Note : Les descriptions sont présentées dans la langue officielle dans laquelle elles ont été soumises.
This is a divisional application oE copending Canadian
application Serial Number 382,051, filed July 20, 1981.
FIEID OF I~E ~NVrh~TION:
This invention relates generally to electrical assemblies and
pertains more particularly to assemblies for interconnecting electronic
packages and com~onents with support substrates.
B~CKGROUND OF THE INV~2~rION:
. _ . ... _
In recent years, the electronics industry has looked increasingly
to so-called "stacking" of chip carriers and the like to meet information
density requirements. Such practice, wherein plural packages overlie
common printed circuit board (PCB) real estate, provides a doubling or
m~re of infor~ation density, for example, ~emory capability~
Known efforts in this area, preceding that set forth in
Canadian Patent 1~139J386r had looked to the stacking of chip carriers
and dual-in-line packages (DIP) and had provided receptacles having
contacts insertable in PCB apertures for soldering thereto and extending
upwardly from the PCB to Erictionally receive and engage contacts of
packages inserted into the receptacles.
Where it was desired to employ the stacked packages electrically
independently of one another, the art preceding -the '386 patent had
looked to several measures for separately addressing the packages.
Typically, the contacts of the stacked packages were vertically aligned
and circuit paths to the PCB would be redundant -to -~le stac]sed packages
for contacts thereof not involved in package selection. Thus, a single
receptacle contact would engage vertically successive package contacts.
On -the other hand, a unique circuit path is required from -the PCB
to each package contact providing selec-tion or activation of a package.
In one
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1 know~ prior approach, receptacle con~acts were provided
with break-away portions, whereby one would interrup-t
continuity from the PCB to an upper package contact or
a lower package contact/ despite vertical alignment
thereof. In another known prior approach, package
selection contacts were led from ~he receptacle ofE-
board and were.tilus not available at the PCB as were
all other package contacts. In still another prior
approach, packages were customized to provide for
vertically unaligned select/address contacts.
. While stacking presents little user dif~iculty
where the stacked packages are used electrically depen-
dently in parallel circuit relation to the PCB~ user
difficult~ is seen in ~.he alternative situation wherein
~5 vertical address/select differentiation is required. In
the first known prior approach discussed above~ bypassing
of one of two verticall~ aligned package contacts pre-
sented a problem in later accessing such bypassed con-
tact from the PCB. Thus, one needed t~-define another
usable circuit path, for example, from the bypassed
package contact to an-unused package contact and thence
to the RCB through a recep-tacle.co~tact servicing the
unused package contact~ In the second discussed prior
approachr the of~-board disposition o~ address/select
packa~e contacts precluded accessiny from the PCB~ The
last noted prior approach required the tailorins OL
package contact layout to the receptacle contacts and
accordingly did not lend itself to standardiæation
permitting commercial package substitution. Finally,
~0 all of the known approaches pricr to the 1386 paten-t
adopted frictional contact interfitting and did
not meet zero insertion force applica-tions.
In the '386 pa-tent, applican-ts herein
set forth a receptacle for supporting electronic
packages :in stacked relation and providin~ electrical
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1 connec~ion to package contacts without the disadvantages
of the prio~ appro~ches. Such receptacle has an
upstanding housing defining a channel and supports
received packages in vertically spaced relation in the
channel. Contacts a~e supported in the housing in
verticall~ spaced relation and in noninterering dis-
position with respec~ ~o ~he channel~ An actuator is
supported in the housing for d.:isplacing the contacts
from such noninterfering di.sposi~ion with respect to
the channel into engagement with contacts of the pack-
ages ~ As is se~ forth in more deta~l below, the '386
receptacle includes movable support means for the upper
stacked package and provides selective spaci~gs of
contact sets to facilitate accessing of the pacXages.
