Note : Les descriptions sont présentées dans la langue officielle dans laquelle elles ont été soumises.
~- 20~6338 Docket P-2271C
UNIFORMLY-COATED CERAMIC PARTICLES
PARAM H. TEWARI
40 Marlboro Road
Hudson, MA 01749
TECHNICAL FIELD
This invention relates to ceramic particles, especially
silicon nitride or silicon carbide particles, having a substan-
tially uniform coating thereon of one or more conventional ox-
M 3 sintering aids, e.g. yttria, or a precursor thereto, in theastantial absence of any individual sintering aid oxide parti-
3S. Due to a uniform coating of sintering aid on each ceram-
~ nitride or carbide particle, the total amount of sintering
aid required to produce a sintered body having excellent high
temperature properties may be reduced substantially below the
amounts now conventionally used. The invention also relates to
a method of preparing such sintering aid-coated particles in
the substantial absence of any free sintering aid particles by
means of a surface precipitation of a precursor to the sinter-
1~ aid upon the ceramic particles.
The invention further relates to the general comminution
~ one material in the presence of another material which is
kr~own to deleteriously interact with the freshly formed sur-
faces of the material being comminuted. More particularly, it
relates to the comminution of ceramic particles, especially sil-
icon nitride or silicon carbide particles, in water by a pro-
cess which precludes deleterious reactions between the water
~nd the ceramic particles. The aqueous comminution process al-
~o permit~ the incorporation of additional aomponents, e.g. sin-
tering aids, onto the freshly formed ceramic particle surfaces.
. .
X~6338
-- 2 --
TECHNICAL BACKGROUND
Traditionally, sintering aid addition to ceramic materi-
als which undergo a liquid phase densification is performed by
simply milling a solid sintering aid powder with the ceramic
material in the presence of an alcoholic solvent, normally iso-
propanol. The milling serves both to comminute the ceramic par-
ticles to a smaller and more uniform particle size and to dis-
tribute particles of the sintering aid somewhat uniformly among
the ceramic particles. The result is a simple mixture of dif-
ferent particles which inherently means that some portions of
the mixture will be richer in sintering aid particles while oth-
e~ portions will be poorer in them. This variation in sinter-
aid concentration is believed to be a cause for failure of~e ceramic parts, particularly at elevated temperatures. In
lition, due to the inherent non-uniformity the total amount
of sintering aid needed to produce dense bodies from the ceram-
iC5 is quite high. This is generally undesirable, especially
for high temperature performance, because it can result in the
presence of an excessive amount of glassy phase. There is need
for ceramic material/sintering aid compositions which contain a
lower than conventional amount of sintering aid, but have the
~intering aid distributed more uniformly so that the resultant
densified bodies exhibit desirable high temperature properties.
This is particularly true for silicon nitride compositions.
Furthermore, the comminution of ceramic materials such as
silicon nitride and silicon carbide being performed in conven-
tional alcoholic solvents is both expensive and hazardous. The
ability to perform the comminution in water without causing de-
gradation of the ceramic material or generation of explosive
levels of gases would be highly desirable. The present inven-
tion evolved ~rom seeking a solution to each of these problems
and a recognition that they are interrelated.
Previous attempts to resolve these problems has been di-
rected at solving each individually, rather than simultaneous-
,.. . ; .- . .. .. ~
. - ' i ,
20~6338
- 3 -
ly. U.S. Pat. No. 3,830,652 (Gazza) claims a densifiable sili-
con nitride composition containing an yttrium compound wherein
the weight of yttrium in the yttrium compound is about 1.0 to
3.5 weight percent of the weight of the silicon nitride. This
simple approach of merely using lower than normal amounts of yt-
tria sintering aid would be wonderful, except that, as shown by
comparative example below, it has not been found to produce sil-
icon nitride bodies having sufficient high temperature proper-
ties to be commercially useful. As a result, currently produc-
ed silicon nitride bodies generally contain a minimum of about
4% by weight yttria to have sufficient high temperature proper-
ties to be commercially useful.
Another attempt at reducing the amount of sintering aid
is disclosed in Japanese Publn. 62-265,171 which teaches sinter-
ing a silicon nitride material with a sintering aid which has
been prepared by spraying aqueous metal salts in a solvent into
a plasma flame. A reduced sintering aid usage is alleged, but
only a simple mixture of silicon nitride particles and sinter-
ing aid oxide particles is produced.
A further method of adding a sintering aid is shown in Ja-
panese Publn. 62-187,170 in which a mixture of silicon nitride
~articles and silicon carbide whiskers is impregnated with a
lvent-based solution of yttrium hydroxide or alkoxide and
~aen the impregnated hydroxide or alkoxide is transformed to an
oxide. The process is similar to that of Shaw et al., discuss-
ed below, and produces a substantial amount of yttrium oxide
particles intimately blended with silicon nitride particles and
silicon carbide whiskers as well as a small amount of the ni-
tride and carbide having a partial yttria coating.
A still further attempt is disclosed in Japanese Publn.
62-158,166 in which silicon nitride powder is mixed with a so-
lution containing a metal nitrate, the solvent simply evaporat-
ed, and the mixture dried and baked to convert the nitrate to
338
- 4 -
an oxide. The solvent is stated to be water or a 1-4 carbon al-
cohol. The process does not yield particles of silicon nitride
uniformly coated with a sintering aid oxide because after addi-
tion of the metal nitrate to the silicon nitride particles the
powder must be dried and pulverized before baking to convert to
an oxide. The intermediate pulverization step means that many
fresh silicon nitride surfaces are produced which can not pos-
sibly have any sintering aid thereon. Although water is sug-
gested as a possible solvent there is no disclosure in the ab-
stract of any step being taken to prevent or even deter the de-
gradation of the silicon nitride that must occur by reaction
with the water. Also no steps are taken to prevent the forma-
on of individual particles of sintering aid oxide which aress efficient than a coating in promoting densification.
Japanese Publn. 61-281,069 mixes silicon carbide and sili-
con nitride powders in a solution containing a metal alkoxide
and then calcines the mixture until the aIkoxide is hydroliz-
ed. The result is predominantly a mixture of particles of sil-
icon carbide, silicon nitride, and metallic oxide, with a small
amount of metal oxide particles formed on the surfaces of the
carbide and nitride powders.
