Note : Les descriptions sont présentées dans la langue officielle dans laquelle elles ont été soumises.
CA 02408262 2009-03-24
20365-4665
- 1 -
Description
Electronic power module
Technical Field
The invention relates to an electronic power module, in
particular for an electronic motor control device for
the smooth starting of motors, with two semiconductor
elements which are connected in an electrically anti-
parallel manner and with at least one heat sink for
dissipating the heat loss of the semiconductor
elements.
Background
An electronic power module of the generic type is known
as a component part of a power-electronic unit for the
smooth starting of motors. The power-electronic unit
here comprises one or more electronic power modules,
which have to be designed for short-term loading. The
electronic power module serves for carrying and
influencing current in a phase, i.e., depending on
whether there is a single-phase or three-phase system,
an appropriate number of electronic power modules are
required.
A power-electronic unit of this type only carries
current in the starting phase of the motor, said
current being taken over in the operating phase by a
switching device connected in parallel.
In the smooth starting of motors, the current is only a
fraction of the direct starting current of the motor.
Typically, the current during starting is 25% to 750 of
the direct starting current. However, smooth starting
at reduced current results in a prolonged starting time
for the motor in comparison with direct starting.
CA 02408262 2009-03-24
20365-4665
- la -
In the starting phase, very high power losses occur in
the semiconductors of the electronic power modules. By
suitable combination of the power module or power
semiconductor and heat sink, it must be ensured that
the
CA 02408262 2009-03-24
20365-4665
2 -
barrier-layer temperature permissible for the
semiconductors is not exceeded, to avoid their
destruction. On account of restricted space in the
switch cabinet, there is also the requirement to
minimize the amount of space needed for the electronic
power modules.
An embodiment of an electronic power module in which
two individual thyristors are connected in an anti-
parallel manner and are pressed between two symmetrical
halves of a heat sink is known but not documented by
printed publications. One of the two halves of the
heat sink is centrally divided and the two halves are
connected by a flexible, electrically conductive
connection. This makes it possible for the thyristor
disk cells to be pressed over their surface area, even
if the height of the disk cells differs. The two
halves of the heat sink of this known power section,
which is designed both for short-term loading and for
continuous operation, are part of the power circuit and
are consequently under potential.
The short-term loading occurring in smooth starting
causes a very high power loss in the silicon cell,
which leads to heating of the disk cell immediately
after loading begins. After approximately 2 to 5
seconds, a constant temperature difference is
established between the silicon cell and the heat sink,
i.e. the disk cell is thermally in the steady state, in
which virtually the entire power loss is then used for
heating the heat sink. The cooling of the power
section is performed here by a fan.
Summary
Embodiments of the invention are based on the object of
providing an electronic power module of the type stated at the
CA 02408262 2009-03-24
20365-4665
- 2a -
beginning with good heat dissipation, high storage
capacity for the heat dissipated by the semiconductor
elements in smooth starting at the same time as a
simple construction and low space requirement.
CA 02408262 2009-03-24
20365-4665
3 -
The object is achieved in some embodiments by at
least two conducting bars, between which the two
semiconductor elements are clamped by means of pressure
contacting. This configuration has the particular advantage
that the conducting bars no longer serve just for carrying
current but can, if made from a material with a high thermal
capacity, serve as an intermediate store, from which the
heat is passed on to heat sinks connected to it and is
dissipated.
Thus, in one aspect, there is provided an
electronic power module for the smooth starting of motors,
comprising: two semiconductor elements, connected in an
electrically anti-parallel manner; at least one heat sink
for dissipating heat loss of the semiconductor elements; and
at least two conducting bars, between which the two
semiconductor elements are clamped by pressure contacting;
wherein one of the at least two bars includes hard copper;
and wherein another one of the at least two bars includes
electrolytic copper.
In another aspect, there is provided an electronic
power module, comprising: a plurality of semiconductor
elements, connected in an electrically anti-parallel manner;
at least one heat sink, adapted to dissipate heat loss of
the semiconductor elements; and at least two conducting
bars, between which the plurality of semiconductor elements
are clamped by pressure contacting; wherein one of the at
least two bars includes hard copper; wherein another one of
the at least two bars includes electrolytic copper.
CA 02408262 2009-03-24
20365-4665
- 3a -
It is particularly advantageous if the semiconductor
elements are configured as semiconductor cells, for
example as silicon cells.
If the two bars consist of a material with a thermal
capacity greater than 1.8 Ws/K/cm3, such as aluminum
for example, correspondingly good heat dissipation can
be achieved with them.
With regard to carrying current and heat, it is
particularly advantageous however if the two bars
consist of copper.
In an advantageous way, one of the two copper bars
consists of hard copper. This copper bar can then be
used as a component part of a pressing device for the
pressure contacting mentioned above.
Furthermore, it proves to be particularly advantageous
if a heat sink is connected to the hard copper bar,
since in this way an interface with a low heat transfer
resistance can be achieved.
The second of the two copper bars advantageously
consists of electrolytic copper, which is comparatively
soft and deformable.
CA 02408262 2009-03-24
20365-4665
4 -
If the second copper bar is made narrower in its
central region, it is possible without any problem to
compensate for small differences in thickness of the
semiconductor elements.
If the electronic power module is assembled with two
further electronic power modules of the same
construction to form a three-phase unit, which is
operated in conjunction with a contactor, this allows a
motor to be operated in the starting phase and in
continuous operation.
