DISPOSITIF A SEMI-CONDUCTEUR SUR ISOLANT AVEC JONCTION PN INCLINEE ET PROCEDE DE PRODUCTION DE CE DISPOSITIF

BIPOLAR SOI DEVICE HAVING A TILTED PN-JUNCTION, AND A METHOD FOR PRODUCING SUCH A DEVICE

Abrégé français

Dispositif transistor bipolaire (1) à semi-conducteur sur isolant, comprenant une région d'émission (4), une région base (5), une région collectrice (2) et une région de contact de collecteur (6) sur une plaquette semi-conductrice telle qu'une plaquette de silicium monocristallin (2) sur un isolant (3). Les jonctions base-émetteur et collecteur-base sont inclinées par rapport à l'interface entre la plaquette semi-conductrice (2) et l'isolant (3). Le dispositif peut être réalisé par gravure anisotrope pour obtenir une surface inclinée (7) sur un bord du dispositif ou, de manière équivalente, une rainure en V présentant des parois latérales inclinées. Les régions base et émetteur (5, 4) sont ensuite élaborées par diffusion d'atomes appropriés donneurs et accepteurs dans le matériau contenu à l'intérieur de la surface inclinée. Un tel transistor bipolaire à semi-conducteur sur isolant combine les caractéristiques de vitesse élevée d'un dispositif à semi-conducteur latéral et les caractéristiques de tension élevée d'un dispositif à semi-conducteur vertical.

Abrégé anglais

In a bipolar semiconductor-on-insulator transistor device (1) comprising an
emitter region (4), a base region (5), a collector region (2) and a collector
contacting region (6) in a semiconductor wafer, e.g. a monocrystalline silicon
wafer (2), on top of an insulator (3), the base-emitter and collector-base
junctions are tilted relative to the interface between the semiconductor wafer
(2) and the insulator (3). The device can be made by anisotropic etching in
order to produce a tilted surface (7) at an edge of the device or equivalently
a V-groove having tilted sidewalls. The base and emitter regions (5, 4) are
then produced by diffusing suitable donor and acceptor atoms into the material
inside the tilted surface. Such a bipolar semiconductor-on-insulator
transistor combines the high speed features of a lateral semiconductor device
and the high voltage features of a vertical semiconductor device.

Revendications

CLAIMS
1. A bipolar semiconductor-on-insulator device (1) comprising an
emitter region (4), a base region (5), and a collector region in
a semiconductor wafer (2) on an insulator (3), characterized in
that the base-emitter and collector-base junctions are tilted in
relation to the interface between the semiconductor wafer (2)
and the insulator (3).
2. A device according to claim 1, characterized in that the
angle of tilt of the base-emitter and collector-base junctions
3 is in the range of 45° ~ 20°.
3. A device according to claim 1 or 2, in the case where the
semiconductor wafer is made of monocrystalline silicon (Si),
characterized in that the angle of tilt of the base-emitter and
collector-base junctions corresponds to the (111) crystal plane
of the silicon wafer (2).
4. A method of producing a bipolar semiconductor-on-insulator
device from a semiconductor wafer (2) on an insulator (3),
characterized by doping the wafer to produce a base region (5)
and an emitter region (4) which are tilted in relation to the
interface between the semiconductor wafer (2) and the insulator
(3).
5. A method according to claim 4, characterized in that the
base-emitter and collector-base junctions are tilted in an angle
in the range of 45° ~ 20°.
6. A method according to claim 4 or 5, in the case where the
semiconductor wafer is made of monocrystalline silicon (Si),
characterized by anisotropically etching the silicon wafer (2)
to expose a (111) crystal plane at one of lateral edges thereof
before doping the base region (5) and the emitter region (4)
parallel to the exposed (111) crystal plane of the silicon wafer
(2).