Japanese Publn. 61-251,578 forms an alcoholic solution of
~ etal alkoxide and uses that solution in place of a metal ox-
~ ~ powder as a sintering aid source for silicon nitride. The
r~ult is a mere blend of silicon nitride and metal oxide parti-
cles with a slight amount of the metal oxide possibly adhering
to some of the silicon nitride particles, but not completely
coating them.
T.M. Shaw and B.A. Pethica in "Preparation and Sintering
of Homogeneous Silicon Nitride Green Compacts", 69 Journal of
~he American Ceramic Society 88-93 ~1986) teach a means to ob-
tain a more uniform di~tribution of sintering aid than by con-
ventional milling. Specifically, they teach the precipitation
- !
38
-- 5 --
of yttrium, magnesium, and/or aluminum hydroxides by adding so-
lutions of the corresponding metal nitrates to a suspension of
silicon nitride powder in water which also contains tetraethyl-
ammonium hydroxide in sufficient quantity to cause precipita-
tion of the metal hydoxide from the dispersion medium. The pre-
cipitate and the suspended silicon nitride particles, some of
which may be partially coated with the precipitate, are jointly
flocculated to produce a well-mixed powder of silicon nitride
and densification aiding metal hydroxides. Such mixtures were
found to sinter to higher final densities under the same sinter-
ing conditions than mixtures of the same chemical composition
formed by conventional joint milling of constituents initially
introduced into the suspension in powder form.
The general preparation of solid materials in finely di-
vided ~orm is a frequent practical need. Generally the process
~f comminuting solids is most effectively accomplished while
the solids are suspended in a fluid that lubricates the flow of
the particles as they interact with the milling balls, knives,
or the liXe that are used to accomplish the actual division of
the relatively large solid particles into smaller ones. The di-
vision of solid particles into smaller ones necessarily produc-
es new solid surfaces and therefore promotes chemical reaction
~etween the new surfaces and constituents of the environment in
ich the surfaces are formed. At times, these reactions are
leterious to the properties desired in the fine solid materi-
~ij being prepared and/or generate explosive levels of gases, so
that preventing such reactions would be advantageous.
One of the well-known examples of a deleterious reaction
between a suspension medium and a solid material being comminut-
ed is silicon nitride and water since the silicon nitride readi-
ly reacts with water leaving a substantial coating of silica on
the silicon nitride surface. It is known that in the presence
of water silicon nitride undergoes the reaction:
Si3N4 + 6 H20 = 3 SiO2 + 4 NH3
- . . . ..
.
338
- 6 -
And in the presence of water, silicon carbide undergoes the
reaction:
SiC + 2 H20 = SiO2 + CH4
which again results in the presence of substantial amounts of
silica on the particle surfaces. The silica in each case can
reduce the usefulness of the particles particularly at high tem-
peratures. Also the water can generate dangerous amounts of am-
monia or methane. Based upon these problems, milling of sili-
con nitride and silicon carbide in water, while having been at-
t-1mpted, has previously generally been avoided. Also, milling
water has been ~ound to cause extreme morphological changes
the powder by forming extensive hard agglomerates which have
~eded densification and adversely affected the mechanical pro-
-ties of the resultant dense body. As a result, conventional
_tice in the art is to mill silicon nitride or silicon car-
e in an organic solvent, such as isopropanol, to produce the
~e~y fine powders used for making shaped articles having desir-
able physical properties, particularly at high temperatures.
Alcohol is more expensive and more hazardous, due to its poten-
tial for fires and explosions, than water. Also it is becoming
more difficult to dispose of due to environmental considera-
tions. It would be clearly more advantageous to use water as
the milling mediium.
Although the presence of small amounts, i.e. less than
;i~out 2%, of silica in silicon nitride is normally not detrimen-
~ l, larger amounts are generally undesirable in the intergran-
i~lar phase of silicon nitride articles intended for service at
high temperatures. In addition, some densifying aid oxide is
needed to permit adequate densification under known practical
temperatures and pressures. ~he most preferred densification
aid at present iB yttria, with magnesia an alternative for low-
er temperature uses, and mixture~ of these constituents with
each other, with a small amount of silica, or with other metal
oxides being known in the art. Conventionally, oxide sintering
aids have been milled together with the silicon nitride or sil-
!
338- 7 -
icon carbide powders in alcohol. While this has produced ade-
quate results for many applications, it is generally believed
that a more uniform distribution of sintering aid than can now
be achieved by conventional milling in alcohol is desirable to
permit a reduction in the total amount of sintering aid needed.
SUMMARY OF THE INVENTION
It has now been found that solid materials can be milled
in a liquid with which the materials are reacti~e, while actual
reaction with the liquid is minimized or prevented by the pre-
sence of a sufficient amount of a surfactant in the liquid. It
is believed that the surfactant covers, and may even chemically
react with, freshly produced solid surfaces before reaction can
ccur with the liquid dispersion medium. In particular, ceram-
~, particularly nitride and carbide ceramics, and most partic-
~ ~rly silicon nitride and silicon carbide, can be milled in wa-
ter in the presence of suitable surfactant materials to produce
a readily densifiable powder without an undesirably high silica
content and without causing any substantial agglomeration. Fur-
thermore, suspensions prepared by this process can be filtered
through filters with average openings at least as small as two
microns with less than about 2% loss of ceramic powder content
hCih ha~ not usually been possible with slurries prepared by
nventional means since a non-uniform amount of ceramic and
atering aid particle~ would be removed.
