formed contacts the resin composition 84A on the first
side (upper surface
side) of the substrate 81 of the first workpiece 85C, the middle mold 130A is
interposed between
the first workpiece 85C and the second workpiece 85D, the smooth upper mold
surface 131A of
the middle mold 130A contacts the second side (lower surface side) of the
substrate 81 of the first
workpiece 85C, and the smooth lower mold surface 136A of the middle mold 130A
contacts the
resin composition 84A on the first side (upper surface side) of the substrate
81 of the second
workpiece 85D. Thus, the concave/convex shape is formed on only the resin
composition 84A on
the first side (upper surface side) of the one workpiece 85C by the upper mold
125A, and on the
second workpiece 85D, the concave/convex shape is formed on only the resin
composition 84B
on the second side (lower surface side) of the substrate 81 by the lower mold
120A, and the resin
composition 84A on the first side (upper surface side) can be formed as a
smooth resin layer.
[0082]
In the mold structure 150E shown in FIG. 15, a mold 112D which is capable of
processing a
plurality of workpieces is arranged relative to a workpiece 85E in which the
film-like resin
compositions 84A, 84B are laminated on both surfaces of the substrate 81 and
another workpiece
85F in which the film-like resin compositions 84A, 84B are likewise laminated
on both surfaces
of the substrate 81. The mold 112D comprise a lower mold 120B having a mold
surface 121B on
which the concave/convex surface shape 122 is formed, an upper mold 125A
having a mold surface
126A on which the concave/convex surface shape 127 is formed, and a middle
mold 130B having
mold surfaces 131B, 136B on which the concave/convex surface shapes 132, 137
are formed on
both surfaces thereof.
[0083]
In the mold structure 150E, the lower mold 120B on which the concave/convex
surface shape
122 is formed contacts the resin composition 84B on the second side (lower
surface side) of the
substrate 81 of the second workpiece 85F, the upper mold 125A on which the
concave/convex
surface shape 127 is formed contacts the resin composition 84A on the first
side (upper surface
side) of the substrate 81 of the first workpiece 85E, and the middle mold 130B
is interposed
between the first workpiece 85E and the second workpiece 85F, the upper mold
surface 131B on
which the upper concave/convex surface shape 132 of the middle mold 130B is
formed contacts
the second side (lower surface side) of the substrate 81 of the first
workpiece 85E, and the lower
mold surface 136B on which the lower concave/convex surface shape 137 of the
middle mold
Date Recue/Date Received 2021-09-17 22
CA 03134110 2021-09-17
130B is formed contacts the resin composition 84A on the first side (upper
surface side) of the
substrate 81 of the second workpiece 85F. Thus, on the one workpiece 85E, the
concave/convex
shape can be formed on the resin composition 84A on the first side (upper
surface side) by the
upper mold 125A, and the concave/convex shape can be formed on the resin
composition 84B on
the second side (lower surface side) by the upper mold surface 131B of the
middle mold 130B,
and on the second workpiece 85F, the concave/convex shape can be formed on the
resin
composition 84B on the other side (lower surface side) of the substrate 81 by
the lower mold 120B
and the concave/convex shape can be formed on the resin composition 84A on the
first side (upper
surface side) by the lower mold surface 136B of the middle mold 130B.
[0084]
According to the mold structure 150D shown in FIG. 14, by interposing the
middle mold 130A
between different workpieces, a plurality of thin plate-like laminates having
different types can be
molded. According to the mold structure 150E shown in FIG. 15, by interposing
the middle mold
130B between identical workpieces, a plurality of identical thin plate-like
laminates can be molded.
Thus, by arranging a plurality of workpieces and arranging upper mold, middle
mold, and lower
mold on both sides of each workpiece, a plurality of thin plate-like laminates
of the same type or
of different types can be simultaneously molded, whereby work efficiency and
production
efficiency can be improved. Note that though the middle molds 130A, 130B of
the mold structures
150D, 150E are configured so as to have the same mold surface on both sides
thereof, a plurality
of different thin plate-like laminates can be molded by forming different mold
surfaces, for
example, one is a smooth mold surface and the other is a mold surface having a
concave/convex
shape. Furthermore, the number of workpieces to be simultaneously processed is
not particularly
limited, and is preferably approximately 2 to 3 from the viewpoint of
processing accuracy, etc.
EXAMPLES
[0085]
[Thin Plate-like Laminate Production]
The thin plate-like laminates of Prototype Examples 1 to 3 were produced under
the following
conditions using workpieces in which carbon-coated stainless steel (SUS316L)
was used as the
substrate, and a mixture of a polypropylene-based resin, carbon nanotubes
(CNT), and graphite
was used as the film-like resin composition.
