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Sommaire du brevet 1058350 

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(12) Brevet: (11) CA 1058350
(21) Numéro de la demande: 1058350
(54) Titre français: RESINE A DURCISSEMENT RAPIDE ET UTILISATION
(54) Titre anglais: RAPIDLY-HARDENABLE RESIN AND USE THEREOF
Statut: Durée expirée - au-delà du délai suivant l'octroi
Données bibliographiques
Abrégés

Abrégé anglais


INVENTION: RAPIDLY-HARDENABLE RESIN AND USE THEREOF
ABSTRACT OF THE DISCLOSURE
A rapid-hardening synthetic resin which also hardens at
low temperatures without the application of heat and manifested
by the features that the resin component contains an episulfide
compound having on the average more than one <IMG> group
per molecule.
The invention also concerns a method of using such synthetic
resin in construction engineering, such as building constructions,
container constructions, for producing coatings, coverings, as
adhesive, mortar, injection agent or for impregnation.

Revendications

Note : Les revendications sont présentées dans la langue officielle dans laquelle elles ont été soumises.


THE EMBODIMENTS OF THE INVENTION IN WHICH AN EXCLUSIVE
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A rapid-hardening synthetic resin which also hardens at
low temperatures in the absence of heat, the improvement comprising the
resin component containing an episulfide compound having on the average
more than one <IMG> group per molecule.
2. The synthetic resin as defined in claim 1, wherein said
resin contains an episulfide compound or a mixture of episulfide
compounds having an episulfide value in the order of 0.2 to 0.9.
3. The synthetic resin as defined in claim 1, wherein the
episulfide value is in the order of 0.5 and 0.9.
4. The synthetic resin as defined in claim 1, wherein said
resin contains a quantity of an aliphatic or cycloaliphatic amine
and which quantity is at least equivalent to the contained quantity
of the episulfide compound.
5. The synthetic resin as defined in claim 4, wherein said
aliphatic or cycloaliphatic amine is a compound selected from the
group consisting of diethylenetriamine, triethylenetetramine or
tetraethylenepentamine, or mixtures of the aforesaid compounds.

6. The synthetic resin as defined in claim 1, wherein the resin
contains an episulfide compound or a mixture of episulfide compounds, the
<IMG> groups of which are bonded by a member selected from the group
consisting essentially of bivalent aliphatic, bivalent cycloaliphatic,
substituted aryl residues or substituted aryl alkylene residues.
7. The synthetic resin as defined in claim 6, wherein said
member is interrupted by heteroatoms.
8. The synthetic resin as defined in claim 6, wherein said member
is interrupted by functional groups.
9. A method of forming a coating on a substrate which comprises
applying the synthetic resin as defined in claim 1 to said substrate.
10. A method of attaching one member to a second member which
comprises applying the synthetic resin as defined in claim 1 to at least one
of said members and then bringing said members into contact with each other,
wherein said synthetic resin is an adhesive or mortar.
11. The synthetic resin as defined in claim 9, wherein the components
of the resin are applied by means of a two-component installation in an
injection process, said two-component installation separately conveying the
resin component and the hardener component.

Description

Note : Les descriptions sont présentées dans la langue officielle dans laquelle elles ont été soumises.


: `:
.05835Q
. .
BACKG~OUND OF THE INVENTION
: . .
The present invention ~elates to a rapid-hardening resin and the
; use thereof.
Cold hardenable mixtures of epoxide resins and amines and poly-
amides containing amino groups have been used for considerable time in the
construction industry as coating substances, coverings, mortar, adhesive,
injection agent and for impregnation purposes.
The hardening time of such mixtures, in other words the time
required for the mixtures to reach a condition where they can be used is
dependent upon temperature. Generally, the hardening reaction at temperatures
, beneath about 8C proceeds so slowly that such mixtures can no longer be
employed.
;~ It has already been proposed to add to such hardenable mixtures
:,
;~ compounds which accelerate the hardening reaction.
,
'; What is disadvantageous with this proposal is that the accelera-
tor, which is not consumed during the hardening reaction, unfavorably affects
the use properties of the hardened mixture, for example, the surface hardness,
the resistance against the affects of water and chemicals and the mechanical
:. . . .
strength, and thus such accelerators can only be added in limited quantities.
Hence, the possibility of using the hardenable mixture containing the
~; accelerator is limited to temperatures above about 5C, and furthermore,
~;~ since most of the accelerators are toxic soluble compounds, it should be
` apparent that epoxide resins containing accelerators generally cannot be used
~' in the construction of swimming pools or drinking water installations. ~;
~;, .
,~ At temperatures between 5C and 10C there are employed so-
;~ called highly reactive epoxide resins which, however, at temperatures exeed-
ing 10C no longer can be used since their processing time is too short for
, proper application.
., .
: OBJECTS OF THE INVENTION
It is therefore a primary object of the present invention to
provide a rapidly hardening synthetic resin which is not associated with the
aforementioned drawbacks and limitations.
~' '
'
',:
.
: . . . .:~ . . .
,- , ~ . : ~ : : : , ~ .. :.

