Note : Les descriptions sont présentées dans la langue officielle dans laquelle elles ont été soumises.
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DESCRIPTION
ELECTRIC POWER SOURCE DEVICE
TECHNICAL FIELD
[0001]The present invention relates to an electric power source
device having electrical components such as semiconductor
devices, capacitors, and the like in its housing.
BACKGROUND ART
[0002] A conventional electric power source device has a plurality
of vertically arranged power conversion units in a housing
standing on a floor. The power conversion units each have
electronic components, such as a plurality of semiconductor
devices and a plurality of electrolytic capacitors, mounted in a
planar fashion on a substrate parallel to the floor surface.
[0003] These electronic components generate heat during
operation of the electric power source device. Therefore, a fan
fixed to the housing is used to cause cooling airflow to flow onto
the power conversion units in a planar fashion to thereby cool
the electronic components (refer to, e.g., Patent Document 1).
Note that, for enhancing heat radiation performance, the
semiconductor devices are generally mounted on the substrate
through a heat sink in which cooling holes are formed so as to
allow cooling airflow generated by the fan to pass therethrough.
PATENT DOCUMENT 1: Japanese Patent Application
1
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Laid-Open Publication No. 11-27930
DISCLOSURE OF THE INVENTION
PROBLEMS TO BE SOLVED BY THE INVENTION
[0004] In the above electric power source device, the flow path
resistance of the cooling holes of the heat sink is high, so that
the cooling airflow generated by the fan is difficult to pass
through the cooling holes of the heat sink. Thus, cooling effect
for the semiconductor devices mounted on the heat sink is low.
[0005] Further, in the above electric power source device, the
electronic components such as the semiconductor devices and the
electrolytic capacitors have a great need for maintenance.
However, these electronic components are mounted on the
substrate parallel to the floor surface and thus workability at
the time of maintenance is low.
MEANS FOR SOLVING THE PROBLEMS
[0006] In order to solve the problem described above, according to
the present invention, there is provided an electric power source
device having a housing raised from a floor surface, the device
comprising: a housing including: a front face panel having an air
inlet hole through which air outside the housing can be passed
inside the housing; a rear face panel disposed opposite to the
front face panel; two side face panels constituting a tubular body
together with the front and rear face panels; a front-rear
partition plate disposed so as to partition a space within the
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housing into a front face-side space and a rear face-side space
and having a front-rear air flow opening through which the front
face-side space and the rear face-side space communicate with
each other; a top plate disposed on upper end surface of the
tubular body and having an air discharge opening formed in an
upper portion of the rear face-side space; an air discharger
disposed at the air discharge opening so as to discharge air in the
rear face-side space outside the housing; a plurality of capacitors
vertically arranged on a surface of front side of the front-rear
partition plate; a plurality of heat sinks arranged on the
surface of front side of the front-rear partition plate and between
the front-rear air flow opening and the capacitors and having
cooling holes penetrating therethrough from capacitor side to
front-rear air flow opening side; a plurality of semiconductor
devices vertically arranged on the surface of the front side of the
heat sinks; and a guide member through which the front-rear air
flow opening and opening portions of the cooling holes on side of
the front-rear air flow opening communicate with each other.
ADVANTAGES OF THE INVENTION
[00071 According to the present invention, the air in the front
face-side space flows into the rear face-side space through the
cooling holes of the heat sinks, thereby effectively cooling the
semiconductor devices. In addition, the semiconductor devices
and the electrolytic capacitors having a great need for
maintenance are arranged in the front face-side space, which
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I
improves workability at the time of maintenance.
BRIEF DESCRIPTION OF THE DRAWINGS
[00081
FIG. 1 is a perspective view of the front side of an electric
power source device according to a first embodiment of the
present invention, in which electric wirings are omitted and a
front face panel of the electric power source device has been
removed.
FIG. 2 is a perspective view of the rear side of the electric
power source device of FIG. 1, in which a rear face panel of the
electric power source device has been removed.
FIG. 3 is a schematic front view of the electric power
source device of FIG. 1, in which a part of the front face panel
has been cut away and in which the main airflow is illustrated.
FIG. 4 is a cross-sectional view as viewed in the direction
of arrow IV-IV of FIG. 3.
FIG. 5 is a perspective view of the front side of the electric
power source device according to a second embodiment of the
present invention, in which electric wirings are omitted and a
front face panel of the electric power source device has been
removed.
FIG. 6 is a perspective view of the rear side of the electric
power source device of FIG. 5, in which a rear face panel of the
electric power source device has been removed.