[0086]
[Prototype Example 11
In the setting part of the device for the production of a thin plate-like
laminate, the above
workpiece was held in a mold and a mold retention structure was created
(operation time:
Date Recue/Date Received 2021-09-17 23
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approximately 10 seconds), and after heating was performed in the heating part
at a heating
temperature of 200 C for a heating time of 120 seconds, and thermocompression-
bonding was
performed in the pressurization part with compression rollers at a pressure of
40 kN, a
pressurization time of 20 seconds, and a pressurization temperature of 200 C,
the workpiece was
slowly cooled to obtain the thin plate-like laminate of Prototype Example 1.
[0087]
[Prototype Example 21
In the setting part of the device for the production of a thin plate-like
laminate, the above
workpiece was held in a mold and a mold retention structure was created
(operation time:
approximately 10 seconds), and after heating was performed in the heating part
at a heating
temperature of 300 C for a heating time of 30 seconds, and thermocompression-
bonding was
performed in the pressurization part with compression rollers at a pressure of
40 kN, a
pressurization time of 20 seconds, and a pressurization temperature of 200 C,
the workpiece was
slowly cooled to obtain the thin plate-like laminate of Prototype Example 2.
[0088]
[Prototype Example 31
In the heating part of the device for the production of a thin plate-like
laminate, heating was
performed on the mold at a heating temperature of 300 C for a heating time of
30 seconds, in the
setting part, the above workpiece was held in the heated mold and the mold
retention structure was
created (operation time: approximately 10 seconds), and after
thermocompression-bonding was
performed in the pressurization part with compression rollers at a pressure of
40 kN, a
pressurization time of 20 seconds, and a pressurization temperature of 200 C,
the workpiece was
slowly cooled to obtain the thin plate-like laminate of Prototype Example 3.
[0089]
Regarding the thin plate-like laminates of Prototype Examples 1 to 3, the
quality of the
molding state was visually evaluated. The evaluation criteria were "Good" when
the molded part
(film-like resin layer) was acceptable as a product, and "Excellent" when it
was in a superior
condition. The results are shown in Table 1.
[0090]
Date Recue/Date Received 2021-09-17 24
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[Table 1]
Mold at Time Heating Temperature Heating Time
State
of Heating ( C) (sec)
Prototype Workpiece
200 120 Excellent
Example 1 Present
Prototype Workpiece
300 30 Good
Example 2 Present
Prototype Workpiece
300 30 Excellent
Example 3 Absent
[0091]
[Results and Discussion]
In Prototype Example 1, the mold in which the workpiece was held was processed
by gently
heating it. In Prototype Example 2, the mold in which the workpiece was held
was heated at a
higher temperature and in a shorter time than in Prototype Example 1 to
perform processing. In
Prototype Example 3, the mold, which did not hold the workpiece, was heated at
a higher
temperature and in a shorter time than in Prototype Example 1, and immediately
thereafter, the
unheated workpiece was held by the heated mold and processing was performed.
As a result, as
shown in Table 1, the thin plate-like laminate of Prototype Example 2 was able
to be molded with
a quality that does not cause any problems as a product. Conversely, in the
thin plate-like laminates
of Prototype Examples 1 and 3, the molded product was in an extremely suitable
state as compared
with Prototype Example 2.
[0092]
As can be understood from the comparison of Prototype Example 1 and Prototype
Example 2,
it was found that when the mold in which the workpiece is held is heated, a
higher-quality product
can be obtained at a relatively low temperature and with gentle heating than
with high-temperature
and short time heating. This is because in Prototype Example 2, the workpiece
is heated to a higher
temperature, together with the mold, as compared with Prototype Example 1, and
thus, the film-
like resin composition of the workpiece is more easily oxidized than in
Prototype Example 1,
whereby it is considered that quality is less likely to be improved.
[0093]
Conversely, in Prototype Example 3, by heating the mold, which did not hold
the workpiece,
and then holding the workpiece therein, a high-quality product was obtained,
as in Prototype
Example 1. It is considered that this is because the workpiece was not exposed
to a high
temperature at the time of heating the mold in Prototype Example 3, and thus,
the oxidation of the
Date Recue/Date Received 2021-09-17 25
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film-like resin composition of the workpiece was suppressed as compared with
Prototype Example
2, which enabled high-quality molding. Furthermore, since in Prototype Example
3, the mold
could be heated in a shorter time than in Prototype Example 1, operation time
can be shortened as
compared with Prototype Example 1.