The objective of using common PCB real es tate
for plural packages, as noted above, is reached by the
~386 receptacle with zero insertion force and other
benefit. The present invention addresses a furthex
~nhancement in PC~ real estate usage, namely, disposition
of electronic components which are accessory to elec-
txonic packages stacked in receptacles. As an example
of such an accessory componen-t, a decoupling capacitor
typically is used for each separa-te voltage level
supplied to a DIP. Presently, such capacitors are dis-
posed on PCBs as sole consumers of PCB real estate,
adjacent the DIP which they serve and are connected to
PCB strips in turn electrically connected to package
receptacle contacts.
SUMMARY OF THE INVENTION:
It is an object of this invention to provide
for enhanced PCB real estate usage
A more particular object of the inventi~n is
to provide for common PCB real esta-te usage for elec-
tronic packages and components accessoxy ~he.reto~
3~
A still more specific ob~ect of the invention is to provide
assemblies interconnecting one or more electronic packages to PCB and
like support substrates and having capaci-tive decoupling capability.
In attaining the foregoing and o~her objects, the inven-tion
provides an assembly having a receptacle commonly housing koth an electronic
p~c~age and a com~onent accessory there-to, both electrically cormected -to a
co~mon electrical contact extending from the recep-tacle. In its preferred
embcdiment, the invention is shown in usage of the '386 receptacle, expanding
same -to provide integrally housed capaciti~e decoupling means.
Therefore, in acoordance with the present inverltion there is
provided in an electrical assembly of the type including an electrical
package ~aving a row of contacts, accessory com~onent means Ln electrical
interconnection with t~he package contacts, comprising. a substrate of
insulative material, a plurality of spaced conductive strips on the
substrate and an electrical component supported by the substrate and
electrically connected to selected conductive strips; and plural ear
portions each including a portion of one of -the selected conducti~7e
strips, project~lg outwardly from one side edge of -the substrate at spaced
locations and defining therebetween an open region within which reside
contacts of the package tha-t are not connected to the componen-t ~eans,
the ear portions being electrically connected to selected contacts in
the row that are no~ adjacent to each other.
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DESCI?IEYI'ION OF ~IE DR7~WINGS:
Fig. 1 is an exploded perspec-tive vlew of an interconnect
assembly in acoordance wi-th the present application shc~Jn above a PCB
for use wi-th the assembly.
Figs~ 2(a)-2~f~ are side and front elevations of diverse
receptacle contact configurations for the Fig. 1 receptac]e.
Figs. 3(a)-3(c~ are side and front elevdtions of con-tact
actuators of the Fig. 1 recept~cle.
Fig. 4 is a front elevation of the housing of the Fig. 1
receptacle.
Fig. 5 is a top plan view of the Fiy. 4 housing.
Fig. 6 is a side elevation of the Fi~. 4 h~using.
Fig. 7 is a sec-tional view as seen from plane VII-VII of Fig. 5.
Fig. 8 is a sectional view as seen frcm plane VIII-VIII oE Fig. 5.
Figs. 9 and 10 are sectionkal views illustrating actuator-contact
relations for the lower contacts of the Fig. 1 receptacle and omit-ting
capacitive decou~ling asse~ly 100 of Fig. 1.
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1 Figs. 11 and 12 are sectional views illustrating
actuator~contact rela~ions for the upper contacts of
the Fi~ 1 receptacle for convenience.
. Fig. 13 is an expl.oded view showing the posi-
.tional registration o. recep~acle contacts and a PCB
strip o~ capacitive decoupling assembly 100 o~ Fig. 1.
DESCRIPTION OF THE PREFERRED EMBODIMENT:
~ eferring to Fig. 1, interconnect receptacle 10
includes housing 12 having elongate channel 14 extending
between open ends of the housing and bordered by
housing interior sidewalls 16 and 18. The channel is
of top-open type to facilitate vertical insertion of
electronic packages or components to be stacked within
housing 12. O~enings are formed in bottom surface 20
of housing 12 for insertion of contacts 22 and 24
respectively into registry with lower contact slots 26
and upper contact slots 28. For purposes discussed in
detail belowr each upper contact slot has an expanded
portion 30 for receiving upper component support insert
32. ~ower component support is provided by interior
base surfaces 34 and 36. Chamfered ~uides 38 lead from
surfaces 34 and 36 into lower contact slots 26 to guide
leads of the lower electronic component into registry
with lower contacts 22.