FIG. 7 is a schematic front view of the electric power
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source device of FIG. 5, in which a part of the front face panel
has been cut away and in which the main airflow is illustrated.
FIG. 8 is a cross-sectional view as viewed in the direction
of arrow VIII-VIII of FIG. 7.
FIG. 9 is a view of the electric power source device
according to a third embodiment of the present invention, which
illustrates a cross-section of the electric power source device as
viewed in the same direction as in FIG. 4.
FIG. 10 is a view of the electric power source device
according to a fourth embodiment of the present invention, which
illustrates a cross-section of the electric power source device as
viewed in the same direction as in FIG. 4.
FIG. 11 is a view of the electric power source device
according to a fifth embodiment of the present invention, which
illustrates a cross-section of the electric power source device as
viewed in the same direction as in FIG. 4.
EXPLANATION OF REFERENCE SYMBOLS
[0009]
1: electric power source device; 2: housing; 3: floor surface;
21: front face panel; 22: rear face panel; 23, 24: side face
panels; 25: bottom plate; 26: top plate; 27: upper-lower
partition plate; 28: front-rear partition plate; 29: lower
space; 30: front face-side space; 31: rear face-side space; 32:
front-rear air flow opening; 33: opened air inlet hole; 34:
grating; 35: leg portion; 36: air discharge opening; 37: leg
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portion; 51: semiconductor device; 52: heat sink; 53: cooling
hole; 54: opening of cooling hole on side near front-rear air flow
opening; 55: opening of cooling hole on side near electrolytic
capacitor; 56: electrolytic capacitor
61: AC reactor; 62: DC reactor; 63: control transformer; 64:
supporting plate; 71: circuit breaker; 72: filter capacitor;
73: main circuit connection wiring; 81: air discharger; 82: fan;
91: guide member; 92: standing plate; 93: end plate; 94:
parallel plate
BEST MODE FOR CARRYING OUT THE INVENTION
[0010]
(First Embodiment)
An electric power source device according to a first
embodiment of the present invention will be described using
FIGS. 1 to 4. FIG. 1 is a perspective view of the front side of an
electric power source device according to the first embodiment of
the present invention, in which electric wirings are omitted and
a front face panel of the electric power source device has been
removed. FIG. 2 is a perspective view of the rear side of the
electric power source device of FIG. 1, in which a rear face panel
of the electric power source device has been removed. FIG. 3 is
a schematic front view of the electric power source device of FIG.
1, in which a part of the front face panel has been cut away and
in which the main airflow is illustrated. FIG. 4 is a cross
sectional view as viewed in the direction of arrow IV-IV of FIG. 3.
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[0011] An electric power source device 1 according to the first
embodiment of the present invention has a configuration in
which electrical components such as semiconductor devices 51
and electrolytic capacitors 56 are mounted in a housing 2. The
electric power source device 1 is mainly featured by this
mounting structure.
[0012] First, a structure of a housing 2 will be described. The
housing 2 is raised vertically relative to a floor surface 3 on
which the electric power source device 1 is installed. A space
for mounting the electrical components is formed inside the
housing 2. The outer shape of the housing 2 is constituted by
mutually facing front and rear face panels 21 and 22, mutually
facing two side face panels 23 and 24, a bottom plate 25, and a
top plate 26 so as to be formed into a rectangular solid vertically
extending relative to the floor surface 3. The housing 2 has
inside thereof an upper-lower partition plate 27 and a front-rear
partition plate 28.
[0013] The upper-lower partition plate 27 is disposed
horizontally so as to partition the space within the housing 2 into
upper and lower sides, thereby forming an upper space and a
lower space 29 in the housing 2. An upper-lower vent (not
illustrated) is formed in the range where the upper-lower
partition plate 27 contacts a rear face-side space 31 (to be
described later), and the lower space 29 and the rear face-side
space 31 communicate with each other through the upper-lower
vent.
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[00141 The front-rear partition plate 28 is disposed vertically so
as to partition the upper space into front and rear sides, thereby
forming a front face-side space 30 and a rear face-side space 31
in the housing 2. Front-rear air flow openings 32 are formed so
as to vertically extend on both lateral side portions of the
front-rear partition plate 28. The front face-side space 30 and
the rear face-side space 31 communicate with each other through
the front-rear air flow openings 32.