The ability of being able to place the ceramic powders in
water, without causing a deleterious reaction, in combination
with control of the surface chemistry enables a more effective
and economical mixing of sintering aids with the ceramic parti-
cles which results in surface precipitation of a densification
~d, or more usually a precursor of it, onto the surfaces of
the suspended ceramic particles, without simultaneously precipi-
tating any of the sintering aid or its precursor in the bulk of
the suspension medium. The resultant ceramic particles are es-
sentially completely coated with the sintering aid or its pre-
2~)~6338
-- 8 --cursor in the substantial absence of free sintering aid or pre-
cursor particles. Specifically, a metal hydroxide that will
readily convert to a densification-aiding metal oxide is con-
trollably precipitated onto the surfaces of suspended nitride
or carbide particles while avoiding simultaneous precipitation
of hydroxide particles in the bulk. Thus, a desirable inter-
granular phase constituent, such as yttria, is distributed over
the nitride or carbide powder surfaces with exceptional uniform-
ity, thereby reducing the total amount of sintering aid requir-
ed for densification. Moreover, the process is particularly ad-
vantageous when two or more sintering aids are used simultane-
ously, since they can be deposited either simultaneously or,
more preferrably, sequentially thereby providing additional con-
trol of the subsequent densification.
~IEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a scanning transmission electronmicrograph of
~ licon nitride particles which have been milled in water con-
taining 2% Cavco Mod APG surfactant.
Figure 2 is a scanning transmission electronmicrograph of
the particles of Figure 1 wherein 4% yttria has been surface
^ecipitated thereon.
Figure 3 is a scanning transmission electronmicrograph of
conventionally prepared mixture of silicon nitride particles
which have been milled in isopropanol with yttria present.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention is applicable to nitride and ca-
rbide ceramic powders which are reduced in size to form very
~ine powders which are then used to produce useful articles.
More particularly it is applicable to ceramic powders which un-
dergo a liquid phase densification. Examples of suitable such
nitride and carbide powders include, but are not limited to,
silicon nitride, aluminum nitride, boron nitride, titanium
- . - -- - . -.. .. ... . ... ...................
I
~:~13G338
_ g _
nitride, silicon carbide, boron carbide, and titanium carbide.
To prepare the nitride and carbide ceramic particles hav-
ing a surface precipitated coating of sintering aid oxide in
the substantial absence of free sintering aid particles, (i)
the ceramic material is comminuted, preferably in water, to a
desired fine particle size, (ii) a metal salt which will gener-
ate metal ions of the desired sintering aid is added to the cer-
amic particles in the form of an aqueous solution, generally af-
ter the comminution, (iii) the metal ions combine with hydroxyl
ions and a metal hydroxide precursor to the desired oxide is
rface-precipitated onto the ceramic particles from the aque-
~s solutions under conditions which preclude the precipitation
e the precursor in the bulk, and finally (iv) the precursor is
onverted to the desired final oxide.
The comminution (milling) of the nitride or carbide parti-
cles to the desired fine particle size may be performed in a
conventional manner in the presence of an alcoholic solvent,
such as isopropanol, and then dried to remove the solvent. In
this case the inherent oxide surface that forms upon exposure
to air should be removed by acid washing to improve surfactant
adhesion. Preferably, however, the milling is performed in the
~esence of water and a surfactant which is more reactive with
tride or carbide than is the water so that the ceramic materi-
i~ protected from attack by the water and thus reaction with
~he water is prevented. Suitable surfactants useful herein in-
clude amino-functional zircoaluminate surfactants having an in-
organic polymer backbone ~from Cavedon Chemical, now Manchem),
silanes, titanium alkoxides, aluminum alkoxides, zirconium al-
koxides, iridium-based surfactants, and the like. Of course,
the selected surfactant must not detrimentally effect the per-
formance of the ceramic material in its intended u~e. In addi-
tion, the surfactant must not generate any substantial amount
of foam which could deleteriously effect the comminuting opera-
tion. Preferably, it is an organofunctional zircoaluminate.
X~6338
-- 10 --
More preferably the organofunctional groups are selected from
amino, mercapto, carboxy, and oleophilic groups. Still more
preferably, the zircoaluminate surfactant i8 the reaction pro-
duct of a chelated aluminum moiety, an organofunctional ligand,
and a zirconium oxyhalide, the organofunctional ligand being
complexed with and chemically bound to the chelated aluminum
moiety, the aluminum moiety having the formula
A12(0RlO)aAbBc, wherein each of A and B is hydroxy or
halide and each of a, b, and c are integers such that 2a + b +
c = 6, and ORlo is (a) an alpha, beta or an alpha, gamma
glycol group in which R1 is an alkyl group having about 1 to
about 6 carbon atoms or (b) an alpha-hydroxy carboxylic acid
r~;idue having the formula:
--o---CH---C---O--
R3 0
~ rein R3 is H or an alkyl group having about 1 to about 4
carbon atoms; said organofunctional ligand being (a) an alkyl,
alkenyl, alkynl, or aralkyl carboxylic acid having about 2 to
about 36 carbon atoms, (b) an aminofunctional carboxylic acid
having about 2 to about 18 carbon.atoms, (c) a dibasic carboxyl-
ic acid having about 2 to about 18 carbon atoms, (d) an acid
anhydride o~ a dibasic acid having about 2 to about 18 carbon
:oms, (e) a mercapto functional carboxylic acid having about 2
about 18 carbon atoms, or (f) an epoxy functional carboxylic
:id having about 2 to about 18 carbon atoms; said zirconium
~yhalide moiety having the formula ZrAdBe, wherein A and B
;;.~e as above defined and d and e are integers such that d + e =
4; the molar ratio of chelated aluminum moiety to zirconium oxy-
halide moiety being about 1.5 to about 10; and the molar ratio
of organofunctional ligand to total metal being about 0.05 to
about 2.
Generally the sur~actants useful herein are those surface
.~tive agents which are sufficiently attracted to the nitride
or carbide particles to react therewith more rapidly than can
water. The sur~actant serves to prevent, or at least substan-
Z~ G338
-- 11 --
tially retard, reaction of the nitride or carbide with waterwhile simultaneously not generating an excessive amount of foam
which would interfere with the milling process. The surfactant
is normally used in an amount of about 0.5 to about 10, prefer-
ably about 1 to a~out 5, weight % based on the water. The mill-
ing is normally conducted for an extended period of at least
about 10 hours, though the time has not been found critical pro-
vided that the desired particle size is achieved. The water
milling in the presence of the surfactant has been found to sub-
stantially increase the milling efficiency such that the total
milling time required to produce a particular average size par-
ticle has been found to be reduced by 50 to 70 % or more.