lOS8350
Another object of the invention is directed to a method of
using such new and improved synthetic resin for different purposes,
especially in construction engineering. -~
DETAILED DESCRIPTION OF THE INVENTION
.,
According to the present invention, there is provided a rapid-
hardening synthetic resin which also hardens at low temperatures in the
absence of heat, the improvement comprising the resin component containing -
an episulfide compound having on the average more than one -CH - CH2 -
group per molecule.
Preferably said resin contains an episulfide compound or a
mixture of episulfied compounds having an episulfide value in the order
of 0.2 to 0.9.
In another aspect, there is provided a method of forming
a coating on a substrate which comprises applying the synthetic resin
to the substrate.
In particular, it has been found that episulfide compounds
containing on the average more than one -CH - CH2 - group per molecule with
stochiometric quantities of amines preferably with aliphatic or cyclo-
aliphatic amines, harden while forming products which can be rapidly loaded
20 and without the need to add heat to such mixture. -
It has been further found that episulfide compounds markedly
accelerate the hardening of epoxide resins by means of amine hardeners at
low temperatures as a function of their dosage.
The episulfide compounds or mixtures of episulfide compounds
used according to the invention can be produced, for instance, according to
the process which has been patented in DRP No. 636,708 (German Reichspatent
636,708) in 1934 and disco~ered by K. Dachlauer and L. Jackel, from epoxide
compounds by reaction with thiocyanates, sodium thiosulfate, thio-urea or
by reduction of chloropolysulfides with Al-amalgam (French patent 1,428,686).
~he episulfide groups of the inventive employed episulfide
~ .
r - 2 -
. '. "
- : ~ : .

1(~58350
compounds can be possibly bound by heteroatoms, especially oxygen, or func~
tional groups, such as ester-, urea-, urethane-, or amide-groups of
aliphatic-, cycloaliphatic-, possibly substituted aryl - or possibly sub-
stituted aryl alkyl-residues.
The polyamines used for hardening the episulfide resins are
preferably cycloaliphatic and aliphatic polyamines or mixtures of such
amines with amines containing aryl- or substituted aryl alkyl-residues.
The increased reaction capabilities of episulfide compounds in
contrast to the corresponding epoxide compounds is known to the art and
has been discussed in detail for instance by P. Sigwalt in an article
entitlcd "Ring- ~pening Polymerization", Marcel Dekker publishers,
New York, 1969 page 191. The behavior of polyepisulfide compounds in :.
contrast to nucleophilic coreactants has been described, for instance, by
P. Penczek et al in
- 2a -
,h ~
, .
,
,: . , ' :"i . ~ '

1058350
"Plaste und Kautschuk", 20 (3)! 176 (1973). These authors have found, among
other things, that polyepisulfides with catalytic quantities of nucleophilic
coreactants gell m~re rapidly at temperatures in the order of 24C and SOC
than the corresponding epoxide resins. The hardening of polyepisulfide com-
pounds by means of nucleophilic coreactants in the presence or heat con-
stitutes the subject matter of United States patent 3,378,522, granted in
1968 to R.W. Martin.
On the basis of these experimentations it can be assumed that
the inventively employed episulfide compounds modify the course of the
reaction between an epoxide resin and a polyamine. It has been found from
kinetic tests that polyepisulfide compounds initially react with polyamines
and that the reaction products formed by such reactions either react with
other polyepisulfide molecules or with polyepoxide molecules, and such
reaction proceeds quicker than the reaction between a polyepoxide compound
and a polyamine. It could also be shown that the episulfide compound alone
in the prescribed dosage does not essentially accelerate the hardening of an
epoxide resin by an amine hardener.
It is therefore possible to previously admix any given amine
hardener, for instance an aliphatic or a cycloaliphatic amine or mixture of
such amines such that the stochiometric conditions are maintained, and to
add the episulfide compound, prior to application of the system, in such a
dosage that there is obtained a hardenable mixture which at a certain tempera-
ture possesses the processing time and hardening time respectively, for the
intended purpose of use. In this way it is possible to control the degree
of the hardening acceleration by means of the dosing of the episulfide com-
pound throughout a wide temperature range, for instance between -30C and
+10 C .
The inventive episulfide resins are characterized by the features
that they together with amines at a temperature of 20C gell and harden ~ -
3Q within one minute.
The amines which are preferred for the hardening of such epi-
sulfide compounds are aliphatic or cycloaliphatic amines, which can be
-- 3 --