Description

CA 02243998 1998-07-22
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B~POLAR SOT DEvrCE ~AV~NG A TILl'ED PN-JUNCrlON. AND A MEIHOD FOR PRODUCTNG
SUCH A DEVICE
TECHNICAL FIE~D
The invention relates to a bipolar semiconductor-on-insulator
5 device as well as to a method of producing such a device.
R~RG~OUND AND PRIOR ART
A large number of bipolar semiconductor devices be designed
without heavily doped, buried layers on semiconductor substrates
has been proposed. There are two basic types of such bipolar
osemiconductor devices, namely lateral devices and vertical
devices.
Lateral devices (see e.g. Stephen A. Parke, Chenming ~u, Ping R.
Ko: "A High-Performance Lateral Bipolar Transistor Fabricated on
Simox", IEEE Electron Dev. Lett., vol. 14, pp. 33-35, Jan. 1993,
~sand R. Dekker, W.T.A. v.d. Einden and H.G.R. Maas: "An Ultra Low
Power ~ateral Bipolar Emitter Technology on SOI", ~993 IEDM
Conference Digest, pp. 7~-77~, are intended for high speed
applications but are able to support only quite small voltages.
Vertical devices (see e.g. Andrej Litwin and Torkel Arnborg:
~"Compact Very High Voltage Compatible Bipolar Silicon-On-
Insulator Transistor", ISPSD'94, Davos, June 1994, and U.S.
Patent No. 4,8~8,624) are intended more for high voltages and
moderate switching velocities.
Isolating shallow lateral devices can be achieved more easily
~than isolating vertical devices since a simple LOCOS or mesa
isolation can be utilized instead of a trench or iunction
isolation. However, the control of base and emitter doping is
difficult, since lateral diffusion has to be utilized. The
lateral devices exhibit lower breakdown voltages BVCeo than
~vertical devices, in which BVCeo = BVC~o. On the other hand,
vertical devices which are capable of supporting high voltages,
suffer from low switching speeds, limited by the transit time
for lateral carrier transport along the semiconductor-insulator
interface below the base due to potential lock-up (see Torkel
~Arnborg: ~Modelling and Simulation of High Speed, High Voltage
Bipolar SOI Transistor with fully Depleted Collector" presented

CA 02243998 1998-07-22
W O 97/33319 - PCT/SE97/00377
in 1994 IEDM Conference Digest).
SUMMARY
The o~ject of the invention is to provide a bipolar semicon-
ductor-on-insulator device which combines the high speed
5 features of a lateral semiconductor device and the high voltage
features of a vertical semiconductor device.
This object is attained by a bipolar semiconductor-on-insulator
device having base-emitter and collector-base junctions which
are tilted.
o~his object is also attAine~ by a method of producing a bipolar
semiconductor-on-insulator device comprising that the base
region and the emitter region are produced to have a tilted con-
figuration.
BRIEF DESCRIPTION OF THE DRAWINGS
t~ The invention will be described in detail by way of a non-
limiting embodiment with reference to the accompanying drawings
in which:
- Fig. 1 is a schematic cross-~ectional view of a bipolar semi-
conductor-on-insulator device,
~- Figs. 2 and 3 are diagrams illustrating calculated dopant
profiles at the emitter of a bipolar device according to Fig. 1,
- Fig. 4 is a diagram illustrating measured dopant pro~iles at
the emitter of a bipolar device according to Fig. 1.
DETATT.F~ DESCRIPTION
~Figure 1 schematically shows an embodiment of a bipolar semi-
conductor-on-insulator device 1, where the semiconductor is a
monocrystalline silicon wafer, the device 1 thus being a
silicon-on-insulator (SOI) semiconductor device. The silicon
wafer ifi denoted 2, whereas the insulator, e.g. a silicon oxide
~layer, is denoted 3 and is located underneath the silicon wafer
as seen in the figure. The device as illustrated has a generally
rectangular cross-section.
The silicon wafer 2 includes an emitter region 4, a base region
5, and a collector contacting region 6, the collector being the
-