The comminution of the relatively large nitride or car-
de particles to the desired particle size may be performed inconventional mill or other particle comminution device that
~ rates on the principle of suspending solid particles in a
liguid medium. Examples of suitable such devices include vibra-
tory, ball, and attritor mills, and the like.
The sintering/densification aids added to the nitride or
carbide include those conventional oxides which are known to be
useful for densifying the ceramic material involved. Examples
c euitable oxides include those of rare earth metals such as
:rium, as well as magnesium, zirconium, aluminum, cerium, haf-
~m, and mixtures thereof. Preferably the sintering aid is
lected from yttria, magnesia, and mixtures thereof. Most pre-
~erably the sintering aid is yttria. Precursor hydroxides of
these sintering aids which can be surface-precipitated in accor-
dance with this invention are prepared in situ from metal salts
which produce metal ions when placed in water. Salts which can
generate the desired metal hydroxide precursors include yttrium
nitrate, yttrium chloride, yttrium acetate, magnesium nitrate,
magnesium bromide, magnesium acetate, and mixtures thereof.
Most preferably the salt used is the nitrate of the particular
metal because the product of neutralization, ammonium nitrate,
. ~ . .. .. . ... . ... ..... .. . ... . .. .
338
is readily decomposable at low temperatures with no deleterious
effect on the ceramic products. The amount of sintering aid
used will depend upon its particular efficiency and the use to
which the final body will be put, but generally an amount of
about 0.5 to about 10 % by weight of the ceramic material will
be appropriate. Preferably, the amount of sintering aid will
be as low as possible, particularly for high temperature appli-
cations.
For silicon nitride the amount of sintering aid can be
l-~ss than about 2%, since silicon nitride bodies prepared with
little as 0.7 weight % yttria in accordance with the present
vention have shown essentially equivalent performance to con-
ntionally prepared bodies having 4% yttria. Most preferably,
sintering aid is yttria which is used in an amount of about
; to about 1.2 weight %.
To deposit the sintering aid precursor hydroxide on the
surfaces of the nitride or carbide particles which have been
previously milled, i.e. in alcohol, and dried, the milled par-
ticles can be slurried in water which contains the surfactants
described above, in substantially similar amounts, along with
the necessary metal salt. To deposit the sintering aid precur-
~or hydroxide in the preferred case where the milling operation
per~ormed in water, the desired metal salt may simply be add-
to the mill after the milling is completed and, preferably,
~er the milled suspension has been filtered to remove any ni-
iide or carbide particles larger than about 2 microns. Theslurry may also contain an alcohol in up to about 50% of the
weight of the water. The deposition of the sintering aid pre-
cursor hydroxide upon the milled particles by surface precipi-
tation is then performed by addinq the desired metal salt and
then slowly increasing the pH of the solution by the addition
of a base such as aqueous ammonia. The deposition conditions
i~re selected to preclude any bulk precipitation of the sinter-
ing aid hydroxide precursor so that the final composition is
20~:116338
- 13 -
substantially free Gf independent sintering aid oxide parti-
cles. To achieve this, advantage i8 taken of the ~act that the
pH of the surface of the nitride or carbide particle, pH(s), is
related to the pH of the bulk solution, pH(b), as follows:
pH(s) = pH~b) ~ ~e ~y/2.3kT
wherein ~ e is the electronic charge of the metal, ~ y is the
surface potential of the particle suspension, k is the Boltz-
mann constant, and T is the absolute temperature (J.T.Davies et
al., Interfacial Phenomena, Academic Press, p 9S, 1963). The
pH(s) is the same as pH(b) only when ~ y is zero. There is gen-
erally a 2-3 pH unit difference between pH(s) and pH(b) in sta-
ble suspensions. To assure that only surface precipitation of
the sintering aid precursor occurs, the pH of the entire system
controlled to be at least about 1.5, preferably at least
;out 2, and most preferably at least about 2.5 pH units below
,e hydrolysis constant of the specific metal ion until almost
Lll, i.e. at least about 90 percent, of the metal has been con-
sumed in the surface precipitation. Thereafter, the pH can be
increased to slightly below the hydrolysis constant to assure
that all of the metal is precipitated onto the nitride or car-
bide surfaces and that essentially none of it is precipitated
in the bulk.
If two or more sintering aids are desired for a particu-
lar ceramic material, they may be deposited from a single solu-
~ion containing metal ions of each. More preferably, the sin-
ring aids will be deposited in a sequential manner, thereby~t~oviding an additional means of controlling the interaction of
the materials to obtain optimum densification results and physi-
cal properties of the resultant ceramic body.
The precursor hydroxide coating may be converted to the
de~ired oxide by simply heating the particles. Generally this
will be performed at temperatures generally greater than about
20-C. and under conditions which will not cause degradation of
the nitride or carbide. Thus the maximum temperature may be as
.. ~ .
. .
338
- 14 -
high as conventional sintering temperatures if the conversion
is performed in an inert atmosphere, but normally only up to
about 250-C. when performed in the presence of oxygen to mini-
mize any reaction with oxygen. Preferably, the conversion is
performed by placing the material in a vacuum oven at about 180
C. It should be noted that these temperatures are substantial-
ly below those at which the corresponding bulk hydroxides con-
vert to oxides. For instance, bulk yttrium hydroxide converts
to yttrium oxide at a temperature of about 350-540-C. (M.D. Ras-
mussen et al, Ceramics International, 11:51, 1985) and bulk zir-
oonium hydroxide converts to zirconia at a temperature of about
730-430-C. (Taichi Sato, Thermochemica Acta, 34:211, 1979)
The nitride or carbide particles having a coating of sin-
ring aid or precursor may also be used directly for slip cast-
lrS~ or shape forming procedures without drying or they may be
dried in any conventional manner. Freeze-drying has been found
to be particularly advantageous since it minimizes particle ag-
gregation. Thereafter the sintering aid coated particles may
be used in the same manner as previous ceramic material/sinter-
ing aid mixtures, i.e. conventional forming procedures such as
cold pressing, hot pressing, gas pressure sintering, hot isosta-
~c pressing, and the like may be used. Further details on sin-
~ring procedures are not included herein as they readily existthe open literature.