Brief Description of the Drawings
An exemplary embodiment of the invention is explained
in more detail below on the basis of a drawing, in
which:
figure 1 shows a side view of an electronic
power module according to the invention
for short-term loading,
figure 2 shows a further side view of an
electronic power module according to
the invention with a connected heat
sink and
figures 3, 4, 5 show side views of electronic power
modules with different contacting.
Detailed Description
The electronic power module according to the invention
as shown in figure 1 has two copper bars 1, 2 arranged
in parallel, between which two silicon cells 3 have
been introduced as semiconductor elements. The silicon
cells 3 are configured as thyristors and arranged such
CA 02408262 2009-03-24
20365-4665
- 4a -
that they are turned through 180 , producing an
electrically anti-parallel circuit arrangement.
Instead of thyristors, any other desired semiconductor
components with a comparable function may be
introduced.
The copper bars 1, 2 perform the task of carrying the
heat losses occurring during the high short-term
loading away from the silicon cells 3 as quickly as
possible and storing them.
CA 02408262 2002-11-06
WO 01/87032 PCT/DE01/01566
-
On account of the high volume-specific thermal capacity
of approximately 3.4 Ws/K/cm3 and the high thermal
conductivity, copper is particularly well suited as the
material. The very good thermal conductivity of copper
5 ensures very rapid removal of the lost heat from the
silicon cell 3 and at the same time leads to uniform
distribution and heating of the remaining copper that
is not in the direct vicinity of the silicon cell 3.
As compared with aluminum as a material for the bars,
the dimensions can be reduced by 1/3 third when copper
is used, because of its approximately 1.5 times higher
volume-specific thermal capacity.
In principle, materials other than copper are also
suitable, provided that they have a high thermal
conductivity and a high volume-specific heat capacity.
Alternatively, it would also be possible for example to
use a combination of copper and a material which stores
latent heat, for example a phase changing material
(PCM).
Each silicon cell 3 is pressed over its surface area
between the copper bars 1 and 2 by means of a special
pressing device 4. The pressing of the silicon cells 3
leads to a pressure contact over the full surface area
between the silicon cell 3 and the copper bars 1 and 2
and has the consequence of a low electrical and thermal
transfer resistance at the bearing surfaces.
The pressure contacting ensures a high resistance to
alternating thermal loading and consequently a long
service life of the power module, which is necessary
because of the exclusive operation with short-term
loading.
The lower copper bar 1 in figure 1 consists of harder
copper, the upper copper bar 2 consists of soft
electrolytic copper. Threads 5 for mounting the
CA 02408262 2002-11-06
WO 01/87032 PCT/DE01/01566
- 5a -
pressing devices 4 have been made in the lower copper
bar 1. By choosing the harder copper, bending of the
lower copper bar 1 as a
CA 02408262 2002-11-06
WO 01/87032 PCT/DE01/01566
6 -
consequence of the forces acting due to the pressing
device is prevented to the greatest extent and the
surface-area bearing of the silicon cells 3 is ensured.
Furthermore, tearing out or running away of the threads
5 is prevented.
Fastened to the lower copper bar 1, for example by a
screwed connection, is a heat sink 6 (see figure 2), in
order to dissipate the heat losses occurring during the
short-term loading. The use of harder copper provides
a largely surface-area contact between the copper bar 1
and the heat sink 6, and consequently a low thermal
transfer resistance.
The upper copper bar 2 is made narrower in the center,
to make it possible to compensate for small differences
in thickness of the silicon cells 3. This effect is
also assisted by the use of soft electrolytic copper
for the upper copper bar 2. This measure ensures
pressure contact over the full surface area between the
silicon cells 3 and the upper copper bar 2. It is
possible here to dispense with a division of the upper
copper bar 2 in the way provided by the prior art. By
doing away with flexible, electrical connecting
elements between the parts of the copper bars, which
are present in the case of the prior art, the overall
height of the electronic power module according to the
invention can be reduced in comparison and the assembly
effort can be reduced.
According to figure 2, the heat sink 6 is
advantageously connected in an electrically conducting
manner to the lower copper bar 1. As a result, thermal
transfer resistances are minimized and very good
thermal coupling of the heat sink 6 to the power module
is achieved. Consequently, the heat sink 6 likewise
contributes with its thermal capacity to increasing the
short-term loading capacity.
CA 02408262 2002-11-06
WO 01/87032 PCT/DE01/01566
- 6a -
An electrically insulated attachment of the heat sink 6
with, for example, an electrically insulating film is
likewise possible.
CA 02408262 2009-03-24
20365-4665
7 -
On account of the approximately 3 to 5 times higher
thermal transfer resistance of such films, compared
with direct attachment, the contribution of the heat
sink 6 to increasing the short-term loading capacity is
reduced.
The upper copper bar 2 is made slightly narrower than
the lower copper bar 1. This allows a plastic housing
7 to be attached around the upper copper bar 2 and the
pressing device 4 without increasing the overall width
of the power module. A polymer composition is
subsequently introduced into the plastic housing 7 in
order to ensure the dielectric strength between the two
copper bars 1, 2. The copper bars 1, 2, the
semiconductor cells 3 and the pressing device 4 are
encapsulated together to form a module.
The electrical contacting may take place at the end
face on the lower copper bar 1. The electrical
connection to the upper copper bar may be configured
differently, depending on the installation situation
according to figures 3, 4, 5. In figure 3, the
contacting of the upper copper bar 2 is performed
within the housing 7 by means of a flat copper material
8 bent in a U-shaped manner. In figure 4, a piece of
copper bar 9 taken perpendicularly upward and formed in
a stepped manner at the lower end is used for this
purpose. Figure 5 shows a connection of the two copper
bars 1 and 2 at their end faces.