[00151The front face panel 21 is removably attached to the
housing 2 in consideration of convenience at the time of
mounting the electrical components in the front face-side space
30. An opened air inlet hole 33 is formed so as to extend from
the lower portion of a range where the front face panel 21
contacts the front face-side space 30 to the upper portion of a
range where the front face panel 21 contacts the lower space 29.
Through the air inlet hole 33, a space outside the housing 2
communicates with the front face-side space 30 and the lower
space 29. A grating 34 for preventing electrical shock is
attached to the air inlet hole 33.
[00161 The rear face panel 22 is removably attached to the
housing 2 in consideration of convenience at the time of
mounting the electrical components in the rear face-side space 31.
The rear face panel 22 is formed of magnetic metal in order to
prevent radiation noise from leaking outside the housing 2.
[00171 Leg portions 35 extend from the lower surface of the
bottom plate 25. The leg portions 35 are bolted to the floor
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surface 3, whereby the electric power source device 1 is fixed to
the floor surface 3.
[0018]An air discharge opening 36 is formed on the top plate 26
in a range where the top plate 26 contacts the rear face-side
space 31. Through the air discharge opening 36, the rear
face-side space 31 and the space outside the housing 2
communicates with each other.
[0019] An electrical component mounting structure will next be
described. The electric power source device 1 has, inside the
housing 2, semiconductor devices 51, heat sinks 52, electrolytic
capacitors 56, AC reactors 61, DC reactors 62, control
transformers 63, circuit breakers 71, filter capacitors 72, and
main circuit connection wirings 73.
[0020] The semiconductor devices 51, the heat sinks 52, and the
electrolytic capacitors 56 are housed in the front face-side space
30. The plurality of electrolytic capacitors 56 are vertically
arranged on the front surface of the front-rear partition plate 28
at the center portion in the width direction of the front-rear
partition plate 28. In the example illustrated in FIGS. 1 to 4,
24 electrolytic capacitors 56 are arranged in two lines. Each
electrolytic capacitor 56 is constituted by a cylindrical main
portion 57 and a terminal portion 58 protruding from one end
portion thereof and is attached to the front-rear partition plate
28 by means of a supporting member 59 such that the main
portion 57 is raised relative to the front-rear partition plate 28.
[0021] The plurality of heat sinks 52 are vertically arranged on
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the front surface of the front-rear partition plate 28 and between
the front-rear air flow openings 32 and the electrolytic
capacitors 56 . In the example illustrated in FIGS. 1 to 4, eight
heat sinks 52 are arranged in two lines between the 24
electrolytic capacitors 56 and the two front-rear air flow
openings 32. Each heat sink 52 is formed into a plate body and
has a plurality of cooling holes 53 penetrating the inside thereof
in a planar direction. Each heat sink 52 is arranged such that
the cooling holes 53 extend in the width direction.
[00221 The plurality of semiconductor devices 51 are vertically
arranged on the front side surface of the plurality of heat sinks
52. In the example illustrated in FIGS. 1 to 4, 16 semiconductor
devices 51 are arranged in two lines on eight heat sinks 52.
Heat generated from the semiconductor devices 51 is radiated
mainly through the heat sinks 52.
[00231 The AC reactors 61, the DC reactors 62, and the control
transformers 63 are housed in the rear face-side space 31. The
plurality of AC reactors 61 are arranged on and above the
upper-lower partition plate 27. A supporting plate 64 is
provided above the plurality of AC reactors 61. The supporting
plate 64 is attached to the two side face panels 23 and 24 so as to
be parallel to the floor surface 3. The plurality of DC rectors 62
and the plurality of control transformers 63 are arranged on and
the supporting plate 64.
[0024) The circuit breakers 71, the filter capacitors 72, and the
main circuit connection wirings 73 are housed in the lower space
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29. The circuit breakers 71 are provided at the center portion of
the bottom plate 25 in the forward-rear direction. The filter
capacitors 72 are provided on the rear side of the bottom plate 25,
and the main circuit connection wirings 73 are provided on the
front side of the bottom plate 25.
[0025] Next, an air discharger 81 and a guide member 91 will be
described. The air discharger 81 is attached to the top plate 26
so as to cover the air discharge opening 36 formed in the top
plate 26. The air discharger 81 has a fan 82 capable of
discharging the air in the rear face-side space 31 outside the
housing 2. That is, when the fan 82 rotates, the space within
the housing 2 assumes a negative pressure. Accordingly, the air
outside the housing 2 flows into the housing 2 through the air
inlet hole 33, and the air in the housing 2 flows out through the
air discharge opening 36.