The resultant nitride or carbide particles have surfaces
which consist essentially of the sintering aid oxide or its hy-
droxide precursor. For instance, silicon nitride particles
coated with about 0.7 weight % yttria produced a coating about
2 angstroms thick (about a monolayer). When the yttria amount
was increased to about 1~, the layer was about 2-3 angstroms;
en the yttria amount was 2%, the coating was about 6-7 ang-
~roms (about two monolayers). The silicon nitride particles
are believed to be uniformly coated even at the very low levels
of sintering aid, but no direct means for confirming this is
- 15 -
currently available. As shown in the examples below, the pre-
sence of a uniform coating is supported by relative acoustophor-
etic mobility techniques (RAM) and by electron spectroscopy ~or
chemical analysis (ESCA), scanning transmission electron micros-
copy (STEM), and most importantly by the successful preparation
of densified silicon nitride bodies from coated particles hav-
ing less yttria than is required for conventionally prepared
particle mixtures.
The coated nitride or carbide particles produced are in
the substantial absence of any free sintering aid particles.
It is believed that no free sintering aid particles are produc-
by the surface precipitation process of the invention since
e were detectable by examination of scanning transmission
ctronmicrographs of the products. However, this does not
clude the presence of trace amounts of some free sintering
particles.
Also, while it is expected that the coated particles will
be used in this condition, i.e. in the substantial absence of
free sintering aid particles, since this is considered the most
efficient way to utilize the sintering aid, it is also within
the scope of the present invention to intentionally add free
n~rticles of one or more sintering aids to the sintering aid-
ated particles. While this would partially defeat the pur-
ise and some of the benefits of the surface precipitation pro-
oess, it will not prevent the use of the sintering aid oxide-
coated ceramic particles in many applications.
~ he surface precipitation process also avoids any contami-
nation problem which could occur when dealing with fine parti-
ole5 of different sintering aids. Since no particles of sinter-
l,-,g aid oxides are milled to an ultrafine particle ~ize, dedi-
cated equipment for each particular sintering aid is avoided.
While one aspect of the present invention is to form sin-
, .. .. . . . . . ..... , . .. ~ _ .. _ ,.. ... .. ..
- - .,
~6338
- 16 -
tering aid-coated nitride and carbide particles in the substan-
tial absence of free sintering aid particles, the process of
preparing suspensions of finely divided particles of solid ma-
terials when the finely divided materials will undergo a dele-
terious reaction with the suspension medium is of more general
application. It has been found that reactions between a fluid,
i.e. water, and a freshly prepared finely divided particle may
be precluded by the addition of surfactants which are soluble
in the fluid and which protect the finely divided particles
from attack by the fluid. Examples of materials which may be
-otected include silicon nitride, silicon carbide, boron ni-
~ide, aluminum nitride, and other carbides and nitrides. Thus
en fine particles of these and other materials are requiredthe absence of any sintering aid coatings, the~ may readily
prepared by comminuting larger particles thereof in water in
t~e presence of the surfactants in the manner described above.
The best mode known for using this invention involves com-
minution of materials comprising either silicon nitride or sili-
con carbide in water to prepare powders upon which a sintering
aid precursor hydroxide is surface precipitated so that the re-
~sltant powders are useful for molding and eventual densifica-
tlon to near-theoretical density.
The practice of the invention may be further understood
from the following non-limiting examples in which all parts and
percents are by weight unless otherwise specified.
Exam~les 1-6 and Comparative Examples C-l - C-9
These examples and comparative examples demonstrate the
comminution of ~ilicon nitride particles in water which would
normally be expected to attack the surfaces of the silicon ni-
-ide and convert them to silica. For each of these examples,
~50 g of silicon nitride powder and 7SO g of dispersion medium
were milled together with 3 kg of dense silicon nitride-yttria
milling media in a vibratory mill (Sweco mill). Each such lot
6338
- 17 -
was milled for about 18-20 hours. The aurface areas of the pow-
ders were determined before and after milling by conventional
BET adsorption using nitrogen gas. The dispersion media used
are shown in Table 1. In Table 1, nKem" for the type of sili-
con nitride means KemaNord SICONIDE grade P 95 C, available
from Superior Graphite Co., Chicago, Illinois; "Ube SN-E 10" in-
dicates a grade so designated by the manufacturer, Ube Indus-
tries, ~td., Tokyo, Japan for a substantially equiaxed, high
purity silicon nitride powder made by a liquid-interfacial reac-
tion method and having > 95% alpha phase and a surface area of
about 10 square meters per gram; "Ube SN-E 05~ and "Ube SN-E
02" are the same as Ube SN-E 10 except for having larger parti-
cles, giving them a specific surface areas of about 5 and 2
m2/g respectively; "Ube B" is a mixture of 40% Ube SN-E 10
and 60% Ube SN-E 05; and "Ube T" is a mixture of 20% Ube SN-E
10, 30~ Ube SN-E 05, and 50 % Ube SN-E 02; "Nor" is Type HN-63
silicon nitride from Norton Company, Worcester, MA. Each of
the silicon nitrides is generally at least about 95% silicon
nitride.
"Cavco Mod APG" is an amino-functional zirocoaluminate
surfactant having an inorganic polymer backbone, dissolved in
~pylene glycol, available from Cavedon Chemical Co., Inc.,
,nsocket, R.I. Its total metal content is about 4.1 to 4.4 %,
.h the surface active component being about 20 % of the to-
. The synthesis and chemical structure of Cavco Mod APG are: forth in U.S. Pat. No. 4,539,049, particularly in columns
2-~ thereof, and more particularly in lines 21-23 and lines 47-
52 of column 3 thereof, the subject matter of which is hereby
incorporated by reference. "Coco" is an abbreviation for a mix-
ture of coco alkylamine acetates, Chemical Abstracts Registry
No. 61730-57-6, available from Armak Chemicals, Chicago, IL.
~. - -- , ~ .. .. .. . .. ... . .