Housing top surface openings 40 and 42 are
continuous respectively with lower contact slots 26 anc~
uppex contac~ slots 28. Actuators 44 ~lower contact)
and 46 (upper contact~ are supported in common by plate
48 for respective entry into openinc3s 40 and 42 and
vertical movement in slots 26 and 28.
Upper contact slots 28 are uniformly spaced
on centers by distance dl lon~itudinally along channel
14. Like spacing dl is provided between centers o lower
contact slots 26~ A longitudinal offset distance d2
exists between re~pective centers of each lower slot 26
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1 and each adjacen-t upper slo-t 2%, spacing d2 being one-
half o* spacing dl With spacing dl also a~plying
between adjacent apertures 50 of pxinted circuit board
52, the Fig. 1 arrangement provides vertical nonalignment
of upper and lower receptacle contacts, while permittin~
access to both such contacts between successive PCB
apertures. To this end, contact coniguration 54
supports lower contact 22 ~ointly with upper contact 24
with center spacing d2 and stem 56 provides PCB connec-
tion for both contacts. Contact con-figuration 58
supports only a lower con~act 22 and stem 60 provides
PCB connection there~or. Contact configuration 62
differs by supporting only an upper contact 24 and has
its stem 64 offset to the opposi~e side of -the contact,
all such contact configurations being illustrated in
Figs. 2(a)-2~f) in de~ail showing these similarities
and differences.
Contact configuration 54 is used throughout
or collectively bringing to the PCB those package
contacts not involved in address/select function. Con-
tact configuration 48 is used to access the lower com-
ponent received in receptacle 10 and contact configuration
60 is used to access the upPer co~ponent received in
receptacle 10. PCB 52 is com~lemental to receptacle 10,
and vice versa~ with quite slight departure -from customary
PCB geometry ~or receiving a single DIP. Thus, board
apertures 50 may run in t~`70 Parallel rows wîth uniorm
spacing. An additional aPerture 66 is formed in the
PCB, at longitudinal spacing d2 from ad~acent apertures
50, for upper component accessing. In instances where
one ma~ look to stacking dynamic com~onents, e.g., where
read/write access stroke~ are ne ded for each package~
a further aperture 68 may be formed outboard of apertures
50 and longitudinally staggered witn respect thereto, as
in the case of aperture 66. ~5 wi11 be seen, all of
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1 apertures 50, 66 and 68 are inboard of the perimeter
of receptacle 10 when the PCB and recep-tacle are
assembled.
Capacitive decouPling asse~bly 100 is adapted
for integral containment by receptacle 10 and includes
board or substrate 102 having projecting ears 104, 106,
108 and 110, electrically conductive strips 112l 114,
116 and 118 and capacitors 120, 122 and 12~. The
capacitors have first terminals 126, 128 and 130 and
second terminals 132, 134 and 136. ~s indicated, con-
ductive strip 112 is in registry with each of caPacitor
first terminals 126, 128 and 130. Strips 114, 116 and
118 are in separate regis~ry wi-th ca~acitor second
terminals 136, 132 and 134. In this exemplary accessory
component: showing, it is assumed that three diverse d.c.
voltage levels are supplied to the ~ackages in the
receptacle~ to be decoupled indlvidually by the three
capacitors. As will be shown below 5Fig. 13), board 102
will be disposed flush with bottom surface 20 of housing
112, with the capacitors received i.n openings in surface
20 and recesses .n housing 12.