[00261The guide member 91 is a member for guiding the air in
the front face-side space 30 to the rear face-side space 31 so as to
allow the air in the front face-side space 30 to flow into the rear
face-side space 31 after passing through the cooling holes 53.
[0027] Specifically, the guide member 91 is constituted by
standing plates 92, end plates 93, and parallel plates 94, and is
attached to the front-rear partition plate 28. The standing
plates 92 are plate-like members extending from lateral end
portions of the front-rear air flow opening 32 on the far-sides
from the heat sinks 52 to the front sides by a length
corresponding to the thickness of the heat sinks 52. The end
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plates 93 are plate-like members extending from vertical both
end portions of the front-rear air flow opening 32 to the front
sides by a length corresponding to the thickness of the heat sinks
52. The parallel plates 94 are plate-like members extending
parallel to the front-rear partition plate 28 from end portions of
the standing plates 92 and the end plates 93 to the
semiconductor device 51 side surface of the heat sinks 52.
[0028] That is, the guide member 91 integrally covers the
front-rear air flow opening 32 and the openings 55 of the cooling
holes 53 on the near-side from the front-rear air flow opening 32
so as to make the front-rear air flow opening 32 and the cooling
holes 53 communicate with each other. With the existence of
the guide member 91, the air fed from the front face-side space
30 to the rear face-side space 31 is forced to pass through the
cooling holes 53.
[0029] The airflow into the housing 2 generated when the fan 82
rotates will be described. Since the opened air inlet hole 33 is
formed so as to extend from the lower portion of the front
face-side space 30 to the upper portion of the lower space 29, the
air outside the housing 2 passes thorough the air inlet hole 33
and then flows simultaneously in the front face-side space 30 and
the lower space 29.
[0030] Since the rear face-side space 31 assumes a negative
pressure, the air in the front face-side space 30 passes through
the front-rear air flow opening 32 and flows into the rear
face-side space 31. At this time, with the existence of the guide
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member 91, the air fed from the front face-side space 30 to the
rear face-side space 31 is forced to pass through the cooling holes
53 of the heat sinks 52. When passing through the cooling holes
53, the air enters the cooling holes 53 from their openings
(openings on the side near the electrolytic capacitors 56) 54 on
the side of the electrolytic capacitors 56 and flows out of the
cooling holes 53 from the openings (openings on the side near the
front-rear air flow openings 32) 55 on the side of the front-rear
air flow opening vents 32.
[0031]That is, the air in the front face-side space 30 is collected
at the electrolytic capacitors 56 side openings 54 to cool the
adjacent electrolytic capacitors 56 (refer to FIG. 3). Further,
the air directed to the rear face-side space 31 passes through the
cooling holes 53 of the heat sinks 52 to cool the semiconductor
devices 51 through the heat sinks 52.
[0032] The air that has flowed into the rear face-side space 31
from the front face-side space 30 rises while rotating in the rear
face-side space 31 and is then discharged outside the housing 2.
Assuming that the fan 82 rotates in the counterclockwise
direction, the air in the rear face-side space 31 rises while
rotating in the counterclockwise direction (refer to FIG. 4). At
this time, the air in the rear face-side space 31 cools the AC
reactors 61, the DC reactors 62, and the control transformers 63
arranged in the rear face-side space 31.
[0033] Meanwhile, the air in the lower space 29 passes through
the upper-lower vent and flows into the rear face-side space 31,
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since the rear face-side space 31 assumes a negative pressure.
At this time, the air in the lower space 29 cools the circuit
breakers 71 and the filter capacitors 72 provided in the lower
space 29.
[0034] The air that has flowed into the rear face-side space 31
from the lower space 29 rises while rotating in the rear face-side
space 31 as described above to cool the AC reactors 61, the DC
reactors 62, and the control transformers 63 and is then
discharged outside the housing 2.
[0035] Hereinafter, effects of the electric power source device
according to the first embodiment of the present invention will
be described. According to the present embodiment, the air in
the front face-side space 30 passes through the cooling holes 53
of the heat sinks 52 and flows into the rear face-side space 31.
Thus, it is possible to effectively cool the semiconductor devices
51 which are highly required to be cooled. Further, the air in
the front face-side space 30 is collected at the opening portions
54 of the cooling holes 53 on the side near the electrolytic
capacitors 56, so that it is possible to effectively cool the
electrolytic capacitors 56 adjacent to the openings 54.