2~ 6338
- 18 -
lable 1
Dispersion Media and Type of Silicon Nitride
Used for Examples 1-6 and Comparative Examples Cl-Cg
Desig- Silicon Dispersion Medium
nation Nitride Used
C-l Nor Deionized water, pH 7.0
C-2 Nor Deionized water adjusted to pH 4.0
with nitric acid
C-3 Nor Deionized water adjusted to pH 11.0
with ammonia
C-4 Nor Isopropyl alcohol (commercial grade)
C-5 Kem 25 volume % IPA in deionized water
C-6 Ube B Isopropyl alcohol
C-7 Kem Deionized water, pH 7.0
C-8 Kem Deionized water adjusted to pH 4.0
with nitric acid
C-9 Kem Deionized water adjusted to pH 11.0
with ammonia
1 Ube B Deionized water ~ 1% Cavco Mod APG
2 Ube B Deionized water + 2% Cavco Mod APG
3 Ube B Deionized water + 4% Cavco Mod APG
4 Kem Deionized water + 2% Cavco Mod APG
Ube T Deionized water + 2% Cavco Mod APG
6 Ube B Deionized water + 1% Coco
The milling conditions were determined by having perform-
ed a preliminary screening for attractive operating conditions
which would minimiz~ the amount of ammonia generated during the
milling. All of the comparative example~ except C-6, which re-
pre~ents the currently established conventional art, generated
substantial amounts of ammonia during milling. C-5, with some
o~ the water replaced by isopropanol, produced less ammonia
:~an the others but still did not make satisfactory powder in
cvmparison with C-6.
,
338
-- 19 --
All of the Examples 1-6 generated less ammonia during the
milling than did any of the comparative examples except C-4 or
C-6. Examples 2, 4, and 5 all generated approximately equal
amounts of ammonia durinq milling, smaller amounts of ammonia
than the other examples, while Example 3, with more surfactant,
generated more foam and was thus considered less desirable. It
was therefore concluded that Cavco Mod APG at a level of about
2% was the best surfactant among these examples. Example 6 us-
ing Coco at 1% did show evidence of foaming and also produced
more ammonia (and thus silica) than the other Examples and thus
_o is suggested for primary use for silicon nitrides which
11 not be subjected to extremely hiqh temperatures.
Several replications of Example 2 were made, and it was
7ays found that the surface area of the resulting powder was
hin the range of 9.7 - 10.7 m2/g and the oxygen content
1.5 plus or minus 0.1%. These values are the same as those ob-
tained for silicon nitride conventionally milled in alcohol as
shown in Comparative Example C-6.
Fourier transform infrared spectroscopy of some of the
powders produced in these Examples showed that those milled in
alcohol contained hydrocarbon functional groups, probably iso-
propyl siloxyl groups, and significant amounts of surface N-H
bonds. The presence of such groups at the surfaces of the pow-
ders probably contributes to their favorable lack of a strong
tendency to agglomerate until compressed into green bodies.
The powders produced by Examples 2 and 3 have spectra indicat-
ing the presence of similar chemical species and also have ex-
cellent dispersibility and little tendency to agglomerate. To
the contrary, the powders from the other comparative examples
had in their spectra extensive absorption ascribed to Si-o-H
bonds and very little absorption ascribed to N-H bonds.
After milling, the slurry of ~xample 2 had a pH of about
9.4 in the bulk. The slurry is very stable and was readily fil-
6338- 20 -
tered through conventional filters with opening sizes as smallas 2 microns, without loss of more than 5% of the silicon ni-
tride content. This is a further demonstration of the high
quality of the dispersion obtained, and represents a useful
technique for removing hard agglomerates or foreign particles
that could be a source of weakness in bodies made by densifying
the powders. The powder after drying by a preferred freeze dry-
ing technique is fluffy and readily redispersible, at least as
well as that powder prepared by conventionally alcohol milling.
Examples 7 - 10
These examples illustrate the selective precipitation of
ore solid (yttrium hydroxide) on the surface of another (sili-
~ nitride) by control of surface activity of reagents with re-
act to the bulk activity. A slurry prepared as in Example 2
3 filtered successively through filters having average open-
~ Is of 10 microns, 5 microns, and 2 microns. Less than 2% of
t~ slurry was retained which confirms that the suspension is
very well deflocculated and that the suspension is well-stabil-
ized by the surfactant covering the silicon nitride particles.
To the suspension prepared as described above, nitric
acid was added slowly with stirring to reduce the pH to about
7. An aqueous solution of yttrium nitrate having the desired
~mount of yttrium was then added slowly with stirring. To this
Lution was slowly added an aqueous ammonia solution with con-
~nt monitoring of the pH of the bulk suspension. Precipita-
~ion oi yttrium hydroxide on the surfaces of the silicon ni-
tride particles commenced immediately. The amount of yttrium
ion added to the suspension was sufficient to form yttria in an
amount of 0.7% of the silicon nitride powder for Example 7, 1.4
% for Example 8, 2.8% for Example 9, and 4.0% for Example 10.
After addition of the ammonia had caused more than 90% of the
yttrium to be precipitated as yttrium hydroxide, the pH was
gradually raised in the bulk of the dispersion medium by the
addition of aqueous ammonia until the pH reached about 10.5.
., ~ .
2~(i338
- 21 -
This was done to assure essentially complete precipltation of
all the added yttrium ion as yttrium hydroxide on the surface
of the suspended solid powder. The hydrolysis constant for yt-
trium is about 12 and thus no yttrium hydroxide should have pre-
cipitated in the bulk.
Measurements of relative acoustophoretic mobility ("RAM")
as a function of pH showed that the powder of Example 10 con-
taining about 4% yttrium hydroxide had an RAM essentially iden-
tical to that of pure colloidal yttrium hydroxide. ~ With the
lesser amounts of yttrium used in the other examples, the RAM
m~surements showed behavior in between yttrium hydroxide and
.icon nitride, depending on the extent of yttrium hydroxide
~erage of the surface.