~058350 t
employed alone or in mixture with another polyamine or polyaminoamide, for
instance with aryl- or aryl alkyl-residues.
Since the inventively employed episulfide compounds are them-
selves consumed during the hardening reaction, there is formed therefrom
an amine hardener insoluble product, so that the rapid hardening resins or
resin mixtures of the invention additionally fulfill the regulations concern-
ing toxicity.
The inventive episulfide compounds or their mixtures with epoxide
resin possess a low viscosity, thereby facilitating the admixing of the
components at low temperatures.
The inventive episulfide compounds or their mixtures with epoxide
resins can be employed without or with added substances or additives, such
as fillers, pigments, plasticizers, extenders and auxiliary substances or
adjuvants, such as surface-active agents, leveling agents, wetting agents,
delustering or dulling agents, for instance as paint coats, coatings, cover-
ings, adhesive, mortar or injection agent.
They are particularly suitable for processing with a so-called
two-component or dual-component installation which separately conveys the
resin components and the hardener components, for instance in injection pro-
cesses, and reinforcing materials such as fabrics or fibers can be employed.
The invention will be further explained on the basis of the
following examples. Testing of the chemical resistance was undertaken in
accordance with the procedures of DIN 51958 (the symbol DIN representing
German Industrial Standards) and the Brinell hardness according to DIN 50351).
Example 1
The following Table 1 shows the chemical resistances of an
episulfide compound/TETA systems, the symbol TETA representing triethylene-
tetramine. A stochiometric mixture of an episulfide compound with the epi-
sulfide value 0.70 and TETA, which gelled at 18C within approximately 1
minute, was applied by means of a dual component spray gun in the form of a
film having an average thickness of 200 ~. After hardening for 1 hour and
24 hours at 18C the film was loaded with the chemicals listed in Table 1 and
-- 4 --
.. , : : :
.. . , : : - .: ~ :

10583S0
after 24 hours visually checked.
In Table 1 presented hereinafter the following symbols are
intended to have the following meanings:
The symbol "A" means that the film is resistant to permanent
contact, i.e., the film surface remained absolutely unchanged.
The symbol "B" means that the film is temporarily resistant to
permanent contact, i.e., visual inspection thereof revealed slight discolora-
tion of the surface.
The symbol "Z" means that the film is not resistant to permanent
contact, i.e., the film was destroyed.
Table 1
Episulf de Resin Epoxy lesin
1 Hr 24 Hrs. 1 Hr. 24 Hrs.
.. .. -.
Concentrated Z Z Z Z
hydrochloric acid `
Hydrochloric acid 10% Z Z~ Z Z
Concentrated sulphuric acid Z Z Z Z
Sulphuric acid 10% Z Z Z Z
Nitric acid 10% Z Z Z Z
Acetic acid 5% B B Z Z
Caustic soda 50% A A Z Z
Sodium carbonate A A Z Z
solution 2% _
Acetone A A Z
. ;.
Diethyl ether A A Z_ Z
_
Ethyl acetate A A Z Z
Ethanol A A Z Z
Methanol A A Z Z
__ ~
Chloroform A A Z Z
Methylene chloride B A Z Z
Premium gasolene A A Z Z
Benzol A A Z Z
Heating oil CDIN 51507)
' . . , ,:, ' ~' '