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region of the bulk silicon material 2 located between the base
region 5 and the collector contacting region 6. In an npn-
transistor the emitter region 4 has an n-doping of e.g. arsenic,
the base region has a p-doping of e.g. boron, the bulk silicon
5 material has a n doping of e.g. arsenic and the collector con-
tacting region 6 has a heavy n-doping of e.g. arsenic. In the
silicon wafer 2, the base-emitter junction and the collector-
base junction are parallel to each other and they are both
tilted in relation to the interface between the silicon wafer 2
~oand the insulator 3. This is accomplished by the fact that the
thin emitter region or layer 4 and the thin base region or layer
5 are tilted in relation to said interface between the silicon
wafer 2 and the insulator 3.
The angle of tilt of the base-emitter and collector-base
15 junctions in relation to the interface between the silicon wafer
2 and the insulator 3, is typically in the range of 45~ + 20~,
i.e. between 25 and 6~~.
The emitter and base regions 4, 5 are located at an upper edge
line of the wafer structure where the structure has a tilted
~surface 7, the configuration being obt~ine~ by cutting away a
corner region of the generally rectangular cross-section. The
emitter and base regions are located at this tilted surface 7,
the emitter region 5 being a thin layer located directly inside
the tilted surface and the base region 4 being a thin layer
~located directly inside the emitter region, the emitter and base
regions thus ext~n~i ng in parallel to the tilted surface 7. The
tilted surface 7 is only a surface of the silicon layer 2 and
does not extend into the insulator layer 3. The collector con-
tacting region 6 is located at the upper edge line of the
~structure which is opposite the edge where the tilted surface 7
is located.
A method of producing the semiconductor device 1 shown comprises
etching anisotropically an SOI film, having a (100) silicon
crystal orientation of the plane along its surface. The etching
~is made with a solution of KOH in order to produce the tilted
surface 7 achieving that this surface will always be located
along a ~111) crystal plane of the silicon wafer 2. The etching

CA 02243998 1998-07-22
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i8 made only at one of the lateral edges of the SOI film, re-
~uiring that a suitable mask is applied before the etching step.
Thereupon a base region 5 and an emitter region 4 are doped so
that they will ~e parallel to the tilted surface 7 and thus to a
s(lll) crystal plane in the silicon wafer 2, which is supposed to
already include a collector contacting region 6 made in some
earlier processing step. The angle of tilt of the parallel base-
emitter and collector-base junctions will thus correspond to the
angle of tilt of the (111) crystal plane of the silicon wafer 2
10 in relation to its upper surface. Emitter-, base- and collector
con~acts, not shown, are finally produced in some conventional
way such as by ~king heavily doped contacting regions at
suitable places and by producing metallizations on top of these
regions or by making polysilicon structures at suitable con-
15 tacting places.
The method can also be used for producing transistors on a wa~ersuch as for an integrated circuit having several different com-
ponents on the same chip. Then the anisotropic etching is made
to produce V-grooves having sides walls located along (111)
~planes of the silicon monocrystalline material. In the V-
grooves, from the sides thereof suitable dopants are dif~used
into the silicon material to produce the base and emitter
regions. This method will then differ from conventional methods
of producing transistors mainly in the step of producing the V-
~grooves ~efore the diffusion steps or in producing V-grooves
having tilted sidewalls instead of rectangular cross-section
grooves having sidewalls perpendicular to the surface of the
wafer.
The diagram of Fig. 2 shows a one-dimensional simulation of the
~doping profiles as taken perpendicularly to the tilted surface 7
of the emitter 4 for a typical embodiment of a transistor as
described with reference to Fig. 1. The various lines drawn
illustrate the concentrations of arsenic, boron and phosphorous
as functions of the distance from the surface 7. Also, the net
~dopant concentration is shown. In the diagram of Fig. 3 the net
donor concentration and the net acceptor concentrations are
illustrated as functions of the same distance. Also here, the
net dopant concentration is shown.
. . , _

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WO97/33319 - PCT/SE97/00377
In Fig. 4 measured values of the actual concentrations of dopant
atoms are shown for a npn-transistor doped with arsenic and
boron, also as functions of the same perpendicular distance from
v the tilted surface of the emitter region.
sIt is to be understood, however, that other methods in addition
to etching as described above may be used to produce tilted
parallel base-emitter and collector-base junctions. Also,
another crystal surface than the (lll) crystal plane of the
silicon wafer may be exposed for producing the tilted surface to
t~be doped to achieve a base region and an emitter region parallel
to the exposed crystal surface.
The ~ n~ions of the SOI film are chosen in such a way that the
electric field perpendicular to the emitter-base junction will
be reduced. This will increase the breakdown voltage of the
5 semiconductor device. Due to its geometry, the charge is
injected into the collector space charge region in the direction
of the electric field. Since no potential lock-up is present,
and thus, the lateral field is never zero, the transport will be
by drift and not by diffusion 8S in the case of a semiconductor
~device having a fully depleted collector. This feature will make
the semiconductor device as described above faster having a per-
formance comparable to a lateral semiconductor device.
Moreover, it is to be understood that the invention is not re-
stricted to the use of silicon as a semiconducting material in
~the semiconductor-on-insulator device. Instead of silicon, e.g.
GaAs or SiC may equally well be used.

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