[0036] Further, the main air that has flowed into the front
face-side space 30 flows therein so as to cool the electrolytic
capacitors 56, the semiconductor devices 51, the AC reactors 61,
the DC reactors 62, and the control transformers 63, thereby
enhancing the cooling efficiency of the entire electric power
source device.
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[0037] Further, the air outside the housing 2 flows into the front
face-side space 30 and the lower space 29 simultaneously, and
independent flow paths are formed in the front face-side space 30
and the lower space 29, so that it is possible to independently
cool a block including the semiconductor devices 51 and the
electrolytic capacitors 56 and a block including the circuit
breakers 71 and the filter capacitors 72. That is, the
semiconductor devices 51 and the electrolytic capacitors 56 are
cooled not by the air that has already cooled the circuit breakers
71 and the filter capacitors 72 but fresh cooling air, so that it is
possible to effectively cool the semiconductor devices 51 and the
electrolytic capacitors 56. Alternatively, the circuit breakers 71
and the filter capacitors 72 are cooled not by the air that has
already cooled the semiconductor devices 51 and the electrolytic
capacitors 56 but fresh cooling air, so that it is possible to
effectively cool the circuit breakers 71 and the filter capacitors
72.
[0038] Further, the air in the rear face-side space 31 rises while
rotating, so that it is possible to effectively cool the AC reactors
61, the DC reactors 62, and the control transformers 63.
[0039] According to the present embodiment, the semiconductor
devices 51 and the electrolytic capacitors 56 having a great need
for maintenance are arranged in the front face-side space 30,
which improves workability at the time of maintenance. From
the same reason, workability at the time of assembling the
electric power source device 1 is high.
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[0040] Further, the AC reactors 61, the DC reactors 62, and the
control reactors 63 that generate radiation noise are arranged in
the rear face-side space 31, it is possible to suppress the
radiation noise from leaking to the front side of the electric
power source device 1. Further, the rear face panel 22 is formed
of magnetic metal, thereby preventing radiation noise from
leaking to the rear side of the electric power source device 1.
[0041] Further, the air inlet hole 33 is provided on the front face
panel, and air discharge opening 36 is provided on the top plate
26, thereby eliminating the need for additional space for air inlet
and outlet, with the result that the electric power source device 1
can be installed adjacent to another device or walls. Further,
the housing 2 is formed into a vertically extending rectangular
solid, thereby reducing the installation space for the electric
power source device 1.
[0042]
(Second Embodiment)
The electric power source device according to a second
embodiment will be described using FIGS. 5 to 8. FIG. 5 is a
perspective view of the front side of the electric power source
device according to the second embodiment of the present
invention, in which electric wirings are omitted and a front face
panel of the electric power source device has been removed. FIG.
6 is a perspective view of the rear side of the electric power
source device of FIG. 5, in which a rear face panel of the electric
power source device has been removed. FIG. 7 is a schematic
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front view of the electric power source device of FIG. 5, in which
a part of the front face panel has been cut away and in which the
main airflow is illustrated. FIG. 8 is a cross-sectional view as
viewed in the direction of arrow VIII-VIII of FIG. 7. The
present embodiment is a modification of the first embodiment,
and the same or similar parts as those of the first embodiment
are represented with the same reference numerals to omit
redundant description.
[0043] In the electric power source device 1 according to the
second embodiment of the present invention, the front-rear air
flow opening 32 is formed so as to vertically extend on one lateral
side portion (right end portion in FIGS. 5 and 7) of the front-rear
partition plate 28.
[0044] The plurality of electrolytic capacitors 56 are vertically
arranged on the front surface of the front-rear partition plate 28
at the side portion thereof (left end side in FIGS. 5 through 7)
where the front-rear air flow opening 32 are not formed. In the
example illustrated in FIGS. 5 and 7, eight electrolytic
capacitors 56 are arranged in one line.
[0045] The plurality of heat sinks 52 are vertically arranged on
the front surface of the front-rear partition plate 28 and between
the front-rear air flow opening 32 and the electrolytic capacitors
56 (at the lateral center of the front surface of the front-rear
partition plate 28). In the example illustrated in FIGS. 5 to 8,
four heat sinks 52 are arranged in one line between the eight
electrolytic capacitors 56 and one front-rear air flow opening 32.
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Further, in this example, eight semiconductor devices 51 are
arranged in one line on the four heat sinks 52.