` -" ` lOS8350
Example 2
Table 2 illustrates the mechanical loading capacity of a coating
formed on the basis of the episulfide compound of Table 1 and TETA as the
hardener. The Brinell hardness was measured after hardening at -20C, +5C
and +20C.
Table 2 (Brinell Hardness kp/cm )
. ~ .
Episulfide Resin Epoxide Resin
_ . . _
~emPerature -20C +5C +20C -20C +5C +20C
30 Minutes _ ~ 930 _ _ ;~
45 Minutes 350 500 960 ~ ~ _
_0 Minutes 940 950 960 _ _ _
. __ , _
90 Minutes 950 950 960 _ _ _ -~
. . ,-:
180 Minutes 980 1000 1050 _ _ _ ;
72 Hours1 loo1 lOo lloo 300
. ~ .
Example 3
The following Table 3 shows the accelerating influence of the
inventive combination of episulfide compound and ethylene amine upon the
hardening of an epoxide resin of bisphenol A-type by means of an amine
hardener. The mixing ratio of resin:hardener is 4:1 parts by weight, the
amine hardener contains 10% by weight triethylenetetramine (TETA~ and the
resin component the quantities of episulfide compounds having an episulfide
value of 0.78 and which quantities are set forth in Table 3 below. -
Table 3
.
Inventive Without
Mixture _ Episulfide Compounds
Epoxy Resin 80 80 80 80 ~ 100 100100 100
(parts by wei~ht)
_ . .
Amine Hardener 20 20 20 20 20 20 20 20
(parts by weight~
Episulfide compound 20 20 20 20 _ _ _ _
(parts by weight)
_
Temperature CC)+10 +5 0 -5 +10 +5 0 -5 :
_
Processing Time 8 12 15 30 120 600
(minutes )
_ . . _ "
-- 6 --
. . .
, . .. .. : , .. .
.

```~ 1058350
Example 4
Table 4 given hereinafter illustrates the influence of the dosing
of the episulfide compound of Table 3 upon the hardening speed of the resin-
hardener-mixture also employed in Table 3. The amine hardener contains 10% ,
by weight TETA.
Table 4
Episulfide Resin 30 20 15 10
~parts by weight) ~
Temperature (C) 0 0 0 0 -
Processing Time 8 15 18 30
(minutes )
Example 5
The following Table 5 illustrates the influence of the dosing
of the ethylene amine (DETA) upon the hardening speed of the epoxide resin-
amine hardener mixture used in Table 3, wherein the epoxide resin component
contains 10% by weight episulfide compound with an "episulfide value" of 0.60
and the hardener component contains the quantities of DETA given in Table 5.
Table 5
Delta 5 8 10 12
Temperature (C) 5 5 5 5
Processing Time
(minutes) 28 20 15 12
Example 6
The following Table 6 illustrates the development of the Brinell
hardness at a temperature of 10C and -5C for a non-accelerated and an
accelerated resin-hardener-mixture. There was produced a respective 100 g
mixture of an aliphatic epoxy resin and an amine hardener in a ratio of 3:1,
wherein the accelerated resin component contained 25% by weight of the
episulfide compound of Table 3 and the accelerated resin component 15% by
weight TETA.
-- 7 --
. . . ~ ,

~`` 1058350 :`
Table 6
. . .
Te erature ~Cl 10 -5
mp
Brinell Hardness lO 50 lO0 lO 50 lO0
~kp/cm ) after hour
Accelerated 3601180 1250 230 780 1050
Non-Accelerated 20 93 220 + o + 0 + o
Example 7 `~
Table 7 given hereinafter illustrates the influence of the epi-
sulfide compound of Table 3 upon the viscosity of an epoxide resin and the
possibility through the addition of an inventive episulfide compound to an
epoxy resin of stepwise lowering its viscosity. The viscosities were measured
at 20C + 1C by means of a reometer. The epoxide resin is bisphenol A-type.
Table 7
~Episulf de percent by w g ~ ~ ~ 1000 ~ 700 ~ 450 ~ 100
It will be understood that while the invention has been des-
lOcribed specifically with reference to certain embodiments thereof, various
changes and modifications may be made, all within the full and intended scope
of the claims which follow.
- 8 -- -

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Accordé par délivrance 1979-07-10

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Description du
Document 
Date
(aaaa-mm-jj) 
Nombre de pages   Taille de l'image (Ko) 
Dessins 1994-05-01 1 6
Abrégé 1994-05-01 1 23
Revendications 1994-05-01 2 52
Description 1994-05-01 9 332