The RAM measurements indicate that the surface layer form-
1A in these Examples was capable of reversible hydration-dehy-
dration cycles between hydroxide and oxide on drying at room
temperature and redispersion in water. When the powder was
dried and then redispersed in water, the RAM behavior in each
case was closely analogous to that of colloidal yttria. As the
redispersed powder remained in contact with water, its RAM be-
havior returned to that characteristic of yttrium hydroxide in-
stead. This reversibility suggested that the material present
:~ the ~urface may have a somewhat different chemical reactiv-
r than conventional bulk yttrium hydroxide or yttrium oxide,
~ ~ the material was capable of being converted to the oxide by
d~ying and heating, such as would automatically occur if the
coated powder were directly formed into a green body and densi-
fied. Any such material is regarded herein as a precursor to
the desired oxide. The oxide formed may also have a somewhat
different chemical reactivity from bulk yttrium oxide because
there was some evidence that the coated powders formed by this
method densified more readily at a given temperature than would
be expected for the amount of oxide present in the powder.
~ ~, . . . ................... .. ... . . . .
- .,
.
,;, , . -
Z~ 38
- 22 -
The products were also studied by electron spectroscopy
for chemical analysis ("ESCA~). The apectra for powders with
yttrium compounds coated on the surface are significantly dif-
ferent from those for uncoated powders only in the presence of
peaks ascribable to the yttrium compounds and in attenuation of
the peaks ascribable to the 2p orbital electrons of silicon and
the ls orbital electrons of nitrogen in samples with coatings.
Assuming an attenuation length, lambda, of 1.8 nanometers for
silicon 2p electrons and even coverage of the yttrium compound
on the powder surface, the thickness of the coating can be esti-
mated from the equation:
Il/I2 = e-X/1.8
~^here Il aand I2 are the intensities of the silicon 2p spec-
^^a in the uncoated and coated powders respectively, e is these of natural logarithms, and x is the thickness of the cover-
lg in nm. This calculation indicates that the coatings hadtnicknesses of about 0.2 nm in Example 7, 0.2-0.3 nm in Example
8, 0.7 nm in Example 9, and 0.9 nm in Example 10.
The powders from these Examples were also studied by sur-
face transmission electron microscopy ("STEM"). STEM images
for powder from Examples 2 and 10 are shown in Figures 1 and 2
respectively. The powder shown in Figure 1 contains no yttrium
~oating and is relatively smooth, while that of Figure 2 with
l yttrium surface precipitated coating is noticeably rough in
-- mparison. This is consistent with a coverage of very fine
~icrocrystals of yttrium hydroxide or oxide. The surface area
of the yttria-coated powders increases with increasing yttria
content and is substantially greater than silicon nitride with
no yttria coating, as shown in Table 2.
Table 2
Specific Surface Area as a Function of Amount of Yttria
Wt % Yttria Added: 0 0.7 1.4 2.8 4.0
Sg. Meters per Gram: 10.2 11 13.5 13.5 19
2[)~6338
- 23 -
A STEM image of similar silicon nitride powder milled in
alcohol together with yttria, according to the conventional
prior art, is shown in Figure 3. Discrete small particles of
yttria are scattered inhomogeneously among the milled powder,
with little, if any, evidence that any of the yttria is adhered
to the silicon nitride or comes even close to uniformly cover-
ing its surface. This is in sharp contrast to the yttria-coat-
ed powder of this invention as shown in Figure 2. As shown by
Comparative Example C-10 below, the non-uniformly distributed
yttria produced by alcohol milling is le~s effective as a sin-
tering aid than the much more nearly uniform coating of the pre-
sent invention.
The powders prepared according to Examples 7-10 were con-
~ntionally cold pressed into green bodies and then densifieda hot isostatic press ("HIP") according to the teachings of
3. Pat. No. 4,446,100. The densities achieved thereby were
~n megagrams per cubic meter) 3.218 for Example 10, 3.186 for
Example 9, 3.178 for Example 8, and 3.171 for Example 7.
Conventional test bars for measuring modulus of rupture
~MOR) were cut from the densified products from Examples 9 and
10. The bars from Example 10 had an MOR of 760 + or - 100 mega-
pascals (MPa) at room temperature (average of fifteen tests)
1 an MOR of 580 + or - 40 MPa at 1370C. (average of five
7ts). Those from Example 9 had an MOR of 750 + or - 100 MPa
room temperature and of 560 + or - 13 MPa at 1370-C. Frac-
t~re toughness values were measured (by a controlled flow meth-
od with a 10 kg load) only at 1370-C. and were 5.6 MPa m0-5
for Example 10 and 5.1 MPa m0-5 for Example 9. All these val-
ues are at least about equal to those obtained by similar pro-
cessing of powders milled in alcohol with additions of the same
amount of yttria during milling.
Scanning electron micrograph of chemically etched surfac-
es of material densified as described above show that the sili-
. .
-- .
20~6338
- 24 -
con nitride microcrystals have exceptionally long, asymmetric
shapes with aspect ratios up to 8. The micrographs do not show
any porosity even at 10,000 x magnification. X-ray diffraction
patterns show that the conversion to beta silicon nitride ap-
pears complete, with no other phases detectable; the sensitiv-
ity is too low to detect the yttrium containing intergranular
phase expected to be present.
No presence of any of the surfactants was detected in any
of the samples, suggesting that the level either was below the
l.~vel of detection or that the surfactants were totally destroy-
1 during the high temperature processing.
Comparative Example C-10
To evaluate the sintering ability of low levels of yttria
~ded to silicon nitride conventionally, i.e. as particles dur-
ing milling in isopropanol, as compared to the yttria-coated
silicon nitride powders of the present invention, samples were
prepared by each method at a rate of 0.7 and 1.0% yttria.
The conventional silicon nitride compositions were prepar-
ed by mixing the compositions with a small amount of isopropa-
n~l to form a slurry. The two slurries were each placed in a
~1 jar together with several silicon nitride balls and mixed
approximately twenty-four hours. Each slurry was removed
1 dried. About 55 g of each of the dried powders was formed
to a billet by cold isostatic pressing at 30,000-50,000 psi.
~ samples were then degassed at 1350-C. and then hot isostat-
i ally pressed in a glass encapsulant at 1860-l900'C. for one
hour. Neither of these samples densified to full density, hav-
ing densities of less than 3.17. To determine the strength of
the resultant bodies, machining of standard modulus of rupture
bars from the billets was attempted. No 6uch bars could be ma-
chined because the billets were so cracked and porous.