Housing interior structural detail is seen in
Figs~ 4-8. ~he housing is upstanding from eet 70 and
has transverse base ribs 72-78 extending between interior
sidewalls 16 and ~8, openings/recesses 80-84 existing
between the xihs for receipt of accessory components
therein, e.g.~ capacitors 120~124~ Fig. 7 shows housing
12 sectionally through uoper contact slots 28 and illus
trates openings 86 for insertion of contacts. Fig. 8
shows housing 12 sectionally through lower contact slots
26. O~enings 86 of Fig~ 7 are also seen in Fig. 8~ as
such openings bridge slots 26 and 28 whereby a contact
of configuration 54 of Fi~. 2(a) may be inserted with
its contacts 22 and 24 seating in slots 26 and 28.
Openings 86 likewise p_rmit insertion of contacts oE
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1 configuration 58 of ~ . 2(c) in slots 26 and contacts
of configur~tion 62 of Fig. 2(3~ in slots 28. Con-tact
retainers 88 ~Fig. 8) removablv secure the contacts in
housing 12, ~he contac~s ~eing Provided wlth locking
tangs (not shown) for frictional engagement with the
retaîners and interior housing structure.
Referrinq to Figs~ 3(a3-3(c~, lower contact
actuator 44 has a horizontal flange 44a for securement
to plate ~8 of Fig. 1, a vertical run 44b, a knee 44c,
an inclined run 44d and a further vertical run 44e in
spaced parallel relatio~ to run 44b. Wpper contact
actuator 46 has a horizontal flange 46a, a first vertical
xun 46b, an u~per knee 46c, an upper inclined run 46d,
a second vertical run 46e, a lower inclined run 46f, a
lower kn~e 46g and a third vertical run 46h. The
operation of the actu~tors u~on respective lower and
upper contacts will now be discussed in con~unction with
Figs. 9~12~
. In Fig. 9, lower component package 90 is shown
inserted in channel 14 of housing 12 with package con-
tact 92/ in dependen~ leg form as for a DIP, seated in
guiae 38. Vertical posi~ioning and support for the
package is established by support surface 34. In the
course of package insertion, actuator 44 is moved ver-
tically uPward of its Fig. 9 Position, i.e,l above andout of engagement with contact 22, whereby the contact
is self-biased leftwardly of its Fig. 9 position and
insertion of package contact 92 is attained wlth zero
insertion forceO In the Position of actuator 4~ in
Fig. 9, following package insertion, contact 22 is forced,
b~ engagement with actuator inclined run 44d, into elec-
trical engagement with ~ackage contact 92~ In Fig. 10,
actuator 44 is in fully inserted position, as will be
the case (discussed below~ when an upper component
package .is electrically engaged in the housing and all
actuators ar~ fully 1nserted in the housing. In this
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1 Fig. 10 actuator position, contact 22 is cn~age~ by
actuator vertical run 44b which is forced rightwardl~
in slot 26 by reason of housing restraint on snaced
vertical run 44e. The inserted extent of package con-
tact 92 is captured against housing extent below surface34 and guide 38 by contact 22 pressure thereon.
Following insertion of lower component package
90 into housing 12, sup~ort inserts 32 (Fig. 11) are to
be displaced outwardly of exPanded portions 30 of upper
contact slots 28 to provide vertical positioning and
support for upper component package 94. This may be
done, prior to insertion of package 94, b~ downward
movement of actuator 46 from its position shown in
Fig. 11. Such movement forces actuator inclined run 46d
into slc)t 28, urging contact 24 leftwardly against wall
32a of insert 32 and dis~lacing the insert outwardly.