[0046]The fan 82 of the air discharger 81 rotates so as to make
the air just after passing through the front-rear air flow opening
32 move in substantially perpendicular direction (toward the
rear side) to the front-rear partition plate 28 in the rear
face-side space 31. Referring to FIG. 8, the front-rear air flow
opening 32 is formed at the lateral right end portion of the
front-rear partition plate 28, so that the fan 82 rotates in the
counterclockwise direction. Then, the air just after passing
through the front-rear air flow opening 32 moves in substantially
perpendicular direction (toward the rear side) to the front-rear
partition plate 28 in the rear face-side space 31 and, after that,
rises while rotating in the counterclockwise direction.
[0047] According to the present embodiment, the air in the rear
face-side space 31 smoothly rotates to thereby effectively cool the
AC reactors 61, the DC reactors 62, and the control transformers
63.
[0048]
(Third Embodiment)
The electric power source device according to a third
embodiment of the present invention will be described using FIG.
9. FIG. 9 is a view of the electric power source device according
to the third embodiment of the present invention, which
illustrates a cross-section of the electric power source device as
viewed in the same direction as in FIG. 4. The present
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embodiment is a modification of the first embodiment, and the
same or similar parts as those of the first embodiment are
represented with the same reference numerals to omit redundant
description.
[0049] In the electric power source device 1 according to the third
embodiment of the present invention, cut portions are formed so
as to vertically extend at both lateral side portions of the
front-rear partition plate 28. Gaps between the cut portions
and the side face panels 23 and 24 serve as the front-rear air flow
openings 32.
[0050] The guide member 91 is constituted by the end plates 93
and the parallel plates 94. The parallel plates 94 extend from
the inner surface of the side face panels 23 and 24 to the
semiconductor device 51 side surfaces of the heat sinks 52. The
end plates 93 extend from top and bottom end portions of the
front-rear air flow openings 32 to top and bottom end portions of
the parallel plates 94.
[0051] According to the present embodiment, the same effects as
in the electric power source device 1 according to the first
embodiment of the present invention can be obtained.
[0052]
(Fourth Embodiment)
The electric power source device according to a fourth
embodiment of the present invention will be described using FIG.
10. FIG. 10 is a view of the electric power source device
according to the fourth embodiment of the present invention,
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which illustrates a cross-section of the electric power source
device as viewed in the same direction as in FIG. 4. The present
embodiment is a modification of the first embodiment, and the
same or similar parts as those of the first embodiment are
represented with the same reference numerals to omit redundant
description.
[0053] In the electric power source device 1 according to the
fourth embodiment of the present invention, the front-rear air
flow opening 32 is formed so as to vertically extend at the lateral
center portion of the front-rear partition plate 28.
[0054] The plurality of electrolytic capacitors 56 are vertically
arranged in two lines on the front surface of the front-rear
partition plate 28 at lateral side portions thereof. The plurality
of heat sinks 52 are vertically arranged in two lines on the front
surface of the front-rear partition plate 28 and between the
front-rear air flow opening 32 and the plurality of electrolytic
capacitors 56.
[0055] The guide member 91 is constituted by the end plates 93
and the parallel plates 94. The parallel plates 94 extends
across the semiconductor device 51 side surfaces of the plurality
of heat sinks 52 arranged in two lines. The end plates 93 extend
from top and bottom portions of the front-rear air flow opening
32 to top and bottom portions of the parallel plates 94.
[0056]According to the present embodiment, the same effects as
in the electric power source device 1 according to the first
embodiment of the present invention can be obtained.
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[0057]
(Fifth Embodiment)
The electric power source device according to a fifth
embodiment of the present invention will be described using FIG.
11. FIG. 11 is a view of the electric power source device
according to the fifth embodiment of the present invention,
which illustrates a cross-section of the electric power source
device as viewed in the same direction as in FIG. 4. The present
embodiment is a modification of the first embodiment, and the
same or similar parts as those of the first embodiment are
represented with the same reference numerals to omit redundant
description.
[0058] In the electric power source device 1 according to the fifth
embodiment of the present invention, the guide member 91 is
integrally formed with the heat sinks 52. Specifically, the
semiconductor device 51 side surfaces of the heat sinks 52 are
extended along the side surface to form the parallel plates 94.
[0059] According to the present invention, heat radiation can be
achieved not only by the heat sinks 52 but also by the guide
members 91, thereby enhancing the heat radiation effect of the
semiconductor devices 51.
[0060]
(Other Embodiments)
The above embodiments are merely examples, and the
present invention is not limited to such embodiments. For
example, the number of the electrical components such as the
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semiconductor devices 51 or electrolytic capacitors 57 is not
limited to the above embodiments. Further, the features of
different embodiments may be combined.
22