For comparison purposes, coated silicon nitride particles
.. . . .. , .... ,.. ~. __
X~)~3G338
- 25 -
were prepared in accordance with the procedure of Examples 7-
10, i.e. having yttria deposited upon the particles as a sub-
stantially uniform surface layer coating, but having 0.7 and
1.0% yttria respectively. The particles were formed into bill-
ets by cold isostatic pressing and then hot isostatically press-
ed in a glass encapsulant as were the conventional samples.
The resultant billets were fully dense and uncracked. Modulus
of rupture bars were machined from the billets of the 1.0% yt-
tria composition and were found to have a room temperature flex-
ure strength of 132 + 19 ksi.
Example 11
The procedure of Examples 1-6 was repeated to demonstrate
t materials other than silicon nitride can be protected from
leterious reactions with a suspension fluid during comminu-
Ion. The material comminuted was silicon carbide and the flu-
id was water. Cavco Mod APG was used in one sample as the sur-
factant at a level of 2% while the other sample contained no
surfactant. Milling was continued for about 15 hours at which
point the samples were evaluated for the presence of oxygen
which was found at a level below about 1.8% in the sample con-
taining the surfactant. The oxygen content was about 6% in the
corresponding sample not containing the surfactant.
Comparative Example C-ll
The procedure of Examples 1-6 is repeated with a variety
of different surfactants which were found either to cause exces-
ive foam or to insufficiently protect the silicon nitride from
~gradation due to its reaction with the water dispersion medi-
um. The surfactants tested and results of the milling tests
were as shown in Table 4 which follows:
Table 4
Surfactant Results of Millina
(a) Coco - 2% Excessive foaming and silica
(b) Coco - 4% Excessive foaming and silica
,
2 [)~G338
.
- 26 -
(c) Ammonium poly- Excessive silica formation
acrylate - 2%
(d) Pluronic P1~3 - 2% Excessive silica formation
(e) Daxad - 2% Excessive silica formation
(f) Colloid lllM - 3% Excessive silica formation
In Table 4 "Pluronic P123" is a polyol formed by the addi-
tion of propylene oxide to the two hydroxyl groups of a propyl-
ene glycol, having an average molecular weight of 4,400, and
available from BASF; "Daxad" is a sodium salt of a polymerized
alkyl naphthalene sulfonic acid and available from Diamond Sham-
rock: and "Colloid lllM" is an amine salt of a polycarboxylate
and available from Calgon.
Example 12
The procedure of Examples 7-10 is repeated except the yt-
trium nitrate is replaced by magnesium nitrate which is used in
an amount to produce a coating of about 0.5% surface precipitat-
ed magnesium hydroxide on the silicon nitride particles. The
hydrolysis constant for magnesium ion is about 12. According-
ly, the pH of the deposition solution is maintained below about
10.5 until most of the magnesium has been deposited. Thereaf-
ter, the pH i~ increased to about 11 to assure complete utiliza-
~on of the magnesium. The resultant magnesium hydroxide coat-
silicon nitride particles are then used directly to cast mod-
us of rupture test bars. When the bars are evaluated along
w.th bars prepared from conventionally milled silicon nitride-
magnesia compositions containing about 1% magnesia, an amount
which is often used, the results are substantially the same
even though the bars of the present invention only contained
50% of the magnesia of the conventional bars.
Example 13
The procedure of Example 11 was repeated to evaluate the
effectiveness of other surfactants (1% by weight) at protecting
silicon carbide from reaction with water milling medium while
.... . . . . .
!
2C)~16338
- 27 -
milling for 24 hours. The surfactants evaluated and results
obtained are shown in Table 5.
Table 5
$urfactant Results of Millina
(a) Triethylamine titanate Good - 1.44% oxygen
(b) Zirconium alkylamine Poor - blew mill
(13% metal)
(c) Manchem S (mercapto func- Excellent, no qas
tional zircoaluminate)
(d) Manchem F (oleophilic Excellent, no gas
zircoaluminate)
(e) Manchem C (carboxy func- Excellent, no gas
tional zircoaluminate)
Example 14
The procedure of Examples 1-6 was repeated with a variety
o~ dif~erent surfactants which were found to protect silicon ni-
tride from undue deleterious reactions with water. The surfac-
tants tested and the results of the milling tests are shown in
Table 6 below.
Table 6
Surfactant Results of Millina
(a) Triethanolamine com- Fair - 1.44% oxygen
plex of Ti (Tyzor TE)
(b) Alkanolamine complex Poor - 2.48% oxygen
of Zr (MPD 6212)
(c) Alkanolamine complex 1.26% oxygen; 9.45 m2/g
of Ti (Tyzor DEA) surface area
Example 15
The procedure of Examples 1-6 was repeated several times
to produce water-milled silicon nitride particles which were
dried and their particle sizes determined. The particles were
then coated with 1% yttria by the procedure of Example 7 which
.
338
- 28 -
were dried and their particle sizes determined. The average re-
sults of the multiple different determinations were:
As Milled After Yttria
Dlo 0.20 0.22
DSo 0.60 0.63
Dgo 1.00 1.06
The presence of a uniform yttria coating is substantiated by
the consistency of the particle size results.
Example 16
The procedure of Examples 7-10 was repeated to produce a
1~ magnesia-coated silicon nitride. NBD-200, a conventional 1%
~nesia-silicon nitride mixture, was used for comparative pur-
3es. The coated material was sintered by the standard sinter-
cycle used for the conventional NBD-200 and reached full
i~sity. The material was evaluated for hardness and toughness
by Vickers indentation and for phase conversion. The results
and typical values for NBD-200 were:
Coated Invention NBD-200 Typical
Dense Phase 8.7% 7-15%
Analysis
Toughness 4.7 4.2-4.8
(MPa m~)
Hardness 21.8 16-17
~HVlOkg)
While the Examples above have described the processes of
(i) aqueous milling of materials subject to degradation from
contact with water and (ii) selective precipitation on the sur-
~ace of suspended particles in connection with particles prepar-
ed by milling in the presence of surfactants, the utility of
the aqueous milling and the selective precipitation processes
are not restricted to such conditions.
f