Insert wall 32b bears against ac-tuator vertical run 46e
to precisely measure insert displacement into such
position as to underlie package 94 and sit le~twardly
o~ package contact 96 on package insertion. Actuator
4~ is now elevated to slightly above its Fig. 11 posi-tion
whereby contact 2d retuxns, under sel~-bias, to non-
interfering relation to the zero ~orce insertion path
of package contact 96. On package 94 insertion, actuator
46 is moved downwardly through its Fig. 11 position,
whereupon contact 24 electrically engages packa~e conkack
96, and into its Fig. 12 position. In such fully
inserted position, actuator ~ertical runs 46h bears
a~ainst the base o contact 24 and its vertical run 46e
3~ bears against the rightward slot wall. This disposes
actuator knee 46c against contact 24, compressing same
against package contact 96.
Referring again to Fig. 1, in assembling
receptacle 10/ inserts 32 are first placed in expanded
35 portions 30 o upPer contact slots 28. Contactt. are
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1 next inser~ed through the receP~acle bottom sur:Eace and
inserts 32, contact configuration being preselected in
the three diverse varieties in accordance with the
nature o-f the componen~ packages to be received and
PC~ connections desired. On insertion of ~he actuators,
the receptacle is readied for package insertion.
Based on the difference in configurations of
actuators 44 and 46, upper package removal and suh-
s~itution may be made at any time without interru~ting
electrical continuity between the lower package and
the PCB. As depicted in Figs. 11 and 12, vertical
spacing is prescribed as between inserted ~ackages 90
and 94j chann~l 14 remaininy fully oPen in such inter-
package ~olume~ Connection to PCB is readily made
wihtout packages inserted/ thus isola~ing the packages
from soldering heat and the like. As noted above,
desired zero insertion force is afforded by selective
actuator positioning.
The rece~tacle housing is Preferably comprised
of molded plastic. The actuators and upper package
support inserts ma~ also be o~ rigid syn~hetic matter,
but are pre~erably metal. Contacts may be noble metal-
plated, based on zero insertion forceO
Reference is now made to Fig. 13 t~ compleke
discussion of the exemplary assembly herein. CaPacitive
decoupling assembly 100 is shown in exploded fashion
with receptacle 10, set downwardly therebelow to show
the intellded reg.istry of ear 104 of board 102 with
receptacle end contact 54. As will be seen, as board
102 is elevated i.nto ~lush relationship wi~h bottom
surface 20 of housing 12~ contact land 56a and stri~ 112
are placed in registry, to be elec~rically interconnected9
as by soldering or the like. In this arrangement, as
seen by re~erence again to Fig. 1, such end contact 56
is connected in common, through strip 1l2, to ground
te~minals 126, 128 and 130 of capacitors 120, 122 and
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~ AM-2
1 124u Ears 106, 108 and 110 of Fig. 1 are similarly
disposed in registry with other receptacle contacts and
s-~rips 114, 116 and 113 are electrically connected
thereto whereby capacitors 120, 122 and 124 are connected
individually between ground and such o-ther receptacle
contacts to affect capacitive decoupling of d.c~ voltages
applied from ~he PCB to such other r~ceptacle contacts.
While the described assembly embodiment is
inclusive of plural electronic packages, a single re~
ceived package may of course be assembled with zero
insextion force in a single level receptacle also having
an integrally packaged accessory component. In this
connection, receptacle 10 above will be seen as fixedly
supporting a first portion of contacts 56, i.e., lands
56a, for selective connection to the accessory component.
The remainder of contacts 56 may be considered as second
portions vertically sPaced from such first portions and
are supported by the receptacle for electrical engagemen~ I
with the package contacts. As will also be seen, the
assembly is highly ventilated as the receptacle ends
and top are ully open and airflow between packages and
accessory com~onents is permitted ~y the spacings ~ro- I
vided therebetween.
Various modifications to the foregoing particu-
larly set forth embodiment of the invention will now beevident to those skilled in the art. ~ccordingly, such
preferred embodiment and the foregoing discussion thereof
are intended in an illus-trative and no~ in a limiting
sense. The true spirit and scope o-f -the invention is
set ~or-th in the following claims.
Embodiments disclosed in this divisional
application are also disclosed and claimed in copending
Canadian applicatlon Serial Number 382,051.