[0094]
As exemplified and described above, since the method for the production of a
thin plate-like
laminate having a film-like resin layer of the present invention comprises the
steps of creating a
mold retention structure in which molds, which have been heated to a thermal
deformation
temperature of the thin film-like resin composition, are arranged on both
surface sides of a
workpiece, and introducing the mold retention structure in which the heated
molds are arranged
between two compression rollers and compressing the outer surfaces of the
molds by rotating the
compression rollers to integrally thermocompression-bond the film-like resin
composition and the
substrate to form a thin plate-like laminate having a film-like resin layer,
pressure is applied
unifointly to the molds to suppress the occurrence of pressure unevenness, and
the concave/convex
shape can be formed on the film-like resin layer laminated on the thin plate-
like substrate with
high accuracy and stability. In particular, a fine concave/convex shape can be
accurately and stably
formed one the film-like resin layer laminated on the thin plate-like
substrate.
[0095]
Note that the method for the production of a thin plate-like laminate having a
film-like resin
layer of the present invention is not limited to only the Examples described
above, and a portion
of the structure can be appropriately modified without departing from the
spirit of the invention.
In the Examples described above, regarding the step of creating the mold
retention structure in the
setting part and the heating part, though a step in which the mold is heated
to the thermal
deformation temperature of the film-like resin composition after the creation
of the mold retention
structure in which the mold in which the workpiece is held is arranged or a
step in which the mold
in which the workpiece is not held is heated to the thermal deformation
temperature of the film-
like resin composition, the workpiece is then held in the heated mold and the
mold retention
structure is created was adopted in the Examples described above, this step is
not limited thereto.
For example, a step in which the mold retention structure is created after the
mold, which is not
retained in the retention body and in which the workpiece is held, is heated,
a step in which the
mold, which is not retained in the retention body and which does not hold the
workpiece, is heated,
and the workpiece is then held in the mold to create the mold creation
structure, etc., can be
performed by an appropriate procedure as long as it is a step in which the
mold retention structure
in which the heated mold in which the workpiece is held is arranged is
ultimately created in the
setting part and the heating part.
[0096]
Date Recue/Date Received 2021-09-17 26
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Furthermore, the array combination of the setting part, the heating part, the
pressurization part,
and the extraction part of the device for the production of a thin plate-like
laminate is not limited
to only the Examples described above, but it can be appropriately configured
in accordance with
the application, the installation location, etc.
[0097]
Furthermore, though the setting part, the heating part, the pressurization
part, and the
extraction part are connected in series by the rail part provided on the
machine base of the device
for the production of a thin plate-like laminate, and the mold retention
structure is configured so
as to be capable of moving on the rail part in the Examples described above, a
rail part may not be
provided and the mold retention structure may be moved by means of a known
transfer device or
the like.
INDUSTRIAL APPLICABILITY
[0098]
The method for the production of a thin plate-like laminate of the present
invention can
unifoimly pressurize the molds to form a concave/convex shape stably in high
accuracy on the
film-like resin layer laminated on the thin plate-like substrate. Thus, it is
a promising alternative
to conventional thin plate-like laminate production methods.
REFERENCE SIGNS LIST
[0099]
10, 10A to 10H thin plate-like laminate production device
11 machine base
12 machine base leg
20 rail part
21 rail body
setting part
31 setting device
heating part
30 41 heating device
42 upper hot plate
43 lower hot plate
pressurization part
51 compression roller device
35 52 lower compression roller
53 lower rotational drive device
Date Recue/Date Received 2021-09-17 27
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54 upper compression roller
55 upper rotational drive device
56 pressurization part lifting means
57 rod part of pressurization part lifting means
60 extraction part
61 extraction device
70 cooling part
71 cooling device
72 upper cooling plate
73 lower cooling plate
80 thin plate-like laminate
81 thin plate-like substrate
82 film-like resin layer
83 film-like resin layer concave/convex shape
84, 84A, 84B film-like resin composition
85, 85A, 85B, 85C, 85D, 85E, 85F workpiece
86 workpiece edge position
100, 100A, 100B, 100C mold retention structure
101 retention body
102 side edge
103 edge part
104 lower opening
105 mold retention part
110, 110A, 110B, 110C mold
111 heated mold
112A, 112B, 112C, 112D mold
115 interleaving paper
120, 120A, 120B lower mold
121, 121A, 121B mold surface of lower mold
122 lower mold concave/convex surface shape
123 mating protrusion
125, 125A upper mold
126,126A mold surface of upper mold
127 upper mold concave/convex surface shape
128 mating hole
130A, 130B middle mold
Date Recue/Date Received 2021-09-17 28
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131A, 131B middle mold upper mold surface
132 middle mold upper concave/convex surface shape
136A, 136B middle mold lower mold surface
137 middle mold lower concave/convex surface shape
150A, 105B, 150C, 150D, 150E mold structure
H concave/convex groove depth
P1 contact position between lower compression
roller and mold
P2 contact position between upper compression
roller and mold
W1 concave/convex groove top surface width
W2 concave/convex groove inner surface width
Date Recue/Date Received 2021-09-17 29
