METHODE DE FABRICATION DE BLOCS DE REUNION

METHOD OF FORMING A BUSSING BLOCK

Abrégé anglais

ABSTRACT
A method of forming a bussing block having
wafers stacked one on top of the other and including
apertures which are in alignment with each other. Buss
bars are carried on the wafers and have apertures aligned
with the apertures in the wafers. Electrically insulating
collars extend from selected ones of the wafer apertures
so that when electrical terminals are inserted through
all of the aligned apertures of the wafers and buss bars,
the electrical terminals will be electrically isolated
from the buss bars by the collars.

Revendications

The embodiments of the invention in which an exclusive
property or privilege is claimed are defined as follows:
1. A method of forming a bussing block comprising:
1) providing a plurality of wafers, each of
said wafers including a plurality of first
apertures, and electrically insulative collars
extending from each of said wafers around said
first apertures,
2) providing a plurality of electrical buss
bars, each of said buss bars having a plurality
of second apertures therein and spring tabs
extending into said second apertures,
3) removing selected ones of said collars,
4) removing selected ones of said spring tabs,
5) assembling said electrical buss bars on said
wafers such that those of said second
apertures having their spring tabs removed fit
around the remaining collars, and
6) stacking said wafers with said buss bars
one on top of the other such that all of said
first and second apertures are aligned.
2. A method of forming a bussing block comprising
1) providing at least one wafer having a
plurality of first apertures, and electrically
insulative collars extending from said
one wafer around said first apertures,
2) providing a plurality of electrical buss
bars, each of said buss bars having a plurality
of second apertures therein and spring tabs
extending into said second apertures,
3) removing selected ones of said collars,

4) removing selected ones of said spring tabs,
and
5) assembling said electrical buss bars on said
one wafer such that those of said second
apertures having their spring tabs removed
fit around the remaining collars.

Description

I
This invention pertains to a method of forming
a bussing block, and more particularly a husking
block which can be readily integrated with a terminal
block for a timing mechanism.
Timing mechanisms are used to control the
operation of appliances such as dryers, dishwashers,
and washing machines by opening and closing electrical
switches, which are opened and dosed, are comprised
of movable and fixed contact blades the ends of
which are integral with or serve as electrical terminals.
The electrical terminals are carried by -terminal
blocks in some sort of spaced relationship. Depending
upon the desired operational sequences, the electrical
terminals are sometimes electrically connected in
accordance with a predetermined pattern by some sort
of bussing means. The bussing means, which are normally
thin strips of electrically conductive Motorola,
are usually carried by bussing blocks.
It is highly desirable that such bussing
hocks be a unit in and of itself which may he easily
connected and disconnected from the timing mechanism
or terminal block such that a programmed sequence
can be readily changed. Also if -there are many bussing
means to be us edit is essential that the bussing
means be electrically insulated from each other.
Moreover, means should be provided to readily allow
the bussing means to be positioned according to a
desired pattern.
Accordingly, the present invention is directed
to a method of forming a bussing block which in general
comprises at least one wafer, first apertures in
the wafer, electrical bussing means carried on the
wafer and including second apertures in alignment

with the first apertures, electrical terminals extending
through the first and second apertures, and electrical
insulating means separating the bussing means from
selected ones of the electrical -terminals.
According to a further broad aspect of
the present invention, there is provided a method
of forming a bussing block and which comprises a
the steps of providing a plurality of wafers, each
of which includes a plurality of first apertures
and electrically insulative collars extending from
each of the wafers around the first apertures. A
plurality of electrical buss bars are also provided
with each of the buss bars having a plurality of second
apertures therein and spring tabs extending in-to
the second apertures. The method comprises also
removing selected ones of the collars and selected
ones of the spring tabs. The electrical buss bars
are assembled on the wafers such -that those of the
second apertures having their spring tabs removed
fit around -the remaining collars.
According to a further broad aspect, there
is provided the additional step of stacking the wafers
with -the buss bars one on top of the other such that
of the firs-t and second apertures are aligned.
Figure 1 is an exploded view of a bussing
block showing the features of the invention in combination
with a terminal block.
Figure 2 is an exploded isometric view
of the terminal block in combination with electrical
terminals used in the block.
Figure 3 is a view taken along the line
3-3 of Figure 2.
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I
referring to the drawings, there is shown
a bussing block 10 as used in combination with a
terminal block 12. Terminal block I includes a
block 14 through which a plurality of electrical
terminals 16 extend, -the electrical -terminals including
electrical contact blades 18 and 20 with -their electrical
contacts 22.
Bussing block 10 includes a plurality of
wafers 24, 26 and 28, each having apertures 24',
26' and 28' provided therein, and buss bars typically
shown at 29, 30, 32, 33 and 35. As shown, wafer
24 has sidewalls 36 extending therefrom which capture
and hold wafers 26 and 28 during assembly. It is
understood that as many wafers as are needed can
be used. Typically of all the buss bars, buss bars
29, 30 and 32 include apertures 29' t Andy 32'. The
buss bars, as better shown in Figure 3, lie flat
on wafers 24, 26 and 28. The wafers are all fabricated
from a suitable electrically insulative material
such as plastic while the buss bars as well as electrical
terminals are fabricated from a good electrically
conductive material such as copper.
As best shown in figure 2, selected ones
of the apertures in the wafers have collars I extending
from their peripheries -to provide an electrical insulating
means between electrical terminals 16 extending -through
the apertures and the buss bars. The collars are
also fabricated of plastic. As shown in Figure 2,
spring tabs 38 extend into the apertures of the bussing
bars.
Jo

Prior -to assembly, collars 34 are removed
at selected ones of the apertures in the wafers and
enlarge the apertures 26" and 28", for example.
In addition, spring tabs 38 are removed in the apertures
of the buss bars corresponding to the remaining collars
to permit the apertures of the buss bars to fit
around or accommodate -the collars where electrical
bussing is not desired. When assembled, each wafer
with its buss bars carried thereon are stacked one
on top of the other. Referring to Figure 3, when
electrical terminals 16 are inserted through the apertures
of the wafers, those going through the collars 34
will be electrically isolated from the buss bars,
while those terminals going through the apertures
without the collars will deflect the spring tabs
38 of the buss bars causing them to bear against
the terminals to provide a positive electrical connection
between the terminals and the buss bars.
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